INTEGRATED CIRCUITS DATA SHEET TDA3843 Sound-IF circuit for TV AM-sound standard L and L’ Product specification File under Integrated Circuits, IC02 March 1991 Philips Semiconductors Product specification Sound-IF circuit for TV AM-sound standard L and L’ TDA3843 GENERAL DESCRIPTION The TDA3843 performs the AM-sound demodulation for the L- and L’-standard. Features • 5 to 8 V power supply and an alternative 12 V power supply • Low power consumption (200 mW) at 5 V supply voltage • New AC-coupled wideband IF-amplifier (high dynamic ranges, less intermodulation) • In-phase wideband AM demodulator without external reference circuit • Reduced THD figures even for low AF frequencies (typical 1%) • Stabilizer circuit for ripple rejection and constant output signals • All pins are ESD protected QUICK REFERENCE DATA PARAMETER SYMBOL MIN. TYP. MAX. UNIT Supply voltage (pin 14) VP1 4.5 5 8.8 V Supply voltage (pin 11) VP2 10.8 12 13.2 V Supply current I11, 14-13 − 40 48 mA Minimum IF input (RMS value) V1-16 − 70 100 µV IF control range ∆GV 60 63 − dB AF output signal (RMS value) V6-13 − 550 − mV S + W/W 50 56 − dB Signal plus weighted-noise to weighted-noise ratio (CCIR 468-3) PACKAGE OUTLINE 16-lead DIL; plastic (opposite bent leads) (SOT38WBE); SOT38-1; 1996 December 4. March 1991 2 Philips Semiconductors Product specification Sound-IF circuit for TV AM-sound standard L and L’ TDA3843 Fig.1 Block diagram. March 1991 3 Philips Semiconductors Product specification Sound-IF circuit for TV AM-sound standard L and L’ Fig.2 Input/output loading diagram. TDA3843 March 1991 4 Philips Semiconductors Product specification Sound-IF circuit for TV AM-sound standard L and L’ TDA3843 RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) PARAMETER SYMBOL MIN. MAX. UNIT Supply voltage (pin 14) VP1 4.5 8.8 V Supply voltage (pin 11) VP2 10.8 13.2 V Operating ambient temperature range Tamb 0 + 70 °C Storage temperature range Tstg −25 + 125 °C Total power dissipation at VP2 Ptot − 635 mW CHARACTERISTICS VP1 = 5 V (see note 1); Tamb = 25 °C; unless otherwise specified PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT I11 − 40 48 mA Input resistance R1-16 − 2 − kΩ Input capacitance C1-16 − 2.5 − pF note 2 V1-16 − 70 100 µV note 3 V1-16 70 100 − mV 60 63 − dB Current consumption IF amplifier Minimum IF input signal (RMS value) Maximum IF input signal (RMS value) Gain control range IF bandwidth −3 dB DC potential AM demodulator 70 − MHz − 1.7 − V V6-13 440 550 660 mV V6-13 0.02 − >100 kHz THD − 1 2 % S+W/W 50 56 − dB note 4 AF output signal (RMS value) AF bandwidth 50 V1/16-3 −3 dB, note 5 Total harmonic distortion Signal plus weighted-noise to weighted-noise ratio (CCIR 468-3) note 6 V6-13 − 1.8 − V emitter follower with 0.5 mA bias current R6 − 200 − Ω note 7 ±I6 − − 0.3 mA −I6 − − 1 mA DC potential Output resistance Allowable AC output current (peak-to-peak value) Allowable DC output current March 1991 5 Philips Semiconductors Product specification Sound-IF circuit for TV AM-sound standard L and L’ PARAMETER Ripple rejection AF signal output TDA3843 CONDITIONS SYMBOL MIN. TYP. MAX. UNIT Vripple < 200 mV (peak-to-peak), 50 to 100 Hz, measured at 70 Hz αRR = Vripple on VP/Vripple on VO αRR 30 40 − dB IF filter Proposal for sound carrier filter for L-standard Fig.5 Notes to the characteristics 1. Using the power supply voltage range VP1 = 5 to 8 V, the performance will not essentially change. Using the power supply voltage range, VP2 = 12 V, the performance will be comparable with the performance at VP1 = 5 to 8 V. The unused power supply pin must not be connected. 2. Start of gain control (low IF input signal) at −3 dB AF signal reduction at pin 6. 3. End of gain control (high IF input signal) at +1 dB AF signal expansion at pin 6. 4. Sound carrier = 32.4 MHz modulated with f = 1 kHz and a modulation depth m = 80%. IF input signal V1-16 = 10 mV (RMS value). 5. A maximum value of 100 kHz is guaranteed, but, typically a maximum value of 700 kHz is found. 6. The capacitor at pin 4 may be omitted, but then the S+W/W figure will be degraded by up to 8 dB in the IF voltage range 1 mV up to 100 mV. 7. If a higher AC output current is required, an external resistor must be connected from the output to ground. This is to increase the bias current of the emitter follower (note, the maximum allowable DC output current). March 1991 6 Philips Semiconductors Product specification Sound-IF circuit for TV AM-sound standard L and L’ TDA3843 Fig.3 Test circuit, 5 V supply. Fig.4 Test circuit, 12 V supply. March 1991 7 Philips Semiconductors Product specification Sound-IF circuit for TV AM-sound standard L and L’ TDA3843 Where SC = sound carrier and PC = picture carrier. Fig.5 AM IF filter for standard L. March 1991 8 Philips Semiconductors Product specification Sound-IF circuit for TV AM-sound standard L and L’ TDA3843 PACKAGE OUTLINE DIP16: plastic dual in-line package; 16 leads (300 mil); long body SOT38-1 ME seating plane D A2 A A1 L c e Z b1 w M (e 1) b MH 9 16 pin 1 index E 1 8 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.7 0.51 3.7 1.40 1.14 0.53 0.38 0.32 0.23 21.8 21.4 6.48 6.20 2.54 7.62 3.9 3.4 8.25 7.80 9.5 8.3 0.254 2.2 inches 0.19 0.020 0.15 0.055 0.045 0.021 0.015 0.013 0.009 0.86 0.84 0.26 0.24 0.10 0.30 0.15 0.13 0.32 0.31 0.37 0.33 0.01 0.087 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT38-1 050G09 MO-001AE March 1991 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-10-02 95-01-19 9 Philips Semiconductors Product specification Sound-IF circuit for TV AM-sound standard L and L’ TDA3843 SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. March 1991 10