EMLSI EMP216MEAF 2mx16 pseudo static ram Datasheet

Preliminary
EMP216MEAF Series
2Mx16 Pseudo Static RAM
Document Title
2M x 16 bit Pseudo SRAM ( EMP216MEAF Series ) Specification
Revision History
Revision No.
History
Draft Date
Remark
0.0
Initial Draft
Oct. 24 , 2005
Preliminary
Emerging Memory & Logic Solutions Inc.
4F Korea Construction Financial Cooperative B/D, 301-1 Yeon-Dong, Jeju-Si, Jeju-Do, Rep.of Korea
Tel : +82-64-740-1700 Fax : +82-64-740-1749~1750 / Homepage : www.emlsi.com
Zip Code : 690-717
The attached datasheets are provided by EMLSI reserve the right to change the specifications and products. EMLSI will answer to
your questions about device. If you have any questions, please contact the EMLSI office.
Rev 0.0
Preliminary
EMP216MEAF Series
2Mx16 Pseudo Static RAM
2Mb x16 Pseudo Static RAM Specification
GENERAL DESCRIPTION
The EMP216MEAF series is 33,554,432 bits of Pseudo SRAM which uses DRAM type memory cells, but
this device has refresh-free operation and extreme low power consumption technology. Furthermore the
interface is compatible to a low power Asynchronous type SRAM. The EMP216MEAF is organized as
2,097,152 Words x 16 bit.
FEATURES
- Organization :2M x16
- Power Supply Voltage : 2.7 ~ 3.3V
- Separated I/O power(VccQ) & Core power(Vcc)
- Three state outputs
- Byte read/write control by UB# / LB#
- Support Page Read/Write operation with 16 words
- Support PASR, RMS, DPD and Auto-TCSR for power saving
- Package type : 48-FPBGA 6.0x8.0
PRODUCT FAMILY
Part Number
Operating Temp.
EMP216MEAF-70E
Power Supply
-25oC to 85oC
2.7V to 3.3V
Speed
(tRC)
70ns
Power Dissipation
Standby
Operating
(ISB1, Max.)
(ICC2, Max.)
100uA
25mA
FUNCTION BLOCK DIAGRAM
ZZ#
CS#
UB#
LB#
WE#
OE#
CONTROL
LOGIC
A0~A20
ADDRESS
DECODER
DQ0~
DQ15
Self-Refresh
CONTROL
ROW SELECT
COLUMN SELECT
Memory Array
2M X 16
Din/Dout BUFFER
I/O CIRCUIT
Rev 0.0
Preliminary
EMP216MEAF Series
2Mx16 Pseudo Static RAM
PIN DESCRIPTION ( 48-FBGA-6.00x8.00 )
2
1
3
4
5
6
A
LB#
OE#
A0
A1
A2
ZZ#
B
DQ8
UB#
A3
A4
CS#
DQ0
C
DQ9
DQ10
A5
A6
DQ1
DQ2
D
VSSQ
DQ11
A17
A7
DQ3
VCC
E
VCCQ
DQ12
DNU
A16
DQ4
VSS
F
DQ14
DQ13
A14
A15
DQ5
DQ6
G
DQ15
A19
A12
A13
WE#
DQ7
H
A18
A8
A9
A10
A11
A20
TOP VIEW (Ball Down)
Name
Function
Name
Function
CS#
Chip select inputs
LB#
Lower byte (DQ0~7)
OE#
Output enable input
UB#
Upper byte (DQ8~15)
WE#
Write enable input
VCC
Power supply
ZZ#
Low Power Control
VCCQ
I/O Power supply
DQ0-15 Data In-out
VSS(Q) Ground
A0-20
Address inputs
NC
DNU
Do Not Use
No connection
Rev 0.0
Preliminary
EMP216MEAF Series
2Mx16 Pseudo Static RAM
ABSOLUTE MAXIMUM RATINGS 1)
Parameter
Symbol
Ratings
Unit
Voltage on Any Pin Relative to Vss
VIN, VOUT
-0.2 to VCCQ+0.3V
V
Voltage on Vcc supply relative to Vss
VCC, VCCQ
-0.22) to 3.6V
V
Power Dissipation
Storage Temperature
Operating Temperature
PD
1.0
TSTG
-65 to 150
o
C
TA
-25 to 85
o
C
W
1. Stresses greater than those listed above “Absolute Maximum Ratings” may cause permanent damage to the device. Functional
operation should be restricted to recommended operating condition. Exposure to absolute maximum rating conditions for extended
periods may affect reliability.
2. Undershoot at power-off : -1.0V in case of pulse width < 20ns
FUNCTIONAL DESCRIPTION
CS#
ZZ#
OE#
WE#
LB#
UB#
DQ0~7
DQ8~15
Mode
Power
H
H
X
X
X
X
High-Z
High-Z
Deselected
Stand by
H
L
X
X
X
X
High-Z
High-Z
Deselected
Low Power Mode
X
H
X
X
H
H
High-Z
High-Z
Deselected
Stand by
L
H
H
H
L
X
High-Z
High-Z
Output Disabled
Active
L
H
H
H
X
L
High-Z
High-Z
Output Disabled
Active
L
H
L
H
L
H
Data Out
High-Z
Lower Byte Read
Active
L
H
L
H
H
L
High-Z
Data Out
Upper Byte Read
Active
L
H
L
H
L
L
Data Out
Data Out
Word Read
Active
L
H
X
L
L
H
Data In
High-Z
Lower Byte Write
Active
L
H
X
L
H
L
High-Z
Data In
Upper Byte Write
Active
L
H
X
L
L
L
Data In
Data In
Word Write
Active
Note: X means don’t care. (Must be low or high state)
Rev 0.0
Preliminary
EMP216MEAF Series
2Mx16 Pseudo Static RAM
RECOMMENDED DC OPERATING CONDITIONS 1)
Parameter
Symbol
Min
Typ
Max
Unit
VCC
2.7
3.0
3.3
V
VCCQ
2.7
3.0
3.3
V
VSS, VSSQ
0
0
0
V
Input high voltage
VIH
0.8 * VCCQ
-
VCCQ + 0.22)
V
Input low voltage
VIL
-
0.2 * VCCQ
V
Supply voltage
Ground
1.
2.
3.
4.
-0.23)
TA= -25 to 85oC, otherwise specified
Overshoot: VCC +1.0 V in case of pulse width < 20ns
Undershoot: -1.0 V in case of pulse width < 20ns
Overshoot and undershoot are sampled, not 100% tested.
CAPACITANCE1) (f =1MHz, TA=25oC)
Item
Symbol
Test Condition
Min
Max
Unit
Input capacitance
CIN
VIN=0V
-
8
pF
Input/Ouput capacitance
CIO
VIO=0V
-
8
pF
1. Capacitance is sampled, not 100% tested
DC AND OPERATING CHARACTERISTICS
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
Input leakage current
ILI
VIN=VSS to VCCQ , VCC=VCCmax
-1
-
1
uA
Output leakage current
ILO
CS#=VIH , ZZ#=VIH , OE#=VIH or WE#=VIL ,
VIO=VSS to VCCQ , VCC=VCCmax
-1
-
1
uA
ICC1
Cycle time=1µs, 100% duty, IIO=0mA,
CS#<0.2V, ZZ#=VIH , VIN<0.2V or VIN>VCCQ-0.2V
-
-
3
mA
ICC2
Cycle time = Min, IIO=0mA, 100% duty,
CS#=VIL, ZZ#=VIH, VIN=VIL or VIH
-
-
25
mA
Output low voltage
VOL
IOL = 0.5mA, VCC=VCCmin
-
-
0.2*VCCQ
V
Output high voltage
VOH
IOH = -0.5mA, VCC=VCCmin
0.8*VCCQ
-
-
V
Standby Current (CMOS)
ISB
-
-
100
uA
Average operating current
CS#,ZZ#>VCCQ-0.2V, Other inputs = 0 ~ VCCQ
(Typ. condition : VCC=3.0V @ 25oC)
(Max. condition : VCC=3.3V @ 85oC)
1. Maximum Icc specifications are tested with VCC = VCCmax.
Rev 0.0
Preliminary
EMP216MEAF Series
2Mx16 Pseudo Static RAM
AC OPERATING CONDITIONS
Test Conditions (Test Load and Test Input/Output Reference)
Dout
Input Pulse Level : 0.2V to VCCQ-0.2V
Input Rise and Fall Time : 5ns
Input and Output reference Voltage : VCCQ/2
CL1)
1)
Output Load (See right) : CL = 30pF
1. Including scope and Jig capacitance
AC CHARACTERISTICS (Vcc = 2.7 to 3.3V, Gnd = 0V, TA = -25C to +85oC)
Symbol
Parameter List
Read
Write
Page
Speed
Min
Max
Unit
Read Cycle Time
tRC
70
20k
ns
Address access time
tAA
-
70
ns
Chip enable to data output
tCO
-
70
ns
Output enable to valid output
tOE
-
25
ns
UB#, LB# enable to data output
tBA
-
70
ns
Chip enable to low-Z output
tLZ
10
-
ns
UB#, LB# enable to low-Z output
tBLZ
10
-
ns
Output enable to low-Z output
tOLZ
5
-
ns
Chip disable to high-Z output
tHZ
0
15
ns
UB#, LB# disable to high-Z output
tBHZ
0
15
ns
Output disable to high-Z output
tOHZ
0
15
ns
Output hold from Address change
tOH
5
-
ns
Write Cycle Time
tWC
70
20k
ns
Chip enable to end of write
tCW
60
-
ns
Address setup time
tAS
0
-
ns
Address valid to end of write
tAW
60
-
ns
UB#, LB# valid to end of write
tBW
60
-
ns
Write pulse width
tWP
50
-
ns
Write recovery time
tWR
0
-
ns
Write to output high-Z
tWHZ
0
15
ns
Data to write time overlap
tDW
20
-
ns
Data hold from write time
tDH
0
-
ns
End write to output low-Z
tOW
5
-
ns
Maximum cycle time
tMRC
-
20k
ns
Page mode cycle time
tPC
25
-
ns
Page mode address access time
tPAA
-
25
ns
Rev 0.0
Preliminary
EMP216MEAF Series
2Mx16 Pseudo Static RAM
TIMING DIAGRAMS
READ CYCLE (1) (Address controlled, CS#=OE#=VIL, ZZ#=WE#=VIH, UB# or/and LB#=VIL)
tRC
Address
tAA
tOH
Data Out
Data Valid
Previous Data Valid
READ CYCLE (2) (ZZ#=WE#=VIH)
tRC
Address
tAA
CS#
tOH
tCO
tHZ
tBA
LB#, UB#
tBHZ
tOE
OE#
Data Out
tOLZ
High-Z
tBLZ
tOHZ
Data Vaild
tLZ
NOTES (READ CYCLE)
1. tHZ , tBHZ and tOHZ are defined as the time at which the outputs achieve the open circuit conditions and are not referenced
to output voltage levels.
2. Do not Access device with cycle timing shorter than tRC for continuous periods > 20us.
Rev 0.0
Preliminary
EMP216MEAF Series
2Mx16 Pseudo Static RAM
PAGE READ CYCLE (ZZ#=WE#=VIH, 16 Words access)
tMRC
Address
(A20~A4)
tRC
Address
(A3~A0)
tPC
tPC
tPC
tPC
tAA
tCO
tOH
CS#
tHZ
tBA
LB#,UB#
tBHZ
tOE
OE#
Data
Out
tPAA
tOLZ
High-Z
tBLZ
Data Valid
tPAA
Data Valid
tPAA
tPAA
Data Valid
Data Valid
tOHZ
Data Valid
tLZ
NOTES (READ CYCLE)
1. tHZ , tBHZ and tOHZ are defined as the time at which the outputs achieve the open circuit conditions and are not referenced
to output voltage levels.
2. Do not Access device with cycle timing shorter than tRC for continuous periods > 20us.
Rev 0.0
Preliminary
EMP216MEAF Series
2Mx16 Pseudo Static RAM
WRITE CYCLE (1) (WE# controlled, ZZ#=VIH)
tWC
Address
tAW
tCW
CS#
tBW
LB#,UB#
WE#
tAS
Data In
tWR
tWP
tDH
tDW
High-Z
Data Valid
tWHZ
tOW
Data Undefined
Data Out
WRITE CYCLE (2) (CS# controlled, ZZ#=VIH)
tWC
Address
tAS
CS#
tWR
tCW
tAW
LB#,UB#
tBW
WE#
tWP
tDH
tDW
Data In
Data Out
Data Valid
High-Z
WRITE CYCLE (3) (UB#/LB# controlled, ZZ#=VIH)
tWC
Address
tWR
tCW
CS#
tAW
LB#,UB#
tAS
tBW
tWP
WE#
tDW
Data Valid
Data In
Data Out
tDH
High-Z
Rev 0.0
Preliminary
EMP216MEAF Series
2Mx16 Pseudo Static RAM
PAGE WRITE CYCLE (ZZ#=VIH, 16 Words access)
tMRC
Address
(A20~A4)
tWC
tPC
tPC
tPC
tPC
Address
(A3~A0)
CS#
LB#,UB#
tAS
WE#
tDW
Data In
High-Z
tWHZ
tDH
Data Valid
tDW
tDH
Data Valid
tDW
tDH
Data Valid
tDW
tDH
Data Valid
tDW
tDH
Data Valid
tOW
Data Out
NOTES (WRITE CYCLE)
1. A write occurs during the overlap(tWP) of low CS#, low WE# and low UB# or LB#. A write begins at the last
transition among low CS# and low WE# with asserting UB# or LB# low for single byte operation or simultaneously
asserting UB# and LB# low for word operation. A write ends at the earliest transition among high CS# and high WE#.
The tWP is measured from the beginning of write to the end of write.
2. tCW is measured from CS# going low to end of write.
3. tAS is measured from the address valid to the beginning of write.
4. tWR is measured from the end of write to the address change. tWR applied in case a write ends as CS# or WE# going high.
5. Do not Access device with cycle timing shorter than tWC for continuous periods > 20us.
Rev 0.0
Preliminary
EMP216MEAF Series
2Mx16 Pseudo Static RAM
LOW POWER MODES
Mode Register Set
A20 ~ A5
A4
A3
A2
All 0
(Reserved for
future)
DPD
Enable/Disable
Array Mode
Selection
Array Half
Selection
DPD Enable / Disable
A1
A0
Array Refresh Area Selection
Array Mode Selection
A4
Type
A3
Type
0
Deep Power Down Enable
0
Partial Array Refresh Mode (Default)
1
DPD Disable (Default)
1
Reduced Memory Size Mode
Array Half Selection (Top/Down)
Array Refresh Area Selection
A2
Type
A1
A0
Type
0
Bottom (Default)
0
0
Full Array (Default)
1
Top
0
1
RFU (Reserved for future)
1
0
1/2 Array
1
1
1/4 Array
NOTES
1. The Partial Array Refresh and Deep Power Down mode is issued only during ZZ# low state.
2. The RMS (Reduced Memory Size) mode is enabled after ZZ# goes high and remains enabled after ZZ# goes high. To
change to a different mode, the mode register will have to be re-written.
3. If register is written to enable the Deep Power Down, the part will go into Deep Power Down during the following time that
ZZ# is driven low and there is no MRS update. When ZZ# is driven high, all of the register settings will return to dafault state
for the part (i.e. full array refresh, Deep Power Down disabled.)
Mode Register Set UpdateTiming Diagram
tWC
Address
tCW
CS#
tWR
tAS
tAW
LB#,UB#
tBW
tWP
WE#
tZZWE
ZZ#
NOTES
Register write start
Register write complete
Register update complete
The register update takes place after over the tZZWE maximum time of 1us. Once the register is updated the next time ZZ#
goes low, without any updates to the register starting within the tZZWE maximum time of 1us, the part will refresh the array
selected. The data bus is a don’t care when ZZ# is low during the register updates.
Rev 0.0
Preliminary
EMP216MEAF Series
2Mx16 Pseudo Static RAM
LOW POWER MODES
Deep Power Down Mode Entry & Exit
~
~~
~
tWC
A4
tWR
~
~
tCW
tAS
tAW
tBW
~
~~
~
CS#
UB#,LB#
~
~~
~
tWP
WE#
tZZWE
tZZmin
~
~
ZZ#
tR
Normal
operation
Register Write Start
Deep Power Down Exit
Parameter
Description
Min
Max
Unit
tZZWE
ZZ# low to Write Enable Low
0
1
us
tR(Deep Power Down mode only)
Operation Recovery Time
200
-
us
tZZmin
Low Power Mode Time
10
-
us
Rev 0.0
Preliminary
EMP216MEAF Series
2Mx16 Pseudo Static RAM
Address Information for PASR mode and RMS mode
Partial Array Self Refresh Mode (A3=0, A4=1)
A2
A1
A0
Refresh Section
Address
Size
Density
0
1
1
1/4
000000h~07FFFFh
512Kb x 16
8Mb
0
1
0
1/2
000000h~0FFFFFh
1Mb x 16
16Mb
X
0
0
Full
000000h~1FFFFFh
2Mb x 16
32Mb
1
1
1
1/4
180000h~1FFFFFh
512Kb x 16
8Mb
1
1
0
1/2
100000h~1FFFFFh
1Mb x 16
16Mb
Reduced Memory Size Mode (A3=1, A4=1)
A2
A1
A0
Refresh Section
Address
Size
Density
0
1
1
1/4
000000h~07FFFFh
512Kb x 16
8Mb
0
1
0
1/2
000000h~0FFFFFh
1Mb x 16
16Mb
1
1
1
1/4
180000h~1FFFFFh
512Kb x 16
8Mb
1
1
0
1/2
100000h~1FFFFFh
1Mb x 16
16Mb
Low Power Mode Characteristics
Parameter
Symbol
Deep Power Down Current
IZZ
Partial Array Refresh Mode
Standby Current
Reduced Memory Size
Mode Standby Current
IZZa
IZZb
Test Conditions
ZZ# < 0.2V, Other inputs = 0 ~ VCCQ
(Max. condition : VCC=3.3V @ 85oC)
Array
Min
Typ
Max
Unit
No Refresh
-
-
10
uA
1/4 Array
-
-
65
uA
1/2 Array
-
-
75
uA
ISB1a
RMS mode. Other inputs = 0 ~ VCCQ
1/4 Array
-
-
65
uA
ISB1b
(Max. condition : VCC=3.3V @ 85oC)
1/2 Array
-
-
75
uA
Rev 0.0
Preliminary
EMP216MEAF Series
2Mx16 Pseudo Static RAM
TIMING WAVEFORM OF POWER UP
200us
VCC(Min.)
VCC
CS#
Power Up Mode
Normal Operation
NOTE ( POWER UP )
1. After Vcc reaches Vcc(Min.) , wait 200us with CS# high. Then you get into the normal operation.
Rev 0.0
Preliminary
EMP216MEAF Series
2Mx16 Pseudo Static RAM
PACKAGE DIMENSION
48 Ball Fine Pitch BGA (0.75mm ball pitch)
Bottom View
Top View
A1 corner index area
A1 index Mark
B
B1
B
6
5
4
3
2
1
A
B
C
C1
C
C
D
E
C/2
F
G
H
B/2
Side View
4
E2(Seating plane)
A
3
D(Diameter)
Detail A
0.25 Typ.
E1
E
C
5
Min.
Typ.
Max.
A
-
0.75
-
B
5.90
6.00
6.10
B1
-
3.75
-
C
7.90
8.00
8.10
C1
-
5.25
-
D
0.30
0.35
0.40
E
-
1.00
1.10
E1
-
0.75
-
E2
0.20
0.25
0.30
R
-
-
0.08
R
0.75 Typ.
C
A
NOTES
1. Dimensioning and tolerancing per ASME Y14.5M-1994.
2. All dimensions are millimeters.
3. Dimension “D” is measured at the maximum solder ball
diameter in a plane parallel to datum C.
4. Primary datum C (Seating plane) is defined by the crown
of the solder balls.
5. This is a controlling dimension.
Rev 0.0
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