Cypress CY7C1020BL-15VC 32k x 16 static ram Datasheet

020B
CY7C1020B
32K x 16 Static RAM
Features
Writing to the device is accomplished by taking Chip Enable
(CE) and Write Enable (WE) inputs LOW. If Byte Low Enable
(BLE) is LOW, then data from I/O pins (I/O1 through I/O8), is
written into the location specified on the address pins (A0
through A15). If Byte High Enable (BHE) is LOW, then data
from I/O pins (I/O9 through I/O16) is written into the location
specified on the address pins (A0 through A15).
• High speed
— tAA = 12, 15 ns
• CMOS for optimum speed/power
• Low active power
— 825 mW (max.)
• Low CMOS standby power (L version only)
— 2.75 mW (max.)
• Automatic power-down when deselected
• Independent control of upper and lower bits
• Available in 44-pin TSOP II and 400-mil SOJ
Reading from the device is accomplished by taking Chip Enable (CE) and Output Enable (OE) LOW while forcing the Write
Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW, then
data from the memory location specified by the address pins
will appear on I/O1 to I/O8. If Byte High Enable (BHE) is LOW,
then data from memory will appear on I/O9 to I/O16. See the
truth table at the back of this data sheet for a complete description of read and write modes.
Functional Description
The CY7C1020B is a high-performance CMOS static RAM organized as 32,768 words by 16 bits. This device has an automatic power-down feature that significantly reduces power
consumption when deselected.
The input/output pins (I/O1 through I/O16) are placed in a
high-impedance state when the device is deselected (CE
HIGH), the outputs are disabled (OE HIGH), the BHE and BLE
are disabled (BHE, BLE HIGH), or during a write operation (CE
LOW, and WE LOW).
The CY7C1020B is available in standard 44-pin TSOP Type II
and 400-mil-wide SOJ packages.
Logic Block Diagram
Pin Configuration
SOJ / TSOP II
Top View
SENSE AMPS
A7
A6
A5
A4
A3
A2
A1
A0
ROW DECODER
DATA IN DRIVERS
32K x 16
RAM Array
NC
A3
A2
A1
A0
CE
I/O1
I/O2
I/O3
I/O4
VCC
VSS
I/O5
I/O6
I/O7
I/O8
WE
A15
A14
A13
A12
NC
I/O1–I/O8
I/O9–I/O16
COLUMN DECODER
A8
A9
A10
A11
A12
A13
A14
BHE
WE
CE
OE
BLE
1
44
2
3
4
43
42
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
A5
A6
A7
OE
BHE
BLE
I/O16
I/O15
I/O14
I/O13
VSS
VCC
I/O12
I/O11
I/O10
I/O9
NC
A8
A9
A10
A11
NC
Selection Guide
7C1020B-12
7C1020B-15
Maximum Access Time (ns)
Commercial
12
15
Maximum Operating Current (mA)
Commercial
140
130
Maximum CMOS Standby Current (mA)
Commercial
L
Cypress Semiconductor Corporation
Document #: 38-05171 Rev. *A
•
3901 North First Street
•
San Jose
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3
0.5
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Revised August 20, 2002
CY7C1020B
Maximum Ratings
Current into Outputs (LOW) ........................................ 20 mA
(Above which the useful life may be impaired. For user guidelines, not tested.)
Storage Temperature ................................. –65°C to +150°C
Ambient Temperature with
Power Applied............................................. –55°C to +125°C
Static Discharge Voltage............................................ >2001V
(per MIL-STD-883, Method 3015)
Latch-Up Current..................................................... >200 mA
Operating Range
Supply Voltage on VCC to Relative GND[1] .... –0.5V to +7.0V
DC Voltage Applied to Outputs
in High Z State[1] ......................................–0.5V to VCC+0.5V
DC Input Voltage[1]...................................–0.5V to VCC+0.5V
Range
Ambient
Temperature[2]
VCC
0°C to +70°C
5V ± 10%
–40°C to +85°C
5V ± 10%
Commercial
Industrial
Electrical Characteristics Over the Operating Range
Parameter
Description
7C1020B-12
Test
Conditions
Min.
Max.
VOH
Output HIGH Voltage
VCC = Min.,
IOH = –4.0 mA
2.4
VOL
Output LOW Voltage
VCC = Min.,
IOL = 8.0 mA
VIH
Input HIGH Voltage
2.2
6.0
VIL
Input LOW Voltage[1]
–0.5
0.8
IIX
Input Load Current
GND < VI < VCC
–1
+1
IOZ
Output Leakage
Current
GND < VI < VCC,
Output Disabled
–1
+1
IOS
Output Short
Circuit Current[3]
VCC = Max.,
VOUT = GND
ICC
VCC Operating
Supply Current
ISB1
Automatic CE
Power-Down
Current—TTL Inputs
ISB2
Automatic CE
Max. VCC,
Power-Down
CE >
Current—CMOS Inputs VCC – 0.3V, VIN >
VCC – 0.3V,
or VIN < 0.3V, f = 0
7C1020B-15
Min.
Max.
2.4
0.4
Unit
V
0.4
V
2.2
6.0
V
–0.5
0.8
V
–1
+1
µA
–1
+1
µA
–300
–300
mA
VCC = Max.,
IOUT = 0 mA,
f = fMAX = 1/tRC
140
130
mA
Max. VCC,
CE > VIH
VIN > VIH or
VIN < VIL,
f = fMAX
20
20
mA
3
3
mA
0.5
0.5
mA
L
Notes:
1. VIL (min.) = –2.0V for pulse durations of less than 20 ns.
2. TA is the case temperature.
3. Not more than one output should be shorted at one time. Duration of the short circuit should not exceed 30 seconds.
Document #: 38-05171 Rev. *A
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CY7C1020B
Capacitance[4]
Parameter
Description
CIN
Input Capacitance
COUT
Output Capacitance
Test Conditions
TA = 25°C, f = 1 MHz,
VCC = 5.0V
Max.
Unit
8
pF
8
pF
AC Test Loads and Waveforms
R 481Ω
R 481Ω
5V
5V
OUTPUT
90%
OUTPUT
30 pF
R2
255Ω
INCLUDING
JIG AND
SCOPE
(a)
OUTPUT
Equivalent to: THÉVENIN
EQUIVALENT
ALL INPUT PULSES
3.0V
R2
255Ω
5 pF
INCLUDING
JIG AND
SCOPE
167
GND
Rise Time: 1 V/ns
(b)
10%
90%
10%
Fall Time: 1 V/ns
1.73V
30 pF
Note:
4. Tested initially and after any design or process changes that may affect these parameters.
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CY7C1020B
Switching Characteristics[5] Over the Operating Range
7C1020B-12
Parameter
Description
Min.
Max.
7C1020B-15
Min.
Max.
Unit
Read Cycle
tRC
Read Cycle Time
12
tAA
Address to Data Valid
tOHA
Data Hold from Address Change
tACE
CE LOW to Data Valid
12
15
ns
tDOE
OE LOW to Data Valid
6
7
ns
[6]
tLZOE
OE LOW to Low Z
tHZOE
OE HIGH to High Z[6, 7]
tLZCE
CE LOW to Low
Z[6]
CE HIGH to High
tPU
CE LOW to Power-Up
tPD
CE HIGH to Power-Down
tDBE
Byte Enable to Data Valid
tLZBE
Byte Enable to Low Z
tHZBE
Write
12
3
15
3
ns
7
3
6
0
7
6
0
ns
ns
15
ns
7
ns
0
6
ns
ns
0
12
ns
ns
0
6
Byte Disable to High Z
ns
3
0
Z[6, 7]
tHZCE
15
ns
7
ns
Cycle[8]
tWC
Write Cycle Time
12
15
ns
tSCE
CE LOW to Write End
9
10
ns
tAW
Address Set-Up to Write End
8
10
ns
tHA
Address Hold from Write End
0
0
ns
tSA
Address Set-Up to Write Start
0
0
ns
tPWE
WE Pulse Width
8
10
ns
tSD
Data Set-Up to Write End
6
8
ns
tHD
Data Hold from Write End
0
0
ns
3
3
ns
WE HIGH to Low
Z[6]
tHZWE
WE LOW to High
Z[6, 7]
tBW
Byte Enable to End of Write
tLZWE
6
8
7
9
ns
ns
Notes:
5. Test conditions assume signal transition time of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V, and output loading of the specified
IOL/IOH and 30-pF load capacitance.
6. At any given temperature and voltage condition, tHZCE is less than tLZCE, tHZOE is less than tLZOE, and tHZWE is less than tLZWE for any given device.
7. tHZOE, tHZBE, tHZCE, and tHZWE are specified with a load capacitance of 5 pF as in part (b) of AC Test Loads. Transition is measured ±500 mV from steady-state voltage.
8. The internal write time of the memory is defined by the overlap of CE LOW, WE LOW and BHE / BLE LOW. CE, WE and BHE / BLE must be LOW to initiate a write,
and the transition of these signals can terminate the write. The input data set-up and hold timing should be referenced to the leading edge of the signal that terminates the write.
Document #: 38-05171 Rev. *A
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CY7C1020B
Switching Waveforms
Read Cycle No. 1
[9, 10]
tRC
ADDRESS
tAA
tOHA
DATA OUT
PREVIOUS DATA VALID
Read Cycle No. 2 (OE Controlled)
DATA VALID
[10, 11]
ADDRESS
tRC
CE
tACE
OE
tHZOE
tDOE
BHE, BLE
tLZOE
tHZCE
tDBE
tLZBE
DATA OUT
HIGH IMPEDANCE
tLZCE
VCC
SUPPLY
CURRENT
tHZBE
HIGH
IMPEDANCE
DATA VALID
tPD
tPU
50%
IICC
CC
50%
IISB
SB
Notes:
9. Device is continuously selected. OE, CE, BHE and/or BHE = VIL.
10. WE is HIGH for read cycle.
11. Address valid prior to or coincident with CE transition LOW.
Document #: 38-05171 Rev. *A
Page 5 of 10
CY7C1020B
Switching Waveforms (continued)
Write Cycle No. 1 (CE Controlled)
[12, 13]
tWC
ADDRESS
CE
tSA
tSCE
tAW
tHA
tPWE
WE
tBW
BHE, BLE
tSD
tHD
DATA I/O
Write Cycle No. 2 (BLE or BHE Controlled)
tWC
ADDRESS
BHE, BLE
tSA
tBW
tAW
tHA
tPWE
WE
tSCE
CE
tSD
tHD
DATA I/O
Notes:
12. Data I/O is high impedance if OE or BHE and/or BLE= VIH.
13. If CE goes HIGH simultaneously with WE going HIGH, the output remains in a high-impedance state.
Document #: 38-05171 Rev. *A
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CY7C1020B
Switching Waveforms (continued)
Write Cycle No. 3 (WE Controlled) OE LOW)
tWC
ADDRESS
tSCE
CE
tAW
tHA
tSA
tPWE
WE
tBW
BHE, BLE
tHZWE
tSD
tHD
DATA I/O
tLZWE
Truth Table
CE
OE
H
X
L
L
L
X
WE
BLE
BHE
X
X
X
High Z
High Z
Power-Down
Standby (ISB)
H
L
L
Data Out
Data Out
Read – All bits
Active (ICC)
L
H
Data Out
High Z
Read – Lower bits only
Active (ICC)
H
L
High Z
Data Out
Read – Upper bits only
Active (ICC)
L
L
Data In
Data In
Write – All bits
Active (ICC)
L
H
Data In
High Z
Write – Lower bits only
Active (ICC)
H
L
High Z
Data In
Write – Upper bits only
Active (ICC)
L
I/O1–I/O8
I/O9–I/O16
Mode
Power
L
H
H
X
X
High Z
High Z
Selected, Outputs Disabled
Active (ICC)
L
X
X
H
H
High Z
High Z
Selected, Outputs Disabled
Active (ICC)
Document #: 38-05171 Rev. *A
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CY7C1020B
Ordering Information
Speed
(ns)
12
15
Ordering Code
Package
Name
Package Type
Operating
Range
CY7C1020B-12VC
V34
44-Lead (400-Mil) Molded SOJ
Commercial
CY7C1020BL-12VC
V34
44-Lead (400-Mil) Molded SOJ
Commercial
CY7C1020B-12ZC
Z44
44-Lead TSOP Type II
Commercial
CY7C1020BL-12ZC
Z44
44-Lead TSOP Type II
Commercial
CY7C1020B-15VC
V34
44-Lead (400-Mil) Molded SOJ
Commercial
CY7C1020BL-15VC
V34
44-Lead (400-Mil) Molded SOJ
Commercial
CY7C1020B-15ZC
Z44
44-Lead TSOP Type II
Commercial
CY7C1020BL-15ZC
Z44
44-Lead TSOP Type II
Commercial
Package Diagrams
44-Lead (400-Mil) Molded SOJ V34
51-85082-B
Document #: 38-05171 Rev. *A
Page 8 of 10
CY7C1020B
Package Diagrams (continued)
44-Pin TSOP II Z44
51-85087-A
All product and company names mentioned in this document may be the trademarks of their respective holders.
Document #: 38-05171 Rev. *A
Page 9 of 10
© Cypress Semiconductor Corporation, 2002. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.
CY7C1020B
Document Title: CY7C1020B 32K x 16 Static RAM
Document #: 38-05171
REV.
ECN NO.
Issue
Date
Orig. of
Change
Description of Change
**
115439
05/09/02
DSG
New Data Sheet
*A
116869
08/21/02
DFP
Added L-Power Specifications.
Document #: 38-05171 Rev. *A
Page 10 of 10
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