ON MC74HCO3A Quad 2-input nand gate with open-drain output Datasheet

MC74HC03A
Quad 2-Input NAND Gate
with Open-Drain Outputs
High–Performance Silicon–Gate CMOS
The MC74HC03A is identical in pinout to the LS03. The device
inputs are compatible with Standard CMOS outputs; with pullup
resistors, they are compatible with LSTTL outputs.
The HC03A NAND gate has, as its outputs, a high–performance
MOS N–Channel transistor. This NAND gate can, therefore, with a
suitable pullup resistor, be used in wired–AND applications. Having
the output characteristic curves given in this data sheet, this device can
be used as an LED driver or in any other application that only requires
a sinking current.
• Output Drive Capability: 10 LSTTL Loads With Suitable Pullup
Resistor
• Outputs Directly Interface to CMOS, NMOS and TTL
• High Noise Immunity Characteristic of CMOS Devices
• Operating Voltage Range: 2 to 6V
• Low Input Current: 1µA
• In Compliance With the JEDEC Standard No. 7A Requirements
• Chip Complexity: 28 FETs or 7 Equivalent Gates
DESIGN GUIDE
Value
Unit
Internal Gate Count*
Criteria
7.0
ea
Internal Gate Propagation Delay
1.5
ns
5.0
µW
0.0075
pJ
Internal Gate Power Dissipation
Speed Power Product
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MARKING
DIAGRAMS
14
PDIP–14
N SUFFIX
CASE 646
1
14
SOIC–14
D SUFFIX
CASE 751A
14
PIN 14 = VCC
PIN 7 = GND
* Denotes open–drain outputs
OUTPUT
PROTECTION
DIODE
3,6,8,11
Y*
HC
03A
ALYW
TSSOP–14
DT SUFFIX
CASE 948G
1
A
= Assembly Location
WL or L = Wafer Lot
YY or Y = Year
WW or W = Work Week
FUNCTION TABLE
Inputs
VCC
HC03A
AWLYWW
1
* Equivalent to a two–input NAND gate
LOGIC DIAGRAM
MC74HC03AN
AWLYYWW
Output
A
B
Y
L
L
H
H
L
H
L
H
Z
Z
Z
L
Z = High Impedance
A
B
1,4,9,12
2,5,10,13
ORDERING INFORMATION
Pinout: 14–Lead Packages (Top View)
VCC
14
B4
13
A4
12
Y4
11
B3
10
A3
9
Y3
8
1
2
3
4
5
6
7
A1
B1
Y1
A2
B2
Y2
GND
 Semiconductor Components Industries, LLC, 2000
March, 2000 – Rev. 8
1
Device
Package
Shipping
MC74HC03AN
PDIP–14
2000 / Box
MC74HC03AD
SOIC–14
55 / Rail
MC74HC03ADR2
SOIC–14
2500 / Reel
MC74HC03ADT
TSSOP–14
96 / Rail
MC74HC03ADTR2
TSSOP–14
2500 / Reel
Publication Order Number:
MC74HC03A/D
MC74HC03A
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MAXIMUM RATINGS*
Symbol
VCC
Parameter
DC Supply Voltage (Referenced to GND)
Value
Unit
– 0.5 to + 7.0
V
V
Vin
DC Input Voltage (Referenced to GND)
– 0.5 to VCC + 0.5
Vout
DC Output Voltage (Referenced to GND)
– 0.5 to VCC + 0.5
V
DC Input Current, per Pin
± 20
mA
Iout
DC Output Current, per Pin
± 25
mA
ICC
DC Supply Current, VCC and GND Pins
± 50
mA
PD
Power Dissipation in Still Air
750
500
450
mW
Tstg
Storage Temperature
– 65 to + 150
_C
Iin
TL
Plastic DIP†
SOIC Package†
TSSOP Package†
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high–impedance circuit. For proper operation, Vin and
Vout should be constrained to the
range GND (Vin or Vout) VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
v
v
_C
Lead Temperature, 1 mm from Case for 10 Seconds
Plastic DIP, SOIC or TSSOP Package
260
*Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
†Derating — Plastic DIP: – 10 mW/_C from 65_ to 125_C
SOIC Package: – 7 mW/_C from 65_ to 125_C
TSSOP Package: – 6.1 mW/_C from 65_ to 125_C
For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor High–Speed CMOS Data Book (DL129/D).
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RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
Vin, Vout
Parameter
Min
DC Supply Voltage (Referenced to GND)
Max
Unit
2.0
6.0
V
0
VCC
V
– 55
+ 125
_C
0
0
0
1000
500
400
ns
DC Input Voltage, Output Voltage (Referenced to GND)
TA
Operating Temperature, All Package Types
tr, tf
Input Rise and Fall Time
(Figure 1)
VCC = 2.0 V
VCC = 4.5 V
VCC = 6.0 V
DC CHARACTERISTICS (Voltages Referenced to GND)
Guaranteed Limit
VCC
V
–55 to 25°C
≤85°C
≤125°C
Unit
VIH
Minimum High–Level Input
Voltage
Vout = 0.1V or VCC –0.1V
|Iout| ≤ 20µA
2.0
3.0
4.5
6.0
1.50
2.10
3.15
4.20
1.50
2.10
3.15
4.20
1.50
2.10
3.15
4.20
V
VIL
Maximum Low–Level Input
Voltage
Vout = 0.1V or VCC – 0.1V
|Iout| ≤ 20µA
2.0
3.0
4.5
6.0
0.50
0.90
1.35
1.80
0.50
0.90
1.35
1.80
0.50
0.90
1.35
1.80
V
VOL
Maximum Low–Level Output
Voltage
Vout = 0.1V or VCC – 0.1V
|Iout| ≤ 20µA
2.0
4.5
6.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
V
3.0
4.5
6.0
0.26
0.26
0.26
0.33
0.33
0.33
0.40
0.40
0.40
Symbol
Parameter
Condition
|Iout| ≤ 2.4mA
|Iout| ≤ 4.0mA
|Iout| ≤ 5.2mA
Vin = VIH or VIL
Maximum Input Leakage Current
Vin = VCC or GND
6.0
±0.1
±1.0
±1.0
µA
ICC
Maximum Quiescent Supply
Current (per Package)
Vin = VCC or GND
Iout = 0µA
6.0
1.0
10
40
µA
IOZ
Maximum Three–State Leakage
Current
Output in High–Impedance State
Vin = VIL or VIH
Vout = VCC or GND
6.0
±0.5
±5.0
±10
µA
Iin
NOTE: Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor High–Speed CMOS Data Book (DL129/D).
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2
MC74HC03A
AC CHARACTERISTICS (CL = 50pF, Input tr = tf = 6ns)
Symbol
Parameter
Guaranteed Limit
VCC
V
–55 to 25°C
≤85°C
≤125°C
Unit
tPLZ,
tPZL
Maximum Propagation Delay, Input A or B to Output Y
(Figures 1 and 2)
2.0
3.0
4.5
6.0
120
45
24
20
150
60
30
26
180
75
36
31
ns
tTLH,
tTHL
Maximum Output Transition Time, Any Output
(Figures 1 and 2)
2.0
3.0
4.5
6.0
75
27
15
13
95
32
19
16
110
36
22
19
ns
Maximum Input Capacitance
10
10
10
pF
Maximum Three–State Output Capacitance
(Output in High–Impedance State)
10
10
10
pF
Cin
Cout
NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the ON
Semiconductor High–Speed CMOS Data Book (DL129/D).
Typical @ 25°C, VCC = 5.0 V, VEE = 0 V
CPD
Power Dissipation Capacitance (Per Buffer)*
8.0
pF
* Used to determine the no–load dynamic power consumption: PD = CPD VCC2f + ICC VCC. For load considerations, see Chapter 2 of the
ON Semiconductor High–Speed CMOS Data Book (DL129/D).
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3
MC74HC03A
VCC
tr
tf
INPUT A
Rpd
OUTPUT
DEVICE
UNDER
TEST
GND
tPZL
tPLZ
HIGH
IMPEDANCE
90%
50%
10%
OUTPUT Y
1kΩ
VCC
90%
50%
10%
10%
TEST
POINT
CL*
VOL
tTHL
*Includes all probe and jig capacitance
Figure 1. Switching Waveforms
Figure 2. Test Circuit
25
VCC=5V
TYPICAL
T=25°C
I D, SINK CURRENT (mA)
20
T=25°C
15
T=85°C
10
T=125°C
EXPECTED MINIMUM*
5
0
0
1
2
3
4
VO, OUTPUT VOLTAGE (VOLTS)
5
*The expected minimum curves are not guarantees, but are design aids.
Figure 3. Open–Drain Output Characteristics
VCC
+
VR
–
+
VF
–
VCC
PULLUP
RESISTOR
A1
B1
A2
B2
An
Bn
1/4
HC03
Y1
1/4
HC03
OUTPUT
LED1
1/4
HC03
1/4
HC03
^
DESIGN EXAMPLE
CONDITIONS: ID 10mA
USING FIGURE NO TAG TYPICAL
CURVE, at ID=10mA, VDS 0.4V
Y2
LED2
LED
ENABLE
1/4
HC03
VCC
NR + VCC * IVDF * VO
* 0.4V
+ 5V * 1.7V
10mA
+ 290W
Yn
OUTPUT = Y1 • Y2 • . . . • Yn
= A1B1 • A2B2 • . . . • AnBn
USE R = 270Ω
Figure 4. Wired AND
Figure 5. LED Driver With Blanking
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4
^
MC74HC03A
PACKAGE DIMENSIONS
PDIP–14
N SUFFIX
CASE 646–06
ISSUE L
14
8
1
7
NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
4. ROUNDED CORNERS OPTIONAL.
B
A
F
DIM
A
B
C
D
F
G
H
J
K
L
M
N
L
C
J
N
H
G
D
SEATING
PLANE
K
M
INCHES
MIN
MAX
0.715
0.770
0.240
0.260
0.145
0.185
0.015
0.021
0.040
0.070
0.100 BSC
0.052
0.095
0.008
0.015
0.115
0.135
0.300 BSC
0_
10_
0.015
0.039
MILLIMETERS
MIN
MAX
18.16
19.56
6.10
6.60
3.69
4.69
0.38
0.53
1.02
1.78
2.54 BSC
1.32
2.41
0.20
0.38
2.92
3.43
7.62 BSC
0_
10_
0.39
1.01
SOIC–14
D SUFFIX
CASE 751A–03
ISSUE F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
–A–
14
8
–B–
1
P 7 PL
0.25 (0.010)
7
G
B
M
M
R X 45 _
C
F
–T–
SEATING
PLANE
D 14 PL
0.25 (0.010)
M
K
M
T B
S
A
S
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5
J
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
8.55
8.75
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.337
0.344
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.228
0.244
0.010
0.019
MC74HC03A
PACKAGE DIMENSIONS
TSSOP–14
DT SUFFIX
CASE 948G–01
ISSUE O
14X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
V
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
S
S
N
2X
14
L/2
0.25 (0.010)
8
M
B
–U–
L
PIN 1
IDENT.
F
7
1
0.15 (0.006) T U
N
S
DETAIL E
K
ÉÉ
ÇÇ
ÇÇ
ÉÉ
A
–V–
K1
J J1
SECTION N–N
–W–
C
0.10 (0.004)
–T– SEATING
PLANE
D
G
H
DETAIL E
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6
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
MIN
MAX
4.90
5.10
4.30
4.50
–––
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.50
0.60
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
INCHES
MIN
MAX
0.193
0.200
0.169
0.177
–––
0.047
0.002
0.006
0.020
0.030
0.026 BSC
0.020
0.024
0.004
0.008
0.004
0.006
0.007
0.012
0.007
0.010
0.252 BSC
0_
8_
MC74HC03A
Notes
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7
MC74HC03A
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MC74HC03A/D
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