ON MC74AC125MG Quad buffer with 3−state output Datasheet

MC74AC125, MC74ACT125
Quad Buffer with 3−State
Outputs
Features
• Outputs Source/Sink
• ′ACT125 Has TTL Compatible Inputs
• Pb−Free Packages are Available
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VCC
A2
B2
O2
A3
B3
O3
14
13
12
11
10
9
8
PDIP−14
N SUFFIX
CASE 646
14
1
SOIC−14
D SUFFIX
CASE 751A
14
1
2
3
4
5
6
7
A0
B0
O0
A1
B1
O1
GND
1
Figure 1. Pinout: 14−Lead Packages Conductors
(Top View)
14
1
TSSOP−14
DT SUFFIX
CASE 948G
PIN ASSIGNMENT
PIN
FUNCTION
An, Bn
Inputs
On
Outputs
14
1
SOEIAJ−14
M SUFFIX
CASE 965
FUNCTION TABLE
Inputs
An
Output
Bn
L
L
L
H
H
X
NOTE: H = High Voltage Level;
L = Low Voltage Level;
Z = High Impedance;
X = Immaterial
© Semiconductor Components Industries, LLC, 2006
October, 2006 − Rev. 7
ORDERING INFORMATION
On
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
L
H
Z
DEVICE MARKING INFORMATION
See general marking information in the device marking
section on page 5 of this data sheet.
1
Publication Order Number:
MC74AC125/D
MC74AC125, MC74ACT125
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VCC
DC Supply Voltage (Referenced to GND)
−0.5 to +7.0
V
Vin
DC Input Voltage (Referenced to GND)
−0.5 to VCC + 0.5
V
Vout
DC Output Voltage (Referenced to GND)
−0.5 to VCC + 0.5
V
Iin
DC Input Current, per Pin
± 20
mA
Iout
DC Output Sink/Source Current, per Pin
± 50
mA
ICC
DC VCC or GND Current per Output Pin
± 50
mA
Tstg
Storage Temperature
−65 to +150
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
Vin, Vout
tr, tf
Parameter
Supply Voltage
Min
Typ
Max
′AC
2.0
5.0
6.0
′ACT
4.5
5.0
5.5
0
−
VCC
VCC @ 3.0 V
−
150
−
VCC @ 4.5 V
−
40
−
VCC @ 5.5 V
−
25
−
−
−
140
°C
−40
25
85
°C
DC Input Voltage, Output Voltage (Ref. to GND)
Input Rise and Fall Time (Note 1)
′AC Devices except Schmitt Inputs
Unit
V
V
ns/V
TJ
Junction Temperature (PDIP)
TA
Operating Ambient Temperature Range
IOH
Output Current − HIGH
−
−
−24
mA
IOL
Output Current − LOW
−
−
24
mA
1. Vin from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times.
2. Vin from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times.
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2
MC74AC125, MC74ACT125
DC CHARACTERISTICS
Symbol
Parameter
VIH
Minimum High Level
Input Voltage
VIL
Maximum Low Level
Input Voltage
VOH
Minimum High Level
Output Voltage
VOL
Minimum Low Level
Output Voltage
IIN
Maximum Input
Leakage Current
IOZ
VI (OE) = VIL, VIH
VI = VCC, GND
VO = VCC , GND
†Minimum Dynamic
Output Current
IOLD
IOHD
ICC
Maximum Quiescent
Supply Current
74AC
74AC
VCC
(V)
TA = +25°C
TA =
−40°C to
+85°C
3.0
4.5
5.5
3.0
4.5
5.5
3.0
4.5
5.5
Typ
1.5
2.25
2.75
1.5
2.25
2.75
2.99
4.46
5.49
Guaranteed Limits
2.1
2.1
3.15
3.15
3.85
3.85
0.9
0.9
1.35
1.35
1.65
1.65
2.9
2.9
4.4
4.4
5.4
5.4
3.0
4.5
5.5
3.0
4.5
5.5
−
−
−
0.002
0.001
0.001
2.56
3.86
4.86
0.1
0.1
0.1
2.46
3.76
4.76
0.1
0.1
0.1
3.0
4.5
5.5
−
−
−
0.36
0.36
0.36
0.44
0.44
0.44
5.5
−
±0.1
±1.0
mA
5.5
−
±0.5
±5.0
mA
5.5
5.5
−
−
−
−
75
−75
mA
mA
5.5
−
8.0
80
mA
Unit
Conditions
V
VOUT = 0.1 V
or VCC − 0.1 V
V
VOUT = 0.1 V
or VCC − 0.1 V
V
V
V
V
IOUT = − 50 mA
*VIN = VIL or VIH
−12 mA
IOH
− 24 mA
− 24 mA
IOUT = 50 mA
*VIN = VIL or VIH
12 mA
IOL
24 mA
24 mA
VI = VCC, GND
VI (OE) = VIL, VIH
VI = VCC, GND
VO = VCC, GND
VOLD = 1.65 V Max
VOHD = 3.85 V Min
VIN = VCC or GND
*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one input loaded at a time.
NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V.
AC CHARACTERISTICS
Symbol
VCC*
(V)
Parameter
tPLH
Propagation Delay
Data to Output
tPHL
Propagation Delay
Data to Output
tPZH
Output Enable
Time
tPZL
Output Enable
Time
tPHZ
Output Disable
Time
3.3
5.0
3.3
5.0
3.3
5.0
3.3
5.0
3.3
5.0
3.3
5.0
Output Disable
Time
*Voltage Range 3.3 V is 3.3 V ±0.3 V.
Voltage Range 5.0 V is 5.0 V ±0.5 V.
tPLZ
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3
74AC
74AC
TA = +25°C
CL = 50 pF
TA = −40°C
to +85°C
CL = 50 pF
Min
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
Min
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
Max
9.0
7.0
9.0
7.0
10.5
7.0
10
8.0
10
9.0
10.5
9.0
Max
10
7.5
10
7.5
11
8.0
11
8.5
10.5
9.5
11.5
9.5
Unit
ns
ns
ns
ns
ns
ns
MC74AC125, MC74ACT125
DC CHARACTERISTICS
Symbol
Parameter
74ACT
74ACT
VCC
(V)
TA = +25°C
TA =
−40°C to
+85°C
Typ
1.5
1.5
1.5
1.5
4.49
5.49
Guaranteed Limits
2.2
2.0
2.0
2.0
0.8
0.8
0.8
0.8
4.4
4.4
5.4
5.4
Unit
VIH
Minimum High Level
Input Voltage
VIL
Maximum Low Level
Input Voltage
VOH
Minimum High Level
Output Voltage
4.5
5.5
4.5
5.5
4.5
5.5
−
−
0.001
0.001
3.86
4.86
0.1
0.1
3.76
4.76
0.1
0.1
V
Minimum Low Level
Output Voltage
4.5
5.5
4.5
5.5
4.5
5.5
−
−
0.36
0.36
0.44
0.44
V
VOL
V
V
V
V
Conditions
VOUT = 0.1 V
or VCC − 0.1 V
VOUT = 0.1 V
or VCC − 0.1 V
IOUT = − 50 mA
*VIN = VIL or VIH
− 24 mA
IOH
− 24 mA
IOUT = − 50 mA
*VIN = VIL or VIH
IOH
− 24 mA
− 24 mA
VI = VCC, GND
IIN
Maximum Input
Leakage Current
5.5
−
±0.1
±1.0
mA
IOZ
VI (OE) = VIL, VIH
VI = VCC, GND
VO = VCC , GND
5.5
−
±0.5
±5.0
mA
VI (OE) = VIL, VIH
VI = VCC, GND
VO = VCC, GND
DICCT
Additional Max. ICC/Input
5.5
0.6
−
1.5
mA
VI = VCC − 2.1 V
IOLD
†Minimum Dynamic
Output Current
5.5
−
−
75
mA
VOLD = 1.65 V Max
5.5
−
−
−75
mA
VOHD = 3.85 V Min
8.0
80
mA
VIN = VCC or GND
IOHD
ICC
Maximum Quiescent Supply Current
5.5
−
*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one input loaded at a time.
AC CHARACTERISTICS
Symbol
VCC*
(V)
Parameter
74ACT
74ACT
TA = +25°C
CL = 50 pF
TA = −40°C
to +85°C
CL = 50 pF
Unit
Min
Max
Min
Max
5.0
1.0
9.0
1.0
10
ns
Propagation Delay
Data to Output
5.0
1.0
9.0
1.0
10
ns
tPZH
Output Enable
Time
5.0
1.0
8.5
1.0
9.5
ns
tPZL
Output Enable
Time
5.0
1.0
9.5
1.0
10.5
ns
tPHZ
Output Disable
Time
5.0
1.0
9.5
1.0
10.5
ns
5.0
1.0
10
1.0
10.5
ns
tPLH
Propagation Delay
Data to Output
tPHL
Output Disable
Time
*Voltage Range 5.0 V is 5.0 V ±0.5 V.
tPLZ
CAPACITANCE
Symbol
Parameter
Value
Typ
Unit
Test Conditions
CIN
Input Capacitance
4.5
pF
VCC = 5.0 V
CPD
Power Dissipation Capacitance
45
pF
VCC = 5.0 V
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4
MC74AC125, MC74ACT125
ORDERING INFORMATION
Device
Shipping †
Package
MC74AC125N
PDIP−14
MC74AC125NG
PDIP−14
(Pb−Free)
MC74AC125D
SOIC−14
MC74AC125DG
SOIC−14
(Pb−Free)
MC74AC125DR2
SOIC−14
MC74AC125DR2G
SOIC−14
(Pb−Free)
MC74AC125DTR2
TSSOP−14*
MC74AC125DTR2G
TSSOP−14*
MC74AC125M
SOEIAJ−14
MC74AC125MG
SOEIAJ−14
(Pb−Free)
MC74AC125MEL
SOEIAJ−14
MC74AC125MELG
SOEIAJ−14
(Pb−Free)
MC74ACT125DR2
SOIC−14
MC74ACT125DR2G
SOIC−14
(Pb−Free)
MC74ACT125DTR2
TSSOP−14*
MC74ACT125DTR2G
TSSOP−14*
MC74ACT125MEL
SOEIAJ−14
MC74ACT125MELG
SOEIAJ−14
(Pb−Free)
MC74ACT125N
PDIP−14
MC74ACT125NG
PDIP−14
(Pb−Free)
25 Units / Rail
55 Units / Rail
2500 / Tape & Reel
50 Units / Rail
2000 / Tape & Reel
2500 / Tape & Reel
2000 / Tape & Reel
25 Units / Rail
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*This package is inherently Pb−Free.
MARKING DIAGRAMS
PDIP−14
SOIC−14
14
14
14
AC125G
AWLYWW
MC74AC125N
AWLYYWWG
1
TSSOP−14
1
1
14
14
ACT125G
AWLYWW
1
1
AC
125
ALYW
5
74AC125
ALYWG
1
14
ACT
125
ALYW
A
= Assembly Location
L, WL
= Wafer Lot
Y, YY
= Year
W, WW = Work Week
G or = Pb−Free Package
(Note: Microdot may be in either location)
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SOEIAJ−14
14
74ACT125
ALYWG
1
MC74AC125, MC74ACT125
PACKAGE DIMENSIONS
PDIP−14
CASE 646−06
ISSUE P
14
8
1
7
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
B
A
F
L
N
C
−T−
SEATING
PLANE
H
G
D 14 PL
J
K
0.13 (0.005)
M
M
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6
DIM
A
B
C
D
F
G
H
J
K
L
M
N
INCHES
MIN
MAX
0.715
0.770
0.240
0.260
0.145
0.185
0.015
0.021
0.040
0.070
0.100 BSC
0.052
0.095
0.008
0.015
0.115
0.135
0.290
0.310
−−−
10 0.015
0.039
MILLIMETERS
MIN
MAX
18.16
19.56
6.10
6.60
3.69
4.69
0.38
0.53
1.02
1.78
2.54 BSC
1.32
2.41
0.20
0.38
2.92
3.43
7.37
7.87
−−−
10 0.38
1.01
MC74AC125, MC74ACT125
PACKAGE DIMENSIONS
SOIC−14
CASE 751A−03
ISSUE H
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.127
(0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
−A−
14
8
−B−
P 7 PL
0.25 (0.010)
M
7
1
G
−T−
D 14 PL
0.25 (0.010)
T B
S
A
DIM
A
B
C
D
F
G
J
K
M
P
R
J
M
K
M
F
R X 45 C
SEATING
PLANE
B
M
S
SOLDERING FOOTPRINT*
7X
7.04
14X
1.52
1
14X
0.58
1.27
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
7
MILLIMETERS
MIN
MAX
8.55
8.75
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0
7
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.337 0.344
0.150 0.157
0.054 0.068
0.014 0.019
0.016 0.049
0.050 BSC
0.008 0.009
0.004 0.009
0
7
0.228 0.244
0.010 0.019
MC74AC125, MC74ACT125
PACKAGE DIMENSIONS
TSSOP−14
CASE 948G−01
ISSUE B
14X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
V
S
S
N
2X
14
L/2
0.25 (0.010)
8
M
B
−U−
L
PIN 1
IDENT.
N
F
7
1
0.15 (0.006) T U
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL
IN EXCESS OF THE K DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
S
S
DETAIL E
ÇÇÇ
ÉÉÉ
ÇÇÇ
ÉÉÉ
ÇÇÇ
K
A
−V−
K1
J J1
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
SECTION N−N
−W−
C
0.10 (0.004)
−T− SEATING
PLANE
D
H
G
DETAIL E
SOLDERING FOOTPRINT*
7.06
1
0.65
PITCH
14X
0.36
14X
1.26
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
8
MILLIMETERS
MIN
MAX
4.90
5.10
4.30
4.50
−−−
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.50
0.60
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0
8
INCHES
MIN MAX
0.193 0.200
0.169 0.177
−−− 0.047
0.002 0.006
0.020 0.030
0.026 BSC
0.020 0.024
0.004 0.008
0.004 0.006
0.007 0.012
0.007 0.010
0.252 BSC
0
8
MC74AC125, MC74ACT125
PACKAGE DIMENSIONS
SOEIAJ−14
CASE 965−01
ISSUE A
14
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
LE
8
Q1
E HE
M
L
7
1
DETAIL P
Z
D
VIEW P
A
e
A1
b
0.13 (0.005)
c
M
0.10 (0.004)
DIM
A
A1
b
c
D
E
e
HE
0.50
LE
M
Q1
Z
MILLIMETERS
MIN
MAX
−−−
2.05
0.05
0.20
0.35
0.50
0.10
0.20
9.90
10.50
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10 0
0.70
0.90
−−−
1.42
INCHES
MIN
MAX
−−− 0.081
0.002
0.008
0.014
0.020
0.004
0.008
0.390
0.413
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10 0
0.028
0.035
−−− 0.056
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9
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