Holtek HT27LC512 Otp cmos 64kx 8-bit eprom Datasheet

HT27LC512
OTP CMOS 64K×8-Bit EPROM
Features
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64K×8-bit organization
Single +3.3V power supply
Programming voltage
– VPP=12.2V±0.2V
– VCC=5.8V±0.2V
Low power consumption
– Active: 15mA max.
– Standby: 1µA typ.
Fast read access time: 120ns
CMOS and TTL compatible I/O
Commercial and industrial temperature range
Fast programming algorithm
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Read access time: –120ns
Programming time 75µs typ.
High-reliability CMOS technology
Latch-up immunity to 100mA from -1.0V to
VCC+1.0V
Two line control (OE & CE)
Standard product identification code
Package type
– 28-pin DIP/SOP
– 32-pin PLCC
Commercial temperature ranges
(0°C to +70°C)
General Description
The HT27LC512 chip family is a low-power,
512K bit, +3.3V electrically one-time programmable (O TP ) read-only memories
(EPROM). Organized into 64K words with 8
bits per word, it features a fast single address
location programming, typically at 75µs per
byte. Any byte can be accessed in less than 120ns
with respect to Spec. This eliminates the need for
WAIT states in high-performance microprocessor
systems. The HT27LC512 has separate Output Enable
(OE) and Chip Enable (CE) controls which
eliminate bus contention issues.
Block Diagram
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HT27LC512
Pin Assignment
Pin Description
Pin Name
A0~A15
DQ0~DQ7
CE
OE/VPP
NC
I/O/C/P
I
I/O
C
C/P
—
Description
Address inputs
Data inputs/outputs
Chip enable
Output enable/program voltage supply
No connection
Absolute Maximum Ratings
Operation Temperature Commercial ...................................................................................0°C to +70°C
Storage Temperature......................................................................................................... –65°C to 125°C
Applied VCC Voltage with Respect to GND....................................................................... –0.6V to 7.0V
Applied Voltage on Input Pin with Respect to GND ......................................................... –0.6V to 7.0V
Applied Voltage on Output Pin with Respect to GND ............................................. –0.6V to VCC+0.5V
Applied Voltage on A9 Pin with Respect to GND ............................................................ –0.6V to 13.5V
Applied VPP Voltage with Respect to GND ......................................................................–0.6V to 13.5V
Applied READ Voltage (Functionality is guaranteed between these limits) ................... +3V to +3.6V
Note: These are stress ratings only. Stresses exceeding the range specified under “Absolute Maximum Ratings” may cause substantial damage to the device. Functional operation of this device
at other conditions beyond those listed in the specification is not implied and prolonged
exposure to extreme conditions may affect device reliability.
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HT27LC512
D.C. Characteristics
Read operation
Symbol
Test Conditions
Parameter
VCC
Min. Typ.
Max.
Unit
Conditions
VOH
Output High Level
3.3V IOH=–0.4mA
2.4
—
—
V
VOL
Output Low Level
3.3V IOL=2.0mA
—
—
0.45
V
VIH
Input High Level
3.3V
—
2.0
—
VCC+0.5
V
VIL
Input Low Level
3.3V
—
–0.3
—
0.8
V
ILI
Input Leakage Current
3.3V VIN=0 to 3.6V
–5
—
5
µA
ILO
Output Leakage Current
3.3V VOUT=0 to 3.6V
–10
—
10
µA
ICC
VCC Active Current
3.3V
—
—
15
mA
ISB1
Standby Current (CMOS)
3.3V CE=VCC±0.3V
—
1.0
10
µA
ISB2
Standby Current (TTL)
3.3V CE=VIH
—
—
0.6
mA
IPP
VPP Read/Standby Current 3.3V CE=OE=VIL, VPP=VCC
—
—
100
µA
Min.
Typ.
Max.
Unit
CE=VIL, f=5MHz,
IOUT=0mA
Programming operation
Symbol
Parameter
Test Conditions
VCC
Conditions
VOH
Output High Level
5.8V IOH=–0.4mA
2.4
—
—
V
VOL
Output Low Level
5.8V IOL=2.1mA
—
—
0.45
V
VIH
Input High Level
5.8V
—
0.7VCC
—
VCC+0.5
V
VIL
Input Low Level
5.8V
—
–0.5
—
0.8
V
ILI
Input Load Current
5.8V VIN=VIL, VIH
—
—
5.0
µA
VH
A9 Product ID Voltage
5.8V
—
11.5
—
12.5
V
ICC
VCC Supply Current
5.8V
—
—
—
40
mA
IPP
VPP Supply Current
5.8V CE=VIL
—
—
10
mA
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HT27LC512
Capacitance
Symbol
Test Conditions
Parameter
VCC
Min. Typ. Max. Unit
Conditions
CIN
Input Capacitance
3.3V
VIN=0V
—
8
12
pF
COUT
Output Capacitance
3.3V
VOUT=0V
—
8
12
pF
CVPP
VPP Capacitance
3.3V
VPP=0V
—
18
25
pF
A.C. Characteristics
Read operation
Symbol
Parameter
Test Conditions
VCC
Conditions
–120
Unit
Min.
Max.
tACC
Address to Output Delay
3.3V CE=OE=VIL
—
120
ns
tCE
Chip Enable to Output Delay
3.3V OE=VIL
—
120
ns
tOE
Output Enable to Output Delay
3.3V CE=VIL
—
45
ns
tDF
CE or OE High to Output Float,
Whichever Occurred First
3.3V
—
—
40
ns
tOH
Output Hold from Address, CE or
3.3V
OE, Whichever Occurred First
—
0
—
ns
Ta=+25°C±5°C
Programming operation
Symbol
Parameter
Test Conditions
VCC
Conditions
Min. Typ. Max. Unit
tAS
Address Setup Time
5.8V
—
2
—
—
µs
tOES
CE/VPP Setup Time
5.8V
—
2
—
—
µs
tOEH
OE/VPP Hold Time
5.8V
—
2
—
—
µs
tDS
Data Setup Time
5.8V
—
2
—
—
µs
tAH
Address Hold Time
5.8V
—
0
—
—
µs
tDH
Data Hold Time
5.8V
—
2
—
—
µs
tDFP
Output Enable to Output Float
Delay
5.8V
—
0
—
130
ns
tPW
PGM Program Pulse Width
5.8V
—
30
75
105
µs
tVCS
VCC Setup Time
5.8V
—
2
—
—
µs
tDV
Data Valid From CE
5.8V
—
—
—
150
ns
tVR
OE/VPP Recovery Time
5.8V
—
2
—
—
µs
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HT27LC512
Test waveforms and measurements
tR, tF< 20ns (10% to 90%)
Output test load
Note: CL=100pF including jig capacitance
Product Identification Code
Pins
A0
A1
DQ7
DQ6
DQ5
DQ4
DQ3
DQ2
DQ1
DQ0
Hex
Data
Manufacturer
0
1
0
0
0
1
1
1
0
0
1C
Device Type
1
1
1
0
0
0
0
0
1
1
83
0
0
0
1
1
1
1
1
1
1
7F
1
0
0
1
1
1
1
1
1
1
7F
Code
Continuation
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HT27LC512
Functional Description
Operation mode
All the operation modes are shown in the table following.
CE
OE/VPP
A0
A9
Output
Read
Mode
VIL
VIL
X (2)
X
Dout
Output Disable
VIL
VIH
X
X
High Z
Standby (TTL)
VIH
X
X
X
High Z
VCC± 0.3V
X
X
X
High Z
Program
VIL
VPP
X
X
DIN
Program Verify
VIL
VIL
X
X
DOUT
Product Inhibit
VIH
VPP
X
X
High Z
Manufacturer Code (3)
VIL
VIL
VIL
VH (1)
1C
Device Code (3)
VIL
VIL
VIH
VH (1)
83
Standby (CMOS)
Notes: (1) VH = 12.0V ± 0.5V
(2) X=Either VIH or VIL
(3) For Manufacturer Code and Device Code, A1=VIH, When A1=VIL, both codes will read 7F
Programming of the HT27LC512
assure that each EPROM bit is programmed to
a sufficiently high threshold voltage. This ensures that all bits have sufficient margin. After
the final address is completed, the entire
EPROM memory is read at VCC=VPP=5.25±0.25V
to verify the entire memory.
When the HT27LC512 is delivered, the chip has
all 512K bits in the “ONE”, or HIGH state.
“ZEROs” are loaded into the HT27LC512
through the procedure of programming.
The programming mode is entered when
12.2±0.2V is applied to the OE/VPP pin and CE
is at VIL. For programming, the data to be
programmed is applied with 8 bits in parallel to
the data pins.
Program inhibit mode
Programming of multiple HT27LC512 in parallel with different data is also easily accomplished by using the Program Inhibit Mode.
Except for CE, all like inputs of the parallel
HT27LC512 may be common. A TTL low-level
program pulse applied to an HT27LC512 CE
input with OE/VPP=12.2±0.2V will program that
HT27LC512. A high-level CE input inhibits the
other HT27LC512 from being programmed.
The programming flowchart in Figure 3. shows
the fast interactive programming algorithm.
The interactive algorithm reduces programming time by using 30µs to 105µs programming
pulses and giving each address only as many
pulses as is necessary in order to reliably program the data. After each pulse is applied to a
given address, the data in that address is verified. If the data is not verified, additional pulses
are given until it is verified or until the maximum number of pulses is reached. This process
is repeated while sequencing through each address of the HT27LC512. This part of the programming algorithm is carried at VCC=5.8V to
Program verify mode
Verification should be performed on the programmed bits to determine whether they were
correctly programmed. The verification should
be performed with OE/VPP and CE at VIL. Data
should be verified at tDV after the falling edge
of CE.
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HT27LC512
standby mode which reduces the maximum
VCC current to 0.6mA. It is placed in TTLstandby when CE is at VIH. When in standby
mode, the outputs are in a high-impedance
state, independent of the OE input.
Auto product identification
The Auto Product Identification mode allows
the reading out of a binary code from an
EPROM that will identify its manufacturer and
type. This mode is intended for use by the programming equipment for the purpose of automatically matching the device to be
programmed with its corresponding programming algorithm. This mode is functional in the
25°C±5°C ambient temperature range that is
required when programming the HT27LC512.
Two-line output control function
To accommodate multiple memory connections,
a two-line control function is provided to allow
for:
• Low memory power consumption
• Assurance that output bus contention will not
To activate this mode, the programming equipment must force 12.0±0.5V on the address line A9
of the HT27LC512. Two identifier bytes may then
be sequenced from the device outputs by toggling
address line A0 from VIL to VIH, when A1=VIH. All
other address lines must be held at VIH during
Auto Product Identification mode.
Byte 0 (A0=VIL) represents the manufacturer
code, and byte 1 (A0=VIH), the device code. For
HT27LC512, these two identifier bytes are shown
in the Mode Select Table. All identifiers for the
manufacturer and device codes will possess odd
parity, with the MSB (DQ7) defined as the parity
bit. When A1=VIL, the HT27LC512 will read out
the binary code of 7F, continuation code, to signify
the unavailability of manufacturer ID codes.
occur.
It is recommended that CE be decoded and used
as the primary device-selection function, while
OE be made a common connection to all devices
in the array and connected to the READ line
from the system control bus. This assures that
all deselected memory devices are in their lowpower standby mode and that the output pins
are only active when data is desired from a
particular memory device.
System considerations
During the switch between active and standby
conditions, transient current peaks are produced on the rising and falling edges of Chip
Enable. The magnitude of these transient current peaks is dependent on the output capacitance loading of the device. At a minimum, a
0.1µF ceramic capacitor (high frequency, low
inherent inductance) should be used on each
device between VCC and VPP to minimize transient effects. In addition, to overcome the voltage drop caused by the inductive effects of the
printed circuit board traces on EPROM arrays,
a 4.7µF bulk electrolytic capacitor should be
used between VCC and VPP for each eight devices. The location of the capacitor should be
close to where the power supply is connected to
the array.
Read mode
The HT27LC512 has two control functions,
both of which must be logically satisfied in order to obtain data at outputs. Chip Enable (CE)
is the power control and should be used for
device selection. Output Enable (OE) is the output control and should be used to gate data to
the output pins, independent of device selection. Assuming that addresses are stable, address access time (tACC) is equal to the delay
from CE to output (tCE). Data is available at the
outputs (tOE) after the falling edge of OE, assuming the CE has been LOW and addresses
have been stable for at least tACC-tOE.
Standby mode
The HT27LC512 has CMOS standby mode
which reduces the maximum VCC current to
10µA. It is placed in CMOS standby when CE is
at VCC±0.3V. The HT27LC512 also has a TTL-
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HT27LC512
Figure 1. A.C. waveforms for read operation
Figure 2. Programming waveforms
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HT27LC512
Figure 3. Fast programming flowchart
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HT27LC512
Holtek Semiconductor Inc. (Headquarters)
No.3 Creation Rd. II, Science-based Industrial Park, Hsinchu, Taiwan, R.O.C.
Tel: 886-3-563-1999
Fax: 886-3-563-1189
Holtek Semiconductor Inc. (Taipei Office)
5F, No.576, Sec.7 Chung Hsiao E. Rd., Taipei, Taiwan, R.O.C.
Tel: 886-2-2782-9635
Fax: 886-2-2782-9636
Fax: 886-2-2782-7128 (International sales hotline)
Holtek Microelectronics Enterprises Ltd.
RM.711, Tower 2, Cheung Sha Wan Plaza, 833 Cheung Sha Wan Rd., Kowloon, Hong Kong
Tel: 852-2-745-8288
Fax: 852-2-742-8657
Copyright © 1999 by HOLTEK SEMICONDUCTOR INC.
The information appearing in this Data Sheet is believed to be accurate at the time of publication. However, Holtek
assumes no responsibility arising from the use of the specifications described. The applications mentioned herein are
used solely for the purpose of illustration and Holtek makes no warranty or representation that such applications
will be suitable without further modification, nor recommends the use of its products for application that may present
a risk to human life due to malfunction or otherwise. Holtek reserves the right to alter its products without prior
notification. For the most up-to-date information, please visit our web site at http://www.holtek.com.tw.
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