Superworld L810HW-R68MF-98 High current molded power inductor Datasheet

HIGH CURRENT MOLDED POWER INDUCTORS
L810HW SERIES
1. PART NO. EXPRESSION :
L810HW-1R0MF(a)
(b)
(c)
(d)(e)
(f)
(a) Series code
(d) Tolerance code : M = ±20%
(b) Type code
(e) F : RoHS Compliant
(c) Inductance code : 1R0 = 1.0uH
(f) 11 ~ 99 : Internal controlled number
2. CONFIGURATION & DIMENSIONS :
A'
C'
A
C
D
L
E
B'
B
SWORLD
R47
H
G
PCB Pattern
Unit:m/m
A'
A
B'
B
C'
C
D
E
G
H
L
13.9 Max.
12.7±0.3
13.5 Max.
12.7±0.3
3.7 Max.
3.5 Max.
2.5±0.5
3.0±0.5
7.0 Ref.
4.5 Ref.
15.0 Ref.
3. SCHEMATIC :
4. MATERIALS :
a
b
(a) Core
(b) Wire
(c) Terminal
c
5. FEATURES :
a) Shielded Construction
b) Frequency up to 5MHz
NOTE : Specifications subject to change without notice. Please check our website for latest information.
25.08.2010
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 1
HIGH CURRENT MOLDED POWER INDUCTORS
L810HW SERIES
6. GENERAL SPECIFICATION :
a) Test Freq. : Q : 100KHz/1.0V
b) Ambient Temp. : 20°C
c) Operating Temp. : -55°C to +125°C
d) Storage Temp. : -55°C to +125°C
e) Humidity Range : 50 ~ 60% RH
f) Heat Rated Current (Irms) : Will cause the coil temp. rise approximately ǻT=40°C without core loss.
g) Saturation Current (Isat) : Will cause L 0 to drop approximately 20% typ.
h) Part Temperature (Ambient+Temp. Rise) : Should not exceed 125°C under worst case operating conditions.
7. ELECTRICAL CHARACTERISTICS :
Inductance L 0
( µH )
±20% @ 0 Adc
Test
Frequency
( Hz )
Irms
(A)
Typ.
Isat
(A)
Typ.
DCR
( mȍ )
Max.
Q
Min.
L810HW-R47MF-
0.47
1.0V/100K
32
44
2.0
12
L810HW-R68MF-
0.68
1.0V/100K
28
40
2.5
12
L810HW-R82MF-
0.82
0.25V/100K
25
38
3.0
-
L810HW-1R0MF-
1.00
1.0V/100K
24
36
3.5
20
L810HW-1R5MF-
1.50
1.0V/100K
19
28
5.5
20
L810HW-2R2MF-
2.20
1.0V/100K
16
20
8.0
20
L810HW-3R3MF-
3.30
1.0V/100K
12
18
12
20
L810HW-4R7MF-
4.70
1.0V/100K
10
16
15
20
L810HW-6R8MF-
6.80
1.0V/100K
9
13
22
20
L810HW-100MF-
10.0
1.0V/100K
7
9.5
34
20
Part No.
NOTE : Specifications subject to change without notice. Please check our website for latest information.
25.08.2010
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 2
HIGH CURRENT MOLDED POWER INDUCTORS
L810HW SERIES
8. CHARACTERISTICS CURVES :
INDUCTANCE VS. FREQUENCY
Q VS. FREQUENCY
INDUCTANCE VS. DC CURRENT
TEMP. RISE VS. DC CURRENT
NOTE : Specifications subject to change without notice. Please check our website for latest information.
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SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 3
HIGH CURRENT MOLDED POWER INDUCTORS
L810HW SERIES
8. CHARACTERISTICS CURVES :
L810HW-R47MFL810HW
SMPI120 -R47MF
3HW-R4 7
L810HW-R68MFSML810HW
PI12 03 -R68MF
H W-R6 8
100
1.5
100
90
90
1.2
70
60
0.4
50
40
30
0.2
INDUCTANCE (uH)
0.6
TEMP. RISE( oC)
INDUCTANCE (uH)
80
20
80
70
0.9
60
50
0.6
40
30
0.3
20
10
0
10
0
0
8.8
17.6
26.4
35.2
T EM P. RISE( oC)
0.8
0
44
0
0
DC CURRENT(A)
8.8
17.6
26 .4
35.2
44
DC CURR ENT(A )
-1R0MFLMPI1203HW-1R0
810H W
-1R 0M F
SL810HW
L810HW-R82MFL810HW-R82MF
100
1.5
90
80
70
0.9
60
50
0.6
40
30
0.3
TEMP. RISE(oC)
INDUCTANCE (uH)
1.2
20
10
0
0
0
8
16
24
32
40
DC CURRENT(A)
L810HW
-2R2MFL810HW
-2R 2M F
SMPI1
20 3HW-2R2
L810HW-1R5MFL810HW-1R5MF
SMPI12
03HW-1R5
4
100
100
90
90
3.2
70
1.8
60
50
1.2
40
30
0.6
20
INDUCTANCE (uH)
80
T EM P. RISE( oC)
INDUCTANCE (uH)
2.4
80
70
2.4
60
50
1.6
40
30
0.8
20
10
10
0
0
0
5.6
11.2
16.8
22.4
28
TEMP. RISE(oC)
3
0
0
0
4
DC CURRENT(A)
8
12
16
20
24
DC CURRENT (A)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
25.08.2010
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 4
HIGH CURRENT MOLDED POWER INDUCTORS
L810HW SERIES
8. CHARACTERISTICS CURVES :
L810HW-4R7MFL810HW-4R7MF
SMPI120
3HW-4R7
L810HW-3R3MFL810HW -3R3MF
SMPI1203HW-3R3
100
100
8
90
90
80
3.6
60
50
2.4
40
30
1.2
INDUCTANCE (uH)
70
80
6.4
TEMP. RISE(oC)
20
70
60
4.8
50
40
3.2
30
20
1.6
10
0
10
0
0
4
8
12
16
0
20
0
0
4
DC CURRENT (A)
8
12
16
DC CURRENT(A)
L810HW-100MF
SL810HW-100MFMPI1203HW-100
L810HW-6R8MFL810HW-6R8MF
SMPI1203HW-6R8
10
15
100
100
90
90
12
70
6
60
50
4
40
30
2
20
INDUCTANCE (uH)
80
TEMP. RISE(oC)
INDUCTANCE (uH)
8
80
70
9
60
50
6
40
30
3
20
10
10
0
0
0
2.6
5.2
7.8
20
10.4
13
TEM P. RISE( oC)
I NDUCTANCE (uH)
4.8
TEMP. RISE(oC)
6
0
0
0
2 .2
DC CURRENT (A)
4.4
6.6
8.8
11
DC CURRENT(A)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
25.08.2010
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 5
HIGH CURRENT MOLDED POWER INDUCTORS
L810HW SERIES
9. CORE LOSS :
100KHz and 500KHz
40000
material
gauss loss
K
W
/3m3
K
W
/m
30000
20000
500KHZ
10000
100KHZ
0
0
200
400
600
800
1000
gauss
gauss
100KHz
500KHz
100
-
266
200
-
1,234
300
351.7
2,932
400
665.9
5,195
500
1,039
8,336
600
1,471
12,025
700
1,923
15,715
800
2,537
20,444
900
3,148
25,429
1000
3,902
31,002
100KHz
4000
material
gauss loss
KKW
/3m3
W
/m
3000
2000
1000
0
200
400
600
800
1000
gau ss
gauss
100KHz
300
351.7
400
665.9
500
1,039
600
1,471
700
1,923
800
2,537
900
3,148
1000
3,902
500KHz
40000
KW
W
/m
K
/m
3
3
30000
20000
10000
0
0
200
400
600
800
1000
g au ss
gauss
NOTE : Specifications subject to change without notice. Please check our website for latest information.
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SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 6
HIGH CURRENT MOLDED POWER INDUCTORS
L810HW SERIES
10. RELIABILITY AND TEST CONDITION :
ITEM
PERFORMANCE
TEST CONDITION
Electrical Characteristics Test
Refer to standard electrical characteristics list
Inductance
HP4284A, CH11025, CH3302, CH1320, CH1320S
LCR meter.
DCR
CH16502, Agilent33420A Micro-Ohm Meter.
Heat Rated Current (Irms)
Irms(A) will cause the coil temperature rise
approximately ǻT=40°C without core loss
1. Applied the allowed DC current
2. Temperature measured by digital surface thermometer
Saturation Current (Isat)
Isat(A) will cause Lo to drop approximately 20%
Mechanical Performance Test
Solderability Test
More than 90% of the terminal electrode
should be covered with solder.
Preheating Dipping
245°C
150°C
Solder Heat Resistance
60
seconds
Natural
cooling
4±1
seconds
1. Appearance : No significant abnormality
2. Inductance change : Within ±20%
Preheating
260°C
150°C
60
seconds
Preheat : 150°C, 60sec.
Solder : Sn99.95-Cu0.05
Solder Temperature : 245±5°C
Flux for lead free : rosin
Dip Time : 4±1sec.
Dipping
Natural
cooling
Preheat : 150°C, 60sec.
Solder : Sn99.95-Cu0.05
Solder Temperature : 260±5°C
Flux for lead free : rosin
Dip Time : 10±0.5sec.
10±0.5
seconds
Reliability Test
High Temperature
Life Test
Temperature : 125±5°C
Time : 500±12 hours
Measure at room temperature after placing for 2 to 3 hrs.
Low Temperature
Life Test
1. Appearance : No damage
Thermal Shock
2. Inductance : Within ±20% of initial value.
No disconnection or short circuit.
Temperature : -55±5°C
Time : 500±12 hours
Measure at room temperature after placing for 2 to 3 hrs.
Conditions of 1 cycle.
Step
Temperature (°C)
1
-55±3
30±3
2
Room Temperature
Within 3
Times (min.)
3
+125±3
30±3
4
Room Temperature
Within 3
Total : 5 cycles
Measure at room temperature after placing for 2 to 3 hrs.
Humidity Resistance
1. Appearance : No damage
2. Inductance : Within ±20% of initial value.
No disconnection or short circuit.
Random Vibration Test
Appearance : Cracking, shipping and any other
defects harmful to the characteristics should not
be allowed.
Temperature : 40±5°C
Humidity : 90% to 95%
Applied Current : Rated Current
Time : 500±12 hours
Measure at room temperature after placing for 2 to 3 hrs.
Frequency : 10-55-10Hz for 1 min.
Amplitude : 1.52mm
Directions & times : X, Y, Z directions for 2 hours.
A period of 2 hours in each of 3 mutually perpendicular
directions (Total 6 hours).
NOTE : Specifications subject to change without notice. Please check our website for latest information.
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SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 7
HIGH CURRENT MOLDED POWER INDUCTORS
L810HW SERIES
11. SOLDERING AND MOUNTING :
11-1. Recommended PC Board Pattern
7.0
4.0
4.5
4.0
11-2. Soldering
Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused
by the difference in coefficients of expansion between solder, chip and substrate. Our terminations are suitable for all
wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot
air soldering tools.
11-2.1 Solder Re-flow :
Recommended temperature profiles for re-flow soldering in Figure 1.
11-2.2 Soldering Iron (Figure 2) :
Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that
a soldering iron must be employed the following precautions are recommended.
Note :
a) Preheat circuit and products to 150°C.
b) 280°C tip temperature (max)
c) Never contact the ceramic with the iron tip
d) 1.0mm tip diameter (max)
e) Use a 20 watt soldering iron with tip diameter of 1.0mm
f) Limit soldering time to 3 secs.
Soldering
10s max.
Natural
cooling
250~260
230
180
150
60~120s
30~60s
Preheating
TEMPERATURE °C
TEMPERATURE °C
Preheating
280
Soldering
Natural
cooling
260
150
Over 1min.
Gradual
Cooling
Within 3secs.
Figure 1. Re-flow Soldering
Figure 2. Iron Soldering
NOTE : Specifications subject to change without notice. Please check our website for latest information.
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SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 8
HIGH CURRENT MOLDED POWER INDUCTORS
L810HW SERIES
12. PACKAGING INFORMATION :
12-1. Reel Dimension
COVER TAPE
ØC
B
D
2.0±0.5
A
EMBOSSED CARRIER
Type
A(mm)
B(mm)
C(mm)
D(mm)
13" x 24mm
24.0±0.5
100±2.0
13.5±0.5
330
Ø1.5+0.1
2.0±0.1
t
P
0.15 MIN
Bo
W
F
4.0±0.1
1.75±0.1
12-2 Tape Dimension
Ko
Ao
Series
Ao(mm)
Bo(mm)
Ko(mm)
P(mm)
W(mm)
F(mm)
t(mm)
L810HW
13.5±0.1
13.9±0.1
4.5±0.1
16.0±0.1
24.0±0.3
11.5±0.1
0.35±0.05
12-3. Packaging Quantity
Size
L810HW
Chip / Reel
600
Inner Box
1200
Carton
4800
NOTE : Specifications subject to change without notice. Please check our website for latest information.
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SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 9
HIGH CURRENT MOLDED POWER INDUCTORS
L810HW SERIES
12-4. Tearing Off Force
The force for tearing off cover tape is 15 to 60 grams
in the arrow direction under the following conditions.
F
165° to 180°
Top cover tape
Room Temp.
(°C)
Room Humidity
(%)
Room atm
(hPa)
Tearing Speed
(mm/min)
5~35
45~85
860~1060
300
Base tape
Application Notice
1. Storage Conditions :
To maintain the solderabililty of terminal electrodes :
a) Temperature and humidity conditions : Less than 30°C and 70% RH.
b) Recommended products should be used within 6 months from the time of delivery.
c) The packaging material should be kept where no chlorine or sulfur exists in the air.
2. Transportation :
a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils.
b) The use of tweezers or vacuum pick up is strongly recommended for individual components.
c) Bulk handling should ensure that abrasion and mechanical shock are minimized.
NOTE : Specifications subject to change without notice. Please check our website for latest information.
25.08.2010
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 10
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