HDMI Transmitter Port Protection and Interface Device CM2020-00TR Features Product Description • • The CM2020-00TR HDMI Transmitter Port Protection and Interface device is specifically designed for next generation HDMI source interface protection. An integrated package provides all ESD, level shift, overcurrent output protection and backdrive protection for an HDMI port in a single 38-Pin TSSOP package. • • • • • • • HDMI 1.3 compliant 0.05pF matching capacitance between the TMDS intra-pair Overcurrent output protection Level shifting/isolation circuitry Provides ESD protection to IEC61000-4-2 Level 4 - 8kV contact discharge - 15kV air discharge Matched 0.5mm trace spacing (TSSOP) Simplified layout for HDMI connectors Backdrive protection RoHS-compliant, lead-free packaging Applications • • • • PC Consumer Electronics Set Top Box DVDRW Players ©2010 SCILLC. All rights reserved. May 2010 – Rev. 4 The CM2020-00TR part is specifically designed to complement the CM2021 protection part in HDMI receivers (Displays, DTV, CE devices, etc.) The CM2020-00TR also incorporates a silicon overcurrent protection device for +5V supply voltage output to the connector. Publication Order Number: CM2020-00TR/D CM2020-00TR Electrical Schematic Rev. 4 | Page 2 of 13 | www.onsemi.com CM2020-00TR Pin Descriptions PIN DESCRIPTIONS PINS NAME ESD Level TMDS 0.9pF ESD protection . 3 TMDS 0.9pF ESD protection . 3 TMDS 0.9pF ESD protection . 3 TMDS 0.9pF ESD protection . 3 TMDS 0.9pF ESD protection . 3 TMDS 0.9pF ESD protection . 3 TMDS 0.9pF ESD protection . 3 TMDS 0.9pF ESD protection . 4 LV_SUPPLY referenced logic level into ASIC. 3 5V_SUPPLY referenced logic level out plus 3.5pF ESD to connector. 4 LV_SUPPLY referenced logic level into ASIC. 3 5V_SUPPLY referenced logic level out plus 3.5pF ESD to connector. 4 LV_SUPPLY referenced logic level into ASIC. 3 5V_SUPPLY referenced logic level out plus 3.5pF ESD to connector. 4 LV_SUPPLY referenced logic level into ASIC. 3 5V_SUPPLY referenced logic level out plus 3.5pF ESD to connector 4 Bias for CE / DDC / HOTPLUG level shifters. 4 Current source for 5V_OUT. 3 55mA minimum overcurrent protected 5V output. This output must be bypassed with a 0.1µF ceramic capacitor. 4 4, 35 TMDS_D2+ 8kV 6, 33 TMDS_D2- 8kV 7, 32 TMDS_D1+ 8kV 9, 30 TMDS_D1- 8kV 10, 29 TMDS_D0+ 8kV 12, 27 TMDS_D0- 8kV 13, 26 TMDS_CK+ 8kV 15, 24 TMDS_CK- 8kV 16 CE_REMOTE_IN 2kV 23 CE_REMOTE_OUT 17 DDC_CLK_IN 8kV 2kV 22 DDC_CLK_OUT 8kV 18 DDC_DAT_IN 2kV 21 DDC_DAT_OUT 8kV 19 HOTPLUG_DET_IN 2kV 20 HOTPLUG_DET_OUT 8kV 2 LV_SUPPLY 2kV 1 5V_SUPPLY DESCRIPTION 3 2kV 1 1 1 1 1 1 1 1 2 38 5V_OUT 8kV 37 ESD_BYP 2kV This pin must be connected to a 0.1µF ceramic capacitor. 3, 36 GND N/A Supply GND reference. 5, 34, 8, 31, 11, 28, 14, 25 TMDS_GND N/A TMDS ESD and Parasitic GND return. 5 Note 1: These 2 pins need to be connected together in-line on the PCB. Note 2: This output can be connected to an external 0.1µF ceramic capacitor, resulting in an increased ESD withstand voltage rating. Note 3: Standard IEC 61000-4-2, CDISCHARGE=150pF, RDISCHARGE=330Ω, 5V_SUPPLY and LV_SUPPLY within recommended operating conditions, GND=0V and ESD_BYP (pin 37), 5V_OUT (pin 38), and HOTPLUG_DET_OUT (pin 20) each bypassed with a 0.1µF ceramic capacitor connected to GND. Note 4: Human Body Model per MIL-STD-883, Method 3015, CDISCHARGE=100pF, RDISCHARGE=1.5kΩ, 5V_SUPPLYand LV_SUPPLY within recommended operating conditions, GND=0V and ESD_BYP (pin 37), 5V_OUT (pin 38), and HOTPLUG_DET_OUT (pin 20) each bypassed with a 0.1µF ceramic capacitor connected to GND. Note 5: These pins should be routed directly to the associated GND pins on the HDMI connector with single point ground vias at the connector Rev. 4 | Page 3 of 13 | www.onsemi.com CM2020-00TR Ordering Information PART NUMBERING INFORMATION 1 Pins Package Ordering Part Number Part Marking 38 TSSOP-38 CM2020-00TR CM2020-00TR Note 1: Parts are shipped in Tape and Reel form unless otherwise specified. Backdrive protection Below, two scenarios are discussed to illustrate what can happen when a powered device is connected to an unpowered device via a HDMI interface, substantiating the need for backdrive protection on this type of interface. In the first example a DVD player is connected to a TV via an HDMI interface. If the DVD player is switched off and the TV is left on, there is a possibility of reverse current flow back into the main power supply rail of the DVD player. Typically, the DVD's power supply has some form of bulk supply capacitance associated with it. Because all CMOS logic exhibits a very high impedance on the power rail node when "off", if there may be very little parasitic shunt resistance, and even with as little as a few milliamps of "backdrive" current flowing into the power rail, it is possible over time to charge that bulk supply capacitance to some intermediate level. If this level rises above the power-onreset (POR) voltage level of some of the integrated circuits in the DVD player, these devices may not reset properly when the DVD player is turned back on. In a more serious scenario, if any SOC devices are incorporated in the design which have built-in level shifter and DRC diodes for ESD protection, there is even a risk for permanent damage. In this case, if there is a pullup resistor (such as with DDC) on the other end of the cable, then that resistance will pull the SOC chips "output" up to a high level. This will forward bias the upper ESD diode in the DRC and charge the bulk capacitance in a similar fashion as described in the first example. If this current flow is high enough, even as little as a few milliamps, it could destroy one of the SOC chip's internal DRC diodes, as they are not designed for passing DC. To avoid either of these situations, the CM2020-00TR was designed to block backdrive current, guaranteeing no more than 5mA on any I/O pin when the I/O pin voltage is greater than the CM2020-00TR supply voltage. Figure 1. Backdrive Protection Diagram. Rev. 4 | Page 4 of 13 | www.onsemi.com CM2020-00TR Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS VCC5V, VCCLV 6.0 V DC Voltage at any Channel Input 6.0 V -65 to +150 °C Storage Temperature Range STANDARD (RECOMMENDED) OPERATING CONDITIONS SYMBOL PARAMETER MIN TYP MAX UNITS 5V_SUPPLY Operating Supply Voltage GND 5 5.5 V LV_SUPPLY Bias Supply Voltage 1 3.3 5.5 V 85 °C Operating Temperature Range -40 ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE 1) SYMBOL PARAMETER CONDITIONS ICC5V Operating Supply Current ICCLV TYP MAX UNITS 5V_SUPPLY = 5.0V 110 130 µA Bias Supply Current LV_SUPPLY = 3.3V 1 5 µA VDROP 5V_OUT Overcurrent Output Drop 5V_SUPPLY= 5.0V, IOUT=55mA 65 100 mV ISC 5V_OUT Short Circuit Current Limit 5V_SUPPLY= 5.0V, 5V_OUT = GND 135 175 mA IOFF OFF state leakage current, level shifting NFET LV_SUPPLY 0V 0.1 5 µA Current conducted from output pins to V_SUPPLY rails when powered down 5V_SUPPLY VCH_OUT; Signal pins: TMDS_D[2:0]+/-, TMDS_CK+/-, CE_REMOTE_OUT, DDC_DAT_OUT, DDC_CLK_OUT, HOTPLUG_DET_OUT, 5V_OUT Only 0.1 5 µA Current through CE-REMOTE_OUT when powered down CE-REMOTE_IN = LV_SUPPLY < CE_REMOTE_OUT 0.1 1 µA IBACKDRIVE IBACKDRIVE, CEC Rev. 4 | Page 5 of 13 | www.onsemi.com MIN 90 CM2020-00TR SYMBOL PARAMETER CONDITIONS VON VOLTAGE drop across level shifting NFET when ON LV_SUPPLY = 2.5V, VS = GND, IDS = 3mA VF Diode Forward Voltage Top Diode Bottom Diode IF = 8mA, TA = 25°C VESD ESD Withstand Voltage, contact discharge per IEC 61000-4-2 standard (IEC) Pins 4, 7, 10, 13, 20, 21, 22, 23, 24, 27, 30, 33, 38; TA=25°C Note 2 VCL Channel Clamp Voltage Positive Transients Negative Transients TA=25°C, IPP = 1A, tP = 8/20uS; Note 3 Dynamic Resistance Positive Transients Negative Transients IPP = 1A, tP = 8/20µS; TA = 25°C; Note 3 TMDS Channel Leakage Current TA = 25°C 0.01 1 µA TMDS Channel Input Capacitance 5V_SUPPLY= 5.0V, Measured at 1MHz, VBIAS=2.5V 0.9 1.2 pF TMDS Channel Input Capacitance Matching 5V_SUPPLY= 5.0V, Measured at 1MHz, VBIAS=2.5V; Note 4 0.05 CIN, DDC Level Shifting Input Capacitance, Capacitance to GND 5V_SUPPLY= 5.0V, Measured at 100KHz, VBIAS=2.5V; Note 2 3.5 4 pF CIN, CEC Level Shifting Input Capacitance, Capacitance to GND 5V_SUPPLY= 5.0V, Measured at 100KHz, VBIAS=2.5V 3.5 4 pF CIN, HP Level Shifting Input Capacitance, Capacitance to GND 5V_SUPPLY= 5.0V, Measured at 100KHz, VBIAS=2.5V 3.5 4 pF RDYN ILEAK CIN, TMDS ∆C IN, TMDS MIN TYP MAX UNITS 75 95 140 mV 0.6 0.6 0.85 0.85 0.95 0.95 V V kV ±8 10.8 -2.1 V V 1.4 0.9 Ω Ω pF Note 1: Operating Characteristics are over Standard Operating Conditions unless otherwise specified. Note2: Standard IEC 61000-4-2, CDISCHARGE=150pF, RDISCHARGE=330Ω, 5V_SUPPLY and LV_SUPPLY within recommended operating conditions, GND=0V and ESD_BYP (pin 37), 5V_OUT (pin 38), and HOTPLUG_DET_OUT (pin 20) each bypassed with a 0.1µF ceramic capacitor connected to GND. Note 3: These measurements performed with no external capacitor on ESD_BYP. Note 4: Intra-pair matching, each TMDS pair (i.e. D+, D-) Rev. 4 | Page 6 of 13 | www.onsemi.com CM2020-00TR Performance Information Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 2. Insertion Loss vs. Frequency (TMDS_D1- to GND) Rev. 4 | Page 7 of 13 | www.onsemi.com CM2020-00TR Application Information Figure 3. Typical Application for CM2020-00TR Rev. 4 | Page 8 of 13 | www.onsemi.com CM2020-00TR Application Information (cont’d) Design Considerations ESD Bypass Pin 37 (ESD_BYP) is provided for an optional external ESD bypass capacitor only (i.e. 0.1mF ceramic.) It should not be connected to any supply rail. 5V Overcurrent Output Maximum Overcurrent Protection output drop at 55mA on 5V_OUT is 100mV. To meet HDMI output requirements of 4.8-5.3V, an input of greater than 4.9V should be used (i.e. 5.1V +/- 4%). A 0.1µF ceramic bypass capacitor on this output is also recommended. Hotplug Detect Input To meet the requirements of HDMI CTS TID7-12, the following pullup/pulldown configuration is recommended for a 3.3V+/-10% internal VCC rail (See Figure 4 below). A 0.1µF ceramic capacitor is recommended for additional edge debounce and ESD bypass. DUT On vs. DUT Off Many HDMI CTS tests require a power off condition on the System Under Test. Many Dual Rail Clamp (DRC) ESD diode configurations will be forward biased when their VDD rail is lower than the I/O pin bias, thereby TM exhibiting extremely high apparent capacitance measurements, for example. The MediaGuard backdrive isolation circuitry limits this current to <5µA, and will help ensure compliance. Rev. 4 | Page 9 of 13 | www.onsemi.com CM2020-00TR Figure 4. Design Example Rev. 4 | Page 10 of 13 | www.onsemi.com CM2020-00TR Mechanical Details TSSOP-38 Mechanical Specifications CM2020-00TR devices are supplied in 38-pin TSSOP packages. Dimensions are presented below. PACKAGE DIMENSIONS Package TSSOP JEDEC No. MO-153 (Variation BD-1) Pins 38 Dimensions Millimeters Inches Min Max Min Max A — 1.20 — 0.047 A1 0.05 0.15 0.002 0.006 b 0.17 0.27 0.007 0.011 c 0.09 0.20 0.004 0.008 D 9.60 9.80 0.378 0.386 E E1 e L # per tape and reel 6.40 BSC 4.30 0.252 BSC 4.50 0.50 BSC 0.45 0.169 0.177 0.020 BSC 0.75 0.018 0.030 2500 pieces Controlling dimension: millimeters Package Dimensions for TSSOP-38 Rev. 4 | Page 11 of 13 | www.onsemi.com CM2020-00TR Tape and Reel Specifications PART NUMBER PACKAGE SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 CM2020-00TR 9.70 X 6.40 X 1.20 10.20 X 6.90 X 1.80 16mm 330mm (13") 2500 4mm 12mm Rev. 4 | Page 12 of 13 | www.onsemi.com CM2020-00TR ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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