DIODES AP2161DMPG-13

AP2161D/AP2171D
1A SINGLE CHANNEL CURRENT-LIMITED POWER
SWITCH WITH OUTPUT DISCHARGE
NEW PRODUCT
Description
Pin Assignments
The AP2161D and AP2171D are integrated high-side power
switches optimized for Universal Serial Bus (USB) and other
hot-swap applications. The family of devices complies with
USB 2.0 and available with both polarities of Enable input.
They offer current and thermal limiting and short circuit
protection as well as controlled rise time and under-voltage
lockout functionality. A 7ms deglitch capability on the opendrain Flag output prevents false over-current reporting and
does not require any external components.
( Top View )
GND
1
8
NC
IN
2
7
OUT
IN
3
6
OUT
EN 4
5
FLG
All devices are available in SOT25, SO-8, MSOP-8-EP, and
DFN2018-6 packages.
SO-8
Features
( Top View )
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Single USB port power switches with output discharge
Over-current and thermal protection
1.5A accurate current limiting
Fast transient response
Reverse Current Blocking
90mΩ on-resistance
Input voltage range: 2.7V – 5.5V
0.6ms typical rise time
Very low shutdown current: 1uA (max)
Fault report (FLG) with blanking time (7ms typ)
ESD protection: 4KV HBM, 300V MM
Active high (AP2171D) or active low (AP2161D) enable
Ambient temperature range -40ºC to 85°C
SOT25, SO-8, MSOP-8-EP (Exposed Pad), and
DFN2018-6: Available in “Green” Molding Compound
(No Br, Sb)
Lead Free Finish / RoHS Compliant (Note 1)
UL Recognized, File Number E322375 (pending)
IEC60950-1 CB Scheme Certified
GND
1
8
NC
IN
2
7
OUT
IN
3
6
OUT
EN
4
5
FLG
MSOP-8-EP
( Top View )
OUT
1
GND
2
FLG
3
5
IN
4
EN
SOT25
Applications
( Top View )
•
•
•
Consumer electronics – LCD TV & Monitor, Game
Machines
Communications – Set-Top-Box, GPS, Smartphone
Computing – Laptop, Desktop, Servers, Printers, Docking
Station, HUB
GND
1
6
OUT
IN
2
5
OUT
EN
3
4
FLG
DFN2018-6
Notes:
1. EU Directive 2002/95/EC (RoHS). All applicable RoHS exemptions applied. Please visit our website at
http://www.diodes.com/products/lead_free.html.
AP2161D/2171D
Document number: DS32250 Rev. 1 - 2
1 of 18
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AP2161D/AP2171D
1A SINGLE CHANNEL CURRENT-LIMITED POWER
SWITCH WITH OUTPUT DISCHARGE
Typical Application Circuit
AP2171D Enable Active High
IN
Power Supply
2.7V to 5.5V
10k
10uF
Load
OUT
0.1uF
0.1uF
120uF
NEW PRODUCT
FLG
ON
EN
GND
OFF
Available Options
Part Number
Channel
Enable pin (EN)
AP2161D
AP2171D
1
1
Active Low
Active High
Current limit
(typical)
1.5A
1.5A
Recommended maximum
continuous load current
1A
1A
Pin Descriptions
Pin Number
Pin
Name
SO-8
MSOP-8-EP
SOT25
DFN2018-6
Descriptions
GND
1
2
1
Ground
IN
2, 3
4
2
3
Voltage input pin (all IN pins must be tied together externally)
EN
5
4
FLG
5
3
4
OUT
6, 7
1
5, 6
Voltage output pin (all OUT pins must be tied together
externally)
NC
8
N/A
N/A
No internal connection; recommend tie to OUT pins
AP2161D/2171D
Document number: DS32250 Rev. 1 - 2
Enable input, active low (AP2161D) or active high (AP2171D)
Over-current and over-temperature fault report; open-drain
flag is active low when triggered
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AP2161D/AP2171D
1A SINGLE CHANNEL CURRENT-LIMITED POWER
SWITCH WITH OUTPUT DISCHARGE
Functional Block Diagram
Current
Sense
IN
Discharge
Control
UVLO
NEW PRODUCT
Current
Limit
Driver
EN
OUT
FLG
Deglitch
Thermal
Sense
GND
Absolute Maximum Ratings
Symbol
ESD HBM
ESD MM
VIN
VOUT
VEN , VFLG
Iload
TJmax
TST
Notes:
Parameter
Human Body Model ESD Protection
Machine Model ESD Protection
Input Voltage
Output Voltage
Enable Voltage
Maximum Continuous Load Current
Maximum Junction Temperature
Storage Temperature Range (Note 2)
Ratings
4
300
6.5
VIN + 0.3
6.5
Internal Limited
150
-65 to 150
Unit
KV
V
V
V
V
A
°C
°C
2. UL Recognized Rating from -30°C to 70°C (Diodes qualified TST from -65°C to 150°C)
Recommended Operating Conditions
Symbol
VIN
IOUT
TA
Parameter
Input voltage
Output Current
Operating Ambient Temperature
AP2161D/2171D
Document number: DS32250 Rev. 1 - 2
3 of 18
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Min
2.7
0
-40
Max
5.5
1.0
85
Unit
V
A
°C
June 2010
© Diodes Incorporated
AP2161D/AP2171D
1A SINGLE CHANNEL CURRENT-LIMITED POWER
SWITCH WITH OUTPUT DISCHARGE
Electrical Characteristics (TA = 25oC, VIN = +5.0V, unless otherwise stated)
NEW PRODUCT
Symbol
Parameter
VUVLO
Input UVLO
ISHDN
Input Shutdown Current
IQ
Test Conditions
Min
Typ.
Max
Unit
1.6
1.9
2.5
V
0.5
1
μA
Disabled, IOUT= 0
Input Quiescent Current
Enabled, IOUT= 0
45
70
μA
ILEAK
Input Leakage Current
Disabled, OUT grounded
0.1
1
μA
IREV
Reverse Leakage Current
Disabled, VIN= 0V, VOUT= 5V, IREV at VIN
0.1
1
μA
95
115
90
110
RDS(ON)
Switch on-resistance
TA = 25°C SOT25, MSOP-8-EP,
SO-8
VIN = 5V,
IOUT= 1A
DFN2018-6
-40°C ≤ TA ≤ 85°C
VIN = 3.3V,
IOUT= 1A
ISHORT
140
120
TA = 25°C
-40°C ≤ TA ≤ 85°C
mΩ
140
170
Short-Circuit Current Limit
Enabled into short circuit, CL=22μF
ILIMIT
Over-Load Current Limit
VIN= 5V, VOUT= 4.0V, CL=120μF,-40°C ≤ TA
≤85°C
ITrig
Current limiting trigger threshold Output Current Slew rate (<100A/s) , CL=22μF
VIL
EN Input Logic Low Voltage
VIN = 2.7V to 5.5V
VIH
EN Input Logic High Voltage
VIN = 2.7V to 5.5V
ISINK
EN Input leakage
VEN = 5V
Output turn-on delay time
CL=1μF, Rload=10Ω
0.05
Output turn-on rise time
CL=1μF, Rload=10Ω
0.6
Output turn-off delay time
CL=1μF, Rload=10Ω
0.05
0.05
0.1
ms
20
40
Ω
7
15
ms
TD(ON)
TR
TD(OFF)
Output turn-off fall time
CL=1μF, Rload=10Ω
RFLG
TF
FLG output FET on-resistance
IFLG =10mA
TBlank
FLG blanking time
CIN=10uF, CL=22μF
RDIS
Discharge resistance (Note 3)
VIN = 5V, disabled, IOUT= 1mA
TDIS
1.2
1.1
1.5
A
1.9
A
2.0
A
0.8
V
1
μA
2
4
V
ms
1.5
ms
ms
100
Ω
Discharge Time
CL= 1µF, VIN = 5V, disabled to VOUT < 0.5V
0.6
ms
TSHDN
Thermal Shutdown Threshold
Enabled, Rload=1kΩ
140
°C
THYS
Thermal Shutdown Hysteresis
25
°C
SOT25 (Note 4)
θJA
Thermal Resistance Junction-to- SO-8 (Note 4)
Ambient
MSOP-8-EP (Note 5)
DFN2018-6 (Note 5)
Notes:
170
127
67
o
C/W
70
3. The discharge function is active when the device is disabled (when enable is de-asserted). The discharge function offers a resistive discharge path
for the external storage capacitor.
4. Device mounted on FR-4 4 substrate PCB, 2oz copper, with minimum recommended pad layout.
5. Device mounted on 2” x 2” FR-4 substrate PCB, 2oz copper, with minimum recommended pad on top layer and thermal vias to bottom layer ground
plane.
AP2161D/2171D
Document number: DS32250 Rev. 1 - 2
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AP2161D/AP2171D
1A SINGLE CHANNEL CURRENT-LIMITED POWER
SWITCH WITH OUTPUT DISCHARGE
Typical Performance Characteristics
VEN
50%
TD(ON)
NEW PRODUCT
10%
TD(OFF)
TR
TF
90%
50%
50%
TD(OFF)
TR
VOUT
VEN
50%
TD(ON)
90%
VOUT
10%
TF
90%
10%
90%
10%
Figure 1. Voltage Waveforms: AP2161D (left), AP2171D (right)
All Enable Plots are for AP2171D Active High
Turn-Off Delay and Fall Time
Turn-On Delay and Rise Time
Ven
5V/div
Ven
5V/div
Vout
2V/div
CL=1uF
TA=25°C
CL=1uF
RL=10Ω
TA=25°C
Vout
2V/div
RL=10Ω
100us/div
100us/div
Turn-On Delay and Rise Time
Turn-Off Delay and Fall Time
Ven
5V/div
Ven
5V/div
Vout
2V/div
CL=120uF
TA=25°C
CL=120uF
RL=10Ω
TA=25°C
RL=10Ω
Vout
2V/div
500us/div
AP2161D/2171D
Document number: DS32250 Rev. 1 - 2
500us/div
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AP2161D/AP2171D
1A SINGLE CHANNEL CURRENT-LIMITED POWER
SWITCH WITH OUTPUT DISCHARGE
Typical Performance Characteristics (Continued)
Short Circuit Current,
Device Enabled Into Short
Short Circuit with Blanking Time and Recovery
Vout
5V/div
Vflag
2V/div
NEW PRODUCT
Ven
5V/div
VIN=5V
TA=25°C
CL=22uF
Iout
500mA/div
VIN=5V
TA=25°C
CL=22uF
Iout
1A/div
100us/div
20ms/div
1 Ω Load Connected to Enabled Device
2 Ω Load Connected to Enabled Device
Vflag
2V/div
VIN=5V
TA=25°C
CL=22uF
Vflag
2V/div
VIN=5V
TA=25°C
CL=22uF
Iout
1A/div
Iout
1A/div
1ms/div
1ms/div
Power Off
Power On
TA=25°C
CL=120uF
RL=10Ω
Vflag
5V/div
Vflag
5V/div
TA=25°C
CL=120uF
RL=10Ω
Iout
500mA/div
Iout
500mA/div
Ven
5V/div
Ven
5V/div
Vout
5V/div
Vout
5V/div
20ms/div
2ms/div
AP2161D/2171D
Document number: DS32250 Rev. 1 - 2
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AP2161D/AP2171D
1A SINGLE CHANNEL CURRENT-LIMITED POWER
SWITCH WITH OUTPUT DISCHARGE
Typical Performance Characteristics (Continued)
UVLO Decreasing
UVLO Increasing
TA=25°C
CL=22uF
RL=10Ω
TA=25°C
CL=22uF
RL=10Ω
Vin
2V/div
Vin
2V/div
Iout
500mA/div
20ms/div
2ms/div
Discharge Time
No Load Resistance
Vout
2V/div
Inrush Current
TA=25°C
VIN=5V
No Load
Resistance
CL=470uF
VIN=5V
TA=25°C
RL=10Ω
CL=680uF
CL=120uF
CL=220uF
Iin
400mA/div
CL=100uF
CL=22uF
Ven
2V/div
Ven
5V/div
100ms/div
1ms/div
Turn-On Time vs Input Voltage
Turn-Off Time vs Input Voltage
800
31
700
31
600
Turn-Off Time (us)
Turn-On Time (us)
NEW PRODUCT
Iout
500mA/div
500
400
CL=1uF
RL=10Ω
TA=25°C
300
200
30
CL=1uF
RL=10Ω
TA=25°C
30
29
29
28
100
28
0
1.5
2
2.5
3
3.5
4
4.5
5
5.5
6
1.5
AP2161D/2171D
Document number: DS32250 Rev. 1 - 2
2
2.5
3
3.5
4
4.5
5
5.5
6
Input Voltage (V)
Input Voltage (V)
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AP2161D/AP2171D
1A SINGLE CHANNEL CURRENT-LIMITED POWER
SWITCH WITH OUTPUT DISCHARGE
Typical Performance Characteristics (Continued)
Fall Time vs Input Voltage
25
500
24
400
23
Fall Time (us)
Rise Time (us)
600
300
CL=1uF
RL=10Ω
TA=25°C
200
22
CL=1uF
RL=10Ω
TA=25°C
21
20
100
19
0
1.5
2
2.5
3
3.5
4
4.5
5
5.5
1.5
6
2
2.5
3
4
4.5
5
5.5
6
Supply Current, Output Disabled vs Ambient Temperature
Supply Current, Output Enabled vs Ambient Temperature
1.60
Supply Current, Output Disabled (uA)
65
Supply Current, Output Enabled (uA)
3.5
Input Voltage (V)
Input Voltage (V)
60
Vin=5.0V
55
Vin=5.5V
50
45
Vin=2.7V
40
Vin=3.3V
35
Vin=5.5V
1.40
1.20
Vin=5.0V
1.00
Vin=3.3V
0.80
0.60
Vin=2.7V
0.40
0.20
0.00
30
-60
-40
-20
0
20
40
60
80
-45
100
-25
-5
15
35
55
75
95
Ambient Temperature (°C)
Ambient Temperature (°C)
Short-Circuit Output Current vs Ambient Temperature
Static Drain-Source On-State Resistance vs Ambient
Temperature
710
Short-Circuit Output Current (mA)
200
190
Static Drain-Source On-State
Resistance (mΩ)
NEW PRODUCT
Rise Time vs Input Voltage
180
Vin=2.7V
Vin=3.3V
170
160
150
140
130
120
110
Vin=5V
100
700
Vin=3.3V
Vin=2.7V
Vin=5.0V
690
680
670
660
650
Vin=5.5V
640
630
-60
-40
-20
0
20
40
60
80
100
-60
Ambient Temperature (°C)
AP2161D/2171D
Document number: DS32250 Rev. 1 - 2
-40
-20
0
20
40
60
80
100
Ambient Temperature (°C)
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AP2161D/AP2171D
1A SINGLE CHANNEL CURRENT-LIMITED POWER
SWITCH WITH OUTPUT DISCHARGE
Typical Performance Characteristics (Continued)
Threshold Trip Current vs Input Voltage
Undervoltage Lockout vs Ambient Temperature
1.15
2.05
Threshold Trip Current (A)
Undervoltage Lockout (V)
NEW PRODUCT
2.04
2.03
UVLO Rising
2.02
2.01
2.00
1.99
UVLO Falling
1.98
1.97
1.14
1.13
1.12
TA=25°C
CL=22uF
1.11
1.96
1.10
1.95
-60
-40
-20
0
20
40
60
80
100
2.8
AP2161D/2171D
Document number: DS32250 Rev. 1 - 2
3.3
3.8
4.3
4.8
5.3
Input Voltage (V)
Ambient Temperature (°C)
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AP2161D/AP2171D
1A SINGLE CHANNEL CURRENT-LIMITED POWER
SWITCH WITH OUTPUT DISCHARGE
Application Note
The AP2161D and AP2171D are integrated high-side power switches optimized for Universal Serial Bus (USB)
that requires protection functions. The power switches are equipped with a driver that controls the gate voltage
and incorporates slew-rate limitation. This, along with the various protection features and special functions, makes
these power switches ideal for hot-swap or hot-plug applications.
Protection Features:
NEW PRODUCT
Under-voltage Lockout (UVLO)
Under-voltage lockout function (UVLO) guarantees that the internal power switch is initially off during start-up. The
UVLO functions only when the switch is enabled. Even if the switch is enabled, the switch is not turned ON until
the power supply has reached at least 1.9V. Whenever the input voltage falls below approximately 1.9V, the
power switch is turned off. This facilitates the design of hot-insertion systems where it is not possible to turn off the
power switch before input power is removed.
Over-current and Short Circuit Protection
An internal sensing FET is employed to check for over-current conditions. Unlike current-sense resistors, sense
FETs do not increase the series resistance of the current path. When an over-current condition is detected, the
device maintains a constant output current and reduces the output voltage accordingly. Complete shutdown
occurs only if the fault stays long enough to activate thermal limiting.
The different overload conditions and the corresponding response of the AP2161D/2171D are outlined below:
S.NO
1
Conditions
Short circuit condition
at start-up
Explanation
Output is shorted before
input voltage is applied or
before the part is enabled
Behavior of the AP2161D/2171D
The IC senses the short circuit and immediately
clamps output current to a certain safe level
namely ILIMIT.
2
Short-circuit or overcurrent condition
Short-Circuit or Overload
condition that occurs
when the part is enabled.
• At the instance the overload occurs, higher
current may flow for a very short period of
time before the current limit function can
react.
• After the current limit function has tripped
(reached the over-current trip threshold), the
device switches into current limiting mode
and the current is clamped at ILIMIT.
3
Gradual increase from
nominal operating
current to ILIMIT
Load increases gradually
until the current-limit
threshold.(ITRIG)
The current rises until ITRIG or thermal limit.
Once the threshold has been reached, the
device switches into its current limiting mode
and is set at ILIMIT.
Note that when the output has been shorted to GND at extremely low temperature (< -30oC), a minimum 120-μF
electrolytic capacitor on the output pin is recommended. A correct capacitor type with capacitor voltage rating and
temperature characteristics must be properly chosen so that capacitance value does not drop too low at the
extremely low temperature operation. A recommended capacitor should have temperature characteristics of less
than 10% variation of capacitance change when operated at extremely low temp. Our recommended aluminum
electrolytic capacitor type is Panasonic FC series.
AP2161D/2171D
Document number: DS32250 Rev. 1 - 2
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AP2161D/AP2171D
1A SINGLE CHANNEL CURRENT-LIMITED POWER
SWITCH WITH OUTPUT DISCHARGE
Application Note (Continued)
NEW PRODUCT
Thermal Protection
Thermal protection prevents the IC from damage when the die temperature exceeds safe margins. This mainly
occurs when heavy-overload or short-circuit faults are present for extended periods of time. The
AP2161D/AP2171D implements a thermal sensing to monitor the operating junction temperature of the power
distribution switch. Once the die temperature rises to approximately 140°C, the Thermal protection feature gets
activated as follows: The internal thermal sense circuitry turns the power switch off and the FLG output is asserted
thus preventing the power switch from damage. Hysteresis in the thermal sense circuit allows the device to cool
down to approximately 25°C before the output is turned back on. This built-in thermal hysteresis feature is an
excellent feature, as it avoids undesirable oscillations of the thermal protection circuit. The switch continues to
cycle in this manner until the load fault is removed, resulting in a pulsed output. The FLG open-drain output is
asserted when an over-current occurs with 7-ms deglitch.
Reverse Current Protection
In a normal MOSFET switch, current can flow in reverse direction (from the output side to the input side) when the
output side voltage is higher than the input side, even when the switch is turned off. A reverse-current blocking
feature is implemented in the AP21x1 series to prevent such back currents. This circuit is activated by the
difference between the output voltage and the input voltage. When the switch is disabled, this feature blocks
reverse current flow from the output back to the input.
Special Functions:
Discharge Function
When enable is de-asserted, the discharge function is active. The output capacitor is discharged through an
internal NMOS that has a discharge resistance of 100Ω. Hence, the output voltage drops down to zero. The time
taken for discharge is dependent on the RC time constant of the resistance and the output capacitor.
FLG Response
The FLG open-drain output goes active low for any of the two conditions: Over-Current or Over-Temperature. The
time from when a fault condition is encountered to when the FLG output goes low is 7-ms (TYP). The FLG output
remains low until both over-current and over-temperature conditions are removed. Connecting a heavy capacitive
load to the output of the device can cause a momentary Over-current condition, which does not trigger the FLG
due to the 7-ms deglitch timeout. This 7-ms timeout is also applicable for Over-current recovery and Thermal
recovery. The AP2161D/AP2171D is designed to eliminate erroneous Over-current reporting without the need for
external components, such as an RC delay network.
Applications Information:
Power Supply Considerations
A 0.01-μF to 0.1-μF X7R or X5R ceramic bypass capacitor between IN and GND, close to the device, is
recommended. This limits the input voltage drop during line transients. Placing a high-value electrolytic capacitor
on the input (10-μF minimum) and output pin(s) is recommended when the output load is heavy. This precaution
also reduces power-supply transients that may cause ringing on the input. Additionally, bypassing the output with
a 0.01-μF to 0.1-μF ceramic capacitor improves the immunity of the device to short-circuit transients. This
capacitor also prevents output from going negative during turn-off due to inductive parasitics.
AP2161D/2171D
Document number: DS32250 Rev. 1 - 2
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AP2161D/AP2171D
1A SINGLE CHANNEL CURRENT-LIMITED POWER
SWITCH WITH OUTPUT DISCHARGE
Application Note (Continued)
Power Dissipation and Junction Temperature
The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current.
Using the maximum operating ambient temperature (TA) and RDS(ON), the power dissipation can be calculated by:
PD = RDS(ON)× I2
NEW PRODUCT
Finally, calculate the junction temperature:
TJ = PD x RθJA + TA
Where:
TA= Ambient temperature °C
RθJA = Thermal resistance
PD = Total power dissipation
Generic Hot-Plug Applications
In many applications it may be necessary to remove modules or pc boards while the main unit is still operating.
These are considered hot-plug applications. Such implementations require the control of current surges seen by
the main power supply and the card being inserted. The most effective way to control these surges is to limit and
slowly ramp the current and voltage being applied to the card, similar to the way in which a power supply normally
turns on. Due to the controlled rise times and fall times of the AP2161D/AP2171D, these devices can be used to
provide a softer start-up to devices being hot-plugged into a powered system. The UVLO feature of the
AP2161D/AP2171D also ensures that the switch is off after the card has been removed, and that the switch is off
during the next insertion.
By placing the AP2161D/AP2171D between the VCC input and the rest of the circuitry, the input power reaches
these devices first after insertion. The typical rise time of the switch is approximately 1ms, providing a slow
voltage ramp at the output of the device. This implementation controls system surge current and provides a hotplugging mechanism for any device.
Ordering Information
AP 21 X 1 D XX G - X
Enable
Channel
Package
Green
6 : Active Low
7 : Active High
1 : 1 Channel
S : SO-8
MP : MSOP-8-EP
W : SOT25
FM : DFN2018-6
G : Green
Device
AP21X1DSG-13
AP21X1DMPG-13
AP21X1DWG-7
AP21X1DFMG-7
Notes:
Package
Code
S
MP
W
FM
Packaging
(Note 6)
SO-8
MSOP-8-EP
SOT25
DFN2018-6
Packing
7/13 : Tape & Reel
7”/13” Tape and Reel
Quantity
Part Number Suffix
2500/Tape & Reel
-13
2500/Tape & Reel
-13
3000/Tape & Reel
-7
3000/Tape & Reel
-7
6. Pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can be found on our website at
http://www.diodes.com/datasheets/ap02001.pdf.
AP2161D/2171D
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Marking Information
(1) SO-8
( Top View )
8
7
6
5
1 : 1 Channel
YY : Year : 08, 09,10~
WW : Week : 01~52; 52
represents 52 and 53 week
X : Internal Code
G : Green
Part Number
6 : Active Low
7 : Active High
AP21X X D
YY WW X X
2
1
3
4
(2) MSOP-8-EP
( Top View )
8
7
Logo
6
5
YWXE
AP21X X D
Part Number
6 : Active Low
7 : Active High
1
2
3
A~Z : Green
MSOP-8-EP
Y : Year : 0~9
W : Week : a~z : 1~26 week;
A~Z : 27~52 week; Z represents
52 and 53 week
1 : 1 Channel
4
(3) SOT25
( Top View )
5
4
7
NEW PRODUCT
Logo
XX Y W X
1
2
3
XX : Identification code
Y : Year 0~9
W : Week : A~Z : 1~26 week;
a~z : 27~52 week; z represents
52 and 53 week
X : A~Z : Green
Device
Package type
Identification Code
AP2161DW
AP2171DW
SOT25
SOT25
JC
JD
AP2161D/2171D
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Marking Information (Continued)
(4) DFN2018-6
(Top View)
XX : Identification Code
Y : Year : 0~9
W : Week : A~Z : 1~26 week;
a~z : 27~52 week; z represents
52 and 53 week
X : A~Z : Green
Device
Package type
Identification Code
AP2161DFM
AP2171DFM
DFN2018-6
DFN2018-6
JC
JD
Package Outline Dimensions (All Dimensions in mm)
0.254
0.10/0.20
3.85/3.95
5.90/6.10
(1) Package type: SO-8
Gauge Plane
Seating Plane
0.62/0.82
Detail "A"
7°~9°
0.15/0.25
1.30/1.50
1.75max.
0.35max. 45°
7°~9°
Detail "A"
0°/8°
0.3/0.5
1.27typ
4.85/4.95
5.4
8x-0.60
6x-1.27
8x-1.55
NEW PRODUCT
XX
YWX
Land Pattern Recommendation
(Unit: mm)
AP2161D/2171D
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Package Outline Dimensions (Continued)
(2) Package type: MSOP-8-EP
EXPOSED PAD
(BOTTOM)
4.4
4.7/5.1
2.9/3.1
8x-0.45
8x-1.4
6x-0.65
1
Land Pattern Recommendation
(Unit:mm)
"A"
1
0.25
0.05
2.9/3.1
Gauge plane
0.4/0.8
°
0.05/0.15
1.35/1.65
EXPOSED PAD
(BOTTOM)
0.95Ref.
0 °/ 8
0.75/0.95
0.22/0.38
1.10Max.
0.15Typ.
NEW PRODUCT
1
0.65Bsc.
DETAIL "A"
1.65/1.95
(3) Package type: SOT25
AP2161D/2171D
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Package Outline Dimensions (Continued)
0.13Typ
Seating Plane
Side View
1.75/1.875
A
0.2/0.3
CL
1.3/1.5
CL
0.9/1.1
1.95/2.075
Pin #1 ID
1.20
B
CL
C
CL
Pin #1
0.20
NEW PRODUCT
2X0.25 A
0.08 C
6x-0.35
6X-
0/0.05
0.10 C
0.47/0.53
(4) Package type: DFN2018-6
4x-0.50
6x-0.25
1.600
Land Pattern Recommendation
(Unit:mm)
2X-
Top View
0.25 B
0.50Typ
0.15/0.25
0.10
C A B
Bottom View
AP2161D/2171D
Document number: DS32250 Rev. 1 - 2
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Taping Orientation (Note 7)
NEW PRODUCT
For DFN2018-6
Notes:
7. The taping orientation of the other package type can be found on our website at http://www.diodes.com/datasheets/ap02007.pdf
AP2161D/2171D
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IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS
DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A
PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
NEW PRODUCT
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other
changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability
arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any
license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described
herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies
whose products are represented on Diodes Incorporated website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized
sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall
indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names
and markings noted herein may also be covered by one or more United States, international or foreign trademarks.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without
the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided
in the labeling can be reasonably expected to result in significant injury to the user.
B.
A critical component is any component in a life support device or system whose failure to perform can be reasonably expected
to cause the failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or
systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements
concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems,
notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further,
Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes
Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2010, Diodes Incorporated
www.diodes.com
AP2161D/2171D
Document number: DS32250 Rev. 1 - 2
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