TI1 LM392MX Lm392-n low power operational amplifier/voltage comparator Datasheet

LM392-N
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SNOSBT5D – APRIL 1998 – REVISED MARCH 2013
lm392-N Low Power Operational Amplifier/Voltage Comparator
Check for Samples: LM392-N
FEATURES
DESCRIPTION
•
The lm392-N series consists of 2 independent
building block circuits. One is a high gain, internally
frequency compensated operational amplifier, and the
other is a precision voltage comparator. Both the
operational amplifier and the voltage comparator
have been specifically designed to operate from a
single power supply over a wide range of voltages.
Both circuits have input stages which will commonmode input down to ground when operating from a
single power supply. Operation from split power
supplies is also possible and the low power supply
current is independent of the magnitude of the supply
voltage.
1
2
•
•
•
•
•
•
•
•
Wide Power Supply Voltage Range
– Single Supply: 3V to 32V
– Dual Supply: ±1.5V to ±16V
Low Supply Current Drain—Essentially
Independent of Supply Voltage: 600 μA
Low Input Biasing Current: 50 nA
Low Input Offset Voltage: 2 mV
Low Input Offset Current: 5 nA
Input Common-Mode Voltage Range Includes
Ground
Differential Input Voltage Range Equal to the
Power Supply Voltage
ADDITIONAL OP AMP FEATURES
– Internally Frequency Compensated for
Unity Gain
– Large DC Voltage Gain: 100 dB
– Wide Bandwidth (Unity Gain): 1 MHz
– Large Output Voltage Swing: 0V to V+ −
1.5V
ADDITIONAL COMPARATOR FEATURES
– Low Output Saturation Voltage: 250 mV at 4
mA
– Output Voltage Compatible with all Types
of Logic Systems
Application areas include transducer amplifier with
pulse shaper, DC gain block with level detector, VCO,
as well as all conventional operational amplifier or
voltage comparator circuits. Both circuits can be
operated directly from the standard 5 VDC power
supply voltage used in digital systems, and the output
of the comparator will interface directly with either
TTL or CMOS logic. In addition, the low power drain
makes the lm392-N extremely useful in the design of
portable equipment.
ADVANTAGES
•
•
•
•
•
Eliminates Need for Dual Power Supplies
An Internally Compensated Op Amp and a
Precision Comparator in the Same Package
Allows Sensing at or Near Ground
Power Drain Suitable for Battery Operation
Pin-Out is the Same as Both the LM358 Dual
Op Amp and the LM393 Dual Comparator
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1998–2013, Texas Instruments Incorporated
LM392-N
SNOSBT5D – APRIL 1998 – REVISED MARCH 2013
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Connection Diagram
Top View
(Amplifier A = Comparator)
(Amplifier B = Operational Amplifier)
Figure 1. SOIC and PDIP Packages
See Package Numbers D0008A and P0008E
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
2
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SNOSBT5D – APRIL 1998 – REVISED MARCH 2013
Absolute Maximum Ratings
(1) (2)
lm392-N
Supply Voltage, V+
32V or ±16V
Differential Input Voltage
32V
−0.3V to +32V
Input Voltage
Power Dissipation
(3)
Molded DIP (LM392N)
820 mW
Small Outline Package (LM392M)
Output Short-Circuit to Ground
(4)
Input Current (VIN < −0.3 VDC)
(5)
530 mW
Continuous
50 mA
Operating Temperature Range
0°C to +70°C
−65°C to +150°C
Storage Temperature Range
Lead Temperature (Soldering, 10 seconds)
260°C
ESD rating to be determined.
Soldering Information
Dual-in-Line Package
Soldering (10 seconds)
260°C
Small Outline Package
(1)
(2)
(3)
(4)
(5)
Vapor Phase (60 seconds)
215°C
Infrared (15 seconds)
220°C
“Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
For operating at temperatures above 25°C, the lm392-N must be derated based on a 125°C maximum junction temperature and a
thermal resistance of 122°C/W which applies for the device soldered in a printed circuit board, operating in still air ambient. The
dissipation is the total of both amplifiers—use external resistors, where possible, to allow the amplifier to saturate or to reduce the power
which is dissipated in the integrated circuit.
Short circuits from the output to V+ can cause excessive heating and eventual destruction. When considering short circuits to ground,
the maximum output current is approximately 40 mA for the op amp and 30 mA for the comparator independent of the magnitude of V+.
At values of supply voltage in excess of 15V, continuous short circuits can exceed the power dissipation ratings and cause eventual
destruction.
This input current will only exist when the voltage at any of the input leads is driven negative. It is due to the collector-base junction of
the input PNP transistors becoming forward biased and thereby acting as input diode clamps. In addition to this diode action, there is
also lateral NPN parasitic transistor action on the IC chip. This transistor action can cause the output voltages of the amplifiers to go to
the V+ voltage level (or to ground for a large overdrive) for the time duration that an input is driven negative. This is not destructive and
normal output states will re-establish when the input voltage, which was negative, again returns to a value greater than −0.3V (at 25°C).
Electrical Characteristics
(V+ = 5 VDC; specifications apply to both amplifiers unless otherwise stated)
Parameter
Input Offset Voltage
(1)
Conditions
TA = 25°C,
lm392-N
Min
(2)
Input Bias Current
IN(+) or IN(−), TA =25°C,
Input Offset Current
IN(+) − IN(−), TA = 25°C
Input Common-Mode Voltage Range
V+ = 30 VDC, TA = 25°C,
(3)
, VCM = 0V
(4)
+
Units
Typ
Max
±2
±5
mV
50
250
nA
±5
±50
nA
V+−1.5
V
0
Supply Current
RL = ∞ , V = 30 V
1
2
mA
Supply Current
RL = ∞ , V+= 5 V
0.5
1
mA
(1)
(2)
(3)
(4)
These specifications apply for V+ = 5V, unless otherwise stated. For the lm392-N, temperature specifications are limited to 0°C ≤ TA ≤
+70°C.
At output switch point, VO ≃ 1.4V, RS = 0Ω with V+ from 5V to 30V; and over the full input common-mode range (0V to V+ − 1.5V).
The direction of the input current is out of the IC due to the PNP input stage. This current is essentially constant, independent of the
state of the output so no loading change exists on the input lines.
The input common-mode voltage or either input signal voltage should not be allowed to go negative by more than 0.3V. The upper end
of the common-mode voltage range is V+ − 1.5V, but either or both inputs can go to 32V without damage.
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SNOSBT5D – APRIL 1998 – REVISED MARCH 2013
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Electrical Characteristics (continued)
(V+ = 5 VDC; specifications apply to both amplifiers unless otherwise stated) (1)
Parameter
lm392-N
Conditions
Amplifier-to-Amplifier Coupling
Min
f = 1 kHz to 20 kHz, TA = 25°C, Input Referred,
(5)
Typ
−100
(2)
Input Offset Voltage
Input Bias Current
IN(+) or IN(−)
Input Offset Current
IN(+) − IN(−)
Input Common-Mode Voltage Range
V+ = 30 VDC,
Differential Input Voltage
Keep All VIN's≥ 0 VDC (or V−, if used )
(4)
Units
Max
0
(6)
dB
±7
mV
400
nA
150
nA
V+−2
V
32
V
OP AMP ONLY
Large Signal Voltage Gain
V+ = 15 VDC, Vo swing = 1 VDC to 11 VDC, RL = 2
kΩ, TA = 25°C
25
Output Voltage Swing
RL = 2 kΩ, TA = 25°C
0
+
100
V/mV
V+−1.5
V
Common-Mode Rejection Ratio
DC, TA = 25°C, VCM= 0, VDC to V −1.5 VDC
65
70
dB
Power Supply Rejection Ratio
DC, TA = 25°C
65
100
dB
Output Current Source
VIN(+) = 1 VDC, VIN(−) = 0 VDC,
V+ = 15 VDC, Vo = 2 VDC, TA = 25°C
20
40
mA
Output Current Sink
VIN(−) = 1 VDC, VIN(+) = 0 VDC,
V+ = 15 VDC, Vo =2VDC, TA = 25°C
10
20
mA
VIN(−) = 1 VDC, VIN(+) = 0 VDC,
V+ = 15 VDC, Vo =200 mV, TA = 25°C
12
50
µA
Input Offset Voltage Drift
RS = 0Ω
7
μV/°C
Input Offset Current Drift
RS = 0Ω
10
pADC/°C
200
V/mV
300
ns
COMPARATOR ONLY
RL ≥ 15 kΩ, V+ = 15 VDC, TA = 25°C
Voltage Gain
Large Signal Response Time
(7)
50
VIN = TTL Logic Swing, VREF = 1.4 VDC
VRL = 5 VDC, RL = 5.1 kΩ, TA = 25°C
Response Time
VRL = 5 VDC, RL = 5.1 kΩ, TA = 25°C
Output Sink Current
VIN(−) =1 VDC, VIN(+) = 0 VDC,
VO ≥1.5 VDC, TA = 25°C
Saturation Voltage
VIN(−) ≥ 1 VDC, VIN(+) = 0,
ISINK ≤ 4 mA, TA = 25°C
6
1.3
µs
16
mA
250
VIN(−) ≥ 1 VDC, VIN(+) = 0,
ISINK ≤ 4 mA
Output Leakage Current
VIN(−) = 0, VIN(+) ≥ 1 VDC,
Vo = 5 VDC, TA = 25°C
VIN(−) = 0, VIN(+) ≥ 1 VDC,
Vo = 30 VDC
(5)
(6)
(7)
4
400
mV
700
mV
0.1
nA
1.0
μA
Due to proximity of external components, insure that coupling is not originating via the stray capacitance between these external parts.
This typically can be detected as this type of capacitive coupling increases at higher frequencies.
Positive excursions of input voltage may exceed the power supply level. As long as the other input voltage remains within the commonmode range, the comparator will provide a proper output state. The input voltage to the op amp should not exceed the power supply
level. The input voltage state must not be less than −0.3V (or 0.3V below the magnitude of the negative power supply, if used) on either
amplifier.
The response time specified is for a 100 mV input step with 5 mV overdrive. For larger overdrive signals 300 ns can be obtained.
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SNOSBT5D – APRIL 1998 – REVISED MARCH 2013
Schematic Diagram
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LM392-N
SNOSBT5D – APRIL 1998 – REVISED MARCH 2013
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APPLICATION HINTS
Please refer to the application hints section of the LM193 and the LM158 datasheets.
6
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LM392-N
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SNOSBT5D – APRIL 1998 – REVISED MARCH 2013
REVISION HISTORY
Changes from Revision C (March 2013) to Revision D
•
Page
Changed layout of National Data Sheet to TI format ............................................................................................................ 6
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7
PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM392M
NRND
SOIC
D
8
95
TBD
Call TI
Call TI
0 to 70
LM392
M
LM392M/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
SN | CU SN
Level-1-260C-UNLIM
0 to 70
LM392
M
LM392MX
NRND
SOIC
D
8
2500
TBD
Call TI
Call TI
0 to 70
LM392
M
LM392MX/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
SN | CU SN
Level-1-260C-UNLIM
0 to 70
LM392
M
LM392N
NRND
PDIP
P
8
40
TBD
Call TI
Call TI
0 to 70
LM
392N
LM392N/NOPB
ACTIVE
PDIP
P
8
40
Green (RoHS
& no Sb/Br)
CU SN
Level-1-NA-UNLIM
0 to 70
LM
392N
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
21-Mar-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LM392MX
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM392MX/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
21-Mar-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM392MX
SOIC
D
8
2500
367.0
367.0
35.0
LM392MX/NOPB
SOIC
D
8
2500
367.0
367.0
35.0
Pack Materials-Page 2
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