Lineage Power HC006A6A61Z 18-36vdc input; 3.3v & 5vdc output; 6.6a - 10a output current Datasheet

Data Sheet
May 16, 2008
HC006/010 Series DC-DC Converter Power Modules:
18-36Vdc Input; 3.3V-5Vdc Output; 6.6A-10A Output Current
Features
RoHS Compliant
ƒ
Compliant to RoHS EU Directive 2002/95/EC (-Z
versions)
ƒ
Compliant to ROHS EU Directive 2002/95/EC with
lead solder exemption (non-Z versions)
ƒ
Delivers up to 10A Output current
5V (6.6A), 3.3V (10A)
ƒ
High efficiency – 90% at 3.3V full load
ƒ
Low Output voltage- supports migration to future IC
supply voltages down to 1.0V
ƒ
Low output ripple and noise
ƒ
Small Size and low profile
Applications
ƒ
Wireless Networks
ƒ
Distributed power architectures
ƒ
Optical and Access Network Equipment
ƒ
Enterprise Networks
ƒ
Latest generation IC’s (DSP, FPGA, ASIC)
and Microprocessor powered applications
Options
ƒ
Remote On/Off logic (positive or negative)
ƒ
Surface Mount (-S Suffix)
ƒ
Trimmed leads
47.2mm x 29.5mm x 8.5mm
(1.86 x 1.16 x 0.335 in)
ƒ
Surface mount or Through hole (TH)
ƒ
Remote On/Off
ƒ
Output overcurrent/Over voltage protection
ƒ
Over temperature protection
ƒ
Single Tightly regulated output
ƒ
Output voltage adjustment trim ±10%
ƒ
Wide operating temperature range (-40°C to 85°C)
ƒ
Meets the voltage insulation requirements for ETSI
300-132-2 and complies with and is Licensed for
Basic Insulation rating per EN 60950
ƒ
CE mark meets 73/23/EEC and 93/68/EEC
directives§
ƒ
UL* 60950-1Recognized, CSA† C22.2 No. 60950-1‡
03 Certified, and VDE 0805:2001-12 (EN60950-1)
Licensed
ƒ
ISO** 9001 and ISO 14001 certified manufacturing
facilities
Description
The HC series power modules are isolated dc-dc converters that operate over a wide input voltage range of 18 to 36
Vdc and provide one precisely regulated output. The output is fully isolated from the input, allowing versatile polarity
configurations and grounding connections. The modules exhibit high efficiency, e.g. typical efficiency of 90%
3.3/10A, 91% at 5V/6A. Built-in filtering for both input and output minimizes the need for external filtering. These
open frame modules are available either in surface-mount (-S) or in through-hole form.
* UL is a registered trademark of Underwriters Laboratories, Inc.
†
CSA is a registered trademark of Canadian Standards Association.
VDE is a trademark of Verband Deutscher Elektrotechniker e.V.
** ISO is a registered trademark of the International Organization of Standards
‡
Document No: DS03-122 ver. 1.44
PDF name: hc006-010_series_ds.pdf
Data Sheet
May 16, 2008
HC006/010 Series DC-DC Power Module:
18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are
absolute stress ratings only, functional operation of the device is not implied at these or any other conditions in
excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for
extended periods can adversely affect the device reliability.
Parameter
Device
Symbol
Min
Max
Unit
Input Voltage
All
VIN
Operating Ambient Temperature
All
TA
-0.3
50
Vdc
-40
85
°C
Storage Temperature
All
Tstg
-55
125
°C
I/O Isolation Voltage (100% factory tested)
All
⎯
⎯
1500
Vdc
(see Thermal Considerations section)
Electrical Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature
conditions.
Parameter
Device
Symbol
Min
Typ
Max
Unit
Operating Input Voltage
HC
VIN
18
24
36
Vdc
Maximum Input Current
HC
IIN,max
3.2
Adc
Inrush Transient
All
It
2
1
As
Input Reflected Ripple Current, peak-to-peak
(5Hz to 20MHz, 12μH source impedance; VIN=0V to
75V, IO= IOmax ; see Figure 9)
All
3
mAp-p
Input Ripple Rejection (120Hz)
All
50
dB
(VIN=0V to 75V, IO=IO, max)
EMC, EN55022
2
See EMC Considerations section
CAUTION: This power module is not internally fused. An input line fuse must always be used.
This power module can be used in a wide variety of applications, ranging from simple standalone operation to an
integrated part of a sophisticated power architecture. To preserve maximum flexibility, internal fusing is not included,
however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies
require a fast-acting fuse with a maximum rating of 5A (see Safety Considerations section). Based on the information
provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating
can be used. Refer to the fuse manufacturer’s data sheet for further information.
LINEAGE POWER
2
Data Sheet
May 16, 2008
HC006/010 Series DC-DC Power Module:
18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current
Electrical Specifications (continued)
Parameter
Output Voltage Set-point
(VIN=VIN,nom, IO=IO, max, Tref=25°C)
Output Voltage
Device
Symbol
Min
Typ
Max
Unit
3.3V
VO, set
3.25
3.3
3.35
Vdc
5.0V
VO, set
4.92
5.0
5.08
Vdc
All
VO
-3.0
⎯
+3.0
% VO, set
All
VO
-10.0
+10.0
% VO, set
(Over all operating input voltage, resistive load,
and temperature conditions until end of life)
Adjustment Range
Selected by external resistor
Output Regulation
Line (VIN=VIN, min to VIN, max)
All
⎯
⎯
0.1
% VO, set
Load (IO=IO, min to IO, max)
All
⎯
⎯
10
mV
Temperature (Tref=TA, min to TA, max)
All
⎯
0.2
⎯
% VO, set
RMS (5Hz to 20MHz bandwidth)
All
⎯
8
20
mVrms
Peak-to-Peak (5Hz to 20MHz bandwidth)
All
⎯
40
75
mVpk-pk
Output Ripple and Noise on nominal output
(VIN=VIN, nom and IO=IO, min to IO, max)
Measured across 10μF tantalum//1μF ceramic
External Load Capacitance
Output Current
(At Io < Io,min the output ripple may exceed the
The max specifications. All modules shall
Operate at no load without damage and without
exceeding 100% of VO, set )
Output Current Limit Inception
(Vo = 90% of VO, set)
Output Short-Circuit Current
(VO≤250mV)
Efficiency
VIN=VIN, nom, TA=25°C
3.3V
CO, max
0
⎯
1000
μF
5.0V
CO, max
0
⎯
470
μF
3.3V
Io
0.05
10
Adc
5.0V
Io
0.05
6.6
Adc
3.3V
IO, lim
⎯
12
⎯
Adc
5.0V
IO, lim
⎯
8
⎯
Adc
3.3V
IO, s/c
⎯
17
⎯
Adc
5.0V
IO, s/c
⎯
13
⎯
Adc
3.3V
η
⎯
90.0
⎯
%
5.0V
η
⎯
91.0
⎯
%
IO=IO, max , VO= VO,set
LINEAGE POWER
3
Data Sheet
May 16, 2008
HC006/010 Series DC-DC Power Module:
18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current
Electrical Specifications (continued)
Parameter
Switching Frequency
Device
Symbol
Min
Typ
Max
Unit
All
fsw
⎯
285
⎯
kHz
Dynamic Load Response
(ΔIo/Δt=0.1A/μs; Vin=Vin,nom; TA=25°C)
Load Change from Io= 50% to 75% of Io,max
Vpk
⎯
200
⎯
mV
All
ts
⎯
200
⎯
μs
Peak Deviation
All
Vpk
⎯
200
⎯
mV
Settling Time (Vo<10% peak deviation)
All
ts
⎯
200
⎯
μs
Peak Deviation
Settling Time (Vo<10% peak deviation)
(ΔIo/Δt=0.1A/μs; Vin=Vin,nom; TA=25°C)
Load Change from Io= 75% to 50% of Io,max
Isolation Specifications
Parameter
Symbol
Min
Typ
Max
Unit
Isolation Capacitance
Ciso
⎯
1000
⎯
pF
Isolation Resistance
Riso
10
⎯
⎯
MΩ
General Specifications
Parameter
Min
Calculated MTBF (for HC010A0F1 in accordance with Lucent RIN:
IO=80% of IO, max, TA=25°C, airflow=1m/s)
Weight
LINEAGE POWER
Typ
Max
> TBD
⎯
13 (0.46)
Unit
Hours
Weight
⎯
4
Data Sheet
May 16, 2008
HC006/010 Series DC-DC Power Module:
18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current
Feature Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature
conditions. See Feature Descriptions for additional information.
Parameter
Device
Symbol
Min
Typ
Max
Unit
All
Ion/off
⎯
0.15
1.0
mA
All
Von/off
-0.7
⎯
1.2
V
Logic High – (Typ = Open Collector)
All
Von/off
⎯
15
V
Logic High maximum allowable leakage current
All
Ion/off
⎯
⎯
50
μA
All
Tdelay
20
msec
All
Tdelay
12
msec
Remote On/Off Signal Interface
(VIN=VIN, min to VIN, max ; open collector or equivalent,
Signal referenced to VIN- terminal)
Negative Logic: device code suffix “1”
Logic Low = module On, Logic High = module Off
Positive Logic: No device code suffix required
Logic Low = module Off, Logic High = module On
Logic Low Specification
Remote On/Off Current – Logic Low
On/Off Voltage:
Logic Low
Turn-On Delay and Rise Times
(VIN=VIN, nom, IO=IO, max , VO to within ±1% of steady state)
Case 1: On/Off input is set to Logic high and then
input power is applied (delay from instant at
which VI = VI,min until Vo = 10% of Vo, set)
Case 2: Input power is applied for at least one second
and then the On/Off input is set to logic high (delay
from instant at which Von/Off = 0.9V until Vo = 10% of
Vo, set)
Output voltage Rise time (time for Vo to rise from
10% of Vo, set to 90% of Vo, set)
Output voltage overshoot
(VIN=VIN, nom, Io = 80% of Io,max, TA=25°C)
Output Overvoltage Protection
Overtemperature Protection
All
Trise
All
―
5
―
msec
―
―
5
4.6
V
%VO,
set
3.3V
VO, limit
⎯
4.0
5.0V
VO, limit
⎯
6.1
7.0
V
All
Tref
⎯
125
⎯
°C
(See Feature Descriptions)
Input Undervoltage Lockout
Turn-on Threshold
HC
⎯
16
18
V
Turn-off Threshold
HC
13
14
⎯
V
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5
Data Sheet
May 16, 2008
HC006/010 Series DC-DC Power Module:
18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current
Characteristic Curves
94
12
90
10
OUTPUT CURRENT, Io (A)
EFFICIENCY, η (%)
The following figures provide typical characteristics for the HC010A0F (3.3V, 10A) at 25ºC. The figures are identical
for either positive or negative Remote On/Off logic.
86
82
VIN = 18V
78
VIN = 24V
74
VIN = 36V
70
0
2
4
6
8
10
0.5m/s (100 LFM )
2
1.0m/s (200 LFM )
0
20
30
40
50
60
70
80
90
AMBIENT TEMPERATURE, TA C
OUTPUT VOLTAGE
VO (V) (1V/div)
TIME, t (20ms/div)
Figure 3. Transient Response to Dynamic Load
Change from 50% to 75% to 50% of full load.
LINEAGE POWER
VON/OFF(V) (10V/div)
IO (A) (2A/div)
TIME, t (100μs/div)
VO (V) (1V/div)
Figure 5. Typical Start-Up with application of Vin (VIN
=24Vdc, Io = 10A).
VO (V) (200mV/div)
Figure 2. Typical Output Ripple and Noise.
On/Off VOLTAGE OUTPUT VOLTAGE
VIN (V) (20V/div)
Figure 4. Derating Output Current versus Local
Ambient Temperature and Airflow
INPUT VOLTAGE
VO (V) (20mV/div)
OUTPUT VOLTAGE,
NC
4
OUTPUT CURRENT, OUTPUT VOLTAGE
TIME, t (1μs/div)
6
O
OUTPUT CURRENT, IO (A)
Figure 1. Converter Efficiency versus Output Current
8
TIME, t (20ms/div)
Figure 6. Typical Start-Up Using Remote On/Off,
negative logic version shown.
6
Data Sheet
May 16, 2008
HC006/010 Series DC-DC Power Module:
18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current
Characteristic Curves (continued)
The following figures provide typical characteristics for the HC006A6A (5.0V,6.6A) at 25ºC. The figures are identical
for either positive or negative Remote On/Off logic.
94%
8
OUTPUT CURRENT, Io (A)
EFFICIENCY, η (%)
90%
86%
82%
Vin=18V
78%
Vin=24V
74%
Vin=36V
70%
0
1
2
3
4
5
6
Figure 9. Transient Response to Dynamic Load
Change from 50% to 75% to 50% of full load.
1.0m/s (200 LFM )
0
20
30
40
50
60
70
80
90
VO (V) (1V/div)
VIN (V) (20V/div)
INPUT VOLTAGE, OUTPUT VOLTAGE
TIME, t (20ms/div)
VO (V) (1V/div)
Figure 11. Typical Start-Up with application of Vin (VIN
=48Vdc, Io = 6.6A).
OUTPUT VOLTAGE
TIME, t (100μs/div)
0.5m/s (100 LFM )
2
Figure 10. Derating Output Current versus Local
Ambient Temperature and Airflow
On/Off VOLTAGE
VO (V) (200mV/div)
IO (A) (2A/div)
OUTPUT CURRENT, OUTPUT VOLTAGE
Figure 8. Typical Output Ripple and Noise (VIN =24Vdc,
Io = 6.6A).
NC
3
AMBIENT TEMPERATURE, TA C
VON/OFF(V) (10V/div)
VO (V) (20mV/div)
OUTPUT VOLTAGE,
TIME, t (1μs/div)
5
O
OUTPUT CURRENT, IO (A)
Figure 7. Converter Efficiency versus Output Current
6
TIME, t (20ms/div)
Figure 12. Typical Start-Up Using Remote On/Off,
negative logic version shown (VIN =24Vdc, Io = 6.6A).
7
Data Sheet
May 16, 2008
HC006/010 Series DC-DC Power Module:
18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current
Test Configurations
Design Considerations
CURRENT PROBE
TO OSCILLOSCOPE
The power module should be connected to a low
ac-impedance source. A highly inductive source
impedance can affect the stability of the power module.
For the test configuration in Figure 13, a 33μF
electrolytic capacitor (ESR<0.7Ω at 100kHz), mounted
close to the power module helps ensure the stability of
the unit. Consult the factory for further application
guidelines.
LTEST
Vin+
BATTERY
12μH
CS
220μF
33μF
E.S.R.<0.1Ω
@ 20°C 100kHz
Vin-
NOTE: Measure input reflected ripple current with a simulated
source inductance (LTEST) of 12μH. Capacitor CS offsets
possible battery impedance. Measure current as shown
above.
Figure 13. Input Reflected Ripple Current Test Setup.
COPPER STRIP
VO (+)
RESISTIVE
LOAD
1uF .
10uF
Input Source Impedance
SCOPE
V O (–)
GROUND PLANE
NOTE: All voltage measurements to be taken at the module
terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.
Safety Considerations
For safety-agency approval of the system in which the
power module is used, the power module must be
installed in compliance with the spacing and separation
requirements of the end-use safety agency standard,
i.e., UL 60950-1-3, CSA C22.2 No. 60950-00, and VDE
0805:2001-12 (IEC60950-1).
If the input source is non-SELV (ELV or a hazardous
voltage greater than 60 Vdc and less than or equal to
75Vdc), for the module’s output to be considered as
meeting the requirements for safety extra-low voltage
(SELV), all of the following must be true:
ƒ
The input source is to be provided with reinforced
insulation from any other hazardous voltages, including
the ac mains.
ƒ
One VIN pin and one VOUT pin are to be grounded, or both
the input and output pins are to be kept floating.
ƒ
The input pins of the module are not operator accessible.
ƒ
Another SELV reliability test is conducted on the whole
system (combination of supply source and subject
module), as required by the safety agencies, to verify that
under a single fault, hazardous voltages do not appear at
the module’s output.
Figure 14. Output Ripple and Noise Test Setup.
Rdistribution
Rcontact
Rcontact
Vin+
RLOAD
VO
VIN
Rdistribution
Rcontact
Rcontact
Vin-
Rdistribution
Vout+
Rdistribution
Vout-
NOTE: All voltage measurements to be taken at the module
terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.
Figure 15. Output Voltage and Efficiency Test Setup.
VO. IO
Efficiency
η =
LINEAGE POWER
VIN. IIN
x
100 %
Note: Do not ground either of the input pins of the
module without grounding one of the output pins.
This may allow a non-SELV voltage to appear
between the output pins and ground.
The power module has extra-low voltage (ELV) outputs
when all inputs are ELV.
For input voltages exceeding –60 Vdc but less than or
equal to –75 Vdc, these converters have been evaluated
to the applicable requirements of BASIC INSULATION
between secondary DC MAINS DISTRIBUTION input
(classified as TNV-2 in Europe) and unearthed SELV
outputs."All flammable materials used in the
manufacturing of these modules are rated 94V-0 and
UL60950 A.2 for reduced thicknesses. The input to
these units is to be provided with a maximum 3A fastacting fuse in the unearthed lead."
8
Data Sheet
May 16, 2008
HC006/010 Series DC-DC Power Module:
18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current
begin to operate at an input voltage above the
undervoltage lockout turn-on threshold.
Feature Description
Remote On/Off
Two remote on/off options are available. Positive logic
turns the module on during a logic high voltage on the
ON/OFF pin, and off during a logic low. Negative logic
remote On/Off, device code suffix “1”, turns the module
off during a logic high and on during a logic low.
VIN(+)
VO
Ion/off
ON/OFF
Von/off
Over Voltage Protection
The output overvoltage protection clamp consists of
control circuitry, independent of the primary regulation
loop, that monitors the voltage on the output terminals.
This control loop has a higher voltage set point than the
primary loop (See the overvoltage clamp values in the
Feature Specifications Table). In a fault condition, the
overvoltage clamp ensures that the output voltage does
not exceed Vo,ovsd, max. This provides a redundant
voltage-control that reduces the risk of output
overvoltage.
Over Temperature Protection
COM
VIN(-)
To provide protection in a fault condition, the unit is
equipped with a thermal shutdown circuit. The unit will
o
shutdown if the overtemperature threshold of 125 C is
exceeded at the thermal reference point Tref . Once the
unit goes into thermal shutdown it will then wait to cool
before attempting to restart.
Output Voltage Programming
Figure 16. Remote On/Off Implementation.
To turn the power module on and off, the user must
supply a switch (open collector or equivalent) to control
the voltage (Von/off) between the ON/OFF terminal and
the VIN(-) terminal. Logic low is –0.7V ≤ Von/off ≤ 1.2V.
The maximum Ion/off during a logic low is 1mA, the switch
should be maintain a logic low level whilst sinking this
current.
During a logic high, the maximum Von/off generated by
the module is 15V, and the maximum allowable leakage
current at Von/off = 15V is 50μA.
If not using the remote on/off feature:
For positive logic, leave the ON/OFF pin open.
For negative logic, short the ON/OFF pin to VIN(-).
Trimming allows the output voltage set point to be
increased or decreased, this is accomplished by
connecting an external resistor between the TRIM pin
and either the VO(+) pin or the VO(-) pin (COM pin) .
VIN(+)
VO(+)
Rtrim-up
ON/OFF
LOAD
VOTRIM
Rtrim-down
VIN(-)
COM
Overcurrent Protection
To provide protection in a fault (output overload) condition, the module is equipped with internal current-limiting
circuitry, and can endure current limiting continuously.
At the instance of current-limit inception, the output
current begins to tail-out. When an overcurrent condition
exists beyond a few seconds, the module enters a
“hiccup” mode of operation, whereby it shuts down and
automatically attempts to restart upon cooling. While the
fault condition exists, the module will remain in this
hiccup mode, and can remain in this mode until the fault
is cleared. The unit operates normally once the output
current is reduced back into its specified range.
Figure 17. Circuit Configuration to Trim Output
Voltage.
Connecting an external resistor (Rtrim-down) between the
TRIM pin and the COM pin decreases the output voltage
set point. The following equation determines the value
of trim-down resistor needed to decrease the output
voltage from Vo,set to Vo:
Input Undervoltage Lockout
At input voltages below the input undervoltage lockout
limit, the module operation is disabled. The module will
LINEAGE POWER
9
Data Sheet
May 16, 2008
HC006/010 Series DC-DC Power Module:
18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current
⎧⎡ 45.5(100 + 10) − 1690 ⎤
⎫
Rtrim − up = ⎨⎢
− 73.1⎬kΩ
⎥
10
⎦
⎩⎣
⎭
Feature Descriptions (continued)
Output Voltage Programming (continued)
Rtrim − up = 258.4kΩ
⎡ A
⎤
Rtrim − down = ⎢
− B ⎥ kΩ
⎣ Δ%
⎦
Rtrim-down is the external resistor in kΩ
Δ% is the % change in output voltage
Values of A & B are provided in Table 1
Table 1
Output Voltage
A
B
3.3V
1690
73.1
5.0V
1690
73.1
(V)
Connecting an external resistor (Rtrim-up) between the
TRIM pin and the VO(+) pin increases the output voltage
set point. The relationship between the output voltage
and the trim resistor value for a Δ% increase in output
voltage is:
⎧⎡ A(100 + Δ % − B ⎤
⎫
Rtrim − up = ⎨⎢
− C ⎬kΩ
⎥
Δ%
⎦
⎩⎣
⎭
Rtrim-up is the external resistor in kΩ
Δ% is the % change in output voltage
Values of A , B and C are provided in Table 2
Table 2
Output Voltage
(V)
A
B
V
3.3
45.5
1690
73.1
5.0
69.0
1690
73.1
Examples:
To trim down the output of a nominal 5.0V module
(HC006A6A) to 4.90V
Δ% = 2
⎡1690
⎤
Rtrim − down = ⎢
− 73.1⎥ kΩ
⎣ 2
⎦
Rtrim − down = 771.9kΩ
To trim up the output of a nominal 3.3V module
(HC010A0F) to 3.63V
Δ% = 10
LINEAGE POWER
10
Data Sheet
May 16, 2008
HC006/010 Series DC-DC Power Module:
18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current
Thermal Considerations
The power modules operate in a variety of thermal
environments; however, sufficient cooling should be
provided to help ensure reliable operation.
Considerations include ambient temperature, airflow,
module power dissipation, and the need for increased
reliability. A reduction in the operating temperature of the
module will result in an increase in reliability. The
thermal data presented here is based on physical
measurements taken in a wind tunnel.
The thermal reference point, Tref used in the
specifications is shown in Figure 18. For reliable
operation this temperature should not exceed 110 oC
Figure 19. Suggested Configuration for EN55022
Class B.
For further information on designing for EMC
compliance, please refer to the FLTR100V10 data sheet
(FDS01-043EPS).
Layout Considerations
Q203
Tref
Airflow
Figure 18. Tref Temperature Measurement Location.
Please refer to the Application Note “Thermal
Characterization Process For Open-Frame BoardMounted Power Modules” for a detailed discussion of
thermal aspects including maximum device
temperatures.
The HC power module series are low profile in order to
be used in fine pitch system card architectures. As
such, component clearance between the bottom of the
power module and the mounting board is limited. Avoid
placing copper areas on the outer layer directly
underneath the power module. Also avoid placing via
interconnects underneath the power module.
For additional layout guide-lines, refer to FLTR100V10
data sheet.
Heat Transfer via Convection
Increased airflow over the module enhances the heat
transfer via convection. Derating figures showing the
maximum output current that can be delivered by each
module versus local ambient temperature (TA) for natural
convection and up to 3m/s (600 ft./min) are shown in the
respective Characteristics Curves section.
EMC Considerations
The figure 19 shows a suggested configuration to meet
the conducted emission limits of EN55022 Class B.
LINEAGE POWER
11
Data Sheet
May 16, 2008
HC006/010 Series DC-DC Power Module:
18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current
Mechanical Outline for Surface-Mount Module
Dimensions are in millimeters and (inches).
Tolerances: x.x mm ± 0.5 mm (x.xx in. ± 0.02 in.) [Unless otherwise indicated]
x.xx mm ± 0.25 mm (x.xxx in ± 0.010 in.)
47.2
(1.86)
Top View
18
17
11
2
9
29.5
(1.16)
1
Side View
0.06 x 0.06
chamffer
8.50
(0.335)
MAX
2.5
(0.10)
min stand-off
height
0.5
(.020)
max
compliance
Bottom View
1.7
(0.07)
3.6
(0.14)
TRIM
VO+ VO-
Pin
Function
1
Vo(+)
2
Vo(-)
9
Trim
11
On/Off
17
Vin(-)
18
Vin(+)
26.16
(1.030)
On/Off
VI+ VI5.00
(0.197)
35.00
(1.375)
40.00
(1.575)
LINEAGE POWER
12
Data Sheet
May 16, 2008
HC006/010 Series DC-DC Power Module:
18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current
Mechanical Outline for Through Hole Module
Dimensions are in millimeters and [inches].
Tolerances: x.x mm ± 0.5 mm [x.xx in. ± 0.02 in.] (Unless otherwise indicated)
x.xx mm ± 0.25 mm [x.xxx in ± 0.010 in.]
Top View
Side View
* Optional pin lengths shown in Table 2 Device Options
Bottom View
Pin
Function
1
Vo(+)
2
Vo(-)
9
Trim
11
On/Off
17
Vin(-)
18
Vin(+)
LINEAGE POWER
13
Data Sheet
May 16, 2008
HC006/010 Series DC-DC Power Module:
18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current
Recommended Pad Layout for Surface Mount and Through Hole Module
Dimensions are in millimeters and [inches].
Tolerances: x.x mm ± 0.5 mm [x.xx in. ± 0.02 in.] (Unless otherwise indicated)
x.xx mm ± 0.25 mm [x.xxx in ± 0.010 in.]
LINEAGE POWER
14
Data Sheet
May 16, 2008
HC006/010 Series DC-DC Power Module:
18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current
Packaging Details
The surface mount versions of the HW005 family are also available in tape & reel (suffix –SR) as an option. Detailed
of tape dimensions are shown below. Modules are shipped in quantities of 115 per reel.
Tape Dimensions
Dimensions are in millimeters and (inches).
PICK POINT
4.00
(0.157)
9.02
(0.355)
40.00
(1.575)
FEED
DIRECTION
34.20
(1.346)
72.00
(2.834)
68.40
(2.692)
66.50
(2.692)
TOP COVER TAPE
EMBOSSED CARRIER
NOTE: CONFORMS TO EAI-481 REV. A STANDARD
Reel Dimensions
Outside diameter:
Inside diameter:
Tape Width:
LINEAGE POWER
330.2 mm (13.00”)
177.8 mm (7.00”)
72.00 mm (2.834”)
15
Data Sheet
May 16, 2008
HC006/010 Series DC-DC Power Module:
18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current
Through-Hole Lead-Free Soldering
Information
The RoHS-compliant through-hole products use the
SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed
through single or dual wave soldering machines. The
pins have an RoHS-compliant finish that is compatible
with both Pb and Pb-free wave soldering processes.
A maximum preheat rate of 3°C/s is suggested. The
wave preheat process should be such that the
temperature of the power module board is kept below
210°C. For Pb solder, the recommended pot
temperature is 260°C, while the Pb-free solder pot is
270°C max. Not all RoHS-compliant through-hole
products can be processed with paste-through-hole
Pb or Pb-free reflow process. If additional information
is needed, please consult with your Lineage Power
representative for more details.
Surface Mount Information
Packaging Details
The surface mount versions of the HC family (suffix –
S) are supplied as standard in the plastic tray shown
in Figure 21. The tray has external dimensions of
136mm (W) x 322.6mm (L) x 18.4mm (H) or 5.35in
(W) x 12.7in (L) x 0.72in (H).
Figure 21. Surface Mount Packaging Tray
Tray Specification
Material
Max temperature
Antistatic coated PVC
65oC
Max surface resistivity
Colour
Capacity
Min order quantity
trays)
10 Ω/sq
Clear
15 power modules
45 pcs (1box of 3 full
12
Each tray contains a total of 15 power modules. The
trays are self-stacking and each shipping box will
contain 3 full trays plus one empty hold down tray
giving a total number of 45 power modules.
Pick and Place
The HC-S series of DC-to-DC power converters use
an open-frame construction and are designed for
surface mount assembly within a fully automated
manufacturing process.
The HC-S series modules are fitted with a Kapton
label designed to provide a large flat surface for pick
and placing. The label is located covering the Centre
of Gravity of the power module. The label meets all
the requirements for surface-mount processing, as
well as meeting UL safety agency standards. The
label will withstand reflow temperatures up to 300°C.
The label also carries product information such as
product code, date and location of manufacture.
LINEAGE POWER
16
Data Sheet
May 16, 2008
HC006/010 Series DC-DC Power Module:
18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current
Surface Mount Information (continued)
damage to the modules, and can adversely affect
long-term reliability.
The surface mountable modules in the HC family use
our newest SMT technology called “Column Pin” (CP)
connectors. Fig 23 shows the new CP connector
before and after reflow soldering onto the end-board
assembly.
X
HC Board
14mm
(0.57in)
Insulator
Solder Ball
21mm
(0.84in)
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Even so, they have a
relatively large mass when compared with
conventional SMT components. Variables such as
nozzle size, tip style, vacuum pressure and placement
speed should be considered to optimize this process.
The minimum recommended nozzle diameter for
reliable operation is 6mm. The maximum nozzle outer
diameter, which will safely fit within the allowable
component spacing, is 9 mm.
Oblong or oval nozzles up to 11 x 9 mm may also be
used within the space available.
For further information please contact your local
Lineage Power Technical Sales Representative.
Reflow Soldering Information
The HC family of power modules is available for either
Through-Hole (TH) or Surface Mount (SMT)
soldering. These power modules are large mass, low
thermal resistance devices and typically heat up
slower than other SMT components. It is
recommended that the customer review data sheets
in order to customize the solder reflow profile for each
application board assembly.
The following instructions must be observed when
SMT soldering these units. Failure to observe these
instructions may result in the failure of or cause
LINEAGE POWER
Figure 23. Column Pin Connector Before and After
Reflow Soldering.
The CP is constructed from a solid copper pin with an
integral solder ball attached, which is composed of
tin/lead (Sn/Pb) solder. The CP connector design is
able to compensate for large amounts of co-planarity
and still ensure a reliable SMT solder joint.
Typically, the eutectic solder melts at 183oC, wets the
land, and subsequently wicks the device connection.
Sufficient time must be allowed to fuse the plating on
the connection to ensure a reliable solder joint. There
are several types of SMT reflow technologies
currently used in the industry. These surface mount
power modules can be reliably soldered using natural
forced convection, IR (radiant infrared), or a
combination of convection/IR. For reliable soldering
the solder reflow profile should be established by
accurately measuring the modules CP connector
temperatures.
300
P eak Temp 235oC
250
REFLOW TEMP (°C)
Note: All dimensions in mm.
Figure 22. Pick and Place Location.
Z Plane Height
The ‘Z’ plane height of the pick and place location is
7.50mm nominal with an RSS tolerance of +/-0.25
mm.
End assembly PCB
200
Co o ling
zo ne
1-4oCs -1
Heat zo ne
max 4oCs -1
150
100
50
So ak zo ne
30-240s
Tlim above
205oC
P reheat zo ne
max 4oCs -1
0
REFLOW TIME (S)
Figure 24. Recommended Reflow Profile
17
Data Sheet
May 16, 2008
HC006/010 Series DC-DC Power Module:
18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current
Surface Mount Information (continued)
240
MSL Rating
The HW/HC series SMT modules have a MSL rating
of 1.
235
MAX TEMP SOLDER (°C)
stored at the following conditions: < 40° C, < 90%
relative humidity.
230
Post Solder Cleaning and Drying
Considerations
225
220
215
210
205
200
0
10
20
30
40
50
60
TIME LIMIT (S)
Figure 25. Time Limit Curve Above 205oC Reflow .
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Lineage Power Board
Mounted Power Modules: Soldering and Cleaning
Application Note (AP01-056EPS).
300
Per J-STD-020 Rev. C
Lead Free Soldering
Reflow Temp (° C)
The SMT modules of the HW/HC series are lead-free
(Pb-free) and RoHS compliant and are both forward
and backward compatible in a Pb-free and a SnPb
soldering process. Failure to observe the instructions
below may result in the failure of or cause damage to
the modules and can adversely affect long-term
reliability.
250
Peak Temp 245° C
Cooling Zone
4° C / second
200
* Min. Time Above 235° C
15 seconds
150
Heating Zone
1° C / second
* Time Above 217° C
60 seconds
100
50
Pb-free Reflow Profile
0
Reflow Time (in seconds)
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for
both Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended
forced-air-convection reflow profile based on the
volume and thickness of the package (table 4-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC).
The recommended linear reflow profile using
Sn/Ag/Cu solder is shown in Figure. 26.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices). Moisture barrier
bags (MBB) with desiccant are required for MSL
ratings of 2 or greater. These sealed packages
should not be broken until time of use. Once the
original package is broken, the floor life of the product
at conditions of ≤ 30°C and 60% relative humidity
varies according to the MSL rating (see J-STD-033A).
The shelf life for dry packed SMT packages will be a
minimum of 12 months from the bag seal date, when
LINEAGE POWER
Figure 26. Recommended linear reflow profile
using Sn/Ag/Cu solder.
Solder Ball and Cleanliness Requirements
The open frame (no case or potting) power module
will meet the solder ball requirements per
J-STD-001B. These requirements state that solder
balls must neither be loose nor violate the power
module minimum electrical spacing.
The cleanliness designator of the open frame power
module is C00 (per J specification).
18
Data Sheet
May 16, 2008
HC006/010 Series DC-DC Power Module:
18-36Vdc Input; 3.3V & 5Vdc Output; 6.6A - 10A Output Current
Ordering Information
Please contact your Lineage Power Sales Representative for pricing, availability and optional features.
Table 1. Device Codes
Input Voltage
Output
Voltage
Output
Current
24 (18 – 36) Vdc
3.3 V
10A
Remote
On/Off
Logic
Negative
24 (18 – 36) Vdc
3.3 V
10A
24 (18 – 36) Vdc
5.0V
24 (18 – 36) Vdc
5.0V
24 (18 – 36) Vdc
24 (18 – 36) Vdc
24 (18 – 36) Vdc
Connector
Type
Product codes
Comcodes
SMT
HC010A0F1-S
108975442
Negative
SMT
HC010A0F1-SZ
109100220
6.6A
Negative
SMT
HC006A6A1-S
108975459
6.6A
Negative
SMT
HC006A6A1-SZ
109100212
5.0V
6.6A
Negative
TH
HC006A6A1
5.0V
6.6A
Negative
TH
HC006A6A1Z
CC109107100
5.0V
6.6A
Negative
TH
HC006A6A61Z
CC109140266
108994281
Table 2. Device Options
Option
Negative remote on/off logic
Short Pins: 3.68 mm ± 0.25 mm (0.145 in ±0.010 in)
Suffix
1
6
Short Pins: 2.79 mm ± 0.25 mm (0.110 in ±0.010 in)
8
Tape & Reel
-R
Surface mount connections
-S
RoHS Compliant
-Z
Asia-Pacific Headquarters
Tel: +65 6416 4283
World Wide Headquarters
Lineage Power Corporation
3000 Skyline Drive, Mesquite, TX 75149, USA
+1-800-526-7819
(Outside U.S.A.: +1-972-284-2626)
www.lineagepower.com
e-mail: [email protected]
Europe, Middle-East and Africa Headquarters
Tel: +49 89 6089 286
India Headquarters
Tel: +91 80 28411633
Lineage Power reserves the right to make changes to the product(s) or information contained herein without notice. No liability is assumed as a result of their use or
application. No rights under any patent accompany the sale of any such product(s) or information.
© 2008 Lineage Power Corporation, (Mesquite, Texas) All International Rights Reserved.
Document No: DS03-122 ver. 1.44
PDF name: hc006-010_series_ds.pdf
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