HP HFBR-7924E Agilent hfbr-7924 and hfbr-7924e/h/eh four-channel pluggable parallel fiber optic transceiver part of the agilent metrak family Datasheet

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Agilent HFBR-7924 and
HFBR-7924E/H/EH Four-Channel
Pluggable Parallel Fiber Optic Transceiver
Part of the Agilent METRAK family
Data Sheet
Description
The HFBR-7924 transceiver is a
high performance fiber optic
module for parallel optical data
communication applications. It
incorporates 8 independent
data channels (4 for transmit
and 4 for receive) operating
from 1 to 2.7 Gb/s per channel
providing a cost effective
solution for very short reach
applications requiring 10.8 Gb/s
aggregate bandwidth. The
module is designed to operate
on multimode fiber systems at
a nominal wavelength of 850
nm. It incorporates high
performance, highly reliable,
short wavelength optical devices
coupled with proven circuit
technology to provide long life
and consistent service.
The HFBR-7924 transceiver
module incorporates a 4 channel
VCSEL (Vertical Cavity Surface
Emitting Laser) array together
with a custom 4 channel laser
driver integrated circuit
providing IEC-825 and CDRH
Class 1M laser eye safety. It also
contains a 4 channel PIN
photodiode array coupled with a
custom preamplifier / post
amplifier integrated circuit.
Operating on 3.3 V power
supply this module provides
LVTTL/LVCMOS control
interfaces and CML compatible
high speed data lines which
simplify external circuitry. The
transceiver is housed in MTP®/
MPO receptacled package with
integral finned heatsink.
Electrical connections to the
device are achieved by means of
a pluggable 10x10 connector
array.
Ordering Information
The HFBR-7924 product is
available for production orders
through the Agilent Component
Field Sales Office.
HFBR-7924
No EMI Nose
Shield
HFBR-7924E
With Extended
EMI Nose Shield
HFBR-7924H
No heatsink, No
EMI Nose Shield
HFBR-7924EH No heatsink,
with EMI Nose
Shield
Features
• Four Transmit and Four Receive
Channels; 1 to 2.7 GBd per
channel
• Compatible with SONET scrambled
and 8B10B encoded data formats
• 850 nm VCSEL array source
• Conforms to “POP4” Four-Channel
Pluggable Optical Transceiver
Multisource Agreement
• 50/125 µm multimode fiber
operation
• Distance up to 300 m with
500 MHz.km fiber at 2.5 Gb/s
• Distance up to 600 m with
2000 MHz.km fiber at 2.5 Gb/s
• Pluggable package
• Outputs (Tx & Rx) are squelched
for loss of signal
• Control I/O is compatible with
LVTTL and LVCMOS
• Standard MTP® MPO ribbon fiber
connector interface
• Integrated heat sink
• Manufactured in an ISO 9002
certified facility
• Rx Signal Detect
Applications
• Telecom and Datacom Switch/
Router Rack-to-Rack Connections
• OC-192 Very Short Reach (VSR),
OIF-VSR4-03.0, Interconnects
• Computer Cluster Interconnects
4 Channels
DIN Ch 0 - 3 +
Input
Stage
VCSEL
Array
Driver
DIN Ch 0 - 3 -
TX_DIS
TX_EN
TX_FAULT*
TX_RESET*
SD
DOUT Ch 0 - 3 +
Vcc_TX
GND_TX
Control
Vcc_RX
GND_RX
4 Channels
PIN Array
Input
Stage
Driver
DOUT Ch 0 - 3 -
Figure 1 Block Diagram (dimensions in mm)
POINT FOR TAKING
MODULE TEMPERATURE
e
er
Cod umtb
BaPrartgN
en
A il
Figure 2 - Case temperature measurement
Module Case Temperature Rise Above Ambient ( C)
25
20
15
10
5
0
0
0.5
1
Air Velocity (m/s)
Figure 3 - Ambient air temperature and air flow for TC = +80 °C
2
1.5
2
Package Dimensions
Notes:
1. Module mass approximately 20 grams.
Figure 4A - HFBR-7924 Package dimensions (dimensions in mm)
Figure 4B - HFBR-7924E Package dimensions (dimensions in mm)
3
Figure 5A - HFBR-7924H Package Dimensions (dimensions in mm)
Figure 5B - HFBR-7924EH Package Dimensions (dimensions in mm)
4
2 x ∅ 2.54 MIN. PAD KEEP-OUT
∅ 0.1 A B-C
2 x ∅ 1.7 ± 0.05 HOLES
∅ 0.1 A B-C
3 x ∅ 4.17 MIN. PAD KEEP-OUT
6.73
∅ 0.1 A B-C
B
3 x ∅ 2.69 ± 0.05 HOLES
FOR #2 SCREW
A
∅ 0.1 A B-C
SYM.
13.72
18 REF.
100 PIN FCI
MEG-Array® RECEPTACLE
CONNECTORS
18.42 MIN.
C
SYM.
9 x 1.27 TOT = 11.43
END OF
MODULE
FRONT
(10 x 10 =) 100 x ∅ 0.58 ± 0.05 PADS
∅ 0.05 A B-C
6.73
50
KEEP-OUT AREA
FOR MPO CONNECTOR
9 x 1.27 TOT = 11.43
1.89 REF.
30.23
8.95 REF.
PCB TOP VIEW
NOTE: The host electrical connector attached to the PCB must be a 100-position FCI Meg-Array ® plug (FCI PN: 84512-102) or equivalent.
Figure 6 - Package Board Footprint (dimensions in mm)
0.50 max
19.02 min
PCB
15.70 ± 0.25
Figure 7 - Host Frontplate Layout (dimensions in mm)
5
3.60 ± 0.2
13.40 ± 0.2
Front Panel
PCB
35.31+/- 0.20
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause catastrophic damage to the device. Limits apply to each parameter in
isolation, all other parameters having values within the recommended operating conditions. It should not be assumed that limiting
values of more than one parameter can be applied to the product at the same time. Exposure to the absolute maximum ratings for
extended periods can adversely affect device reliability.
Parameter
Symbol
Minimum
Maximum
Unit
Storage Temperature
TS
-40
+100
ºC
Supply Voltage
VCC
-0.5
4.6
V
Data/Control Signal Input Voltage
VI
-0.5
VCC + 0.5
V
Transmitter Differential Input Voltage
| VD |
2
V
Output Current (dc)
ID
25
mA
Relative Humidity (Non Condensing)
RH
95
%
5
Reference
1
Recommended Operating Conditions
Recommended Operating Conditions specify conditions for which the optical and electrical characteristics hold. Optical and
electrical characteristics are not specified for operation beyond the Recommended Operating Conditions, reliability is not implied
and damage to the device may occur for such operation over an extended time period.
Parameter
Symbol
Minimum Typical
Maximum Unit
Reference
Case Temperature
TC
0
+80
ºC
2, Figures 2,
Supply Voltage
VCC
Figure 8
Signaling Rate/Channel
DVDINP-P
3.465
V
1
3.135
3.3
2.7
GBd
175
1600
mVP-P
160
ps
V
Data Input Differential Peak-to-Peak
Voltage Swing
Data Input Rise & Fall Time (20-80%)
tr, tf
Control Input Voltage High
VIH
2.0
VCC
Control Input Voltage Low
VIL
VEE
0.8
V
Power Supply Noise
NP
200
mVP-P
3, Figures 11,12
4, Figure 8
Data I/O Coupling Capacitors
CAC
0.1
µF
5, Figure 9
Receiver Differential Data Output Load
RDL
100
W
Figure 9
Notes:
1. This is the maximum voltage that can be applied across the Transmitter Differential Data Inputs without damaging the input circuit.
2. Case Temperature is measured as indicated in Figure 2.
3. Data inputs are CML compatible. Coupling capacitors are required to block dc. DVDIN p-p = DVDINH - DVDINL, where DVDINH = High State Differential
Data Input Voltage and DVDINL = Low State Differential Data Input Voltage.
4. Power Supply Noise is defined at the supply side of the recommended filter for all VCC supplies over the frequency range from 500 Hz to 2700 MHz
with the recommended power supply filter in place.
5. For data patterns with restricted run lengths, e.g. 8B10B encoded data, smaller value capacitors may provide acceptable results.
6
Transmitter Electrical Characteristics
(Over recommended operating conditions: Tc= 0ºC to +80ºC, Vcc=3.3V + 5%)
Parameter
Symbol
Minimum Typical
Maximum Unit
Differential Input Impedance
Zin
80
120
FAULT* Assert time
TOFF
100
µs
Figure 13
RESET* Assert time
TOFF
7.5
µs
Figure 14
RESET* De-assert time
TON
18
ms
Figure 14
Transmit Enable (TX_EN) Assert time
TON
18
ms
Figure 15
Transmit Enable (TX_EN) De-assert time
TOFF
7.5
µs
Figure 15
Transmit Disable (TX_DIS) Assert time
TOFF
7.5
µs
Figure 15
Transmit Disable (TX_DIS) De-assert time
TON
18
ms
Figure 15
Power-On Initiation Time
100
21
Control I/Os
Input Current High
| IIH |
TX _DIS, TX_EN,
Input Current Low
| IIL |
TX_FAULT*,
Output Voltage Low
VOL
VEE
TX_RESET*
Output Voltage High
VOH
2.4
W
Reference
6, Figure 9
ms
Figure 17
0.5
mA
2.0 V < VIH < VCC
0.5
mA
VEE < VIH < 0.8 V
0.4
V
IOL = 4.0 mA
VCC
V
IOH = -0.5 mA
Transmitter Optical Characteristics
(Over recommended operating conditions: Tc= 0ºC to +80ºC, Vcc=3.3V + 5%)
Parameter
Symbol
Minimum Typical
Maximum Unit
Reference
Output Optical Power
50/125 µm, Fiber NA = 0.2
Extinction Ratio
POUT
-8.0
-4.5
-2.0
dBm avg.
7
ER
6
7.5
dB
8
Center Wavelength
lC
830
850
860
Spectral Width - rms
s
0.85
nm rms
Rise, Fall Time
tr, tf
60
150
ps
9
50
100
ps
10
RIN
-127
-121
dB/Hz
Deterministic
DJ
20
50
psp-p
11
Total
TJ
45
120
psp-p
12
Inter-channel Skew
Relative Intensity Noise
Jitter Contribution
nm
Notes:
6. Differential impedance is measured between DIN + and DIN - over the range 4 MHz to 2 GHz.
7. The specified optical output power, measured at the output of a 2 meter test cable, will be compliant with IEC 60825-1 Amendment 2, Class 1M
Accessible Emission Limits, AEL Regulatory Compliance section.
8. Extinction Ratio is defined as the ratio of the average output optical power of the transmitter in the high (“1”) state to the low (“0”) state and is
expressed in decibels (dB) by the relationship 10log(Phigh avg/Plow avg). The transmitter is driven with a 550 MBd, 101010 pattern.
9. These are unfiltered 20% - 80% values measured with a 550 MBd 101010 pattern.
10. Inter-channel Skew is defined for the condition of equal amplitude, zero ps skew input signals.
11. Deterministic Jitter (DJ) is defined as the combination of Duty Cycle Distortion (Pulse-Width Distortion) and Data Dependent Jitter. Deterministic
Jitter is measured at the 50% signal threshold level using a 2500 MBd Pseudo Random Bit Sequence of length 223-1 (PRBS-23), or equivalent, test
pattern with zero skew between the differential data input signals.
12. Total Jitter (TJ) includes Deterministic Jitter and Random Jitter (RJ). Total Jitter is specified at a BER of 10-12 for the same 2.5 GBd test pattern as
for DJ and is measured with all channels operating.
7
Receiver Electrical Characteristics
(Over recommended operating conditions: Tc= 0ºC to +80ºC, Vcc=3.3V + 5%)
Parameter
Symbol
Differential Output Impedance
ZOUT
Data Output Differential Peak-to-Peak Voltage Swing
DVDOUTP-P
Minimum Typical
Maximum Unit
100
500
Inter-channel Skew
Data Output Rise, Fall Time
tr, tf
Control I/O
Output Voltage Low
VOL
VEE
2.4
Reference
W
13, Figure 9
650
800
mVP-P
14, Figure 10
50
100
ps
15
120
150
ps
16
0.4
V
IOL = 4.0 mA
Signal Detect
Output Voltage High
VOH
V
IOH = -0.5 mA
LVTTL & LVCMOS
Assert Time (OFF-to-ON)
tSDA
50
µs
17
Compatible
De-assert Time (ON-to-OFF)
tSDD
50
µs
18
VCC
Receiver Optical Characteristics
(Over recommended operating conditions: Tc= 0ºC to +80ºC, Vcc=3.3V + 5%)
Parameter
Symbol
Input Optical Power - Sensitivity
PIN MIN
Minimum Typical
Input Optical Power - Saturation
PIN MAX
-2.0
Operating Center Wavelength
lC
830
-18
Maximum Unit
Reference
-16.0
dBm avg.
19
860
nm
dBm avg.
dBm
20
Stressed Receiver Eye Opening
Stressed Receiver Sensitivity
111
ps
21
Return Loss
12
dB
22
dBm avg.
23
Signal Detect
-11.7
-22
-17
Asserted
PA
Deasserted
PD
-31
-27
dBm avg.
Hysteresis
PA - PD
0.5
1.0
dB
Notes:
13. Measured over the range 4 MHz to 2 GHz.
14. DVDOUTP-P = DVDOUTH - DVDOUTL, where DVDOUTH = High State Differential Data Output Voltage and DVDOUTL = Low State Differential Data Output
Voltage. DVDOUTH and DVDOUTL = VDOUT+ - V DOUT-, measured with a 100 W differential load connected with the recommended coupling capacitors and
with a 2500 MBd, 101010 pattern.
15. Inter-channel Skew is defined for the condition of equal amplitude, zero ps skew input signals.
16. Rise and Fall Times are measured between the 20% and 80% levels using a 550 MHd square wave signal.
17. The Signal Detect output will change from logic “0” (Low) to “1” (High) within the specified assert time for a step transition in optical input power
from the deasserted condition to the specified asserted optical power level.
18. The Signal Detect output will change from logic “1” (High) to “0” (Low) within the specified de-assert time for a step transition in optical input power
from the specified asserted optical power level to the deasserted condition.
19. Sensitivity is defined as the average input power with the worst case, minimum, Extinction Ratio necessary to produce a BER < 10 -12 at the center of
the Baud interval. For this parameter, input power is equivalent to that provided by an ideal source, i.e. one with RIN and switching attributes that do
not degrade the sensitivity measurement. All channels not under test are operating receiving data with an average input power of up to 6 dB above
PIN MIN. Sensitivity at signal rates from 1 to 2.7 GBd is defined for a PRBS 2 23-1 test pattern.
20. The stressed receiver sensitivity is measured using 2.6 dB Inter-Symbol Interference, ISI, (min), 30 ps Duty Cycle Dependent Deterministic Jitter,
DCD DJ (min) and 6 dB ER (ER Penalty = 2.23 dB). All channels not under test are operating receiving data with an average input power of up to 6
dB, above PIN MIN.
21. The stressed receiver eye opening is measured using 2.6 dB ISI (min), 30 ps DCD DJ (min), 6 dB ER (ER Penalty = 2.23 dB) and an average input
optical power of -11.7 dBm. All channels not under test are operating receiving data with an average input power of up to 6 dB above PIN MIN.
22. Return loss is defined as the ratio, in dB, of the received optical power to the optical power reflected back down the fiber.
23. Signal Detect assertion requires all optical inputs to exhibit a minimum 6 dB Extinction Ratio at PA = -17 dBm. All channels not under test are operating with
PRBS 223-1patterns, asynchronous with the channel under test, and average input power of up to 6 dB above the specified PIN MIN.
8
General/Control Electrical Characteristics
(Over recommended operating conditions: Tc= 0ºC to +80ºC, Vcc=3.3V + 5%)
Parameter
Symbol
Supply Current
ICCT
300
400
mA
Power Dissipation
PDIST
1.0
1.39
W
Regulatory Compliance
The overall equipment design
will determine the certification
level. The module performance
is offered as a figure of merit to
assist the designer in
considering their use in
equipment designs.
Electrostatic Discharge (ESD)
There are two design cases in
which immunity to ESD damage
is important.
The first case is during handling
of the module prior to mounting
it on the circuit board. It is
important to use normal ESD
handling precautions for ESD
sensitive devices. These
precautions include using
grounded wrist straps,
workbenches and floor mats in
ESD controlled areas. The
module performance has been
shown to provide adequate
performance in typical industry
production environments.
The second case to consider is
static discharges to the exterior
of the equipment chassis
containing the module parts. To
the extent that the MT-based
connector receptacle is exposed
to the outside of the equipment
chassis it may be subject to
whatever system-level ESD test
criteria that the equipment is
intended to meet. The module
performance exceeds typical
industry equipment
requirements of today.
9
Minimum Typical
Electromagnetic Interference (EMI)
Most equipment designs using
these high-speed modules from
Agilent will be required to meet
the requirements of FCC in the
United States, CENELEC
EN55022 (CISPR 22) in Europe
and VCCI in Japan. These
modules, with their shielded
design, perform to the limits
listed in Table 1 to assist the
designer in the management of
the overall equipment EMI
performance.
Immunity
Equipment utilizing these
modules will be subject to radio
frequency electromagnetic fields
in some environments. These
modules have good immunity to
such fields due to their shielded
design.
Eye Safety
These 850 nm VCSEL-based
transceiver modules provide eye
safety by design.
The HFBR-7924 has been
registered with CDRH and
certified by TUV as a Class 1M
device under Amendment 2 of
IEC 60825-1. See the Regulatory
Compliannce Table for further
detail. If Class 1M exposure is
possible, a safety-warning label
should be placed on the product
stating the following:
LASER RADIATION
DO NOT VIEW DIRECTLY WITH
OPTICAL INSTRUMENTS.
CLASS 1M LASER PRODUCT
Maximum Unit
Reference
MTP®(MPO) Optics Cleaning
Statement
The optical port has recessed
optics that are visible through
the nose of the port. The port
plug provided should be
installed whenever a fiber cable
is not connected. This ensures
the optics remain clean and no
cleaning should be necessary. In
the event of the optics being
contaminated, forced nitrogen
or dry clean air at less than 20
psi is the recommended cleaning
agent. The features of the
optical port and guide pins
preclude the use of any solid
instrument. Liquids are not
advised due to potential
damage.
Application of wave soldering,
reflow soldering and/or aqueous
wash processes with the HFBR7924 modules device on board
is not recommended as damage
may occur.
Normal handling precautions
for electrostatic sensitive
devices should be taken (see
ESD section).
Table 1 - Regulatory Compliance
Feature
Test Method
Electrostatic Discharge (ESD to
JEDEC Human Body (HBM) (JESD22-A114-
the Electrical Pads)
B)
JEDEC Machine Model (MM)
Variation of IEC 61000-4-2
Electrostatic Discharge (ESD to
the Connector Receptacle)
Electromagnetic Interference
FCC Class B
(EMI)
Immunity
CENELEC EN55022 Class B
(CISPR 22A) VCCI Class 1
Variation of IEC 61000-4-3
Laser Eye Safety
IEC 60825-1 Amendment 2
and Equipment Type Testing
CFR 21 Section 1040
Component
Recognition
Underwriters Laboratories and Canadian
Standards Association Joint Component
Recognition
for Information Technology Equipment
Including Electrical Business Equipment.
Performance
Module > 1000 V
Module > 50 V
Typically withstand at least 6 kV (module biased) without damage
when the connector receptacle is contacted by a Human Body Model
probe
Typically pass with 5 dB margin.
(See Notes 24 and 25)
Typically show no measurable effect from a 10 V/m field swept from
80 MHz to 1 GHz applied to the module without a chassis enclosure.
IEC AEL & US FDA CDRH Class 1M
CDRH Accession Number: 9720151-22
TUV Bauart License: E2171095.04
UL File Number: E173874
Notes:
24. EMI performance only refers to shielded version (HFBR-7924E and HFBR-7924HE).
25. EMI performance could be improved by connecting the following pads to electrical ground : C9, G7 and H9.
10
4+4 Transceiver Module Pad Assignment - HFBR-7924
K
F
E
D
C
B
A
VEE RX DOUT03+ VEE RX
VEE RX
VEE TX
VEE TX
DIN03-
VEE TX
DIN00+
2 DOUT00+
VEE RX
DOUT03-
VEE RX
VEE RX
VEE TX
VEE TX
DIN03+
VEE TX
DIN00-
3
VEE RX
VEE RX
VEE RX
VEE RX
VEE RX
VEE TX
VEE TX
VEE TX
VEE TX
VEE TX
4
DOUT1+
VEE RX
DOUT02-
DNC
DNC
DNC
DNC
DIN02+
VEE TX
DIN01-
5
DOUT1-
VEE RX DOUT02+
DNC
DNC
DNC
DNC
DIN02-
VEE TX
DIN01+
6
VEE RX
VEE RX
DNC
DNC
DNC
DNC
VEE TX
VEE TX
VEE TX
DNC
DNC
DNC
DNC
VCC TX
VCC TX
VCC TX
1
7
DOUT00-
J
H
VEE RX
VCCB RX VCCB RX VCCB RX
G
8
DNC
Reserved Reserved Reserved
TBD MSA TBD MSA TBD MSA
DNC
TX_DIS
TX_EN
DNC
DNC
DNC
9
DNC
Reserved Reserved
TBD MSA TBD MSA
SD
DNC
RESET*
FAULT*
DNC
DNC
DNC
DNC
DNC
DNC
DNC
VEE TX
VCC TX
VCC TX
10
VCCA RX VCCA RX
VEE RX
TOP VIEW (PCB LAYOUT)
(10 x 10 ARRAY)
11
Table 2. Transceiver Module Pad Description
Symbol
Functional Description
Din Ch 0 - 3 +/- through
Din Ch 0 - 3 +/-
Transmitter differential data inputs for channels 0 through 3: Data inputs are CML compatible.
TX_DIS
Transmitter Disable: LVCMOS Input (Internal pull down). Control input used to turn off the transmitter
optical outputs. High Active. VCSEL array is off when High. Normal operation is enabled when Low.
TX_EN
Transmitter Enable: LVCMOS Input (Internal pull up). Control input used to enable the transmitter
optical outputs. High Active. VCSEL array is off when Low. Normal operation is enabled when High.
TX_FAULT*
Transmitter Fault: LVCMOS Output. Transmitter status output indicating an eye-safety over-current
condition for any VCSEL, an out of temperature range condition and/or a calibration data corruption
detection. High output state indicates normal operation. Low output state indicates the fault
condition. An asserted FAULT* condition disables the VCSEL array and is cleared by TX_RESET*.
TX_RESET*
Transmitter Reset: LVCMOS Input (Internal pull up). Control input used to reset the transmitter logic
functions. Active Low. VCSEL array is off when Low. Normal operation is enabled when High.
VEE_TX
Transmitter signal common. All transmitter voltages are referenced to this potential unless otherwise
stated. Directly connect these pads to the PC board transmitter ground plane.
VCC_TX
Transmitter power supply.
Dout Ch 0 - 3 +/- through
Dout Ch 0 - 3 +/-
Receiver differential data outputs for channels 0 through 3: Data outputs are CML compatible. Data
outputs are squelched for de-asserted Signal Detect.
SD
Receiver Signal Detect: LVCMOS Output. Receiver status output indicating valid signal in all
channels. High output state (asserted) indicates valid optical inputs to each and every channel. Low
output state (de-asserted) indicates loss of signal at any of the monitored receiver inputs. All
channels are monitored.
DNC
Do NOT Connect. Do not connect to any electrical potential.
VEE_RX
Receiver signal common. All receiver voltages are referenced to this potential unless otherwise
stated. Directly connect these pads to the PC board receiver ground plane.
VCCA_RX
Pin preamplifier power supply rail.
VCCB_RX
Receiver quantizer power supply rail.
VCCA_RX and VCCB_RX can be connected to the same power supply. However, to insure maximum receiver sensitivity and minimize the impact of
noise from the power supply, it is recommended to keep the power supplies separate and to use the recommended power supply filtering network
on VCCA_RX (see Figure 8).
Module Case
12
Transceiver Case Common. Transceiver Case Common incorporates all exposed conductive surfaces
and is electrically isolated from Transmitter Signal Common and Receiver Signal Common.
HFBR-7924
R5 100 Ω 0603
R6 1.0 kΩ 0603
Vcc Tx
L6 6.8 nH 0805
L5 1 µH 2220
VCC
Vcc Tx
Vcc Tx
Vcc Tx
C12
0.1 µF
0603
C11
0.1 µF
0603
C10
10 µF
1210
R4 1.0 kΩ 0603
C9
10 µF
1210
R3 100
Ω0603
VccA Rx
L4 6.8 nH 0805
L3 1 µH 2220
VCC
VccA Rx
C8
0.1 µF
0603
C7
0.1 µF
0603
C6
10 µF
1210
C5
10 µF
1210
R1 100 Ω 0603
R2 1.0 kΩ 0603
VCC
VccB Rx
L2 6.8 nH 0805
L1 1 µH 2220
VccB Rx
VccB Rx
C4
0.1 µF
0603
Figure 8 - Recommended power supply filter
13
C3
0.1 µF
0603
C2
10 µF
1210
C1
10 µF
1210
DOUT+
DIN+
CAC
RDL
RECEIVER
DOUT-
ZIN
DIN-
CAC
AC COUPLING CAPACITORS (DC BLOCKING CAPACITORS) SHOULD BE USED TO
CONNECT DATA OUTPUTS TO THE LOAD. THE DIFFERENTIAL DATA PAIR SHOULD BE
TERMINATED WITH A DIFFERENTIAL LOAD, RDL, OF 100 Ω USING EITHER AN INTERNAL
LOAD, ZIN, AS SHOWN ABOVE, OR AN EXTERNAL LOAD, IF NECESSARY.
Figure 9 - Recommended AC coupling and data signal termination
DIN+
VDI/O+
+
∆VDIN
TRANSMITTER
∆VDI/OH
-
∆VDI/OL
DINVDI/ODOUT+
+
RECEIVER
∆VDOUT
DOUT-
∆VDI/OH
+
∆VDI/O P-P
VDI/O REFERS TO EITHER VDIN
OR VDOUT AS APPROPRIATE.
∆VDI/OL
-
Figure 10 - Differential signals
VCC
VCCT
50 Ω
50 Ω
DOUT+
DIN+
50 Ω
ZIN
50 Ω
VBIAS
(NONIMAL 1.9V)
DOUT-
DINVEE
VEE
Figure 11 - Transmitter data input equivalent circuit
14
Figure 12 - Receiver data output equivalent
circuit.
NO FAULT DETECTED
FAULT DETECTED
< 100 µs
~ 100 ns
FAULT*
TX OUT Ch 0 - 3
Figure 13 - Transmitter FAULT* signal timing diagram
RESET*
FAULT*
>100 ns
18 ms (max)
~4.2 ms
TX_OUT Ch 0
SHUTDOWN
~4.6 ms
(typ)
TX_OUT Ch 1
TX_OUT Ch 2
TX_OUT Ch 3
7.5 µs (max)
Figure 14 - Transmitter RESET* timing diagram
15
NORMAL
TX_DIS
TX_EN
~ 7.5 µs
~ 7.5 µs
TX OUT Ch 0 - 3
Normal
Shutdown
TX OUT Ch 0 - 3
Normal
(a)
TX_EN [1]
Shutdown
(b)
NOTE [1]: TX_DIS, WHICH IS
NOT SHOWN, IS THE
FUNCTIONAL COMPLEMENT OF
TX_EN.
~18 ms
~4.2 ms
~4.6 ms
TX OUT Ch 0
TX OUT Ch 1
TX OUT Ch 2
TX OUT Ch 3
(c)
Figure 15 - Transmitter TX_EN and TX_DIS timing diagram
> 1 ms
~18 ms
TX_EN [1]
~ 200 ns
FAULT*
~4.2 ms
~4.6 ms
Tx OUT Ch 0
Tx OUT Ch 1
Tx OUT Ch 2
Tx OUT Ch 3
NOTE [1]. TX_DIS, WHICH IS NOT SHOWN, IS THE FUNCTIONAL COMPLEMENT OF TX_EN.
Figure 16 - Transmitter fault recovery via TX_EN timing diagram
16
Vcc > 2.8V
Vcc
~21 ms
6.5ms
NORMAL
TX_OUT 0
TX_OUT 1
TX_OUT 2
TX_OUT 3
NORMAL
~4.6ms
~4.6ms
~4.6ms
Figure 17. Typical Transmitter Power-Up Sequence
17
NORMAL
NORMAL
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Data subject to change.
Copyright © 2003 Agilent Technologies, Inc.
February 1, 2004
5989-0360EN
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