DIODES DMN65D8LW

DMN65D8LW
N-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
V(BR)DSS
Features
RDS(ON)
•
•
•
•
•
•
•
•
•
ID
TA = +25°C
Package
300mA
3Ω @ VGS = 10V
SOT323
60V
260mA
4Ω @ VGS = 5V
Description
This new generation MOSFET has been designed to minimize the onstate resistance (RDS(on)) and yet maintain superior switching
performance, making it ideal for high efficiency power management
applications.
Applications
•
•
•
•
Low On-Resistance
Low Gate Threshold Voltage
Low Input Capacitance
Fast Switching Speed
Small Surface Mount Package
ESD Protected Gate, 1KV (HBM)
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
•
•
Case: SOT323
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Matte Tin Finish annealed over Alloy 42 leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
Terminal Connections: See Diagram
Weight: 0.006 grams (approximate)
•
•
DC-DC Converters
Power Management Functions
Battery Operated Systems and Solid-State Relays
Drivers: Relays, Solenoids, Lamps, Hammers, Displays,
Memories, Transistors, etc
•
•
Drain
SOT323
D
Gate
Top View
ESD PROTECTED TO 1kV
Gate
Protection
Diode
S
G
Top View
Pin Configuration
Source
Equivalent Circuit
Ordering Information (Note 4)
Part Number
DMN65D8LW-7
Notes:
Case
SOT323
Packaging
3000/Tape & Reel
1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.
2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com.
MM3
Date Code Key
Year
Code
Month
Code
2011
Y
Jan
1
YM
Marking Information
2012
Z
Feb
2
DMN65D8LW
Document number: DS35639 Rev. 4 - 2
Mar
3
MM3 = Product Type Marking Code
YM = Date Code Marking
Y = Year (ex: Y = 2011)
M = Month (ex: 9 = September)
2013
A
Apr
4
May
5
2014
B
Jun
6
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2015
C
Jul
7
Aug
8
2016
D
Sep
9
Oct
O
2017
E
Nov
N
Dec
D
July 2012
© Diodes Incorporated
DMN65D8LW
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
VDSS
VGSS
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (Note 6) VGS = 10V
Steady
State
Continuous Drain Current (Note 6) VGS = 5V
Steady
State
TA = +25°C
TA = +70°C
TA = +25°C
TA = +70°C
Value
60
±20
300
230
ID
mA
260
210
800
1
ID
Pulsed Drain Current (10µs pulse, duty cycle = 1%)
Maximum Body Diode Continuous Current (Note 6)
Units
V
V
IDM
IS
mA
mA
A
Thermal Characteristics
Characteristic
Symbol
(Note 5)
(Note 6)
(Note 5)
(Note 6)
(Note 5)
Total Power Dissipation
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Case
Operating and Storage Temperature Range
Value
300
432
398
290
142
-55 to +150
PD
RθJA
RθJC
TJ, TSTG
Units
mW
°C/W
°C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Body Leakage
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
Symbol
Min
Typ
Max
Unit
BVDSS
IDSS
IGSS
60
⎯
⎯
⎯
⎯
⎯
⎯
1.0
±5.0
V
µA
µA
VGS = 0V, ID = 250µA
VDS = 60V, VGS = 0V
VGS = ±20V, VDS = 0V
VGS(th)
Static Drain-Source On-Resistance
RDS (ON)
gFS
VSD
1.2
⎯
⎯
80
-
⎯
2
2.5
290
0.8
2.0
3
4
⎯
1.2
V
Ω
Ω
mS
V
VDS = VGS, ID = 250µA
VGS = 10V, ID = 0.115A
VGS = 5V, ID = 0.115A
VDS = 10V, ID = 0.115A
VGS = 0V, IS = 115mA
Ciss
Coss
Crss
RG
Qg
Qg
Qgs
Qgd
tD(on)
tr
tD(off)
tf
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
22.0
3.2
2.0
79.9
0.87
0.43
0.11
0.11
2.7
2.8
12.6
7.3
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
pF
VDS = 25V, VGS = 0V, f = 1.0MHz
Ω
VDS = 0V, VGS = 0V, f = 1.0MHz
nC
VGS = 10V, VDS = 30V,
ID = 150mA
nS
VDD = 30V, ID = 0.115A, VGEN = 10V,
RGEN = 25Ω
Forward Transconductance
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Total Gate Charge VGS = 10V
Total Gate Charge VGS = 4.5V
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Notes:
Test Condition
5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper pad layout.
7 .Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to production testing.
DMN65D8LW
Document number: DS35639 Rev. 4 - 2
2 of 5
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© Diodes Incorporated
DMN65D8LW
1
0.6
VDS = 5.0V
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
0.5
0.4
0.3
0.2
0.1
TA = 150°C
TA = 125°C
TA = 85°C
TA = 25°C
0.1
TA = -55°C
0.01
0
1
2
3
4
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 1 Typical Output Characteristic
5
0
2.4
4.5
2.2
RDS(ON), DRAIN-SOURCE
ON-RESISTANCE (NORMALIZED)
5.0
4.0
3.5
3.0
VGS = 5V
2.5
2.0
VGS= 10V
1.5
1.0
0.5
0
0.5
1.0 1.5 2.0 2.5 3.0 3.5 4.0
VGS, GATE-SOURCE VOLTAGE
Figure 2 Typical Transfer Characteristics
2.0
VGS = 10 V
ID = 115mA
1.8
1.6
VGS = 5V
ID = 115mA
1.4
1.2
1.0
0.8
0.6
0
0.1
0.2
0.3
0.4
0.5
ID, DRAIN CURRENT
Figure 3 Typical On-Resistance vs.
Drain Current and Temperature
0.4
50
0.6
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Figure 4 On-Resistance Variation with Temperature
5
2.0
VGS(th), GATE THRESHOLD VOLTAGE (V)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
0
4
3
VGS = 5V
ID = 115mA
2
VGS = 10V
ID = 115mA
1
0
- 50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Figure 5 On-Resistance Variation with Temperature
DMN65D8LW
Document number: DS35639 Rev. 4 - 2
1.8
1.6
ID = 1mA
1.4
1.2
ID = 250µA
1.0
0.8
0.6
0.4
0.2
0
-50
-25
0
25
50 75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Figure 6 Gate Threshold Variation vs. Ambient Temperature
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DMN65D8LW
1,000
IDSS, DRAIN LEAKAGE CURRENT (nA)
IS, SOURCE CURRENT (V)
1
0.1
T A = 150°C
TA = 85°C
T A = 125°C
0.01
TA = 25°C
T A = -55°C
0.001
0
100
TA = 150°C
T A = 125°C
10
TA = -55°C TA = 25°C
1
0.2
0.4
0.6
0.8
1.0
1.2
VSD, SOURCE-DRAIN VOLTAGE (V)
Figure 7 Diode Forward Voltage vs. Current
0
10
20
30
40
50
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 8 Typical Drain-Source Leakage Current vs. Voltage
50
10
f = 1MHz
VGS GATE THRESHOLD VOLTAGE (V)
CT, JUNCTION CAPACITANCE (pF)
45
40
35
30
25
Ciss
20
15
10
Coss
5
0
T A = 85°C
Crss
0
5
10
15
20
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 9 Typical Junction Capacitance
25
9
VDS = 30V
ID = 150mA
8
7
6
5
4
3
2
1
0
0
0.2
0.4
0.6
0.8
Qg, TOTAL GATE CHARGE (nC)
Figure 10 Gate Charge
1.0
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
A
SOT323
Dim
Min
Max
Typ
A
0.25
0.40
0.30
B
1.15
1.35
1.30
C
2.00
2.20
2.10
D
0.65
G
1.20
1.40
1.30
H
1.80
2.20
2.15
J
0.0
0.10
0.05
K
0.90
1.00
1.00
L
0.25
0.40
0.30
M
0.10
0.18
0.11
0°
8°
α
All Dimensions in mm
B C
G
H
K
J
DMN65D8LW
Document number: DS35639 Rev. 4 - 2
M
D
L
4 of 5
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DMN65D8LW
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
Y
Z
Dimensions Value (in mm)
Z
2.8
X
0.7
Y
0.9
C
C
E
X
1.9
1.0
E
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representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2012, Diodes Incorporated
www.diodes.com
DMN65D8LW
Document number: DS35639 Rev. 4 - 2
5 of 5
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July 2012
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