Freescale MC33596FCER2 Pll tuned uhf receiver for data transfer application Datasheet

Freescale Semiconductor
Data Sheet
MC33596
Rev. 3, 06/2007
MC33596
PLL Tuned UHF Receiver for Data Transfer Applications
Overview
The MC33596 is a highly integrated receiver
designed for low-voltage applications. It includes a
programmable PLL for multi-channel applications,
an RSSI circuit, a strobe oscillator that periodically
wakes up the receiver while a data manager checks
the content of incoming messages. A configuration
switching feature allows automatic changing of the
configuration between two programmable settings
without the need of an MCU.
© Freescale Semiconductor, Inc., 2006, 2007. All rights reserved.
GND
SWITCH
VCC2IN
GNDSUBD
STROBE
NC
VCCIN
GNDIO
31
30
29
28
27
26
25
24
SEB
VCC2RF
2
23
SCLK
6
19
DATACLK
NC
7
18
RSSIC
GND
8
17
GNDDIG
16
GND
GND
CONFB
15
20
RBGAP
5
14
VCC2VCO
VCCDIG2
MISO
13
21
VCCDIG
MOSI
12
22
4
VCC2OUT
3
11
RFIN
GNDLNA
VCCINOUT
•
•
•
20 kbps maximum data rate using
Manchester coding
2.1 V to 3.6 V or 5 V supply voltage
Programmable via SPI
6 kHz PLL frequency step
1
10
•
RSSIOUT
XTAL0UT
General:
• 304 MHz, 315 MHz, 426 MHz, 434 MHz,
868 MHz, and 915 MHz ISM bands
• Choice of temperature ranges:
— –40°C to +85°C
— –20°C to +85°C
• OOK and FSK reception
32
Features
QFN32
9
2
LQFP32
XTALIN
1
Features
•
•
Current consumption:
— 10.3 mA in RX mode
— Less then 1 mA in RX mode with strobe ratio = 1/10
— 260 nA standby and 24 μA off currents
Configuration switching — allows fast switching of two register banks
Receiver:
• –106.5 dBm sensitivity, up to –108 dBm in FSK 2.4 kbps
• Digital and analog RSSI (received signal strength indicator)
• Automatic wakeup function (strobe oscillator)
• Embedded data processor with programmable word recognition
• Image cancelling mixer
•
•
380 kHz IF filter bandwidth
Fast wakeup time
Ordering information
Temperature Range
QFN Package
LQFP Package
–40°C to +85°C
MC33596FCE/R2
MC33596FJE/R2
–20°C to +85°C
MC33596FCAE/R2
MC33596FJAE/R2
MC33596 Data Sheet, Rev. 3
2
Freescale Semiconductor
VCC2VC0
GNDLNA
RFIN
VCC2RF
ACCLNA
/2 or
Buffer
BAND
GAIN_SET
LIN
+I/Q
Mixers
SWITCH_TESTOUT
RSSIOUT_TESTIN
/2
AGC_CONTROL
PMA + I/Q
Image
Reject
TEST_CONTROL
Analog
Test
VCO
1.5 MHz, BW
400 kHz
ANALOG_SIGNALS
BAND
Freescale Semiconductor
BAND
Fractional
Divider
FM-to-AM
Converter
AGC
IF
Amplifier
Logarithmic
Amplifier
Analog
Data Filter
and Slicer
Strobe
Oscillator
PFD
XCO
SWITCH_TESTOUT
DATA_RATE
AGC_CONTROL
FM_AM
Detector
RSSI
4 Bits
A/D
RSSI_8BITS
Clock
Generator
BAND
State
Machine
Rx Data
Manager
V&I
Reference
Voltage
Regulator
DIG_CLOCK
IF_REF_CLOCK
SPI
Voltage
Regulator
Pre
Regulator
VCCDIG2
XTALOUT
XTALIN
VCCDIG
DATACLK
CONFB
GND
GND
GNDDIG
GNDIO
GNDSUBD
GNDSUBA
RSSIC
SEB
MOSI
MISO
SCLK
STROBE
RBGAP
VCC2OUT
VCC2IN
VCCINOUT
VCCIN
Features
Figure 1. Block Diagram
MC33596 Data Sheet, Rev. 3
3
Pin Functions
3
Pin Functions
Table 1. Pin Functions
Pin
Name
Description
1
RSSIOUT
RSSI analog output
2
VCC2RF
2.1 V to 2.7 V internal supply for LNA
3
RFIN
4
GNDLNA
Ground for LNA (low noise amplifier)
5
VCC2VCO
2.1 V to 2.7 V internal supply for VCO
6
GND
7
NC
8
GND
9
XTALIN
10
XTALOUT
11
VCCINOUT
2.1 V to 3.6 V power supply/regulator output
12
VCC2OUT
2.1 V to 2.7 V voltage regulator output for analog and RF modules
13
VCCDIG
2.1 V to 3.6 V power supply for voltage limiter
14
VCCDIG2
1.5 V voltage limiter output for digital module
15
RBGAP
16
GND
17
GNDDIG
18
RSSIC
19
DATACLK
Data clock output to microcontroller
20
CONFB
Configuration mode selection input
21
MISO
Digital interface I/O
22
MOSI
Digital interface I/O
23
SCLK
Digital interface clock I/O
24
SEB
25
GNDIO
Digital I/O ground
26
VCCIN
2.1 V to 3.6 V or 5.5 V input
27
NC
28
STROBE
29
GNDSUBD
30
VCC2IN
2.1 V to 2.7 V power supply for analog modules for decoupling capacitor
31
SWITCH
RF switch control output
32
GND
RF input
Ground
Not connected
Ground
Crystal oscillator input
Crystal oscillator output
Reference voltage load resistance
General ground
Digital module ground
RSSI control input
Digital interface enable input
No connection
Strobe oscillator capacitor or external control input
Ground
General ground
MC33596 Data Sheet, Rev. 3
4
Freescale Semiconductor
Silicon Version
4
Silicon Version
This data sheet describes the functional features of silicon version ES4.1.
5
Maximum Ratings
Table 2. Maximum Ratings
Parameter
Symbol
Value
Unit
VCCIN
VGND–0.3 to 5.5
V
Supply voltage on pins: VCCINOUT, VCCDIG
VCC
VGND–0.3 to 3.6
V
Supply voltage on pins: VCC2IN, VCC2RF, VCC2VCO
VCC2
VGND–0.3 to 2.7
V
—
VGND–0.3 to VCC2
V
VCCIO
VGND–0.3 to VCCIN+0.3
V
—
±2000
V
—
±200
V
Solder heat resistance test (10 s)
—
260
°C
Storage temperature
TS
–65 to +150
°C
Junction temperature
TJ
150
°C
Supply voltage on pin: VCCIN
Voltage allowed on each pin (except digital pins)
Voltage allowed on digital pins: SEB, SCLK, MISO, MOSI, CONFB,
DATACLK, RSSIC, STROBE
ESD HBM voltage capability on each pin1
ESD MM voltage capability on each
pin2
NOTES:
1 Human body model, AEC-Q100-002 rev. C.
2
Machine model, AEC-Q100-003 rev. C.
MC33596 Data Sheet, Rev. 3
Freescale Semiconductor
5
Power Supply
6
Power Supply
Table 3. Supply Voltage Range Versus Ambient Temperature
Temperature Range1
Parameter
Unit
Symbol
–40°C to +85°C
–20°C to +85°C
Supply voltage on VCCIN, VCCINOUT, VCCDIG for 3 V operation
VCC3V
2.7 to 3.6
2.1 to 3.6
V
Supply voltage on VCCIN for 5 V operation
VCC5V
4.5 to 5.5
4.5 to 5.5
V
NOTES:
1
–40°C to +85°C: MC33596FCE/FJE.
–20°C to +85°C: MC33596FCAE/FJAE.
The circuit can be supplied from a 3 V voltage regulator or battery cell by connecting VCCIN and
VCCINOUT. It is also possible to use a 5 V power supply connected to VCCIN; in this case VCCINOUT
should not be connected to VCCIN.
An on-chip low drop-out voltage regulator supplies the RF and analog modules (except the strobe
oscillator and the low voltage detector, which are directly supplied from VCCINOUT). This voltage
regulator is supplied from pin VCCINOUT and its output is connected to VCC2OUT. An external
capacitor must be inserted between VCC2OUT and GND for stabilization and decoupling. The analog and
RF modules must be supplied by VCC2 by externally wiring VCC2OUT to VCC2IN, VCC2RF and
VCC2VCO.
3V
25
GNDIO
26
VCCIN
27
NC
28
STROBE
29
GNDSUBD
30
VCC2IN
31
24
23
22
21
CONFB
20
DATACLK
19
RSSIC
18
17
GND
GNDDIG
16
9
VCC2
10
GND
XTALIN
GND
RBGAP
NC
15
8
VCCDIG2
7
17
GND
14
18
VCC2VCO
VCCDIG
RSSIC
MISO
U14
MC33596
13
6
GNDLNA
VCC2OUT
19
5
MOSI
12
DATACLK
VCC2
RFIN
VCCINOUT
4
SCLK
11
21
SEB
VCC2RF
XTAL0UT
3
SWITCH
32
GND
2
RSSIOUT
16
RBGAP
VCC2
20
GNDDIG
15
10
9
22
1
CONFB
NC
GND
24
23
5V
VCC2
25
GNDIO
26
VCCIN
27
NC
28
STROBE
29
GNDSUBD
30
VCC2IN
31
GND
XTALIN
8
VCC2VCO
VCCDIG2
7
MISO
U15
MC33596
14
6
GNDLNA
VCCDIG
5
MOSI
13
VCC2
RFIN
VCC2OUT
4
SCLK
12
3
SEB
VCC2RF
VCCNOUT
2
11
VCC2
RSSIOUT
XTAL0UT
1
SWITCH
GND
32
VCC2
VCC2
3-V Operation
5-V Operation
Figure 2. Wiring Diagrams
A second voltage regulator supplies the digital part. This regulator is powered from pin VCCDIG and its
output is connected to VCCDIG2. An external capacitor must be inserted between VCCDIG2 and
MC33596 Data Sheet, Rev. 3
6
Freescale Semiconductor
Supply Voltage Monitoring and Reset
GNDDIG, for decoupling. The supply voltage VCCDIG2 is equal to 1.6 V. In standby mode, this voltage
regulator goes into an ultra-low-power mode, but VCCDIG2 = 0.7 x VCCDIG. This enables the internal
registers to be supplied, allowing configuration data to be saved.
7
Supply Voltage Monitoring and Reset
At power-on, an internal reset signal is generated. All registers are reset.
When the LVDE bit is set, the low-voltage detection module is enabled. This block compares the supply
voltage on VCCINOUT with a reference level of about 1.8 V. If the voltage on VCCINOUT drops below
1.8 V, status bit LVDS is set. The information in status bit LVDS is latched and reset after a read access.
NOTE
If LVDE = 1, the LVD module remains enabled. The circuit cannot be put
in standby mode, but remains in LVD mode with a higher quiescent current,
due to the monitoring circuitry. LVD function is not accurate in standby
mode.
8
Receiver Functional Description
The receiver is based on a superheterodyne architecture with an intermediate frequency (IF) of 1.5 MHz
(see Figure 1). Its input is connected to the RFIN pin. Frequency down conversion is done by a high-side
injection I/Q mixer driven by the frequency synthesizer. An integrated poly-phase filter performs rejection
of the image frequency.
The low intermediate frequency allows integration of the IF filter providing the selectivity. The center
frequency is tuned by automatic frequency control (AFC) referenced to the crystal oscillator frequency.
Sensitivity is met by an overall amplification of approximately 96 dB, distributed over the reception chain,
comprising low-noise amplifier (LNA), mixer, post-mixer amplifier, and IF amplifier. Automatic gain
control (AGC), on the LNA and the IF amplifier, maintains linearity and prevents internal saturation.
Sensitivity can be reduced using four programmable steps on the LNA gain.
Amplitude demodulation is achieved by peak detection and comparison with a fixed or adaptive voltage
reference selected during configuration. Frequency demodulation is achieved in two steps: the IF amplifier
AGC is disabled and acts as an amplitude limiter; a filter performs a frequency-to-voltage conversion. The
resulting signal is then amplitude demodulated in the same way as in the case of amplitude modulation
with an adaptive voltage reference.
A low-pass filter improves the signal-to-noise ratio.
Shaped data are available if the integrated data manager is not used.
If used, the data manager performs clock recovery and decoding of Manchester coded data. Data and clock
are then available on the serial peripheral interface (SPI). The configuration sets the data rate range
managed by the data manager and the bandwidth of the low-pass filter.
An internal low-frequency oscillator can be used as a strobe oscillator to perform an automatic wakeup
sequence.
MC33596 Data Sheet, Rev. 3
Freescale Semiconductor
7
Frequency Planning
It is also possible to define two different configurations for the receiver (frequency, data rate, data manager,
modulation, etc.) that are automatically loaded during wakeup or under MCU control.
If the PLL goes out of lock, received data are ignored.
9
Frequency Planning
9.1
Clock Generator
All clocks running in the circuit are derived from the reference frequency provided by the crystal oscillator
(frequency fref, period tref). The crystal frequency is chosen in relation to the band in which the MC33596
has to operate. Table 4 shows the value of the CF bits.
Table 4. Crystal Frequency and CF Values Versus Frequency Band
RF
Frequency
(MHz)
CF1
CF0
LOF1
LOF0
FREF (Crystal
Frequency)
(MHz)
FIF (IF
Frequency)
(MHz)
Dataclk
Divider
Fdataclk
(kHz)
Digclk
Divider
Fdigclk
(kHz)
Tdigclk
(µs)
304
0
0
0
0
16.96745
1.414
60
282.791
30
565.582
1.77
315
0
0
1
0
17.58140
1.465
60
293.023
30
586.047
1.71
426
0
1
0
1
23.74913
1.484
80
296.864
40
593.728
1.68
433.92
0
1
0
1
24.19066
1.512
80
302.383
40
604.767
1.65
868.3
1
1
0
1
24.16139
1.510
80
302.017
40
604.035
1.66
916.5
1
1
1
1
25.50261
1.594
80
318.783
40
637.565
1.57
9.2
Intermediate Frequency
The IF filter is controlled by the crystal oscillator to guarantee the frequency over temperature and voltage
range. The IF filter center frequency, FIF, can be computed using the crystal frequency fref and the value
of the CF bits:
• If CF[0] = 0 : FIF = fref/9*1.5/2
• If CF[0] = 1 : FIF = fref/12*1.5/2
The cut-off frequency given in the parametric section can be computed by scaling to the FIF.
Example 1. Cut-off Frequency Computation
Compute the low cut-off frequency of the IF filter for a 16.9683 MHz crystal oscillator. For this
reference frequency, FIF = 1.414 MHz.
So, the 1.3751 MHz low cut-off frequency specified for a 1.5 MHz IF frequency becomes
1.3751*1.414/1.5 = 1.296 MHz
1. Refer to parameter 3.3 found in Section 18.1, “General Parameters.”
MC33596 Data Sheet, Rev. 3
8
Freescale Semiconductor
Register Access through SPI
9.3
Frequency Synthesizer Description
The frequency synthesizer consists of a local oscillator (LO) driven by a fractional N phase locked loop
(PLL).
The LO is an integrated LC voltage controlled oscillator (VCO) operating at twice the RF frequency (for
the 868 MHz frequency band) or four times the RF frequency (for the 434 MHz and 315 MHz frequency
bands). This allows the I/Q signals driving the mixer to be generated by division.
The fractional divider offers high flexibility in the frequency generation for:
• Switching between transmit and receive modes.
• Achieving frequency modulation in FSK modulation transmission.
• Performing multi-channel links.
• Trimming the RF carrier.
Frequencies are controlled by means of registers. To allow for user preference, two programming access
methods are offered (see Section 16.3, “Frequency Register”).
• In friendly access, all frequencies are computed internally from the contents of the carrier
frequency and deviation frequency registers.
• In direct access, the user programs direct all three frequency registers.
10
Register Access through SPI
10.1 SPI Interface
the MC33596 and the MCU communicate via a bidirectional serial digital interface. According to the
selected mode, the MC33596 or the MCU manages the data transfer. The MC33596’s digital interface can
be used as a standard SPI (master/slave) or as a simple interface (SPI deselected). In the latter case, the
interface’s pins are used as standard I/O pins. However, the MCU has the highest priority, as it can control
the MC33596 by setting CONFB pin to the low level.
The interface is operated by four I/O pins.
• SEB — Serial interface Enable
When SEB is set high, pins SCLK, MOSI, and MISO are set to high impedance. This allows
individual selection in a multiple device system, where all devices are connected via the same bus.
The rest of the circuit remains in the current state, enabling fast recovery times, but the power
amplifier is disabled to prevent any uncontrolled RF transmission.
• SCLK — Serial Clock
Synchronizes data movement in and out of the device through its MOSI and MISO lines. The
master and slave devices can exchange a byte of information during a sequence of eight clock
cycles. Since SCLK is generated by the master device, this line is an input on a slave device.
• MOSI — Master Output Slave Input
Transmits bytes when master, and receives bytes when slave, with the most significant bit first.
When no data are output, SCLK and MOSI force a low level.
MC33596 Data Sheet, Rev. 3
Freescale Semiconductor
9
Register Access through SPI
•
MISO — (Master Input) Slave Output
Transmits data when slave, with the MSB first. There is no master function. Data are valid on
falling edges of SCLK. This means that the clock phase and polarity control bits of the
microcontroller SPI have to be CPOL = 0 and CPHA = 1 (using Freescale acronyms).
Table 5 summarizes the serial digital interface feature versus the selected mode.
Table 5. Serial Digital Interface Feature versus Selected Mode (SEB = 1)
Selected Mode
MC33596 Digital Interface Use
Configuration
SPI slave, data received on MOSI, SCLK from MCU, MISO is output
Transmit
SPI deselected, MOSI receives encoded data from MCU
Receive
DME = 1
SPI master, data sent on MOSI with clock on SCLK
DME = 0
SPI deselected, received data are directly sent to MOSI
Standby / LVD
SPI deselected, all I/O are high impedance
The data transfer protocol for each mode is described in the following sections.
10.2 Configuration Mode
This mode is used to write or read the internal registers of the MC33596.
As long as a low level is applied to CONFB (see Figure 27), the MCU is the master node driving the SCLK
input, the MOSI line input, and the MISO line output. Whatever the direction, SPI transfers are 8-bit based
and always begin with a command byte, which is supplied by the MCU on MOSI. To be considered as a
command byte, this byte must come after a falling edge on CONFB. Figure 3 shows the content of the
command byte.
Bit Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
N1
N0
A4
A3
A2
A1
A0
R/W
Figure 3. Command Byte
Bits N[1:0] specify the number of accessed registers, as defined in Table 6.
Table 6. Number N of Accessed Registers
N[1:0]
Number N of Accessed Registers
00
1
01
2
10
4
11
8
Bits A[4:0] specify the address of the first register to access. This address is then incremented internally
by N after each data byte transfer.
MC33596 Data Sheet, Rev. 3
10
Freescale Semiconductor
Register Access through SPI
R/W specifies the type of operation:
0 = Read
1 = Write
Thus, this bit is associated with the presence of information on MOSI (when writing) or MISO (when
reading).
Figure 4 and Figure 5 show write and read operations in a typical SPI transfer. In both cases, the SPI is a
slave. A received byte is considered internally on the eighth falling edge of SCLK. Consequently, the last
received bits, which do not form a complete byte, are lost.
NOTE
A low level applied to CONFB does not affect the configuration register
contents.
SEB
CONFB
SCLK
(Input)
MOSI
(Input)
N1 N0 A4 A3 A2 A1 A0 R/W
D7 D6 D5 D4 D3 D2 D1 D0
D7 D6 D5 D4 D3 D2 D1 D0
MISO
(Output)
Figure 4. Write Operation in Configuration Mode (N[1:0] = 01)
SEB
CONFB
SCLK
(Input)
MOSI
(Input)
N1 N0 A4 A3 A2 A1 A0 R/W
MISO
(Output)
D7 D6 D5 D4 D3 D2 D1
D0
D7 D6 D5 D4 D3 D2 D1 D0
Figure 5. Read Operation in Configuration Mode (N[1:0] = 01)
10.3 Configuration Switching
This feature allows for defining two different configurations using two different banks, and for switching
them automatically during wakeup when using a strobe oscillator, or by means of the strobe pin actuation
by the MCU.
MC33596 Data Sheet, Rev. 3
Freescale Semiconductor
11
Register Access through SPI
10.3.1 Bit Definition
Two sets of configuration registers are available. They are grouped in two different banks: Bank A and
Bank B. Two bits are used to define which bank represents the state of the component.
Bit Name
BANKA
BANKB
BANKA
X
0
1
Direction
R/W
R/W
Location
Bank A
Bank B
BANKB
Actions
0
Bank A is active
1
Bank B is active
1
Bank A and Bank B are active and will be used one after the other
At any time, it is possible to know what is the active bank by reading the status bit BANKS.
Bit Name
BANKS
Direction
R
Location
Comment
A&B
Bank status: indicates which register bank is active.
This bit, available in Bank A and Bank B, returns the same value.
10.3.2 Bank Access and Register Mapping
Registers are physically mapped following a byte organization. The possible address space is 32 bytes. The
base address is specified in the command byte. This is then incremented internally to address each register,
up to the number of registers specified by N[1:0], also specified by this command byte. All registers can
then be scanned, whatever the type of transmission (read or write); however, writing to read-only bits or
registers has no effect. When the last implemented address is reached, the internal address counter
automatically loops back to the first mapped address ($00).
At any time, it is possible to write or read the content of any register of Bank A and Bank B. Register access
is defined as follows:
R/W
Bit can be read and written.
R
Bit can be read. Write has no effect on bit value.
RR
Bit can be read. Read or write resets the value.
R [A]
Bit can be read, this returns the same value as Bank A.
RR [A]
Bit can be read, this returns the same value as Bank A. Read or write resets the value.
Table 7. Access to Specific Bits
Bit
Bank
Byte
Access
Comment
RESET
A
CONFIG1
R/W
OLS
A, B
CONFIG3
R-R[A]
Available in BANKA.
Bit value is the real time status of the PLL, BANKA,
and BANKB access reflect the same value.
LDVS
A, B
CONFIG3
RR-RR[A}
Bit value is the latched value of the low-voltage
detector. Read or write from any bank resets value.
SOE
A, B
CONFIG2
R/W-R[A}
SOE can be modified in BANKA. Access from BANKB
reflects BANKA value.
RSSIx
A, B
RSSI
R-R[A}
RSSI value is directly read from RSSI converter.
Reflected value is the same whatever the active byte.
MC33596 Data Sheet, Rev. 3
12
Freescale Semiconductor
Freescale Semiconductor
MC33596 Data Sheet, Rev. 3
91 h
Bit 6
Bit 5
LOF0
CF1
0
0
R/W
R/W
304–315 315–434
434–916
868
10 h
Bit 6
Bit 5
FRM
MODU
0
0
R/W
R/W
Friendly
OOK
Direct
FSK
30 h
Bit 6
Bit 5
AFF0
OLS
0
1
R/W
R
0.5–2 kHz
RAS
1–4 kHz Unlocked
9h
Bit 6
Bit 5
IFLA
MODE
0
0
R/W
R/W
No
RX
–20 dB
TX
48 h
Bit 6
Bit 5
FSK2
FSK1
1
0
R/W
R/W
0h
Bit 6
Bit 5
F6
F5
0
0
R/W
R/W
Bit 4
CF0
1
R/W
314
434–868
Bit 3
RESET
0
R/W
No
Yes
Bit 2
SL
0
R/W
T/R
R/T
Bit 1
LVDE
0
R/W
No
Yes
Bit 4
DR1
1
R/W
2.4–4.8
9.6–19.2
Bit 3
DR0
0
R/W
2.4–9.6
4.8–19.2
Bit 2
TRXE
0
R/W
Standby
Enable
Bit 1
DME
0
R/W
No
Yes
Bit 4
LVDS
1
RR
RAS
Low V
Bit 3
ILA1
0
R/W
0–8 dB
14–24 dB
Bit 2
ILA0
0
R/W
0–14 dB
8–24 dB
Bit 1
OLA1
0
R/W
0–8 dB
14–24 dB
Bit 4
RSSIE
0
R/W
No
Yes
Bit 3
EDD
1
R/W
Slow dec.
Fast dec.
Bit 2
RAGC
0
R/W
No
Yes
Bit 1
FAGC
0
R/W
No
Yes
Bit 4
FSK0
0
R/W
Bit 3
F11
1
R/W
Bit 2
F10
0
R/W
Bit 1
F9
0
R/W
Bit 4
F4
0
R/W
Bit 3
F3
0
R/W
Bit 2
F1
0
R/W
Bit 1
F1
0
R/W
0Dh CONFIG1-B
Bit 7
Bit Name LOF1
Reset Value
1
R/W
0 = 304–434
1 = 315–916
0Eh CONFIG2-B
Bit 0
Bit 7
SOE
Bit Name DSREF
0
Reset Value
0
R/W
R/W
No
0 = Fixed
Yes
1 = Adaptive
0Fh CONFIG3-B
Bit 0
Bit 7
OLA0
Bit Name AFF1
0
Reset Value
0
R/W
R/W
0–14 dB
0 = 0.5–1 kHz
8–24 dB
1 = 2–4 kHz
10h COMMAND-B
Bit 0
Bit 7
BANKS
Bit Name AFFC
1
Reset Value
0
R
R/W
B Bank
0 = AFFx OFF
A Bank
1 = AFFx ON
11h F1-B
Bit 0
Bit 7
F8
Bit Name FSK3
0
Reset Value
0
R/W
R/W
12h F2-B
Bit 0
Bit 7
F0
Bit Name
F7
0
Reset Value
0
R/W
R/W
Bit 0
CLKE
1
R/W
No
Yes
Bank A Registers
91 h
Bit 6
Bit 5
LOF0
CF1
0
0
R/W
R/W
304–315 315–434
434–916
868
10 h
Bit 6
Bit 5
FRM
MODU
0
0
R/W
R/W
Friendly
OOK
Direct
FSK
30 h
Bit 6
Bit 5
AFF0
OLS
0
1
R/W
R[A]
0.5–2 kHz
RAS
1–4 kHz Unlocked
9h
Bit 6
Bit 5
IFLA
MODE
0
0
R/W
R/W
No
RX
–20 dB
TX
4800 h
Bit 6
Bit 5
FSK2
FSK1
1
0
R/W
R/W
0h
Bit 6
Bit 5
F6
F5
0
0
R/W
R/W
Bit 4
CF0
1
R/W
314
434–868
Bit 3
—
0
R
—
—
Bit 2
SL
0
R/W
T/R
R/T
Bit 1
LVDE
0
R/W
No
Yes
Bit 0
CLKE
1
R/W
No
Yes
Bit 4
DR1
1
R/W
2.4–4.8
9.6–19.2
Bit 3
DR0
0
R/W
2.4–9.6
4.8–19.2
Bit 2
TRXE
0
R/W
Standby
Enable
Bit 1
DME
0
R/W
No
Yes
Bit 0
SOE
0
R[A]
No
Yes
Bit 4
LVDS
1
RR[A]
RAS
Low V
Bit 3
ILA1
0
R/W
0–8 dB
14–24 dB
Bit 2
ILA0
0
R/W
0–14 dB
8–24 dB
Bit 1
OLA1
0
R/W
0–8 dB
14–24 dB
Bit 0
OLA0
0
R/W
0–14 dB
8–24 dB
Bit 4
RSSIE
0
R/W
No
Yes
Bit 3
EDD
1
R/W
Slow dec.
Fast dec.
Bit 2
RAGC
0
R/W
No
Yes
Bit 1
FAGC
0
R/W
No
Yes
Bit 0
BANKS
1
R[A]
B Bank
A Bank
Bit 4
FSK0
0
R/W
Bit 3
F11
1
R/W
Bit 2
F10
0
R/W
Bit 1
F9
0
R/W
Bit 0
F8
0
R/W
Bit 4
F4
0
R/W
Bit 3
F3
0
R/W
Bit 2
F1
0
R/W
Bit 1
F1
0
R/W
Bit 0
F0
0
R/W
Bank B Registers
Figure 6. Bank Registers
13
Register Access through SPI
00h CONFIG1-A
Bit 7
Bit Name LOF1
1
Reset Value
R/W
0 = 304–434
1 = 315–916
01h CONFIG2-A
Bit 7
Bit Name DSREF
0
Reset Value
R/W
0 = Fixed
1 = Adaptive
02h CONFIG3-A
Bit 7
Bit Name AFF1
0
Reset Value
R/W
0 = 0.5–1 kHz
1 = 2–4 kHz
03h COMMAND-A
Bit 7
Bit Name AFFC
0
Reset Value
R/W
0 = AFFx OFF
1 = AFFx ON
04h F1-A
Bit 7
Bit Name FSK3
0
Reset Value
R/W
05h F2-A
Bit 7
Bit Name
F7
0
Reset Value
R/W
Bit Name
Reset Value
Bit 7
FTA11
0
R/W
07h FT2-A
Bit Name
Reset Value
Bit 7
FTA3
0
R/W
08h FT3-A
MC33596 Data Sheet, Rev. 3
Freescale Semiconductor
Bit 7
Bit Name FTB7
0
Reset Value
R/W
09h RXONOFF-A
Bit 7
Bit Name BANKA
0
Reset Value
R/W
0Ah ID-A
Bit 7
Bit Name
IDL1
1
Reset Value
R/W
0Bh HEADER-A
Bit 7
Bit Name HDL1
1
Reset Value
R/W
0Ch RSSI-A
Bit 7
Bit Name RSSI7
0
Reset Value
R
700701 h
Bit 6
FTA10
1
R/W
7h
Bit 6
FTA2
0
R/W
1h
Bit 6
FTB6
0
R/W
75 h
Bit 6
RON3
1
R/W
C0 h
Bit 6
IDL0
1
R/W
80 h
Bit 6
HDL0
0
R/W
80 h
Bit 6
RSSI6
0
R
13h FT1-B
Bit 5
FTA9
1
R/W
Bit 4
FTA8
1
R/W
Bit 3
FTA7
0
R/W
Bit 2
FTA6
0
R/W
Bit 1
FTA5
0
R/W
Bit 0
FTA4
0
R/W
Bit 5
FTA1
0
R/W
Bit 4
FTA0
0
R/W
Bit 3
FTB11
0
R/W
Bit 2
FTB10
1
R/W
Bit 1
FTB9
1
R/W
Bit 0
FTB8
1
R/W
Bit 5
FTB5
0
R/W
Bit 4
FTB4
0
R/W
Bit 3
FTB3
0
R/W
Bit 2
FTB2
0
R/W
Bit 1
FTB1
0
R/W
Bit 0
FTB0
1
R/W
Bit 5
RON2
1
R/W
Bit 4
RON1
1
R/W
Bit 3
RON0
1
R/W
Bit 2
ROFF2
1
R/W
Bit 1
ROFF1
1
R/W
Bit 0
ROFF0
1
R/W
Bit 5
ID5
0
R/W
Bit 4
ID4
0
R/W
Bit 3
ID3
0
R/W
Bit 2
ID2
0
R/W
Bit 1
ID1
0
R/W
Bit 0
ID0
0
R/W
Bit 5
HD5
0
R/W
Bit 4
HD4
0
R/W
Bit 3
HD3
0
R/W
Bit 2
HD2
0
R/W
Bit 1
HD1
0
R/W
Bit 0
HD0
0
R/W
Bit 5
RSSI5
0
R
Bit 4
RSSI4
0
R
Bit 3
RSSI3
0
R
Bit 2
RSSI2
0
R
Bit 1
RSSI1
0
R
Bit 0
RSSI0
0
R
Bit Name
Reset Value
Bit 7
FTA11
0
R/W
14h FT2-B
Bit Name
Reset Value
Bit 7
FTA3
0
R/W
15h FT3-B
Bit 7
FTB7
0
R/W
16h RXONOFF-B
Bit 7
Bit Name BANKB
Reset Value
0
R/W
17h ID-B
Bit 7
Bit Name
IDL1
Reset Value
1
R/W
18h HEADER-B
Bit 7
Bit Name HDL1
Reset Value
1
R/W
19h RSSI-B
Bit 7
Bit Name RSSI7
Reset Value
0
R[A]
Bit Name
Reset Value
700701 h
Bit 6
FTA10
1
R/W
7h
Bit 6
FTA2
0
R/W
1h
Bit 6
FTB6
0
R/W
75 h
Bit 6
RON3
1
R/W
C0 h
Bit 6
IDL0
1
R/W
80 h
Bit 6
HDL0
0
R/W
80 h
Bit 6
RSSI6
0
R[A]
Bank A Registers
Bit 5
FTA9
1
R/W
Bit 4
FTA8
1
R/W
Bit 3
FTA7
0
R/W
Bit 2
FTA6
0
R/W
Bit 1
FTA5
0
R/W
Bit 0
FTA4
0
R/W
Bit 5
FTA1
0
R/W
Bit 4
FTA0
0
R/W
Bit 3
FTB11
0
R/W
Bit 2
FTB10
1
R/W
Bit 1
FTB9
1
R/W
Bit 0
FTB8
1
R/W
Bit 5
FTB5
0
R/W
Bit 4
FTB4
0
R/W
Bit 3
FTB3
0
R/W
Bit 2
FTB2
0
R/W
Bit 1
FTB1
0
R/W
Bit 0
FTB0
1
R/W
Bit 5
RON2
1
R/W
Bit 4
RON1
1
R/W
Bit 3
RON0
1
R/W
Bit 2
ROFF2
1
R/W
Bit 1
ROFF1
1
R/W
Bit 0
ROFF0
1
R/W
Bit 5
ID5
0
R/W
Bit 4
ID4
0
R/W
Bit 3
ID3
0
R/W
Bit 2
ID2
0
R/W
Bit 1
ID1
0
R/W
Bit 0
ID0
0
R/W
Bit 5
HD5
0
R/W
Bit 4
HD4
0
R/W
Bit 3
HD3
0
R/W
Bit 2
HD2
0
R/W
Bit 1
HD1
0
R/W
Bit 0
HD0
0
R/W
Bit 5
RSSI5
0
R[A]
Bit 4
RSSI4
0
R[A]
Bit 3
RSSI3
0
R[A]
Bit 2
RSSI2
0
R[A]
Bit 1
RSSI1
0
R[A]
Bit 0
RSSI0
0
R[A]
Bank B Registers
Figure 6. Bank Registers (continued)
Register Access through SPI
14
06h FT1-A
Register Access through SPI
10.3.3 Direct Switch Control
The conditions to enter direct switch control are:
• Strobe pin = VCC
• SOE bit = 0
By simply writing BANKA and BANKB, the active bank will be defined:
BANKA
X
0
1
BANKB
0
Bank A is active
1
Bank B is active
1
Not allowed in direct switch control
Defined bank is active after exiting the configuration mode, i.e., CONFB line goes high.
The direct switch control should be used when:
• When the strobe oscillator cannot be used to define the switch timing (for example, not periodic)
• When strobe pin use is not possible (no sleep mode between the two configurations)
• No automatic switching is required and MCU SPI access is possible
10.3.4 Strobe Pin Switch Control
The conditions to enter strobe pin switch control are:
• Strobe pin: controlled by MCU I/O port
• SOE bit = 0
By simply writing BANKA and BANKB, the active banks will be defined.
BANKA
X
0
1
BANKB
0
Bank A is active
1
Bank B is active
1
Bank A and Bank B are both active, configuration will toggle at each wakeup
The strobe pin will control the OFF/ON state of the MC33596. The various available sequences are
described in the following subsections.
10.3.4.1 BANKA = X, BANKB = 0
State A
OFF
State A
OFF
Strobe Pin
If strobe pin is 1, configuration is defined by Bank A, BANKS = 1
If strobe pin is 0, MC33596 configuration is OFF.
If a message is received during State A, current state remains State A up to end of message.
MC33596 Data Sheet, Rev. 3
Freescale Semiconductor
15
Register Access through SPI
10.3.4.2 BANKA = 0, BANKB = 1
State B
OFF
State B
OFF
Strobe Pin
If strobe pin is 1, configuration is defined by Bank B, BANKS = 0.
If strobe pin is 0, MC33596 configuration is OFF.
If a message is received during State B, current state remains State B up to end of message.
10.3.4.3 BANKA = 1, BANK B = 1
State A
OFF
State B
OFF
State A
Strobe Pin
Banks Bit
If strobe pin is 1, configuration is defined by BANKS. BANKS is toggled at each falling edge of the strobe
pin.
If strobe pin is 0, MC33596 configuration is OFF.
If a message is received during state A or state B, current state remains the same up to end of message.
If a read or write access is done using SPI, the next sequence will begin with state A whatever was the
active state before SPI access by MCU.
10.3.5 Strobe Oscillator Switch Control
The conditions to enter strobe oscillator switch control are:
• Strobe pin connected to an external capacitor to define timing (see Section 13, “Receiver On/Off
Control”)
• Strobe pin can also be connected to the MCU I/O port
• SOE bit = 1
By simply writing BANKA and BANKB, the active banks will be defined.
BANKA
X
0
1
BANKB
0
Bank A is active
1
Bank B is active
1
Bank A and Bank B are both active, configuration will toggle at each wakeup
MCU can override strobe oscillator control by controlling strobe pin level. If MCU I/O port is in high
impedance, strobe oscillator will control the OFF/ON state of the MC33596. The various available
sequences are described in the following subsections.
MC33596 Data Sheet, Rev. 3
16
Freescale Semiconductor
Register Access through SPI
10.3.5.1 BANKA = X, BANKB = 0
State A
OFF
State A
OFF
State A
If strobe pin is 1, configuration is defined by Bank A, BANKS = 1.
If strobe pin is 0, MC33596 configuration is OFF.
If a message is received during State A, current state remains State A up to end of message.
10.3.5.2 BANKA = 0, BANKB = 1
State B
OFF
State B
OFF
State B
If strobe pin is 1, configuration is defined by Bank B, BANKS = 0.
If strobe pin is 0, MC33596 configuration is OFF.
If a message is received during State B, current state remains State B up to end of message.
10.3.5.3 BANKA = 1, BANK B = 1
State A
State B
OFF
StateA
StateB
OFF
Banks Bit
BANKS toggles at the end of each state A or state B.
If strobe is forced to 1, configuration is frozen according to BANKS value.
If a read or write access is done using SPI, the next sequence will begin with state A in whatever was the
active state before SPI access by MCU.
A
Strobe
B
OFF
A
B
OFF
A
B
OFF
A
B
1
Z
Banks
For all available sequences:
• State A and State B are defined by Bank A and Bank B.
• State A duration, TonA is defined by Bank A RON[3–0].
• State B duration, TonB is defined by Bank B RON[3–0].
• OFF duration, TonB is defined by Bank A ROFF[2–0].
• If strobe pin is 1, the state is ON and defined by BANKS at that time and remains this state up to
the release of strobe and end of message if a message is being received.
• If a message is being received during State A or B, current state remains State A or B up to end of
message.
MC33596 Data Sheet, Rev. 3
Freescale Semiconductor
17
Communication Protocol
•
•
•
If strobe pin is 0 the state is OFF.
If strobe pin is released from 0 while state is OFF, the initial OFF period is completed.
Whenever is the change of duration of one state due to STROBE pin level or a message being
received, this has no influence on the timing of the following states (A, B, or OFF).
10.4 Standby: LVD Mode
The SPI is deselected. Nothing is sent and all incoming data are ignored until CONFB and SEB go low to
switch back to configuration mode.
11
Communication Protocol
11.1 Manchester Coding Description
The MC33596 data manager is able to decode Manchester coded messages. For other codings, the data
manager should be disabled (DME=0) for RAW data to be available on MOSI.
Manchester coding is defined as follows: data is sent during the first half-bit; and the complement of the
data is sent during the second half-bit.
0
1
0
0
1
1
0
ORIGINAL
DATA
MANCHESTER
CODED DATA
Figure 7. Example of Manchester Coding
The signal average value is constant. This allows clock recovery from the data stream itself. To achieve
correct clock recovery, Manchester coded data must have a duty cycle between 47% and 53%.
11.2 Preamble, Identifier, Header, and Message
The following description applies if the data manager is enabled (DME = 1).
A complete telegram includes the following sequences: a preamble, an identifier (ID), the preamble again,
a header, the message, and an end-of-message (EOM). These bit sequences are described below.
• Preamble: A preamble is required before the ID and before the header. It enables:
— In the case of OOK modulation, the AGC to settle, and the data slicer reference voltage to
settle if DSREF = 1
— In the case of FSK modulation, the data slicer reference voltage to settle
— Clock recovery
The preamble content must be defined carefully, to ensure that it will not be decoded as the ID or
the header. Figure 8 defines the preamble in OOK and FSK modulation.
MC33596 Data Sheet, Rev. 3
18
Freescale Semiconductor
Communication Protocol
•
•
•
•
•
ID: The ID allows selection of the correct device in an RF transmission, as the content has been
loaded previously in the ID register. Its length is variable, defined by the IDL[1:0] bits. The
complement of the ID is also recognized as the identifier.
Header: The header specifies the beginning of the message, as it is compared with the HEADER
register. Its length is variable, defined by the HDL[1:0] bits. The complement of the header is also
recognized as the header, in this case, output data are complemented.
The ID and the header are sent at the same data rate as data.
Message: Data must follow the header, with no delay.
EOM: The message is completed with an end-of-message, consisting of two consecutive NRZ
ones or zeroes (i.e., a Manchester code violation). Even in the case of FSK modulation, data must
conclude with an EOM, and not simply by stopping the RF telegram.
Figure 9 shows a complete message comprising a 6-bit ID and a 4-bit header, followed by two data bits.
OOK MODULATION (DSREF = 0)
AGC Settling Time
Clock Recovery
ID
1 NRZ > 200 μs (1)
1 Manchester
‘0’ Symbol
at Data Rate
OOK MODULATION (DSREF = 1)
AGC Settling Time
Data Slicer Reference Settling Time
Clock Recovery
ID
1 NRZ > 200 μs (1)
1 Manchester
0 Symbol
at Data Rate (3)
At Least 3 Manchester
0 Symbols
at Data Rate (2 and 3)
FSK MODULATION (DSREF = 1)
Data Slicer Reference Settling Time
Clock Recovery
ID
At Least 3 Manchester
0 Symbols
at Data Rate (2 and 3)
1 Manchester
0 Symbol
at Data Rate (3)
NOTES:
1. The AGC settling time pulse can be split over different pulses as long as the overall duration is at least 200 μs.
2. Table 14 defines the minimum number of Manchester symbols required for the data slicer operation versus the
data and average filters cut-off frequencies.
3. The Manchester 0 symbol can be replaced by a 1.
Figure 8. Preamble Definition
1
Preamble
1
0
0 1
ID
1
0 1
Preamble
1
Header
0 1
0
Data
EOM
Figure 9. Complete Message Example
MC33596 Data Sheet, Rev. 3
Freescale Semiconductor
19
Communication Protocol
NOTE
It is possible to build a tone to form the detection sequence by programming
the ID register with a full sequence of ones or zeroes. In this case, the header
(or its complement) must not be found in this tone (i.e., it must not be a full
sequence of ones or zeroes).
11.3 Message Protocol
When the strobe oscillator is enabled (SOE = 1), the receiver is continuously on/off cycling. The ID must
be recognized for the receiver to stay on. Consequently, the transmitted ID burst must be long enough to
include two consecutive receiver On cycles.
When the strobe oscillator is not enabled (SOE = 0), these timing constraints must be respected by the
external control applied to pin STROBE.
P+ID
RF
Signal
Receiver
Status
P+ID
=
Preamble
P+ID
ID
P+ID
On
Off
On Time
Off Time
P+Header
P+ID
P+ID
P+ID
=
Preamble
P+Header
Header
Data
EOM
On
Off
ID
Detected
SPI
Output
Data
Figure 10. Complete Telegram with ID Detection
RF
Signal
Receiver
Status
SPI
Output
Tone
On
Off
On Time
Off Time
Header
Data
On
ID
Detected
EOM
Off
Data
Figure 11. Complete Telegram with Tone Detection
MC33596 Data Sheet, Rev. 3
20
Freescale Semiconductor
Data Manager
11.4 Receiver Startup Delay
As shown in Figure 12, a settling time is required when entering the on state.
Receiver
Status
Off
On
Off
On
Settling
Time
RF
Signal
ID
ID
ID
ID
ID
ID
ID
ID
ID
Detected
Figure 12. Receiver Usable Window
12
Data Manager
In receive mode, Manchester coded data can be processed internally by the data manager. After decoding,
the data are output on the digital interface, in SPI format. This minimizes the load on the MCU.
The data manager, when enabled (DME = 1), has five purposes:
• ID detection: The received identifier is compared with the identifier stored in the ID register.
• Header recognition: The received header is compared with the one stored in the HEADER
register.
• Clock recovery: The clock is recovered during reception of the preamble and is computed from
the shortest received pulse. During the reception of the telegram, the recovered clock is constantly
updated to the data rate of the incoming signal.
• Output data and recovered clock on digital interface: See Section 14.1, “Receive Mode.”
• End-of-message detection: An EOM consists of two consecutive NRZ ones or zeroes.
Table 8 details some MC33596 features versus DME values.
Table 8. the MC33596 Features versus DME
13
DME
Digital Interface Use
Data Format
Output
0
SPI deselected
Bit stream
No clock
MOSI
—
1
SPI master
when CONFB = 1
Data bytes
Recovered clock
MOSI
SCLK
Receiver On/Off Control
In receive mode, on/off sequencing can be controlled internally, or managed externally by the MCU
through the input pin STROBE.
If the internal timer is selected (SOE = 1),
MC33596 Data Sheet, Rev. 3
Freescale Semiconductor
21
Receiver On/Off Control
•
•
Off time is clocked by the strobe oscillator,
On time is clocked by the crystal oscillator, enabling accurate control of the on time and,
therefore, the current consumption of the whole system.
Each time is defined with the associated value found in the RXONOFF register.
• On time = RON[3:0] x 512 x Tdigclk (see Table 17; begins after the crystal oscillator has started),
• Off time = receiver OFF time = N x TStrobe + MIN (TStrobe / 2, receiver On time), with N decoded
from ROFF[2:0] (see Table 18).
The strobe oscillator is a relaxation oscillator in which an external capacitor C3 is charged by an internal
current source (see Figure 43). When the threshold is reached, C3 is discharged and the cycle restarts. The
strobe frequency is FStrobe = 1/TStrobe with TStrobe = 106 x C3.
In receive mode, setting the STROBE pin to VCCIO at any time forces the circuit on. As VCCIO is above
the oscillator threshold voltage, the condition on which the STROBE pin is set to VCCIO is detected
internally, and the oscillator pulldown circuitry is disabled. This limits the current consumption. After a
strobe forced at “1”, the external driver should pass via a “0” state to discharge the capacitor before going
to high impedance state (otherwise, the ON time would last a long time after the driver release).
When the strobe oscillator is running (i.e., during an off time), forcing the STROBE pin to VGND stops the
strobe clock and, therefore, maintains the circuit off.
Figure 13 shows the associated timings.
STROBE
Threshold
STROBE
Clock
Off
Counter
STROBE
SET TO VCCIO
tStrobe
0
0
ROFF-1ROFF
Digital
Clock
On
Counter
0
0
RON
Receiver
Status
RON
Off
On
RON
Off
On
Cycling Period
Crystal Oscillator Startup
Figure 13. Receiver On/Off Sequence
MC33596 Data Sheet, Rev. 3
22
Freescale Semiconductor
Communication in Receive Mode
14
Communication in Receive Mode
14.1 Receive Mode
The MC33596 is master and drives the digital interface in one of two ways, depending on the selection of
the data manager.
1. DME = 1: The data manager is enabled. The SPI is master. The MC33596 sends the recovered
clock on SCLK and the received data on the MOSI line. Data are valid on falling edges of SCLK.
If an entire number of bytes is received, the data manager may add an extra byte. The content of
this extra byte is random. If the data received do not fill an entire number of bytes, the data manager
will fill the last byte randomly. Figure 14 shows a typical transfer.
SEB
SCLK
(Output)
Recovered Clock Updated to Incoming Signal Data Rate
MOSI
(Output)
D7 D6 D5 D4
D3
D2
D1
D0
D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0
Figure 14. Typical Transfer in Receive Mode with Data Manager
2. DME = 0: The data manager is disabled. The SPI is deselected. Raw data are sent directly on the
MOSI line, while SCLK remains at the low level.
15
Received Signal Strength Indicator (RSSI)
15.1 Module Description
In receive mode, a received signal strength indicator can be activated by setting bit RSSIE.
The input signal is measured at two different points in the receiver chain by two different means, as
follows.
• At the IF filter output, a progressive compression logarithmic amplifier measures the input signal,
ranging from the sensitivity level up to –50 dBm.
• At the LNA output, the LNA AGC control voltage is used to monitor input signals in the range
–50 dBm to –20 dBm.
Therefore, the logarithmic amplifier provides information relative to the in-band signal, whereas the LNA
AGC voltage senses the input signal over a wider band.
The RSSI information given by the logarithmic amplifier is available in:
• Analog form on pin RSSIOUT
• Digital form in the four least significant bits of the status register RSSI
MC33596 Data Sheet, Rev. 3
Freescale Semiconductor
23
Received Signal Strength Indicator (RSSI)
The information from the LNA AGC is available in digital form in the four most significant bits of status
register RSSI.
The whole content of status register RSSI provides 2 x 4 bits of RSSI information about the incoming
signal (see Section 16.6, “RSSI Register”).
Figure 15 shows a simplified block diagram of the RSSI function.
The quasi peak detector (D1, R1, C1) has a charge time of about 20 μs to avoid sensitivity to spikes.
R2 controls the decay time constant of about 5 ms to allow efficient smoothing of the OOK modulated
signal at low data rates. This time constant is useful in continuous mode when S2 is permanently closed.
To allow high-speed RSSI updating in peak pulse measurement, a discharge circuit (S1) is required to reset
the measured voltage and to allow new peak detection.
RSSI Register
LNA AGC Out
IF Filter Output
ADC
MSB
LSB
S2
Σ
D1
R1
RSSIOUT
C1
R2
S1
C2
Figure 15. RSSI Simplified Block Diagram
S2 is used to sample the RSSI voltage to allow peak pulse measurement (S2 used as sample and hold), or
to allow continuous transparent measurement (S2 continuously closed).
The 4-bit analog-to-digital convertor (ADC) is based on a flash architecture. The conversion time is
16 x Tdiglck. As a single convertor is used for the two analog signals, the RSSI register content is updated
on a 32 x Tdigclk timebase.
If RSSIE is reset, the whole RSSI module is switched off, reducing the current consumption. The output
buffer connected to RSSIOUT is set to high impedance.
15.2 Operation
Two modes of operation are available: sample mode and continuous mode.
15.2.1 Sample Mode
Sample mode allows the peak power of a specific pulse in an incoming frame to be measured.
The quasi peak detector is reset by closing S1. After 7 x Tdigclk, S1 is released. S2 is closed when RSSIC
is set high. On the falling edge of RSSIC, S2 is opened. The voltage on RSSIOUT is sampled and held.
The last RSSI conversion results are stored in the RSSI register and no further conversion is done.
MC33596 Data Sheet, Rev. 3
24
Freescale Semiconductor
Received Signal Strength Indicator (RSSI)
The RSSI register is updated every 32 x Tdigclk. Therefore, the minimum duration of the high pulse on
RSSIC is 32 x Tdigclk.
RSSIC
7 x tdigclk
S1
Closed
Open
Closed
S2
Open
Closed
Open
RSSI Register
Frozen
Updated
Frozen
Sampled and Hold RSSI Voltage
RSSIOUT
Peak Detector
Reset
Sampling
CONFB
MOSI
CMD
RSSI Value
MISO
Figure 16. RSSI Operation in Sample Mode
MC33596 Data Sheet, Rev. 3
Freescale Semiconductor
25
Configuration, Command, and Status Registers
15.2.2 Continuous Mode
Continuous mode is used to make a peak measurement on an incoming frame, without having to select a
specific pulse to be measured.
The quasi peak detector is reset by closing S1. After 7 x Tdigclk, S1 is opened. S2 is closed when RSSIC
is set high. As long as RSSIC is kept high, S2 is closed, and RSSIOUT follows the peak value with a decay
time constant of 5 ms.
The ADC runs continuously, and continually updates the RSSI register. Thus, reading this register gives
the most recent conversion value, prior to the register being read. The minimum duration of the high pulse
on CONFB is 32 x Tdigclk.
RSSIC
5 x tdigclk
S1
S2
RSSI Register
Closed
Open
Open
Closed
Frozen
Updated
Frozen
Updated
Frozen
RSSIOUT
Peak Detector
Test
CONFB
MOSI
MISO
CMD
CMD
RSSI
RSSI
Figure 17. RSSI Operation in Continuous Mode
16
Configuration, Command, and Status Registers
This section discusses the internal registers, which are composed of two classes of bits.
• Configuration and command bits allow the MC33596 to operate in a suitable configuration.
• Status bits report the current state of the system.
All registers can be accessed by the SPI; these registers are described below.
At power-on, the POR resets all registers to a known value (in the shaded rows in the following tables).
This defines the MC33596’s default configuration.
After POR, CONFB forces a low level. Therefore, an external pullup resistor is required to avoid entering
configuration mode.
MC33596 Data Sheet, Rev. 3
26
Freescale Semiconductor
Configuration, Command, and Status Registers
16.1 Configuration Registers
Figure 18 describes configuration register 1, CONFIG1.
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Addr
Bit Name
LOF1
LOF0
CF1
CF0
RESET
SL
LVDE
CLKE
$00
Reset Value
1
0
0
1
0
0
0
1
Figure 18. CONFIG1 Register
Table 9. LOF[1:0] and CF[1:0] Setting Versus Carrier Frequency
Carrier Frequency
LOF1
LOF0
CF1
CF0
304 MHz
0
0
0
0
315 MHz
1
0
0
0
426 MHz
0
1
0
1
434 MHz
0
1
0
1
868 MHz
0
1
1
1
915 MHz
1
1
1
1
RESET is a global reset. The bit is cleared internally, after use.
0 = no action
1 = reset all registers and counters
SL (Switch Level) selects the active level of the SWITCH output pin.
Table 10. Active Level of SWITCH Output Pin
SL
Receiver Function
Level on SWITCH
0
Receiving
Low
Other
High
Other
Low
Receiving
High
1
LVDE (Low Voltage Detection Enable) enables the low voltage detection function.
0 = disabled
1 = enabled
NOTE
This bit is cleared by POR. In the event of a complete loss of the supply
voltage, LVD is disabled at power-up, but the information is not lost as the
status bit LVDS is set by POR.
CLKE (Clock Enable) controls the DATACLK output buffer.
0 = DATACLK remains low
1 = DATACLK outputs Fdataclk
MC33596 Data Sheet, Rev. 3
Freescale Semiconductor
27
Configuration, Command, and Status Registers
Figure 19 describes configuration register 2, CONFIG2.
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Addr
Bit Name
DSREF
FRM
MODU
DR1
DR0
TRXE
DME
SOE
$01
Reset Value
0
0
0
1
0
0
0
0
Figure 19. CONFIG2 Register
DSREF (Data Slicer Reference) selects the data slicer reference.
0 = Fixed reference (cannot be used in FSK)
1 = Adaptive reference (recommended for maximum sensitivity in OOK and FSK)
In the case of FSK modulation (MODU = 1), DSREF must be set.
FRM (Frequency Register Manager) enables either a user friendly access to one frequency register or a
direct access to the two frequency registers.
0 = The carrier frequency and the FSK deviation are defined by the F register
1 = The local oscillator frequency and the two carrier frequencies are defined by two frequency
registers, F and FT.
MODU (Modulation) sets the data modulation type.
0 = On/Off Keying (OOK) modulation
1 = Frequency Shift Keying (FSK) modulation
DR[1:0] (Data Rate) configure the receiver blocks operating in base band.
• Low-pass data filter
• Low-pass average filter generating the data slicer reference, if DSREF is set
• Data manager
Table 11. Base Band Parameter Configuration
Data Filter
Cut-off Frequency
Average Filter
Cut-off Frequency
0
6 kHz
0.5 kHz
2–2.8 kBd
1
12 kHz
1 kHz
4–5.6 kBd
1
0
24 kHz
2 kHz
8–10.6 kBd
1
1
48 kHz
4 kHz
16–22.4 kBd
DR1
DR0
0
0
Data Manager
Data Rate Range
If the data manager is disabled, the incoming signal data rate must be lower than or equal to the data
manager maximum data rate.
TRXE (Receiver Enable) enables the whole receiver.
0 = standby mode
1 = other modes can be activated
DME (Data Manager Enable) enables the data manager.
0 = disabled
1 = enabled
MC33596 Data Sheet, Rev. 3
28
Freescale Semiconductor
Configuration, Command, and Status Registers
SOE (Strobe Oscillator Enable) enables the strobe oscillator.
0 = disabled
1 = enabled
Figure 20 describes configuration register 3, CONFIG3.
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Addr
Bit Name
AFF1
AFF0
OLS
LVDS
ILA1
ILA0
-
-
$02
Reset Value
0
0
1
1
0
0
0
0
Figure 20. CONFIG3 Register
OLS (Out of Lock Status) indicates the current status of the PLL.
0 = The PLL is in lock-in range
1 = The PLL is out of lock-in range
LVDS (Low Voltage Detection Status) indicates that a low voltage event has occurred when LVDE = 1.
This bit is read-only and is cleared after a read access.
0 = No low voltage detected
1 = Low voltage detected
ILA[1:0] (Input Level Attenuation) define the RF input level attenuation.
Table 12. RF Input Level Attenuation
ILA1
ILA0
RF Input Level
Attenuation
See Parameter
Number
0
0
0 dB
2.5
0
1
8 dB
2.6
1
0
16 dB
2.7
1
1
30 dB
2.8
Values in Table 12 assume the LNA gain is not reduced by the AGC.
AFF[1:0] (Average Filter Frequency) define the average filter cut-off frequency if the AFFC bit is set.
Table 13. Average Filter Cut-off Frequency
AFF1
AFF0
Average Filter Cut-off
Frequency
0
0
0.5 kHz
0
1
1 kHz
1
0
2 kHz
1
1
4 kHz
If AFFC is reset, the average filter frequency is directly defined by bits DR[1:0], as shown in Table 11.
MC33596 Data Sheet, Rev. 3
Freescale Semiconductor
29
Configuration, Command, and Status Registers
If AFFC is set, AFF[1:0] allow the overall receiver sensitivity to be improved by reducing the average
filter cut-off frequency. The typical preamble duration of three Manchester zeroes or ones at the data rate
must then be increased, as shown in Table 14.
Table 14. Minimum Number of Manchester Symbols in Preamble
versus DR[1:0] and AFF[1:0]
DR[1:0]
00
01
10
11
00
3
6
12
24
01
—
3
6
12
10
—
—
3
6
11
—
—
—
3
AFF[1:0]
16.2 Command Register
Figure 21 describes the Command register, COMMAND.
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Addr
Bit Name
AFFC
IFLA
—
RSSIE
EDD
RAGC
FAGC
—
$03
Reset Value
0
0
0
0
1
0
0
1
Figure 21. COMMAND Register
AFFC (Average Filter Frequency Control) enables direct control of the average filter cut-off frequency.
0 = Average filter cut-off frequency is defined by DR[1:0]
1 = Average filter cut-off frequency is defined by AFF[1:0]
IFLA (IF Level Attenuation) controls the maximum gain of the IF amplifier in OOK modulation.
0 = No effect
1 = Decreases by 20 dB (typical) the maximum gain of the IF amplifier, in OOK modulation only
The reduction in gain can be observed if the IF amplifier AGC system is disabled (by setting RAGC = 1).
RSSIE (RSSI Enable) enables the RSSI function.
0 = Disabled
1 = Enabled
EDD (Envelop Detector Decay) controls the envelop detector decay.
0 = Slow decay for minimum ripple
1 = Fast decay
RAGC (Reset Automatic Gain Control) resets both receiver internal AGCs.
0 = No action
1 = Sets the gain to its maximum value
MC33596 Data Sheet, Rev. 3
30
Freescale Semiconductor
Configuration, Command, and Status Registers
A first SPI access allows RAGC to be set; a second SPI access is required to reset it.
FAGC (Freeze Automatic Gain Control) freezes both receiver AGC levels.
0 = No action
1 = Holds the gain at its current value
16.3 Frequency Register
Figure 22 defines the Frequency register, F.
Bit 15
Bit 14
Bit 13
Bit 12
Bit 11
Bit 10
Bit 9
Bit 8
Addr
Bit Name
—
—
—
—
F11
F10
F9
F8
$04
Reset Value
0
1
0
0
1
0
0
0
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Bit Name
F7
F6
F5
F4
F3
F2
F1
F0
Reset Value
0
0
0
0
0
0
0
0
$05
Figure 22. F Register
How this register is used is determined by the FRM bit, which is described below.
FRM = 0 (User Friendly Access)
Bits F[11:0] define the carrier frequency Fcarrier. The local oscillator frequency FLO is then set
automatically to Fcarrier + FIF (with FIF = intermediate frequency).
FRM = 1 (Direct Access)
F[11:0] defines the receiver local oscillator frequency FLO
Table 15 defines the value to be binary coded in the frequency registers F[11;0], versus the desired
frequency value F (in Hz).
Table 15. Frequency Register Value versus Frequency Value F
CF[1:0]
Frequency Register Value
00, 01
(2 x F/Fref-35) x 2048
11
(F/Fref-35) x 2048
Conversely, Table 16 gives the desired frequency F and the frequency resolution versus the value of the
frequency registers F[11;0].
Table 16. Frequency Value F versus Frequency Register Value
CF[1:0]
Frequency (Hz)
Frequency Resolution (Hz)
00, 01
(35 + F[11;0]/2048)xFref/2
Fref/4096
11
(35 + F[11;0]/2048)xFref
Fref/2048
MC33596 Data Sheet, Rev. 3
Freescale Semiconductor
31
Configuration, Command, and Status Registers
16.4 Receiver On/Off Duration Register
Figure 23 describes the receiver on/off duration register, RXONOFF.
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Addr
Bit Name
—
RON3
RON2
RON1
RON0
ROFF2
ROFF1
ROFF0
$09
Reset Value
0
1
1
1
1
1
1
1
Figure 23. RXONOFF Register
RON[3:0] (Receiver On) define the receiver on time (after crystal oscillator startup) as described in
Section 13, “Receiver On/Off Control.”
Table 17. Receiver On Time Definition
RON[3:0]
Receiver On Time: N x 512 x Tdigclk
0000
Forbidden value
0001
1
0010
2
...
...
1111
15
ROFF[2:0] (Receiver Off) define the receiver off time as described in Section 13, “Receiver On/Off
Control.”
Table 18. Receiver Off Time Definition
ROFF[2:0]
Receiver Off Time: N x TStrobe
000
1
001
2
010
4
011
8
100
12
101
16
110
32
111
63
16.5 ID and Header Registers
Figure 24 defines the ID register, ID.
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Addr
Bit Name
IDL1
IDL0
ID5
ID4
ID3
ID2
ID1
ID0
$0A
Reset Value
1
1
0
0
0
0
0
0
Figure 24. ID Register
IDL[1:0] (Identifier Length) sets the length of the identifier, as shown on Table 19.
MC33596 Data Sheet, Rev. 3
32
Freescale Semiconductor
Configuration, Command, and Status Registers
Table 19. ID Length Selection
IDL1
IDL0
ID Length
0
0
2 bits
0
1
4 bits
1
0
5 bits
1
1
6 bits
ID[5:0] (Identifier) sets the identifier. The ID is Manchester coded. Its LSB corresponds to the register’s
LSB, whatever the specified length.
Figure 25 defines the Header register, HEADER.
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Addr
Bit Name
HDL1
HDL0
HD5
HD4
HD3
HD2
HD1
HD0
$0B
Reset Value
1
0
0
0
0
0
0
0
Figure 25. HEADER Register
HDL[1:0] (Header Length) sets the length of the header, as shown on Table 20.
Table 20. Header Length Selection
HDL1
HDL0
HD Length
0
0
1 bits
0
1
2 bits
1
0
4 bits
1
1
6 bits
HD[5:0] (Header) sets the header. The header is Manchester coded. Its LSB corresponds to the register’s
LSB, whatever the specified length.
16.6 RSSI Register
Figure 26 describes the RSSI Result register, RSSI.
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Addr
Bit Name
RSSI7
RSSI6
RSSI5
RSSI4
RSSI3
RSSI2
RSSI1
RSSI0
$0C
Reset Value
0
0
0
0
0
0
0
0
Figure 26. RSSI Register
Bits RSSI[7:4] contain the result of the analog-to-digital conversion of the signal measured at the LNA
output.
Bits RSSI[3:0] contain the result of the analog-to-digital conversion of the signal measured at the IF filter
output.
MC33596 Data Sheet, Rev. 3
Freescale Semiconductor
33
Controller
17
Controller
This section describes how the MC33596 controller executes sequences of operations, relative to the
selected mode. The controller is a finite state machine, clocked at Tdigclk. An overview is presented in
Figure 27 (note that some branches refer to other diagrams that provide more detailed information).
There are three different modes: configuration, receive, and standby/LVD. Each mode is exclusive and can
be entered in different ways, as follows.
• External signal: CONFB for configuration mode,
• External signal and configuration bits: CONFB and TRXE for all other modes,
• External signal and internal conditions: see Figure 31 and Figure 33 for information on how to
enter standby/LVD mode.
After a POR, the circuit is in state 60 (see Figure 27) and configuration registers’ content is set to the reset
value.
At any time, a low level applied to CONFB forces the finite state machine into state 1, whatever the current
state. This is not always shown in state diagrams, but must always be considered.
Active Bank Change
(A to B or B to A)
CONFB = 0
SPI Deselected
SPI Slave
Configuration Mode
Mode
Configuration
Standby/LVD Mode
State 60
SPI Master
CONFB = 1,
TRXE = 0,
and STROBE = 0
Power-on Reset
State 1
CONFB = 1,
TRXE = 1,
and STROBE = 0
…and SOE = 1
See Figure 30
Receive Mode
…and DME = 1
…and DME = 0
…and SOE = 0
See Figure 31
…and SOE = 1
See Figure 32
…and SOE = 0
See Figure 33
Figure 27. State Machine Overview
17.1 Configuration Mode
The configuration mode is selected by the microcontroller unit (MCU) to write to the internal registers (to
configure the system) or to read them. In this mode, the SPI is a slave. The analog parts (receiver) remain
in the state (on, off) they were in prior to entering configuration mode, until a new configuration changes
them. In configuration mode, data can be neither sent nor received. As long as a low level is applied to
CONFB, the circuit stays in State 1, the only state in this mode.
Figure 28 and Figure 29 describe the two valid sequences for enabling a correct transition from
Standby/LVD mode to configuration mode.
MC33596 Data Sheet, Rev. 3
34
Freescale Semiconductor
Controller
STROBE
CONFB
SPI Startup Time
SEB
Figure 28. First Valid Sequence from Standby/LVD Mode to Configuration Mode
STROBE
CONFB
SPI Startup Time
10 μs (Maximum)
SEB
Figure 29. Second Valid Sequence from Standby/LVD Mode to Configuration Mode
17.2 Receive Mode
The receiver is either waiting for an RF telegram, or is receiving one. Four different processes are possible,
as determined by the values of the DME and SOE bits. A state diagram describes the sequence of
operations in each case.
NOTE
If the STROBE pin is tied to a high level before switching to receive mode,
the receiver does not go through an off or standby state.
17.2.1 Data Manager Disabled and Strobe Oscillator Enabled
Raw received data are sent directly on the MOSI line. Figure 30 shows the state diagram.
SPI Deselected
STROBE = 0
STROBE = 0
STROBE = 1
State 0
Off
Off Counter = ROFF[2:0]
or STROBE = 1
On Counter = RON[3:0]
and STROBE ≠ 1
State 0b
On
Raw Data on MOSI
Figure 30. Receive Mode, DME = 0, SOIE = 1
State 0: The receiver is off, but the strobe oscillator and the off counter are running. Forcing the STROBE
pin low maintains the system in this state.
MC33596 Data Sheet, Rev. 3
Freescale Semiconductor
35
Controller
State 0b: The receiver is kept on by the STROBE pin or the on counter. Raw data are output on the MOSI
line.
For all states: At any time, a low level applied to CONFB forces the state machine to state 1.
17.2.2 Data Manager Disabled and Strobe Pin Control
Raw received data are sent directly on the MOSI line. Figure 31 shows the state diagram.
SPI Deselected
STROBE = 0
STROBE = 1
State 5
Standby/LVD
STROBE = 1
STROBE = 0
State 5b
On
Raw Data on MOSI
Figure 31. Receive Mode, DME = 0, SOE = 0
State 5: The receiver is in standby/LVD mode. For further information, see Section 17.3, “Standby/LVD
Mode.” A high level applied to STROBE forces the circuit to state 5b.
State 5b: The receiver is kept on by the STROBE pin. Raw data are output on the MOSI line.
For all states: At any time, a low level applied to CONFB forces the state machine to state 1.
17.2.3 Data Manager Enabled and Strobe Oscillator Enabled
Figure 32 shows the state diagram when the data manager and the strobe oscillator are enabled. in this
configuration, the receiver is controlled internally by the strobe oscillator. However, external control via
the STROBE pin is still possible, and overrides the strobe oscillator command.
State 10: The receiver is off, but the strobe oscillator and the off counter are running. Forcing STROBE
pin to the low level maintains the system in this state.
State 11: The receiver is waiting for a valid ID. If an ID, or its complement, is detected, the state machine
advances to state 12; otherwise, the circuit goes back to state 10 at the end of the RON time, if STROBE≠1.
State 12: An ID or its complement has been detected. The data manager is now waiting for a header or its
complement. If neither a header, nor its complement, has been received before a time-out of 256 bits at
data rate, the system returns to state 10.
State 13: A header, or its complement, has been received. Data and clock signals are output on the SPI port
until EOM indicates the end of the data sequence. If the complement of the header has been received,
output data are complemented also.
MC33596 Data Sheet, Rev. 3
36
Freescale Semiconductor
Controller
When an EOM occurs before the current byte is fully shifted out, dummy bits are inserted until the number
of shifted bits is a multiple of 8.
For all states: At any time, a low level applied to STROBE forces the circuit to state 10, and a low level
applied on CONFB forces the state machine to state 1.
SPI Master
STROBE = 0
STROBE = 0
State 10
Off
STROBE = 1
Off Counter = ROFF[2:0]
or STROBE = 1
On Counter = RON[3:0]
and STROBE ≠ 1
State 11
On
Waiting For a Valid ID
ID Detected
Time Out
State 12
On
Waiting for a Valid Header
EOM Received
and STROBE = 1
Header Received
State 13
On
Output Data and Clock
Waiting for End of Message
EOM Received
and STROBE ≠ 1
Figure 32. Receive Mode, DME = 1, SOE = 1
MC33596 Data Sheet, Rev. 3
Freescale Semiconductor
37
Controller
17.2.4 Data Manager Enabled and Strobe Pin Control
Figure 33 shows the state diagram when the data manager is enabled and the strobe oscillator is disabled.
In this configuration, the receiver is controlled only externally by the MCU.
SPI Master
STROBE = 0
SPI Deselected
State 20
Standby/LVD
STROBE = 1
STROBE = 1
STROBE = 0
State 21
On
Waiting For a Valid ID
ID Detected
STROBE = 0
State 22
On
Waiting for a Valid Header
EOM Received
and STROBE = 1
Header Received
State 23
On
Output Data and Clock
Waiting for End of Message
EOM Received
and STROBE = 0
Figure 33. Receive Mode, DME = 1, SOE = 0
State 20: The receiver is in standby/LVD mode. For further information, see Section 17.3, “Standby/LVD
Mode.” A high level applied to STROBE forces the circuit to state 21.
State 21: The circuit is waiting for a valid ID. If an ID, or its complement, is detected, the state machine
advances to state 22; if not, the state machine will remain in state 21, as long as STROBE is high.
State 22: If a header, or its complement, is detected, the state machine advances to state 23. If not, the state
machine will remain in state 22, as long as STROBE is high.
State 23: A header or its complement has been received; data and clock signals are output on the SPI port
until an EOM indicates the end of the data sequence. If the complement of the header has been received,
MC33596 Data Sheet, Rev. 3
38
Freescale Semiconductor
Controller
output data are complemented also. When an EOM occurs before the current byte is fully shifted out,
dummy bits are inserted until the number of shifted bits is a multiple of 8.
For all states: At any time, a low level applied to STROBE puts the circuit into state 20, and a low level
applied to CONFB forces the state machine to state 1.
17.3 Standby/LVD Mode
Standby/LVD mode allows minimum current consumption to be achieved. Depending upon the value of
the LVDE bit, the circuit is in standby mode (state 60) or LVD mode (state 5 and 20).
LVDE = 0: The receiver is in standby; consumption is reduced to leakage current (current state after POR).
LVDE = 1: The LVD function is enabled; consumption is in the range of tens of microamperes.
The only way to exit this mode is to go back to configuration mode by applying a low level to CONFB.
17.4 Transition Time
Table 21 details the different times that must be considered for a given transition in the state machine, once
the logic conditions for that transition are met.
Table 21. Transition Time Definition
Transition
State x -> y
Crystal
Oscillator
Startup Time,
Parameter 5.10
Standby to SPI running, state 60 -> 1
Standby to receiver running, states 5 -> 5b, 20 -> 21
√
√
Off to receiver running, states 0 -> 0b, 10 -> 11
√
Configuration to receiver running,
states 1 -> (0b, 5b, 11, 21)
PLL Timing
Lock time parameter
5.9
Lock time parameter
5.9
0 or lock time
parameter 5.1 or lock
time parameter 5.9 2
Receiver running to configuration mode,
state (0b, 5b, 11, 12, 13, 21, 22, 23) -> 1,
Receiver running to standby mode,
state 5b -> 5, (21, 22, 23) -> 20
Receiver running to off mode,
state 0b -> 0, (11, 12, 13) -> 10
Receiver
Receiver
Preamble On-to-Off Time,
Parameter 1.12
Time1
√
√
√
√
√
NOTES:
1
See Section 11.2, “Preamble, Identifier, Header, and Message.”
2 Depending on the PLL status before entering configuration mode. For example, the transition time from standby to receiver
running (FSK modulation, 19.2 kBd, AFFC = 0, data manager enabled) is: 0.6 ms + 50 µs + (3 + 1)/19.2k = 970 µs.
MC33596 Data Sheet, Rev. 3
Freescale Semiconductor
39
Electrical Characteristics
18
Electrical Characteristics
18.1 General Parameters
Operating supply voltage and temperature range see Table 3. Values refer to the circuit recommended in the application
schematic (see Figure 43), unless otherwise specified. Typical values reflect average measurement at VCC = 3.0 V, TA = 25°C.
Parameter
Limits
Test Conditions
Comments
Unit
Min
Typ
Max
1.2 Supply current in receive mode
Receiver on
—
10.3
13
mA
1.3
Strobe oscillator only
—
24
50
μA
1.6 Supply current in standby mode –40°C ≤ TA ≤ 25°C
—
260
700
nA
1.8
TA = 85°C
—
800
1200
nA
1.9 Supply current in LVD mode
LVDE = 1
—
35
50
μA
1.12 Receiver on-to-off time
Supply current reduced to 10%
—
100
—
μs
1.13 VCC2 voltage regulator output
2.7 V < VCC
2.4
2.6
2.8
V
1.14
2.1 V ≤ VCC ≤ 2.7 V
—
VCC–0.1
—
V
1.15 VCCDIG2 voltage regulator
output
Circuit in standby mode
(VCCDIG = 3 V)
—
0.7 x
VCCDIG
—
V
1.16
Circuit in all other modes
1.4
1.6
1.8
V
1.19 Voltage on VCC (Preregulator
output)
Receive mode with VCCIN=5V
2.4
—
—
V
18.2 Receiver: RF Parameters
RF parameters assume a matching network between test equipment and the D.U.T, and apply to all bands
unless otherwise specified.
Operating supply voltage and temperature range see Table 3. Values refer to the circuit recommended in the application
schematic (see Figure 43), unless otherwise specified. Typical values reflect average measurement at VCC = 3.0 V, TA = 25°C.
Limits
Test Conditions,
Comments
Typ
Max
(FCE,
FJE)
Max
(FCAE,
FJAE)
Unit
Min
2.2 OOK sensitivity at 315 MHz DME = 1, DSREF = 1,
DR = 4.8 kbps, PER = 0.1
—
–104
–99
–97
dBm
2.40 OOK sensitivity at 434 MHz DME = 1, DSREF = 1,
DR = 4.8 kbps, PER = 0.1
—
–103.5
–98
–96
dBm
2.41 OOK sensitivity at 868 MHz DME = 1, DSREF = 1,
DR = 4.8 kbps, PER = 0.1
—
–103
–98
–96
dBm
2.42 OOK sensitivity at 916 MHz DME = 1, DSREF = 1,
DR = 4.8 kbps, PER = 0.1
—
–103
–98
–96
dBm
Parameter
MC33596 Data Sheet, Rev. 3
40
Freescale Semiconductor
Electrical Characteristics
Operating supply voltage and temperature range see Table 3. Values refer to the circuit recommended in the application
schematic (see Figure 43), unless otherwise specified. Typical values reflect average measurement at VCC = 3.0 V, TA = 25°C.
Limits
Parameter
Test Conditions,
Comments
Typ
Max
(FCE,
FJE)
Max
(FCAE,
FJAE)
Unit
Min
2.24 FSK sensitivity at 315 MHz
DME = 1, DSREF = 1,
DR = 4.8 kbps,
DFcarrier = ±64 kHz, PER = 0.1
—
–106.5
–102
–100
dBm
2.50 FSK sensitivity at 434 MHz
DME = 1, DSREF = 1,
DR = 4.8 kbps,
DFcarrier = ±64 kHz, PER = 0.1
—
–105.5
–101
–99
dBm
2.51 FSK sensitivity at 868 MHz
DME = 1, DSREF = 1,
DR = 4.8 kbps,
DFcarrier = ±64 kHz, PER = 0.1
—
–104.5
–100
–98
dBm
2.52 FSK sensitivity at 916 MHz
DME = 1, DSREF = 1,
DR = 4.8 kbps,
DFcarrier = ±64 kHz, PER = 0.1
—
–105.4
–102
–100
dBm
2.35 Sensitivity improvement in
RAW mode
DME = 0
—
0.6
—
—
dB
2.5 Sensitivity reduction
ILA[1:0] = 00
—
0
—
—
dB
2.6
ILA[1:0] = 01
—
8
—
—
dB
2.7
ILA[1:0] = 10
—
16
—
—
dB
2.8
ILA[1:0] = 11
—
30
—
—
dB
2.9 In-band jammer
desensitization
Sensitivity reduced by 3 dB CW
jammer at Fcarrier ± 50 kHz/OOK
—
–4
—
—
dBc
2.60
Sensitivity reduced by 3 dB CW
jammer at Fcarrier ± 50 kHz/FSK
—
–6
—
—
dBc
2.11 Out-of-band jammer
desensitization
Sensitivity reduced by 3dB
CW jammer at Fcarrier ±1 MHz
—
37
—
—
dBc
2.12
Sensitivity reduced by 3dB
CW jammer at Fcarrier ± 2 MHz
—
40
—
—
dBc
2.13 RFIN parallel resistance
Receive mode
—
300
—
—
Ω
2.14 RFIN parallel resistance
Standby mode
1300
—
—
—
Ω
2.15 RFIN parallel capacitance
Receive mode
—
1.2
—
—
pF
2.17 Maximum detectable signal, Modulation depth: 99%,
OOK
level measured on a NRZ ‘1’
–25
—
—
—
dBm
2.25 Maximum detectable signal, ΔFcarrier = ±64kHz
FSK
-10
—
—
—
dBm
2.18 Image frequency rejection
304–434 MHz
20
36
—
—
dB
2.19
868–915 MHz
15
20
—
—
dB
MC33596 Data Sheet, Rev. 3
Freescale Semiconductor
41
Electrical Characteristics
OOK Sensitivity Variation vs Temperature
(Ref : 3V, 25°C, 4800bps)
1.4
Sensitivity Variation (dB)
1.2
1
315 MHz
434 MHz
0.8
868 MHz
0.6
916 MHz
0.4
0.2
0
-0.2
-0.4
-40°C
25°C
Temperature (°C)
85°C
Figure 34. OOK Sensitivity Variation Versus Temperature
OOK Sensitivity Variation vs Voltage
(Ref : 3V, 25°C, 4800bps)
0.2
Sensitivity Variation (dB)
0.1
0
-0.1
-0.2
315 MHz
-0.3
434 MHz
868 MHz
-0.4
-0.5
2.1 V
916 MHz
2.4 V
Voltage (V)
3V
3.6 V
Figure 35. OOK Sensitivity Variation Versus Voltage
MC33596 Data Sheet, Rev. 3
42
Freescale Semiconductor
Electrical Characteristics
FSK Sensitivity Variation vs Temperature
(Ref : 3V, 25°C, +/-64kHz, 4800 bps )
1.4
Sensitivity Variation (dB)
1.2
1
315 MHz
0.8
434 MHz
868 MHz
0.6
916 MHz
0.4
0.2
0
-0.2
-0.4
-0.6
-40°C
25°C
Temperature (°C)
85°C
Figure 36. FSK Sensitivity Variation Versus Temperature
FSK Sensitivity Variation vs Voltage
(Ref : 3V, 25°C, +/-64kHz, 4800bps )
0.5
0.4
Sensitivity Variaition (dB)
315 MHz
434 MHz
0.3
868 MHz
916 MHz
0.2
0.1
0
-0.1
-0.2
2.1 V
2.4 V
Voltage (V)
3V
3.6 V
Figure 37. FSK Sensitivity Variation Versus Voltage
MC33596 Data Sheet, Rev. 3
Freescale Semiconductor
43
Electrical Characteristics
Sensitivity Variation Versus Data Rate
(Ref : 25°C, 3V, 434MHz , OOK, 4800bps)
5
Sensitivity Variation (dB)
4
3
2
1
0
-1
-2
-3
2400
4800
9600
19200
Data Rate (bps)
Figure 38. OOK Sensitivity Variation Versus Data Rate
Sensitivity Variation vs Data Rate
(Ref : 25°C, 3V, 434MHz , FSK +/-64kHz, 4800bps)
5
Sensitivity Variation (dB)
4
3
2
1
0
-1
-2
-3
2400
4800
9600
19200
Data Rate (bps)
Figure 39. FSK Sensitivity Variation Versus Data Rate
MC33596 Data Sheet, Rev. 3
44
Freescale Semiconductor
Electrical Characteristics
Sensitivity Variation vs Frequency Deviation
(Ref : 25°C, 3V, 434MHz, FSK +/-64kHz, 4800bps)
6
Sensitivity Variation (dB)
5
4
3
2
1
0
-1
20
32
40
50
65
70
80
90 100 110 120 130 140 150
Frequency Deviation (kHz)
160 170
Figure 40. FSK Sensitivity Variation Versus Frequency Deviation
18.3 Receiver Parameters
Operating supply voltage and temperature range see Table 3. Values refer to the circuit recommended in the application
schematic (see Figure 43), unless otherwise specified. Typical values reflect average measurement at VCC = 3.0 V, TA = 25°C.
Parameter
Test Conditions
Comments
Limits
Unit
Min
Typ
Max
Receiver: IF filter, IF Amplifier, FM-to-AM Converter and Envelope Detector
3.1 IF center frequency
—
1.5
—
MHz
3.2 IF bandwidth at –3dB
—
380
—
kHz
3.3 IF cut-off low frequency at –3 dB Refer to Section 9, “Frequency
Planning”.
3.4 IF cut-off high frequency at –3 dB
—
—
1.387
MHz
1.635
—
—
MHz
—
15
—
ms
3.12 Recovery time from strong signal OOK modulation, 2.4 kbps,
FAGC = 0, input signal from
–50 dBm to –100 dBm
MC33596 Data Sheet, Rev. 3
Freescale Semiconductor
45
Electrical Characteristics
Operating supply voltage and temperature range see Table 3. Values refer to the circuit recommended in the application
schematic (see Figure 43), unless otherwise specified. Typical values reflect average measurement at VCC = 3.0 V, TA = 25°C.
Parameter
Test Conditions
Comments
Limits
Unit
Min
Typ
Max
380
—
650
mV
3.52 Analog RSSI output signal for
Input signal @–100 dBm
420
—
700
mV
3.53 Analog RSSI output signal for
Input signal @–70 dBm
850
—
1200
mV
3.54 Analog RSSI output signal for
Input signal @–28 dBm
1000
—
1300
mV
0
—
2
3.56 Digital RSSI Registers for Input
signal @–100 dBm
0
—
3
3.57 Digital RSSI Registers for Input
signal @–70 dBm
9
—
13
3.58 Digital RSSI Registers for Input
signal @–28 dBm
13
—
16
0
—
2
3.6 Digital RSSI Registers for Input
signal @–50 dBm
4
—
8
3.61 Digital RSSI Registers for Input
signal @–24 dBm
13
—
15
Receiver: Analog and Digital RSSI
3.51 Analog RSSI output signal for
Input signal @–108 dBm
3.55 Digital RSSI Registers for Input
signal @–108 dBm
3.59 Digital RSSI Registers for Input
signal @–70 dBm
Measured on RSSIOUT
RSSI [0:3]
RSSI [4:7]
18.4 PLL & Crystal Oscillator
Operating supply voltage and temperature range see Table 3. Values refer to the circuit recommended in the application
schematic (see Figure 43), unless otherwise specified. Typical values reflect average measurement at VCC = 3.0 V, TA = 25°C.
Parameter
Test Conditions
Comments
Limits
Unit
Min
Typ
Max
5.9 PLL lock time
RF frequency ±25kHz
—
50
100
μs
5.1 Toggle time between 2
frequencies
RF frequency step <1.5MHz,
RF frequency ±25kHz
—
30
—
μs
5.10 Crystal oscillator startup time
—
0.6
1.2
ms
5.8 Crystal series resistance
—
—
120
Ω
MC33596 Data Sheet, Rev. 3
46
Freescale Semiconductor
Electrical Characteristics
18.5 Strobe Oscillator (SOE = 1)
Operating supply voltage and temperature range see Table 3. Values refer to the circuit recommended in the application
schematic (see Figure 43), unless otherwise specified. Typical values reflect average measurement at VCC = 3.0 V, TA = 25°C.
Limits
Test Conditions
Comments
Parameter
Unit
Min
Typ
Max
0.1
—
—
ms
0.1
—
10
nF
—
1
—
μA
6.4 High threshold voltage
—
1
—
V
6.5 Low threshold voltage
—
0.5
—
V
–14.2
—
15.8
%
6.1 Period range
TStrobe = 106.C3
6.2 External capacitor C3
6.3 Sourced/sink current
6.6 Overall timing accuracy
With 1% resistor R13
With 1% resistor R13 & 5%
capacitor C3,
±3 sigma variations
18.6 Digital Input: CONFB, MOSI, SCLK, SEB, STROBE,
RSSIC
Operating supply voltage and temperature range see Table 3. Values refer to the circuit recommended in the application
schematic (see Figure 43), unless otherwise specified. Typical values reflect average measurement at VCC = 3.0 V, TA = 25°C.
Parameter
Limits
Test Conditions
Comments
Unit
Min
Typ
Max
—
—
0.4 x VCC2
V
0.8 x VCC2
—
—
V
0.1 x VCC2
—
—
V
—
—
0.4 x VCCDIG2
V
7.11 Input high voltage
0.8 x VCCDIG2
—
—
V
7.12 Input hysteresis
0.1 x VCCDIG2
—
—
V
1
—
100
nA
0.5
—
10
nA
7.7 Input low voltage
MOSI, SCLK, SEB, RSSIC(1)
7.8 Input high voltage
7.9 Input hysteresis
7.10 Input low voltage
CONFB,
STROBE2
7.5 Sink current
Configuration, receive, modes
7.6
standby or LVD modes
NOTES:
1 Input levels of those pins are referenced to V
CC2 which depends upon VCC (see Section 6, “Power Supply”).
2 Input levels of those pins are referenced to V
CCDIG2 which depends upon the circuit state (see Section 6, “Power Supply”).
MC33596 Data Sheet, Rev. 3
Freescale Semiconductor
47
Electrical Characteristics
18.7 Digital Output
Operating supply voltage and temperature range see Table 3. Values refer to the circuit recommended in the application
schematic (see Figure 43), unless otherwise specified. Typical values reflect average measurement at VCC = 3.0 V, TA = 25°C.
Parameter
Limits
Test Conditions
Comments
Unit
Min
Typ
Max
Digital Output: DATACLK, LVD, MISO, MOSI, SCLK
8.1 Output low voltage
|ILOAD| = 50 μA
8.2 Output high voltage
8.3 Fall and rise time
—
—
0.2 x VCCIO
V
0.8 x VCCIO
—
—
V
—
80
150
ns
—
—
0.2 x VCC
V
0.8 x VCC
—
—
V
From 10% to 90% of the
output swing,
CLOAD = 10pF
Digital Output: SWITCH (VCC = 3V)
8.4 Output low voltage
|ILOAD| = 50 μA
8.5 Output high voltage
18.8 Digital Interface Timing
Operating supply voltage and temperature range see Table 3. Values refer to the circuit recommended in the application
schematic (see Figure 43), unless otherwise specified. Typical values reflect average measurement at VCC = 3.0 V, TA = 25°C.
Parameter
Limits
Test Conditions
Comments
Unit
Min
Typ
Max
9.2 SCLK period
1
—
—
μs
9.8 Configuration enable time
20
—
—
s
3 x Tdigclk
—
—
ns
100
—
—
ns
100
—
—
1
ns
3 x Tdigclk
—
—
s
—
—
100
ns
9.3 Enable lead time
If crystal oscillator is running, if
not see page 15 for entering
into configuration
9.4 Enable lag time
9.5 Sequential transfer delay
9.6 Data hold time
Receive mode, DME = 1,
from SCLK to MOSI
9.7 Data setup time
Configuration mode,
from SCLK to MISO
9.9
Configuration mode, from
SCLK to MOSI
120
—
—
ns
9.10 Data setup time
Configuration mode, from
SCLK to MOSI
100
—
—
ns
NOTES:
1 The digital interface can be used in SPI burst protocol, i.e., with a continuous clock on SCLK port. For example, one (or more)
read access followed by one (or more) write access and so on. In this case and for a practical use, the pulse required on
CONFB between accesses must be less than one digital clock period Tdigclk.
MC33596 Data Sheet, Rev. 3
48
Freescale Semiconductor
Electrical Characteristics
SEB
9.8
CONFB
9.3
9.5
9.4
SCLK
(input)
9.2
9.10
9.9
MOSI
(input)
9.7
MISO
(output)
Figure 41. Digital Interface Timing Diagram in Configuration Mode
SEB
CONFB
9.3
SCLK
(input)
9.6
MOSI
(output)
Figure 42. Digital Interface Timing Diagram in Receive Mode (DME = 1)
Examples of crystal characteristics are given in Table 22.
Table 22. Typical Crystal Reference and Characteristics
Reference & Type
315 MHz
434 MHz
868 MHz
LN-G102-1183
NX5032GA
LN-G102-1182
NX5032GA
EXS00A-01654
NX5032GA
Unit
17.5814
24.19066
24.16139
MHz
Load capacitance
8
8
8
pF
ESR
25
15
<70
Ω
Parameter
Frequency
MC33596 Data Sheet, Rev. 3
Freescale Semiconductor
49
Application Schematics
19
Application Schematics
RSSIOUT
C3
1 nF
STROBE
VCC2
C7
SWITCH
5V
C8
25
GNDIO
26
VCCIN
27
NC
28
STROBE
29
GNDSUBD
30
VCC2IN
31
VCC2VCO
GND
C35
C29
VCC2
C30
23
22
21
CONFB
DATACLK
19
RSSIC
18
GNDDIG
17
SEB
SCLK
MOSI
MISO
CONFB
DATACLK
GND
RSSIC
16
10
9
C24
X1
RBGAP
GND
24
20
NC
XTALIN
8
MISO
U14
MC33596
VCCDIG2
7
GNDLNA
15
6
MOSI
14
5
RFIN
VCCDIG
4
SCLK
13
C22
VCC2
SEB
VCC2RF
VCC2OUT
C40
3
12
C6
VCCINOUT
C39
2
RSSIOUT
11
L7
1
XTAL0UT
VCC2
C20
J1
SNA Vert
SWITCH
GND
32
GND
R13
C31
Figure 43. MC33596 Application Schematic (5 V)
19.1 PCB Design Recommendations
Pay attention to the following points and recommendations when designing the layout of the PCB.
• Ground Plane
— If you can afford a multilayer PCB, use an internal layer for the ground plane, route power
supply and digital signals on the last layer, RF components being located on the first layer.
— Use at least a double-sided PCB.
— Use a large ground plane on the opposite layer.
— If the ground plane must be cut on the opposite layer for routing some signals, maintain
continuity with another ground plane on the opposite layer and a lot of via to minimize
MC33596 Data Sheet, Rev. 3
50
Freescale Semiconductor
Application Schematics
•
•
parasitic inductance.
Power Supply, Ground Connection and Decoupling
— Connect each ground pin to the ground plane using a separate via for each signal; do not use
common vias.
— Place each decoupling capacitor as close to the corresponding VCC pin as possible (no more
than 2–3 mm away).
— Locate the VCCDIG2 decoupling capacitor (C13) directly between VCCDIG2 (pin 14) and
GND (pin 16).
RF Tracks, Matching Network and Other Components
— Minimize any tracks used for routing RF signals.
— Locate crystal X1 and associated capacitors C15 and C11 close to the MC33596. Avoid loops
occurring due to component size and tracks. Avoid routing digital signals in this area.
— Use high frequency coils with high Q values for the frequency of operation (minimum of 15).
Validate any change of coil source.
NOTE
The values indicated for the matching network have been computed and
tuned for the the MC33596 RF Modules available for MC33596 evaluation.
Matching networks should be retuned if any change is made to the PCB
(track width, length or place, or PCB thickness, or component value). Never
use, as is, a matching network designed for another PCB.
MC33596 Data Sheet, Rev. 3
Freescale Semiconductor
51
Case Outline Dimensions
20
Case Outline Dimensions
20.1 LQFP32 Case
MC33596 Data Sheet, Rev. 3
52
Freescale Semiconductor
Case Outline Dimensions
MC33596 Data Sheet, Rev. 3
Freescale Semiconductor
53
Case Outline Dimensions
MC33596 Data Sheet, Rev. 3
54
Freescale Semiconductor
Case Outline Dimensions
20.2 QFN32 Case
MC33596 Data Sheet, Rev. 3
Freescale Semiconductor
55
Case Outline Dimensions
MC33596 Data Sheet, Rev. 3
56
Freescale Semiconductor
Case Outline Dimensions
MC33596 Data Sheet, Rev. 3
Freescale Semiconductor
57
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Document Number: MC33596
Rev. 3
06/2007
Information in this document is provided solely to enable system and software
implementers to use Freescale Semiconductor products. There are no express or
implied copyright licenses granted hereunder to design or fabricate any integrated
circuits or integrated circuits based on the information in this document.
Freescale Semiconductor reserves the right to make changes without further notice to
any products herein. Freescale Semiconductor makes no warranty, representation or
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