CHAMP CMT02N60GN252 Power field effect transistor Datasheet

CMT02N60
POWER FIELD EFFECT TRANSISTOR
GENERAL DESCRIPTION
FEATURES
This high voltage MOSFET uses an advanced termination
‹
Robust High Voltage Termination
scheme to provide enhanced voltage-blocking capability
‹
Avalanche Energy Specified
without degrading performance over time. In addition, this
‹
Source-to-Drain Diode Recovery Time Comparable to a
Discrete Fast Recovery Diode
advanced MOSFET is designed to withstand high energy in
avalanche and commutation modes. The new energy
‹
Diode is Characterized for Use in Bridge Circuits
efficient design also offers a drain-to-source diode with a
‹
IDSS and VDS(on) Specified at Elevated Temperature
fast recovery time. Designed for high voltage, high speed
switching applications in power supplies, converters and
PWM motor controls, these devices are particularly well
suited
for
bridge
circuits
where
diode
speed
and
commutating safe operating areas are critical and offer
additional and safety margin against unexpected voltage
transients.
PIN CONFIGURATION
SYMBOL
TO-220/TO-220FP
TO-251
TO-252
Front View
Front View
Front View
N-Channel MOSFET
SOURCE
DRAIN
GATE
SOURCE
DRAIN
GATE
D
G
1
2
S
3
2
1
3
ABSOLUTE MAXIMUM RATINGS
Rating
Drain to Current - Continuous
Symbol
Value
Unit
A
ID
2.0
IDM
4.0
VGS
±20
V
VGSM
±40
V
TO-251
30
W
TO-220
83
- Pulsed
Gate-to-Source Voltage - Continue
- Non-repetitive
PD(Max)
Total Power Dissipation
TO-220FP
30
Operating and Storage Temperature Range
Single Pulse Drain-to-Source Avalanche Energy - TJ = 25℃
TJ, TSTG
-55 to 150
℃
EAS
20
mJ
θJC
1.0
℃/W
θJA
62.5
TL
260
(VDD = 100V, VGS = 10V, IL = 2A, L = 10mH, RG = 25Ω)
Thermal Resistance - Junction to Case
- Junction to Ambient
Maximum Lead Temperature for Soldering Purposes, 1/8” from case for 10 seconds
2010/12/21
Rev. 1.5
Champion Microelectronic Corporation
℃
Page 1
CMT02N60
POWER FIELD EFFECT TRANSISTOR
ORDERING INFORMATION
Part Number
Package
CMT02N60GN251*
TO-251
CMT02N60GN252*
TO-252
CMT02N60GN220*
CMT02N60GN220FP*
TO-220
TO-220 Full Package
CMT02N60XN251*
TO-251
CMT02N60XN252*
TO-252
CMT02N60XN220*
TO-220
CMT02N60XN220FP*
TO-220 Full Package
*Note: G : Suffix for Pb Free Product
X : Suffix for Halogen Free and PB Free Product
ELECTRICAL CHARACTERISTICS (Unless otherwise specified, TJ = 25℃.)
Characteristic
Drain-Source Breakdown Voltage
(VGS = 0 V, ID = 250 μA)
Drain-Source Leakage Current
(VDS = 600 V, VGS = 0 V)
(VDS = 480 V, VGS = 0 V, TJ = 125℃)
Gate-Source Leakage Current-Forward
(Vgsf = 30 V, VDS = 0 V)
Gate-Source Leakage Current-Reverse
(Vgsr = -30 V, VDS = 0 V)
Gate Threshold Voltage
(VDS = VGS, ID = 250 μA)
Static Drain-Source On-Resistance (VGS = 10 V, ID = 1.0A) *
Drain-Source On-Voltage (VGS = 10 V)
(ID = 2.0 A)
Forward Transconductance (VDS ≧ 50 V, ID = 1.0A) *
Input Capacitance
(VDS = 25 V, VGS = 0 V,
Output Capacitance
f = 1.0 MHz)
Reverse Transfer Capacitance
Turn-On Delay Time
(VDD = 300 V, ID = 2.0 A,
Rise Time
VGS = 10 V,
Turn-Off Delay Time
RG = 18Ω) *
Fall Time
Total Gate Charge
(VDS = 400 V, ID = 2.0 A,
Gate-Source Charge
VGS = 10 V)*
Gate-Drain Charge
Internal Drain Inductance
(Measured from the drain lead 0.25” from package to center of die)
Internal Drain Inductance
(Measured from the source lead 0.25” from package to source bond
pad)
SOURCE-DRAIN DIODE CHARACTERISTICS
Forward On-Voltage(1)
(IS = 2.0 A, VGS = 0 V,
Forward Turn-On Time
dIS/dt = 100A/μs)
Reverse Recovery Time
Symbol
V(BR)DSS
Min
600
CMT02N60
Typ
Max
Units
V
uA
IGSSF
1
3
100
IGSSR
100
nA
3.1
4.0
V
3.3
4.4
8.8
Ω
V
IDSS
VGS(th)
2.0
RDS(on)
VDS(on)
gFS
Ciss
Coss
Crss
td(on)
tr
td(off)
tf
Qg
Qgs
Qgd
LD
1.0
mhos
pF
pF
pF
435
56
9.2
12
21
30
24
13
2.0
6.0
4.5
LS
7.5
VSD
ton
trr
1.0
75
340
nA
ns
ns
ns
ns
nC
nC
nC
nH
nH
1.6
V
ns
ns
* Pulse Test: Pulse Width ≦300μs, Duty Cycle ≦2%
** Negligible, Dominated by circuit inductance
2010/12/21
Rev. 1.5
Champion Microelectronic Corporation
Page 2
CMT02N60
POWER FIELD EFFECT TRANSISTOR
TYPICAL ELECTRICAL CHARACTERISTICS
2010/12/21
Rev. 1.5
Champion Microelectronic Corporation
Page 3
CMT02N60
POWER FIELD EFFECT TRANSISTOR
PACKAGE DIMENSION
TO-220
TO-220FP
2010/12/21
Rev. 1.5
Champion Microelectronic Corporation
Page 4
CMT02N60
POWER FIELD EFFECT TRANSISTOR
PACKAGE DIMENSION
TO-251
2010/12/21
Rev. 1.5
Champion Microelectronic Corporation
Page 5
CMT02N60
POWER FIELD EFFECT TRANSISTOR
TO-252
2010/12/21
Rev. 1.5
Champion Microelectronic Corporation
Page 6
CMT02N60
POWER FIELD EFFECT TRANSISTOR
IMPORTANT NOTICE
Champion Microelectronic Corporation (CMC) reserves the right to make changes to its products or to discontinue any
integrated circuit product or service without notice, and advises its customers to obtain the latest version of relevant information
to verify, before placing orders, that the information being relied on is current.
A few applications using integrated circuit products may involve potential risks of death, personal injury, or severe property or
environmental damage. CMC integrated circuit products are not designed, intended, authorized, or warranted to be suitable for
use in life-support applications, devices or systems or other critical applications. Use of CMC products in such applications is
understood to be fully at the risk of the customer. In order to minimize risks associated with the customer’s applications, the
customer should provide adequate design and operating safeguards.
HsinChu Headquarter
Sales & Marketing
5F, No. 11, Park Avenue II,
Science-Based Industrial Park,
HsinChu City, Taiwan
T E L : +886-3-567 9979
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T E L : +886-2-2696 3558
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2010/12/21
Rev. 1.5
Champion Microelectronic Corporation
Page 7
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