ON CSPEMI202AG 2 channel headset microphone emi filter with esd protection Datasheet

2 Channel Headset Microphone
EMI Filter with ESD Protection
CSPEMI202AG
Features
Product Description
•
•
The CSPEMI202AG is a dual low-pass filter array
integrating two pi-style filters (C-R-C) that reduce
EMI/RFI emissions while at the same time providing
ESD protection. This part is custom-designed to
interface with a microphone port on a cellular
telephone or similar device. Each high quality filter
provides more than 35dB attenuation in the 800-2700
MHz range. These pi-style filters support bidirectional
filtering, controlling EMI both to and from a
microphone element. They also support bipolar
signals, enabling audio signals to pass through
without distortion.
•
•
•
•
•
•
•
Two channels of EMI filtering
Pi-style EMI filters in a capacitor-resistorcapacitor (C-R-C) network
Greater than 40dB attenuation at 1GHz
±8kV ESD protection on each channel
(IEC 61000-4-2 Level 4, contact discharge)
±15kV ESD protection on each channel (HBM)
Supports bipolar signals—ideal for
audio applications
Chip Scale Package features extremely low
lead inductance for optimum filter and ESD
performance
5-bump, 0.930mm X 1.410mm footprint
Chip Scale Package (CSP)
RoHS compliant (lead-free) finishing
Applications
•
•
•
•
•
•
•
EMI filtering and ESD protection for headset
microphone ports
Wireless Handsets
Handheld PCs / PDAs
MP3 Players
Digital Camcorders
Notebooks
Desktop PCs
©2010 SCILLC. All rights reserved.
April 2010 Rev. 3
In addition, the CSPEMI202AG provides a very high
level of protection for sensitive electronic components
that may be subjected to electrostatic discharge
(ESD). The diodes safely dissipate ESD strikes of
±8kV, the maximum requirement of the IEC 61000-42 international standard. Using the MIL-STD-883
(Method 3015) specification for Human Body Model
(HBM) ESD, the device provides protection for
contact discharges to greater than ±15kV.
The CSPEMI202AG is particularly well-suited for
portable electronics (e.g., cellular telephones, PDAs,
notebook computers) because of its small package
format and low weight. The CSPEMI202AG is
available in a space-saving, low-profile Chip Scale
Package with RoHS compliant lead-free finishing.
Publication Order Number:
CSPEMI202AG/D
CSPEMI202AG
Rev. 3 | Page 2 of 9 | www.onsemi.com
CSPEMI202AG
PIN DESCRIPTIONS
PIN
NAME
DESCRIPTION
A1
MIC_IN1
Microphone Input 1 (from microphone)
A3
MIC_IN2
Microphone Input 2 (from microphone)
B2
GND
C1
MIC_OUT1
Microphone Output 1 (to audio circuitry)
C3
MIC_OUT2
Microphone Output 2 (to audio circuitry)
Device Ground
Ordering Information
PART NUMBERING INFORMATION
Bumps
Package
Ordering Part Number1
Part Marking
5
CSP
CSPEMI202AGG
AD
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Rev. 3 | Page 3 of 9 | www.onsemi.com
CSPEMI202AG
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
UNITS
-65 to +150
°C
DC Power per Resistor
100
mW
DC Package Power Rating
200
mW
RATING
UNITS
-40 to +85
°C
Storage Temperature Range
STANDARD OPERATING CONDITIONS
PARAMETER
Operating Temperature Range
Rev. 3 | Page 4 of 9 | www.onsemi.com
CSPEMI202AG
ELECTRICAL OPERATING CHARACTERISTICS1
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
R1
Resistance
61
68
75
Ω
C1
Capacitance
38
47
56
pF
ILEAK
Diode Leakage Current
VIN=5.0V
1.0
μA
VSIG
Signal Voltage
Positive Clamp
Negative Clamp
ILOAD = 10mA
15
-5
V
V
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
Method 3015
b) Contact Discharge per IEC 61000-4-2
Level 4
Note 2
Clamping Voltage during ESD Discharge
MIL-STD-883 (Method 3015), 8kV
Positive Transients
Negative Transients
Notes 2 and 3
Cut-off frequency
ZSOURCE = 50Ω, ZLOAD = 50Ω
R = 68Ω, C = 47pF
VESD
VCL
fC
5
-15
7
-10
±15
kV
±8
kV
+15
-19
V
V
60
MHz
Note 1: TA=25°C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin
A1, then clamping voltage is measured at Pin C1.
Rev. 3 | Page 5 of 9 | www.onsemi.com
CSPEMI202AG
Performance Information
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 1. Insertion Loss VS. Frequency (A1-C1 to GND B2)
Figure 2. Insertion Loss VS. Frequency (A3-C3 to GND B2)
Application Information
Rev. 3 | Page 6 of 9 | www.onsemi.com
CSPEMI202AG
PARAMETER
VALUE
Pad Size on PCB
0.240mm
Pad Shape
Round
Pad Definition
Non-Solder Mask defined pads
Solder Mask Opening
0.290mm Round
Solder Stencil Thickness
0.125mm - 0.150mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
0.300mm Round
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance — Edge To Corner Ball
+50μm
Solder Ball Side Coplanarity
+20μm
Maximum Dwell Time Above Liquidous
60 seconds
Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder
Paste
Non-Solder Mask Defined Pad
0.240mm DIA.
Solder Stencil Opening
0.300mm DIA.
Solder Mask Opening
0.290mm DIA.
Figure 8. Recommended Non-Solder Mask Defined Pad Illustration
Figure 9. Lead-free (SnAgCu) Solder Ball Reflow Profile
Rev. 3 | Page 7 of 9 | www.onsemi.com
260°C
CSPEMI202AG
Mechanical Details
CSP Mechanical Specifications
The CSPEMI202AG is available in a custom Chip Scale Package (CSP). Dimensions are presented below. For
complete information on CMD’s Chip Scale Packaging, see the California Micro Devices CSP Package
Information document.
PACKAGE DIMENSIONS
Package
Custom CSP
Bumps
5
A1
SIDE
VIEW
C1
B2
B1
B4
B3
Millimeters
BOTTOM VIEW
Inches
Dim
C
Nom
Max
Min
Nom
Max
A2
Min
B
A1
0.885 0.930 0.975 0.0348 0.0366 0.0384
A2
1.365 1.410 1.455 0.0537 0.0555 0.0573
1 2 3
B1
0.495 0.500 0.505 0.0195 0.0197 0.0199
D1
0.30 DIA.
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) D2
SOLDER BUMPS
B2
0.245 0.250 0.255 0.0096 0.0098 0.0100
B3
0.430 0.435 0.440 0.0169 0.0171 0.0173
B4
0.430 0.435 0.440 0.0169 0.0171 0.0173
C1
0.165 0.215 0.265 0.0065 0.0085 0.0104
C2
0.220 0.270 0.320 0.0087 0.0106 0.0126
D1
0.562 0.606 0.650 0.0221 0.0239 0.0256
D2
0.356 0.381 0.406 0.0140 0.0150 0.0160
A
C2
# per tape and
reel
DIMENSIONS IN MILLIMETERS
Package Dimensions for
CSPEMI202AG Chip Scale Package
3500 pieces
Controlling dimension: millimeters
Rev. 3 | Page 8 of 9 | www.onsemi.com
CSPEMI202AG
CSP Tape and Reel Specifications
PART NUMBER
CHIP SIZE (mm)
POCKET SIZE (mm)
B0 X A0 X K0
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P0
P1
CSPEMI202AG
1.41 X 0.93 X 0.606
1.52 X 1.07 X 0.72
8mm
178mm (7")
3500
4mm
4mm
+
+
+
Figure 5. Tape and Reel Mechanical Data
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any
products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising
out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical”
parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating
parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the
rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to
support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or
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Rev. 3 | Page 9 of 9 | www.onsemi.com
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