DXTA42 NPN SURFACE MOUNT TRANSISTOR Please click here to visit our online spice models database. Features Mechanical Data • • • • • • • • Epitaxial Planar Die Construction Complementary PNP Type Available (DXTA92) Ideally Suited for Automated Assembly Processes Ideal for Medium Power Switching or Amplification Applications Lead Free By Design/RoHS Compliant (Note 1) "Green" Device (Note 2) Case: SOT89-3L Case Material: Molded Plastic, "Green” Molding Compound. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020C Terminals: Finish — Matte Tin annealed over Copper leadframe (Lead Free Plating). Solderable per MIL-STD-202, Method 208 Marking & Type Code Information: See Page 3 Ordering Information: See Page 3 Weight: 54.8mg (approximate) • • • • • COLLECTOR 2,4 3 E C 4 2 C 1 BASE 1 B 3 EMITTER TOP VIEW Top View Pin Out Configuration Device Schematic Maximum Ratings @TA = 25°C unless otherwise specified Characteristic Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Continuous Collector Current Symbol VCBO VCEO VEBO IC Value 300 300 6 500 Unit V V V mA Value 1 125 -55 to +150 Unit W °C/W °C Thermal Characteristics Characteristic Power Dissipation (Note 3) @ TA = 25°C Thermal Resistance, Junction to Ambient (Note 3) Operating and Storage Temperature Range Symbol PD RθJA TJ, TSTG Electrical Characteristics @TA = 25°C unless otherwise specified Characteristic OFF CHARACTERISTICS (Note 4) Collector-Base Breakdown Voltage Collector-Emitter Breakdown Voltage Emitter-Base Breakdown Voltage Collector Cut-off Current Emitter Cut-off Current ON CHARACTERISTICS (Note 4) Collector-Emitter Saturation Voltage Base-Emitter Saturation Voltage Static Forward Current Transfer Ratio Symbol Min Typ Max Unit V(BR)CBO V(BR)CEO V(BR)EBO ICBO IEBO 300 300 6 ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ 0.1 0.1 V V V μA μA IC = 100μA, IE = 0 IC = 1mA, IB = 0 IE = 100μA, IC = 0 VCB = 200V, IE = 0 VEB = 6V, IC = 0 VCE(SAT) VBE(SAT) ⎯ ⎯ 25 40 40 ⎯ ⎯ 0.5 0.9 V V ⎯ ⎯ ⎯ IC = 20mA, IB = 2mA IC = 20mA, IB = 2mA IC = 1mA, VCE = 10V IC = 10mA, VCE = 10V IC = 30mA, VCE = 10V hFE Test Conditions SMALL SIGNAL CHARACTERISTICS Transition Frequency fT 50 ⎯ ⎯ MHz Output Capacitance Cobo ⎯ ⎯ 3 pF Notes: 1. 2. 3. 4. IC = 10mA, VCE = 20V, f = 100MHz VCB = 20V, f = 1MHz No purposefully added lead. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php. Device mounted on FR-4 PCB; pad layout as shown on page 4 or in Diodes Inc. suggested pad layout document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf. Measured under pulsed conditions. Pulse width = 300μs. Duty cycle ≤ 2%. DXTA42 Document number: DS31158 Rev. 4 - 2 1 of 4 www.diodes.com December 2009 © Diodes Incorporated DXTA42 RθJA = 125°C VCE(SAT), COLLECTOR-EMITTER SATURATION VOLTAGE (V) 0.5 0.4 0.3 0.2 0.1 0 0.01 DXTA42 Document number: DS31158 Rev. 4 - 2 2 of 4 www.diodes.com 0.1 1 10 100 1,000 IC, COLLECTOR CURRENT (mA) Fig. 4 Collector-Emitter Saturation Voltage vs. Collector Current December 2009 © Diodes Incorporated DXTA42 Ordering Information (Note 5) Part Number DXTA42-13 Notes: Case SOT89-3L Packaging 2500/Tape & Reel 5. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf. Marking Information (Top View) = Manufacturer’s code marking K3M = Product Type Marking Code YWW = Date Code Marking Y = Last digit of year ex: 9 = 2009 WW = Week code 01 - 52 YWW K3M Package Outline Dimensions R0 D1 .2 00 C E H L B e B1 8° (4 X ) A SOT89-3L Dim Min Max Typ A 1.40 1.60 1.50 B 0.45 0.55 0.50 B1 0.37 0.47 0.42 C 0.35 0.43 0.38 D 4.40 4.60 4.50 D1 1.50 1.70 1.60 E 2.40 2.60 2.50 e — — 1.50 H 3.95 4.25 4.10 L 0.90 1.20 1.05 All Dimensions in mm D DXTA42 Document number: DS31158 Rev. 4 - 2 3 of 4 www.diodes.com December 2009 © Diodes Incorporated DXTA42 Suggested Pad Layout X1 Dimensions Value (in mm) X1 1.7 X2 0.9 X3 0.4 Y1 2.7 Y2 1.3 Y3 1.9 C 3.0 Y1 X3 X2 Y3 Y2 C IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). 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Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2009, Diodes Incorporated www.diodes.com DXTA42 Document number: DS31158 Rev. 4 - 2 4 of 4 www.diodes.com December 2009 © Diodes Incorporated