Fairchild FODM3053 4-pin full pitch mini-flat package random phase triac driver output optocoupler Datasheet

4-PIN FULL PITCH MINI-FLAT PACKAGE
RANDOM PHASE TRIAC DRIVER
OUTPUT OPTOCOUPLERS
FODM3051
FODM3052
FODM3053
DESCRIPTION
The FODM305X series consists of a galium arsenide diode driving a silicon bilateral switch housed in a compact 4-pin mini-flat
package. The lead pitch is 2.54 mm. The FODM305X series isolates low voltage logic from 115 and 240 Vac lines to provide
random phase control of high current triacs or thyristors. It also features greatly enhanced static dv/dt capability to ensure stable
switching performance of inductive loads.
FEATURES
PACKAGE DIMENSIONS
• Compact 4-pin surface mount package
(2.4 mm maximum standoff height)
• Peak blocking voltage – 600V
• Guaranteed static dv/dt of 1000 V/µs
• Available in tape and reel quantities of
500 and 2500.
• Applicable to Infrared Ray reflow
(230°C max, 30 seconds.)
• BSI, CSA and VDE certifications pending
• UL (File# E90700) certified
PIN 1
0.100 (2.54) TYP
0.020 (0.51)
0.012 (0.30)
0.287 (7.29)
0.248 (6.30)
0.173 (4.40)
TYP
APPLICATIONS
• Solenoid/valve controls
• Interfacing microprocessors to
115 and 240 Vac peripherals
• Temperature controls
• Solid state relays
• Lamp ballast
• Static AC power switch
• Motor control
• Incandescent lamp dimmers
0.026 (0.66)
0.169 (4.29)
0.154 (3.91)
0.094 (2.39)
0.079 (2.01)
ANODE 1
MAIN
4 TERMINAL
CATHODE 2
MAIN
3 TERMINAL
0.008 (0.20)
0.000 (0.0)
0.035 (0.89)
0.012 (0.30)
0.033 (0.85)
0.026 (0.65)
NOTE
All dimensions are in inches (millimeters)
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise specified)
Parameter
TOTAL PACKAGE
Symbol
Value
Units
Storage Temperature
TSTG
-40 to +125
°C
Junction Temperature
TJ
125
°C
TOPR
-40 to +85
°C
Continuous Forward Current
IF (avg)
60
mA
Peak Forward Current (1 µs pulse, 300 pps.)
IF (pk)
1
A
VR
3
V
PD
100
mW
IT(RMS)
70
mA (RMS)
VDRM
600
V
PD
250
mW
Operating Temperature
EMITTER
Reverse Input Voltage
Power Dissipation
(No derating required over operating temp. range)
DETECTOR
On-State RMS Current
Off-State Output Terminal Voltage
Power Dissipation
(No derating required over operating temp. range)
© 2003 Fairchild Semiconductor Corporation
Page 1 of 8
11/10/03
4-PIN FULL PITCH MINI-FLAT PACKAGE
RANDOM PHASE TRIAC DRIVER
OUTPUT OPTOCOUPLERS
FODM3051
FODM3052
FODM3053
ELECTRICAL CHARACTERISTICS (TA = 25°C Unless otherwise specified)
INDIVIDUAL COMPONENT CHARACTERISTICS
Parameter
Test Conditions
Symbol
Device
IF = 10 mA
VF
VR = 3 V
IR
Peak Blocking Current Either Direction
VDRM = 600V, IF = 0 (note 1)
Peak On-State Voltage Either Direction
Min
Typ*
Max
Unit
All
1.20
1.5
V
All
0.01
100
µA
IDRM
All
3
100
nA
ITM = 100mA peak
VTM
All
2.0
2.5
V
IF = 0 (Figure 8, note 2)
dV/dt
All
EMITTER
Input Forward Voltage
Reverse Leakage Current
DETECTOR
Critical Rate of Rise of Off-State Voltage
1000
V/µs
TRANSFER CHARACTERISTICS (TA = 25°C Unless otherwise specified)
DC Characteristics
LED Trigger Current
Test Conditions
Main Terminal
Voltage = 3V (note 3)
Holding Current, Either Direction
Symbol
Device
IFT
FODM3051
FODM3052
FODM3053
IH
All
Min
Typ*
Max
Unit
15
10
5
mA
300
µA
ISOLATION CHARACTERISTICS (TA = 25°C Unless otherwise specified)
Characteristic
Test Conditions
Symbol
Device
Min
t = 1 Minute
VISO
All
3750
Steady State Isolation Voltage
Typ*
Max
Unit
V(RMS)
* All typicals at TA = 25°C
Note
1. Test voltage must be applied within dv/dt rating.
2. This is static dv/dt. See Figure 1 for test circuit. Commutating dv/dt is function of the load-driving thyristor(s) only.
3. All devices are guaranteed to trigger at an IF value less than or equal to max IFT. Therefore, recommended operating IF lies
between max IFT (15 mA for FODM3051, 10 mA for FODM3052, 5 mA for FODM3053) and absolute max IF (60 mA).
© 2003 Fairchild Semiconductor Corporation
Page 2 of 8
11/10/03
4-PIN FULL PITCH MINI-FLAT PACKAGE
RANDOM PHASE TRIAC DRIVER
OUTPUT OPTOCOUPLERS
FODM3051
FODM3052
FODM3053
TYPICAL PERFORMANCE CURVES
Fig. 1 LED Forward Voltage vs. Forward Current
Fig. 2 Leakage Current vs. Ambient Temperature
1000
1.7
VDRM = 600V
IDRM - LEAKAGE CURRENT (nA)
VF - FORWARD VOLTAGE (V)
1.6
1.5
1.4
1.3
TA = -40°C
1.2
TA = 25°C
1.1
100
10
1
TA = 85°C
1.0
0.1
-40
0.9
1
100
10
-20
Fig. 3 Holding Current vs. Ambient Temperature
20
40
60
80
100
Fig. 4 Trigger Current vs. Ambient Temperature
1.4
5
VTM = 3V
NORMALIZED TO TA = 25°C
NORMALIZED TO TA = 25°C
1.3
I FT - TRIGGER CURRENT (NORMALIZED)
I H - HOLDING CURRENT (NORMALIZED)
0
T A - AMBIENT TEMPERATURE (°C)
IF - FORWARD CURRENT (mA)
2
1.0
0.5
0.2
0.1
-40
-20
0
20
40
60
80
1.2
1.1
1.0
0.9
0.8
100
0.7
-40
T A - AMBIENT TEMPERATURE (°C)
100
-20
T A - AMBIENT TEMPERATURE (°C)
Fig. 6 Off-state Output Terminal Voltage vs. Ambient Temperature
IFT - LED TRIGGER CURRENT (NORMALIZED)
TA =T25°C
A
NORMALIZED TO PW IN >> 100µs
10
8
6
4
2
1.4
NORMALIZED TO TA = 25°C
1.3
1.2
(NORMALIZED)
V DRM- OFF-STATE OUTPUT TERMINAL VOLTAGE
Fig. 5 LED Current Required to Trigger vs. LED Pulse Width
12
1.1
1.0
0.9
0.8
0.7
0.6
-40
0
1
10
100
-20
0
20
40
60
80
100
T A - AMBIENT TEMPERATURE (°C)
PW IN - LED TRIGGER PULSE WIDTH (µs)
© 2003 Fairchild Semiconductor Corporation
Page 3 of 8
11/10/03
4-PIN FULL PITCH MINI-FLAT PACKAGE
RANDOM PHASE TRIAC DRIVER
OUTPUT OPTOCOUPLERS
FODM3051
FODM3052
FODM3053
Fig. 7 On-State Characteristics
800
TA = 25°C
ITM - ON-STATE CURRENT (mA)
600
400
200
0
-200
-400
-600
-800
-6
-4
-2
0
2
4
6
VTM - ON-STATE VOLTAGE (V)
400V
Vdc
RTEST
R = 10 kΩ
CTEST
PULSE
INPUT
MERCURY
WETTED
RELAY
D.U.T.
X100
SCOPE
PROBE
1. The mercury wetted relay provides a high speed repeated
pulse to the D.U.T.
2. 100x scope probes are used, to allow high speeds and
voltages.
3. The worst-case condition for static dv/dt is established by
triggering the D.U.T. with a normal LED input current, then
removing the current. The variable RTEST allows the dv/dt to
be gradually increased until the D.U.T. continues to trigger in
response to the applied voltage pulse, even after the LED
current has been removed. The dv/dt is then decreased until
the D.U.T. stops triggering. τRC is measured at this point and
recorded.
Vmax = 400 V
APPLIED VOLTAGE
WAVEFORM
252 V
dv/dt =
0 VOLTS
τRC
0.63 Vmax
τRC
252
= τ
RC
Figure 8. Static dv/dt Test Circuit
© 2003 Fairchild Semiconductor Corporation
Page 4 of 8
11/10/03
4-PIN FULL PITCH MINI-FLAT PACKAGE
RANDOM PHASE TRIAC DRIVER
OUTPUT OPTOCOUPLERS
FODM3051
FODM3052
FODM3053
ORDERING INFORMATION
Option
Description
V
VDE Approved
R1
Tape and Reel (500 units)
R2
Tape and Reel (2500 units)
R3
Tape and Reel (500 units; unit 180° rotated)
R4
Tape and Reel (2500 units; unit 180° rotated)
R1V
Tape and Reel (500 units) and VDE Approved
R2V
Tape and Reel (2500 units) and VDE Approved
R3V
Tape and Reel (500 units; unit 180° rotated) and VDE Approved
R4V
Tape and Reel (2500 units; unit 180° rotated) and VDE Approved
MARKING INFORMATION
1
3051
2
V X YY M
6
3
4
5
Definitions
1
Fairchild logo
2
Device number
3
VDE mark (Note: Only appears on parts ordered with VDE
option – See order entry table)
4
One digit year code
5
Two digit work week ranging from ‘01’ to ‘53’
6
Assembly package code
© 2003 Fairchild Semiconductor Corporation
Page 5 of 8
11/10/03
4-PIN FULL PITCH MINI-FLAT PACKAGE
RANDOM PHASE TRIAC DRIVER
OUTPUT OPTOCOUPLERS
FODM3051
FODM3052
K0
FODM3053
P2
P0
t
D0
E
A0
W1
W
B0
d
F
D1
P
2.54 Pitch
Symbol
Description
Dimensions (mm)
Tape Width
W
Tape Thickness
t
0.30±0.20
Sprocket Hole Pitch
P0
4.00±0.20
12.00±0.4
Sprocket Hole Dia.
D0
1.55±0.20
Sprocket Hole Location
E
1.75±0.20
Pocket Location
F
5.50±0.20
P2
2.00±0.20
Pocket Pitch
P
8.00±0.20
Pocket Dimension
A0
4.40±0.20
B0
7.30±0.20
K0
2.30±0.20
Pocket Hole Dia.
D1
1.55±0.20
Cover Tape Width
W1
9.20
Cover Tape Thickness
d
0.065±0.02
Max. Component Rotation or Tilt
Devices Per Reel
Reel Diameter
© 2003 Fairchild Semiconductor Corporation
20˚ max
R1
500
R2
2500
R1
178 mm (7")
R2
330 mm (13")
Page 6 of 8
11/10/03
4-PIN FULL PITCH MINI-FLAT PACKAGE
RANDOM PHASE TRIAC DRIVER
OUTPUT OPTOCOUPLERS
FODM3051
FODM3052
FODM3053
Footprint Drawing for PCB Layout
0.024 (0.61)
0.060 (1.52)
0.310 (7.87)
0.190 (4.83)
0.100 (2.54)
Recommended Infrared Reflow Soldering Profile
Package Surface Temperature T (°C)
(heating)
to 30 s
230°C (peak temperature)
210°C
180°C
to 60 s
150 s
90 s
60 s
Time (s)
• Peak reflow temperature: 230°C (package surface temperature) for 30 seconds
• Time of temperature higher than 210°C: 60 seconds or less
• One time soldering reflow is recommended
© 2003 Fairchild Semiconductor Corporation
Page 7 of 8
11/10/03
4-PIN FULL PITCH MINI-FLAT PACKAGE
RANDOM PHASE TRIAC DRIVER
OUTPUT OPTOCOUPLERS
FODM3051
FODM3052
FODM3053
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO
ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME
ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR
CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body, or
(b) support or sustain life, and (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in a significant injury of the user.
© 2003 Fairchild Semiconductor Corporation
2. A critical component in any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
Page 8 of 8
11/10/03
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