HSMC HUN2211 Npn silicon surface mount transistor with monolithic bias resistor network Datasheet

HI-SINCERITY
Spec. No. : HN200302
Issued Date : 2003.03.01
Revised Date : 2005.01.14
Page No. : 1/6
MICROELECTRONICS CORP.
HUN2211 / HUN2212 / HUN2213 / HUN2214 / HUN2215
HUN2216 / HUN2230 / HUN2231 / HUN2232 / HUN2233
HUN2234 / HUN2235 / HUN2236 / HUN2237 / HUN2238
HUN2240 / HUN2241
NPN Silicon Surface Mount Transistor with Monolithic Bias Resistor Network
SOT-23
Description
Symbol:
This new series of digital transistors is designed to replace a single device and its
external resistor bias network. The BRT (Bias Resistor Transistor) contains a single
transistor with a monolithic bias network consisting of two resistors; a series base
resistor and a base-emitter resistor. The BRT eliminates these individual components by
integrating them into a single device. The use of a BRT can reduce both system cost and
board space. The device is housed in the SOT-23 package which is designed for low
power surface Mount applications.
Pin 1
Base
(Input)
R1
Pin 3
Collector
(Output)
R2
Pin 2
Emitter
(Ground)
• Simplifies Circuit Design
• Reduces Board Space
• Reduces Component Count
• Moisture Sensitivity Level: 1
• ESD Rating: Human Body Model: Class1, Machine Model: Class B
• The SOT-23 package can be soldered using wave or reflow. (The modified gull-winged leads absorb thermal stress
during soldering eliminating the possibility of damage to the die.)
• Available in 8mm embossed tape and reel. Use the device number to order the 7 inch / 3,000 unit reel.
Maximum Ratings (TA=25oC unless otherwise noted)
Rating
Symbol
Value
Unit
Collector-Base Voltage
VCBO
50
Vdc
Collector-Emitter Voltage
VCEO
50
Vdc
IC
100
mAdc
200
mW
1.6
mW/°C
Collector Curretn
Total Power Dissipation @ TA=25°C
Derate above 25°C (Note1)
PD
Note1: Device mounted on a FR-4 glass epoxy printed circuit board using the minimum recommended footprint.
Thermal Characteristics
Rating
Thermal Resistance-Junction-to-Ambient
Operating and Storage Temperature Range
Maximum Temperature for Soldering Purposes
Time in Solder Bath
HUN22XX Series
Symbol
Value
Unit
RθJA
625
°C/W
TJ, Tstg
-65 to +150
°C
260
°C
10
Sec
TL
HSMC Product Specification
HI-SINCERITY
Spec. No. : HN200302
Issued Date : 2003.03.01
Revised Date : 2005.01.14
Page No. : 2/6
MICROELECTRONICS CORP.
Device Marking and Resistor Values
Device
HUN2211
HUN2212
HUN2213
HUN2214
HUN2215
Package
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
Marking
A8A
A8B
A8C
A8D
A8E
R1(K)
10
22
47
10
10
R2(K)
10
22
47
47
Shipping
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
HUN2216
HUN2230
HUN2231
HUN2232
HUN2233
HUN2234
HUN2235
HUN2236
HUN2237
HUN2238
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
A8F
A8G
A8H
A8J
A8K
A8L
A8M
A8N
A8P
A8R
4.7
1
2.2
4.7
4.7
22
2.2
100
47
2.2
∞
1
2.2
4.7
47
47
47
100
22
∞
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
HUN2240
SOT-23
A8T
47
∞
3000/Tape & Reel
HUN2241
SOT-23
A8U
100
∞
3000/Tape & Reel
∞
Electrical Characteristics (TA=25°C unless otherwise noted)
Characteristic
Symbol
Min.
Typ.
Max.
Unit
ICBO
ICEO
50
50
-
100
500
0.5
0.2
0.1
0.2
0.9
1.9
4.3
2.3
1.5
0.18
0.13
0.2
0.05
0.13
4
0.2
0.1
-
nAdc
nAdc
Off Characteristics
Collector-Base Cutoff Current (VCB=50V, IE=0)
Collector-Emitter Cutoff Current (VCE=50V, IB=0)
HUN2211
HUN2212
HUN2213
HUN2214
HUN2215
HUN2216
HUN2230
HUN2231
Emitter-Base Cutoff Current
HUN2232
(VEB=6V, IC=0)
HUN2233
HUN2234
HUN2235
HUN2236
HUN2237
HUN2238
HUN2240
HUN2241
Collector-Base Breakdown Voltage (IC=10uA, IE=0)
Collector-Emitter Breakdown Voltage (IC=2mA, IB=0)
IEBO
V(BR)CBO
*V(BR)CEO
mAdc
Vdc
Vdc
*Pulse Test: Pulse Width ≤300us, Duty Cycle≤2%
HUN22XX Series
HSMC Product Specification
HI-SINCERITY
Spec. No. : HN200302
Issued Date : 2003.03.01
Revised Date : 2005.01.14
Page No. : 3/6
MICROELECTRONICS CORP.
Electrical Characteristics (TA=25°C unless otherwise noted)
Characteristic
Symbol
Min.
Typ.
Max.
hFE
35
60
80
80
160
160
3
8
15
80
80
80
80
80
160
160
160
60
100
140
140
350
350
5
15
30
200
150
140
150
140
350
350
350
-
-
-
0.25
-
-
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
0.2
Unit
*On Characteristics
DC Current Gain
(VCE=10V, IC=5mA)
HUN2211
HUN2212
HUN2213
HUN2214
HUN2215
HUN2216
HUN2230
HUN2231
HUN2232
HUN2233
HUN2234
HUN2235
HUN2236
HUN2237
HUN2238
HUN2240
HUN2241
Collector-Emitter Saturation Voltage
(IC=10mA, IB=0.3mA)
(IC=10mA, IB=5mA) HUN2230/HUN2231
(IC=10mA, IB=1mA)
HUN2215/HUN2216/HUN2232/HUN2233
HUN2234/HUN2235/HUN2238
VCE(sat)
-
Vdc
*On Characteristics
(VCC=5V, VB=5.5V, RL=1kΩ)
HUN2211
HUN2212
HUN2214
HUN2215
HUN2216
HUN2230
HUN2231
HUN2232
HUN2233
HUN2234
HUN2235
HUN2238
HUN2213
HUN2240
HUN2236
(VCC=5V, VB=4.0V, RL=1kΩ)
HUN2237
-
-
0.2
(VCC=5V, VB=5V, RL=1kΩ)
HUN2241
-
-
0.2
Output Voltage (on)
(VCC=5V, VB=2.5V, RL=1kΩ)
(VCC=5V, VB=3.5V, RL=1kΩ)
VOL
Vdc
*Pulse Test: Pulse Width ≤300us, Duty Cycle≤2%
HUN22XX Series
HSMC Product Specification
HI-SINCERITY
Spec. No. : HN200302
Issued Date : 2003.03.01
Revised Date : 2005.01.14
Page No. : 4/6
MICROELECTRONICS CORP.
Electrical Characteristics (TA=25°C unless otherwise noted)
Characteristic
Symbol
Min.
Typ.
Max.
Unit
VOH
4.9
-
-
Vdc
7
15.4
32.9
7
7
3.3
0.7
1.5
3.3
3.3
15.4
1.54
32.9
70
1.54
32.9
70
0.8
0.17
0.8
0.055
0.38
0.038
1.7
10
22
47
10
10
4.7
1
2.2
4.7
4.7
22
2.2
47
100
2.2
47
100
1
0.21
1
0.1
0.47
0.047
2.1
13
28.6
61.1
13
13
6.1
1.3
2.9
6.1
6.1
28.6
2.86
61.1
130
2.88
61.1
130
1.2
0.25
1.2
0.185
0.56
0.056
2.6
*On Characteristics
Output Voltage (off) (VCC=5V, VB=0.5V, RL=1kΩ)
HUN2215
HUN2216
HUN2233
(VCC=5V, VB=0.25V, RL=1kΩ)
HUN2238
HUN2240
HUN2230
(VCC=5V, VB=0.05V, RL=1kΩ)
HUN2211
HUN2212
HUN2213
HUN2214
HUN2215
HUN2216
HUN2230
HUN2231
Input Resistor
HUN2232
HUN2233
HUN2234
HUN2235
HUN2236
HUN2237
HUN2238
HUN2240
HUN2241
Resistor Ratio HUN2211/HUN2212/HUN2213 /HUN2236
HUN2214
HUN2215/HUN2216/HUN2238/HUN2240
HUN2241
HUN2230/HUN2231/HUN2232
HUN2233
HUN2234
HUN2235
HUN2237
R1
R1/R2
kΩ
*Pulse Test: Pulse Width ≤300us, Duty Cycle≤2%
HUN22XX Series
HSMC Product Specification
HI-SINCERITY
Spec. No. : HN200302
Issued Date : 2003.03.01
Revised Date : 2005.01.14
Page No. : 5/6
MICROELECTRONICS CORP.
SOT-23 Dimension
DIM
A
B
C
D
G
H
J
K
L
S
V
Marking:
A
Series Code
L
(See Page 2)
A 8
Pb Free Mark
3
Pb-Free: " " (Note)
Normal: None
B S
1
V
2
Note: Pb-free product can distinguish by the green
label or the extra description on the right
side of the label.
G
Pin Style: 1.Base 2.Emitter 3.Collector
D
H
K
Max.
3.04
1.60
1.30
0.50
2.30
0.10
0.177
0.67
1.15
2.75
0.65
*: Typical, Unit: mm
Material:
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
C
Min.
2.80
1.20
0.89
0.30
1.70
0.013
0.085
0.32
0.85
2.10
0.25
J
3-Lead SOT-23 Plastic
Surface Mounted Package
HSMC Package Code: N
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HUN22XX Series
HSMC Product Specification
HI-SINCERITY
Spec. No. : HN200302
Issued Date : 2003.03.01
Revised Date : 2005.01.14
Page No. : 6/6
MICROELECTRONICS CORP.
Soldering Methods for HSMC’s Products
1. Storage environment: Temperature=10oC~35oC Humidity=65%±15%
2. Reflow soldering of surface-mount devices
Figure 1: Temperature profile
tP
Critical Zone
TL to TP
TP
Ramp-up
TL
tL
Temperature
Tsmax
Tsmin
tS
Preheat
Ramp-down
25
t 25oC to Peak
Time
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
<3 C/sec
<3oC/sec
- Temperature Min (Tsmin)
100oC
150oC
- Temperature Max (Tsmax)
150oC
200oC
60~120 sec
60~180 sec
<3oC/sec
<3oC/sec
183oC
217oC
Average ramp-up rate (TL to TP)
o
Preheat
- Time (min to max) (ts)
Tsmax to TL
- Ramp-up Rate
Time maintained above:
- Temperature (TL)
- Time (tL)
60~150 sec
Peak Temperature (TP)
Time within 5oC of actual Peak
Temperature (tP)
Ramp-down Rate
Time 25oC to Peak Temperature
o
o
60~150 sec
240 C +0/-5 C
260oC +0/-5oC
10~30 sec
20~40 sec
<6oC/sec
<6oC/sec
<6 minutes
<8 minutes
Peak temperature
Dipping time
245 C ±5 C
5sec ±1sec
3. Flow (wave) soldering (solder dipping)
Products
Pb devices.
Pb-Free devices.
HUN22XX Series
o
o
o
o
260 C +0/-5 C
5sec ±1sec
HSMC Product Specification
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