NL27WZ32 Dual 2−Input OR Gate The NL27WZ32 is a high performance dual 2−input OR Gate operating from a 1.65 V to 5.5 V supply. • • • • • • • • • Extremely High Speed: tPD 2.5 ns (typical) at VCC = 5 V Designed for 1.65 V to 5.5 V VCC Operation Over Voltage Tolerant Inputs LVTTL Compatible − Interface Capability With 5 V TTL Logic with VCC = 3 V LVCMOS Compatible 24 mA Balanced Output Sink and Source Capability Near Zero Static Supply Current Substantially Reduces System Power Requirements Replacement for NC7WZ32 Chip Complexity: FET = 120 http://onsemi.com MARKING DIAGRAM 8 8 L4 1 US8 US SUFFIX CASE 493 D 1 D = Date Code A1 1 8 VCC B1 2 7 Y1 ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. Y2 GND 6 3 5 4 B2 IEEE/IEC 1 A1 B1 A2 Y1 A2 B2 Y2 Figure 1. Pinout Figure 2. Logic Symbol PIN ASSIGNMENT FUNCTION TABLE Pin Function Input 1 A1 2 B1 A B Y 3 Y2 L L L 4 GND L H H 5 A2 H L H 6 B2 H H H 7 Y1 8 VCC Semiconductor Components Industries, LLC, 2004 February, 2004 − Rev. 4 Output Y=A+B 1 Publication Order Number: NL27WZ32/D NL27WZ32 MAXIMUM RATINGS Symbol Parameter Value Unit VCC DC Supply Voltage 0.5 to 7.0 V VI DC Input Voltage 0.5 to 7.0 V VO DC Output Voltage 0.5 to 7.0 V IIK DC Input Diode Current VI < GND 50 mA IOK DC Output Diode Current VO < GND 50 mA IO DC Output Sink Current 50 mA ICC DC Supply Current per Supply Pin 100 mA IGND DC Ground Current per Ground Pin 100 mA TSTG Storage Temperature Range 65 to 150 °C TL Lead Temperature, 1 mm from Case for 10 Seconds TJ Junction Temperature under Bias JA Thermal Resistance PD Power Dissipation in Still Air at 85°C MSL Moisture Sensitivity FR Flammability Rating VESD ESD Withstand Voltage Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) > 2000 > 200 N/A V ILatch−Up Latch−Up Performance Above VCC and Below GND at 85°C (Note 5) 500 mA (Note 1) 260 °C 150 °C 250 °C/W 250 mW Level 1 Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If stress limits are exceeded device functional operation is not implied, damage may occur and reliability may be affected. Functional operation should be restricted to the Recommended Operating Conditions. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow. 2. Tested to EIA/JESD22−A114−A. 3. Tested to EIA/JESD22−A115−A. 4. Tested to JESD22−C101−A. 5. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC Supply Voltage VI Input Voltage VO Output Voltage TA Operating Free−Air Temperature t/V Input Transition Rise or Fall Rate Min Max Unit 1.65 1.5 5.5 5.5 V (Note 6) 0 5.5 V (HIGH or LOW State) 0 VCC V 40 85 °C 0 0 0 0 20 20 10 5 ns/V Operating Data Retention Only VCC = 1.8 V 0.15 V VCC = 2.5 V 0.2 V VCC = 3.0 V 0.3 V VCC = 5.0 V 0.5 V 6. Unused inputs may not be left open. All inputs must be tied to a high−logic voltage level or a low−logic input voltage level. http://onsemi.com 2 NL27WZ32 DC ELECTRICAL CHARACTERISTICS TA = +25C VCC Symbol Parameter Condition (V) Min 0.75 VCC 0.7 VCC VIH HIGH Level Input Voltage 1.65 to 1.95 VIL LOW Level Input Voltage 1.65 to 1.95 2.3 to 5.5 VOH HIGH Level Output Voltage VIN = VIH VOL Low−Level Output Voltage VIN = VIL Typ TA = −40C to +85C Max Min Max 0.75 VCC 0.7 VCC 0.3 VCC V 0.3 VCC IOH = −100 A 1.65 2.3 3.0 4.5 1.55 2.2 2.9 4.4 1.65 2.3 3.0 4.5 1.55 2.2 2.9 4.4 IOH = −4 mA IOH = −8 mA IOH = −16 mA IOH = −24 mA IOH = −32 mA 1.65 2.3 3.0 3.0 4.5 1.29 1.9 2.4 2.3 3.8 1.52 2.15 2.8 2.68 4.2 1.20 1.9 2.4 2.3 3.8 IOL = 100 A 1.65 2.3 3.0 4.5 0 0 0 0 0.1 0.1 0.1 0.1 IOH = 4 mA IOH = 8 mA IOH = 16 mA IOH = 24 mA IOH = 32 mA 1.65 2.3 3.0 3.0 4.5 0.08 0.1 0.15 0.22 0.22 0.24 0.3 0.4 0.55 0.55 Unit V V V IIN Input Leakage Current VIN = VCC or GND 0 to 5.5 0.1 1.0 IOFF Power OFF Leakage Current VIN or VOUT = 5.5 V 0.0 1.0 10 ICC Quiescent Supply Current VIN = VCC or GND 5.5 1.0 10 A A AC ELECTRICAL CHARACTERISTICS tR = tF = 3.0 ns VCC Symbol tPLH Parameter Propagation Delay 3 and 4)) ((Figure g tPHL 40C TA 85C TA = 25C Condition (V) Min Typ Max Min Max Unit RL = 1 M CL = 15 pF 1.8 0.15 2.5 0.2 2.0 1.0 8.0 3.5 9.5 5.8 2.0 1.0 10.5 6.2 ns RL = 1 M CL = 15 pF 3.3 0.3 0.8 2.6 3.9 0.8 4.3 1.2 3.2 4.8 1.2 5.2 0.5 1.9 3.1 0.5 3.3 0.8 2.5 3.7 0.8 4.0 RL = 500 CL = 50 pF RL = 1 M CL = 15 pF 5.0 0.5 RL = 500 CL = 50 pF CAPACITIVE CHARACTERISTICS Symbol Parameter Condition Typical Unit 2.5 pF pF CIN Input Capacitance VCC = 5.5 V, VI = 0 V or VCC CPD Power Dissipation Capacitance ( (Note 7)) 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 9 10 MHz, VCC = 5.5 V, VI = 0 V or VCC 11 7. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC. http://onsemi.com 3 NL27WZ32 tf = 3 ns tf = 3 ns 90% INPUT A and B VCC 90% 50% 50% INPUT 10% 10% tPHL OUTPUT GND RL tPLH CL VOH OUTPUT Y 50% 50% A 1−MHz square input wave is recommended for propagation delay tests. VOL Figure 3. Switching Waveform Figure 4. Test Circuit DEVICE ORDERING INFORMATION Device Nomenclature Device Order Number NL27WZ32US Logic Circuit Indicator No. of Gates per Package Temp Range Identifier Technology Device Function Package Suffix Package Type Tape and Reel Size† NL 2 7 WZ 32 US US8 178 mm, 3000 Unit †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 4 NL27WZ32 PACKAGE DIMENSIONS US8 US SUFFIX CASE 493−01 ISSUE A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION “A” DOES NOT INCLUDE MOLD FLASH, PROTRUSION OR GATE BURR. MOLD FLASH. PROTRUSION AND GATE BURR SHALL NOT EXCEED 0.140 MM (0.0055”) PER SIDE. 4. DIMENSION “B” DOES NOT INCLUDE INTER−LEAD FLASH OR PROTRUSION. INTER−LEAD FLASH AND PROTRUSION SHALL NOT E3XCEED 0.140 (0.0055”) PER SIDE. 5. LEAD FINISH IS SOLDER PLATING WITH THICKNESS OF 0.0076−0.0203 MM. (300−800 “). 6. ALL TOLERANCE UNLESS OTHERWISE SPECIFIED ±0.0508 (0.0002 “). −X− A 8 J −Y− 5 DETAIL E B L 1 4 R S G P U C −T− SEATING PLANE H 0.10 (0.004) T K D N 0.10 (0.004) M T X Y R 0.10 TYP V M F DETAIL E http://onsemi.com 5 DIM A B C D F G H J K L M N P R S U V MILLIMETERS MIN MAX 1.90 2.10 2.20 2.40 0.60 0.90 0.17 0.25 0.20 0.35 0.50 BSC 0.40 REF 0.10 0.18 0.00 0.10 3.00 3.20 0 6 5 10 0.23 0.34 0.23 0.33 0.37 0.47 0.60 0.80 0.12 BSC INCHES MIN MAX 0.075 0.083 0.087 0.094 0.024 0.035 0.007 0.010 0.008 0.014 0.020 BSC 0.016 REF 0.004 0.007 0.000 0.004 0.118 0.126 0 6 5 10 0.010 0.013 0.009 0.013 0.015 0.019 0.024 0.031 0.005 BSC NL27WZ32 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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