MC1488 Quad Line EIA−232D Driver The MC1488 is a monolithic quad line driver designed to interface data terminal equipment with data communications equipment in conformance with the specifications of EIA Standard No. EIA−232D. Features http://onsemi.com • Current Limited Output ± 10 mA typical • Power−Off Source Impedance 300 W minimum 1 • Simple Slew Rate Control with External Capacitor • Flexible Operating Supply Range • Compatible with All ON Semiconductor MDTL and MTTL Logic • SOIC−14 D SUFFIX CASE 751A 14 Families Pb−Free Packages are Available PDIP−14 P SUFFIX CASE 646 14 1 SOEIAJ−14 M SUFFIX CASE 965 14 1 PIN CONNECTIONS Line Driver MC1488 Interconnecting Cable MDTL Logic Input Interconnecting Cable VEE 1 Line Receiver MC1489 MDTL Logic Output 14 VCC Input A 2 13 Input D1 Output A 3 12 Input D2 Input B1 4 11 Output D Input B2 5 10 Input C1 Output B 6 9 Input C2 Gnd 7 8 Output C Figure 1. Simplified Application ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 8 of this data sheet. DEVICE MARKING INFORMATION See general marking information in the device marking section on page 8 of this data sheet. © Semiconductor Components Industries, LLC, 2006 October, 2006 − Rev. 8 1 Publication Order Number: MC1488/D MC1488 VCC 14 6.2 k 8.2 k Pins 4, 9, 12 or 2 Input Input Pins 5, 10, 13 70 300 Output Pins 6, 8, 11 or 3 3.6 k GND 7 10 k 7.0 k VEE 1 Figure 2. Circuit Schematic (1/4 of Circuit Shown) http://onsemi.com 2 70 MC1488 MAXIMUM RATINGS (TA = + 25°C, unless otherwise noted.) Symbol Value Unit Power Supply Voltage Rating VCC VEE + 15 − 15 Vdc Input Voltage Range VIR − 15 p VIR p 7.0 Vdc Output Signal Voltage VO ± 15 Vdc PD 1/RqJA 1000 6.7 mW mW/°C Power Derating (Package Limitation, SO−14 and Plastic Dual−In−Line Package) Derate above TA = + 25°C Operating Ambient Temperature Range TA 0 to + 75 °C Storage Temperature Range Tstg − 65 to + 175 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. ELECTRICAL CHARACTERISTICS (VCC = + 9.0 ± 1% Vdc, VEE = − 9.0 ± 1% Vdc, TA = 0 to 75°C, unless otherwise noted.) Symbol Min Typ Max Unit Input Current − Low Logic State (VIL = 0) Characteristic IIL − 1.0 1.6 mA Input Current − High Logic State (VIH = 5.0 V) IIH − − 10 mA + 6.0 + 9.0 + 7.0 + 10.5 − − − 6.0 − 9.0 − 7.0 − 10.5 − − Output Voltage − High Logic State (VIL = 0.8 Vdc, RL = 3.0 kW , VCC = + 9.0 Vdc, VEE = − 9.0 Vdc) (VIL = 0.8 Vdc, RL = 3.0 kW , VCC = + 13.2 Vdc, VEE = − 13.2 Vdc) VOH Output Voltage − Low Logic State (VIH = 1.9 Vdc, RL = 3.0 kW , VCC = + 9.0 Vdc, VEE = − 9.0 Vdc) (VIH = 1.9 Vdc, RL = 3.0 kW , VCC = + 13.2 Vdc, VEE = − 13.2 Vdc) VOL Positive Output Short−Circuit Current, Note 1 IOS + + 6.0 + 10 + 12 Negative Output Short−Circuit Current, Note 1 IOS − − 6.0 − 10 − 12 mA ro 300 − − Ohms − − − − − − + 15 + 4.5 + 19 + 5.5 − − + 20 + 6.0 + 25 + 7.0 + 34 + 12 − − − − − − − 13 − − 18 − − − − 17 − 500 − 23 − 500 − 34 − 2.5 − − − − 333 576 275 350 ns Output Resistance (VCC = VEE = 0, ⎥ VO ⎜ = ± 2.0 V) Positive Supply Current (RI = ∞) (VIH = 1.9 Vdc, VCC = + 9.0 Vdc) (VIL = 0.8 Vdc, VCC = + 9.0 Vdc) (VIH = 1.9 Vdc, VCC = + 12 Vdc) (VIL = 0.8 Vdc, VCC = + 12 Vdc) (VIH = 1.9 Vdc, VCC = + 15 Vdc) (VIL = 0.8 Vdc, VCC = + 15 Vdc) ICC Negative Supply Current (RL = ∞) (VIH = 1.9 Vdc, VEE = − 9.0 Vdc) (VIL = 0.8 Vdc, VEE = − 9.0 Vdc) (VIH = 1.9 Vdc, VEE = − 12 Vdc) (VIL = 0.8 Vdc, VEE = − 12 Vdc) (VIH = 1.9 Vdc, VEE = − 15 Vdc) (VIL = 0.8 Vdc, VEE = − 15 Vdc) IEE Power Consumption (VCC = 9.0 Vdc, VEE = − 9.0 Vdc) (VCC = 12 Vdc, VEE = − 12 Vdc) PC Vdc Vdc mA mA mA mA mA mA mA mA mW SWITCHING CHARACTERISTICS (VCC = + 9.0 ± 1% Vdc, VEE = − 9.0 ± 1% Vdc, TA = + 25°C.) Propagation Delay Time (zI = 3.0 k and 15 pF) Fall Time tPLH − (zI = 3.0 k and 15 pF) tTHL − 45 75 ns Propagation Delay Time (zI = 3.0 k and 15 pF) tPHL − 110 175 ns Rise Time tTLH − 55 100 ns (zI = 3.0 k and 15 pF) 1. Maximum Package Power Dissipation may be exceeded if all outputs are shorted simultaneously. http://onsemi.com 3 MC1488 CHARACTERISTIC DEFINITIONS 9.0 V −9.0 V 14 9.0 V 1 14 1.9 V 5 2 1 2 3 4 6 9 8 12 11 VOL 10 4 −9.0 V 9 VOH 3.0 k 13 12 0.8 V VOH 7 7 VOL IIL IIH 5.0 V Figure 3. Input Voltage VCC Figure 4. Output Current VEE 14 14 1.9 V 7 1 1 2 IOS + 2 3 4 6 9 8 3 VO ± 2.0 Vdc 4 6 5 IOS ± 8 ± 6.6 mA Max 9 IOS − 11 10 12 11 12 13 7 0.8 V Figure 5. Output Short−Circuit Current Figure 6. Output Resistance (Power Off) VCC ein 2 VIH VO ICC 1.9 V 3.0 k 14 4 3.0 V 7 1.5 V 9 VIL ein 12 0V tPHL 1 tPLH VO 0.8 V 15 pF 50% IEE tTHL tTLH tTHL and tTLH Measured 10% to 90% VEE Figure 7. Power Supply Currents Figure 8. Switching Response http://onsemi.com 4 MC1488 12 VCC = VEE = ± 12 V 9.0 V O , OUTPUT VOLTAGE (V) I SC , SHORT CIRCUIT OUTPUT CURRENT (mA) TYPICAL CHARACTERISTICS (TA = +25°C, unless otherwise noted.) VCC = VEE = ± 9.0 V 6.0 VCC = VEE = ± 6.0 V 3.0 VI 0 VO −3.0 3.0 k −6.0 −9.0 −12 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 12 9.0 IOS + 6.0 VCC = 9.0 V 1.9 V 3.0 VI 0 −3.0 0.8 V VEE = 9.0 V −6.0 IOS − −9.0 −12 −55 0 25 75 125 Vin, INPUT VOLTAGE (V) T, TEMPERATURE (°C) Figure 9. Transfer Characteristics versus Power Supply Voltage Figure 10. Short Circuit Output Current versus Temperature 20 1000 IO , OUTPUT CURRENT (mA) 100 10 VI VO CL 1.0 1.0 10 100 1,000 10,000 12 3.0 kW LOAD LINE 8.0 4.0 0 −4.0 −8.0 1.9 V −12 IOS VI + VO −16 0.8 V VCC = VEE = ± 9.0V − −20 −16 −12 −8.0 −4.0 0 4.0 8.0 CL, CAPACITANCE (pF) VO, OUTPUT VOLTAGE (V) Figure 11. Output Slew Rate versus Load Capacitance Figure 12. Output Voltage and Current−Limiting Characteristics VCC , VEE , POWER SUPPLY VOLTAGE (V) SLEW RATE (V/s) μ 16 16 14 VCC 14 12 3 3.0 k 10 6 3.0 k 8.0 8 3.0 k 6.0 11 3.0 k 4.0 7 2.0 0 −55 1 VEE 0 25 75 T, TEMPERATURE (°C) Figure 13. Maximum Operating Temperature versus Power Supply Voltage http://onsemi.com 5 125 12 16 MC1488 APPLICATIONS INFORMATION The Electronic Industries Association EIA−232D specification details the requirements for the interface between data processing equipment and data communications equipment. This standard specifies not only the number and type of interface leads, but also the voltage levels to be used. The MC1488 quad driver and its companion circuit, the MC1489 quad receiver, provide a complete interface system between DTL or TTL logic levels and the EIA−232D defined levels. The EIA−232D requirements as applied to drivers are discussed herein. The required driver voltages are defined as between 5.0 and 15 V in magnitude and are positive for a Logic “0” and negative for a Logic “1.” These voltages are so defined when the drivers are terminated with a 3000 to 7000 W resistor. The MC1488 meets this voltage requirement by converting a DTL/TTL logic level into EIA−232D levels with one stage of inversion. The EIA−232D specification further requires that during transitions, the driver output slew rate must not exceed 30 V per microsecond. The inherent slew rate of the MC1488 is much too fast for this requirement. The current limited output of the device can be used to control this slew rate by connecting a capacitor to each driver output. The required capacitor can be easily determined by using the relationship C = IOS x DT/DV from which Figure 14 is derived. Accordingly, a 330 pF capacitor on each output will guarantee a worst case slew rate of 30 V per microsecond. power supply designs, a loss of system power causes a low impedance on the power supply outputs. When this occurs, a low impedance to ground would exist at the power inputs to the MC1488 effectively shorting the 300 W output resistors to ground. If all four outputs were then shorted to plus or minus 15 V, the power dissipation in these resistors would be excessive. Therefore, if the system is designed to permit low impedances to ground at the power supplies of the drivers, a diode should be placed in each power supply lead to prevent overheating in this fault condition. These two diodes, as shown in Figure 15, could be used to decouple all the driver packages in a system. (These same diodes will allow the MC1488 to withstand momentary shorts to the ±25 V limits specified in the earlier Standard EIA−232B.) The addition of the diodes also permits the MC1488 to withstand faults with power supplies of less than the 9.0 V stated above. VCC 14 14 14 MC1488 MC1488 MC1488 1000 SLEW RATE (V/s) μ 7 100 1 7 1 7 1 VEE 30 V/ms Figure 15. Power Supply Protection to Meet Power Off Fault Conditions 10 The maximum short circuit current allowable under fault conditions is more than guaranteed by the previously mentioned 10 mA output current limiting. 333 pF 1.0 1.0 10 100 1,000 Other Applications 10,000 The MC1488 is an extremely versatile line driver with a myriad of possible applications. Several features of the drivers enhance this versatility: 1. Output Current Limiting − this enables the circuit designer to define the output voltage levels independent of power supplies and can be accomplished by diode clamping of the output pins. Figure 16 shows the MC1488 used as a DTL to MOS translator where the high level voltage output is clamped one diode above ground. The resistor divider shown is used to reduce the output voltage below the 300 mV above ground MOS input level limit. C, CAPACITANCE (pF) Figure 14. Slew Rate versus Capacitance for ISC = 10 mA The interface driver is also required to withstand an accidental short to any other conductor in an interconnecting cable. The worst possible signal on any conductor would be another driver using a plus or minus 15 V, 500 mA source. The MC1488 is designed to indefinitely withstand such a short to all four outputs in a package as long as the power supply voltages are greater than 9.0 V (i.e., VCC q 9.0 V; VEE p − 9.0 V). In some http://onsemi.com 6 MC1488 2. Power Supply Range − as can be seen from the schematic drawing of the drivers, the positive and negative driving elements of the device are essentially independent and do not require matching power supplies. In fact, the positive supply can vary from a minimum 7.0 V (required for driving the negative pulldown section) to the maximum specified 15 V. The negative supply can vary from approximately − 2.5 V to the minimum specified − 15 V. The MC1488 will drive the output to within 2.0 V of the positive or negative supplies as long as the current output limits are not exceeded. The combination of the current limiting and supply voltage features allow a wide combination of possible outputs within the same quad package. Thus if only a portion of the four drivers are used for driving EIA−232D lines, the remainder could be used for DTL to MOS or even DTL to DTL translation. Figure 17 shows one such combination. 12 V 1/4 MC1488 MDTL MTTL Input MOS Output (with VSS = GND) 1.0 k 10 k −12 V MDTL Input 2 MDTL NAND Gate Input 4 MDTL MHTL Input −12 V MDTL MMOS Input Figure 16. MDTL/MTTL−to−MOS Translator 3 5 9 MRTL Output −0.7 V to +3.7 V 6 3.0 V 8 5.0 V MDTL Output −0.7 V to +5.7 V MC1488 MHTL Output −0.7 V to 10 V 10 12 11 MOS Output −10 V to 0 V 1.0 k 13 10 k 1 −12 V 7 14 12 V Figure 17. Logic Translator Applications http://onsemi.com 7 MC1488 ORDERING INFORMATION Device Package MC1488D SOIC−14 MC1488DG SOIC−14 (Pb−Free) MC1488DR2 SOIC−14 MC1488DR2G SOIC−14 (Pb−Free) MC1488P PDIP−14 MC1488PG PDIP−14 (Pb−Free) Operating Temperature Range 55 Units/Rail 2500/Tape & Reel TA = 0 to +75°C MC1488M SOEIAJ−14 MC1488MG SOEIAJ−14 (Pb−Free) MC1488MEL SOEIAJ−14 MC1488MELG SOEIAJ−14 (Pb−Free) 25 Units/Rail 50 Units/Rail 2000/Tape & Reel MARKING DIAGRAMS SOIC−14 D SUFFIX CASE 751A 14 1 PDIP−14 P SUFFIX CASE 646 14 MC1488G AWLYWW Shipping 14 MC1488DG AWLYWW MC1488P AWLYYWWG 1 1 SOEIAJ−14 M SUFFIX CASE 965 MC1488 ALYWG A WL, L YY, Y WW, W G = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package http://onsemi.com 8 MC1488 PACKAGE DIMENSIONS SOIC−14 CASE 751A−03 ISSUE H NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. −A− 14 8 −B− P 7 PL 0.25 (0.010) M 7 1 G −T− D 14 PL 0.25 (0.010) T B S A DIM A B C D F G J K M P R J M K M F R X 45 _ C SEATING PLANE B M S SOLDERING FOOTPRINT* 7X 7.04 14X 1.52 1 14X 0.58 1.27 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 9 MILLIMETERS MIN MAX 8.55 8.75 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.228 0.244 0.010 0.019 MC1488 PACKAGE DIMENSIONS PDIP−14 CASE 646−06 ISSUE P 14 8 1 7 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. B A F L N C −T− SEATING PLANE H G D 14 PL J K 0.13 (0.005) M M http://onsemi.com 10 DIM A B C D F G H J K L M N INCHES MIN MAX 0.715 0.770 0.240 0.260 0.145 0.185 0.015 0.021 0.040 0.070 0.100 BSC 0.052 0.095 0.008 0.015 0.115 0.135 0.290 0.310 −−− 10 _ 0.015 0.039 MILLIMETERS MIN MAX 18.16 19.56 6.10 6.60 3.69 4.69 0.38 0.53 1.02 1.78 2.54 BSC 1.32 2.41 0.20 0.38 2.92 3.43 7.37 7.87 −−− 10 _ 0.38 1.01 MC1488 PACKAGE DIMENSIONS SOEIAJ−14 CASE 965−01 ISSUE A 14 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). LE 8 Q1 E HE M_ L 7 1 DETAIL P Z D VIEW P A e A1 b 0.13 (0.005) c M 0.10 (0.004) DIM A A1 b c D E e HE 0.50 LE M Q1 Z MILLIMETERS MIN MAX −−− 2.05 0.05 0.20 0.35 0.50 0.10 0.20 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 −−− 1.42 INCHES MIN MAX −−− 0.081 0.002 0.008 0.014 0.020 0.004 0.008 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 −−− 0.056 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 http://onsemi.com 11 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative MC1488/D