Panasonic MN101CA3 Mn101ca3 sery Datasheet

MN101CA3 Series
MN101CA3F
MN101CFA3G
Mask ROM
FLASH
ROM (byte)
96K
128K
RAM (byte)
4K
10K
Type
Internal ROM type
Package (Lead-free)
Minimum Instruction
Execution Time
QFP100-P-1818B
0.1 µs (at 4.5 V to 5.5 V, 20 MHz)
0.24 µs (at 2.7 V to 5.5 V, 8.4 MHz)
0.48 µs (at 2.3 V to 5.5 V, 4.19 MHz)*
1.0 µs (at 2.0 V to 5.5 V, 2.0 MHz)*
62.5 µs (at 2.0 V to 5.5 V, 32 kHz)*
*: The lower limit for operation guarantee for flash memory built-in type is 2.5 V.
 Interrupts
RESET. Watchdog. External 0 to 6. Timer 0 to 4. Timer 6. Timer 7 (2 systems). Timer 8 (2 systems). Time base. Serial 0 (2 systems).
Serial 1 (2 systems). Serial 2. Serial 3 (2 systems). A/D conversion finish. Automatic transfer finish. FL display key scan. FL display
dimmer
 Timer Counter
8-bit timer × 6
Timer 0 ..................Square-wave/8-bit PWM output. Event count. Remote control carrier output. Simple pulse width measurement
Timer 1 ..................Square-wave output. Event count. Serial transfer clock output
Timer 2, 4 ..............Square-wave/8-bit PWM output. Serial transfer clock output. Event count. Simple pulse width measurement
Timer 3 ..................Square-wave output. Event count. Remote control carrier output. Serial transfer clock output
Timer 6 ..................8-bit freerun timer
Timer 0, 1 can be cascade-connected
Timer 2, 3 can be cascade-connected
16-bit timer × 2
Timer 7, 8 ..............Square-wave output. 16-bit PWM output (cycle/duty continuous variable). Event count. Pulse width measurement.
Input capture
Time base timer: One-minute count setting
Watchdog timer × 1
 Serial interface
Synchronous type/UART (full-duplex) × 2: Serial 0, 1
Synchronous type/Single-master I2C × 1: Serial 2
UART (full-duplex) × 1: Serial 3
 DMA controller
Maximum transfer cycles: 255
Starting factor: External request. Various types of interrupt. Software
Transfer mode: 1-byte transfer. Word transfer. Burst transfer
 I/O Pins
I/O
High Voltage
36 : Common use. Specified pull-up resistor available. Input/output selectable (bit unit)
53 : Output: 26. I/O: 27. P-ch. open drain (breakdown voltage –40 V): FL drive: 53. Specified pull-down resistor mask
option: 35
 A/D converter
8-bit × 8 channels (with S/H)
 Display control function
FL: (35 to 43) segments × (18 to 10) digits
16 levels dimmer function
Light-and-dark 2-tones display function
Can support automatic display to universal grid display tubes
Output dimmer waveform for FL driver connection (DROUT)
Internal pull down resister is available between Port 6 and Vpp, Port 9 and Vpp, Port B and Vpp, Port C and Vpp, Port D and Vpp by
Mask option (only for Mask ROM version)
Internal pull down resister between Port 4 and Vpp, Port 7 and Vpp, Port 8 and Vpp
MAD00068DEM
MN101CA3F, MN101CFA3G
 Special Ports
Buzzer output. Remote control carrier output. High-current drive port
 ROM Correction
Correcting address designation: Up to 3 addresses possible
 Pin Assignment
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
PB6, SEG28
PB7, SEG27
PC0, SEG26
PC1, SEG25
PC2, SEG24
P90, SEG23
P91, SEG22
P92, SEG21
P93, SEG20
P94, SEG19
P95, SEG18
P96, SEG17
P97, SEG16
P80, SEG15
P81, SEG14
P82, SEG13
P83, SEG12
P84, SEG11
P85, SEG10
P86, SEG9
P87, SEG8
P70, SEG7, DGT0
P71, SEG6, DGT1
P72, SEG5, DGT2
P73, SEG4, DGT3
QFP100-P-1818B
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
TXD0A, SBO0A, P00
RXD0A, SBI0A, P01
SBT0A, P02
TXD1, SBO1, P03
RXD1, SBI1, P04
SBT1, P05
BUZZER, P06
NRST, P27
VDD1
OSC2
OSC1
VSS
XI
XO
MMOD
AN0, PA0
AN1, PA1
AN2, PA2
AN3, PA3
AN4, PA4
AN5, PA5
IRQ5, AN6, PA6
IRQ6, AN7, PA7
TM8IO, P17
IRQ0, P20
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
PB5, SEG29
PB4, SEG30
PB3, SEG31
PB2, SEG32
PB1, SEG33
PB0, SEG34
PD7, SEG35
PD6, SEG36
PD5, SEG37
PD4, SEG38
PD3, SEG39
PD2, SEG40
PD1, SEG41
PD0, SEG42
VPP
P50, LED0, SBO0B, TXD0B
P51, LED1, SBI0B, RXD0B
P52, LED2, SBT0B
P10, TM0IO, RMOUT
P11, TM1IO
P12, TM2IO
P13, TM3IO
P14, TM4IO
P15, TM7IO
P16, DROUT, SSTART
MAD00068DEM
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
DGT4, SEG3, P74
DGT5, SEG2, P75
DGT6, SEG1, P76
DGT7, SEG0, P77
DGT8, P40
DGT9, P41
DGT10, P60
DGT11, P61
DGT12, P62
DGT13, P63
DGT14, P64
DGT15, P65
DGT16, P66
DGT17, P67
VDD3
VDD2
RXD3, P34
TXD3, P33
SCL, SBT2, P32
SBI2, P31
SDA, SBO2, P30
IRQ4, P24
IRQ3, P23
IRQ2, P22
ACZ, IRQ1, P21
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body.
– Any applications other than the standard applications intended.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
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20080805
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