DIODES DMP2160U-7

DMP2160U
P-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
V(BR)DSS
Features and Benefits
RDS(ON) max
ID max
TA = 25°C
75mΩ @ VGS = -4.5V
-3.3A
140mΩ @ VGS = -1.8V
-2.4A
•
-20V
•
•
•
•
•
•
•
Description and Applications
This MOSFET has been designed to minimize the on-state resistance
(RDS(on)) and yet maintain superior switching performance, making it
ideal for high efficiency power management applications.
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•
•
•
Low On-Resistance
•
75 mΩ @ VGS = -4.5V
•
96 mΩ @ VGS = -2.5V
•
140 mΩ @ VGS = -1.8V
Very Low Gate Threshold Voltage VGS(th) ≤ 1V
Low Input Capacitance
Fast Switching Speed
Low Input/Output Leakage
Lead Free By Design/RoHS Compliant (Note 1)
"Green" Device (Note 2)
Qualified to AEC-Q 101 Standards for High Reliability
Mechanical Data
Battery Charging
Power Management Functions
DC-DC Converters
Portable Power Adaptors
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•
Case: SOT23
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals Connections: See Diagram Below
Terminals: Finish - Matte Tin annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208
Weight: 0.008 grams (approximate)
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•
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Drain
SOT23
D
Gate
Source
Top View
S
G
Top View
Internal Schematic
Ordering Information (Note 3)
Part Number
DMP2160U-7
Notes:
Case
SOT23
Packaging
3000/Tape & Reel
1. No purposefully added lead.
2. Diodes Inc.’s “Green” policy can be found on our website at http://www.diodes.com.
3. For packaging details, go to our website at http://www.diodes.com.
DMF
Date Code Key
Year
Code
Month
Code
2008
V
Jan
1
DMP2160U
Document number: DS31586 Rev. 6 - 2
2009
W
Feb
2
Mar
3
YM
Marking Information
DMF = Marking Code
YM = Date Code Marking
Y = Year (ex: V = 2008)
M = Month (ex: 9 = September)
2010
X
Apr
4
2011
Y
May
5
Jun
6
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2012
Z
Jul
7
2013
A
Aug
8
Sep
9
2014
B
Oct
O
2015
C
Nov
N
Dec
D
August 2011
© Diodes Incorporated
DMP2160U
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Symbol
VDSS
VGSS
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (Note 4) VGS = -4.5V
Units
V
V
IDM
Value
-20
±12
-3.3
-2.6
-13
Symbol
PD
RθJA
TJ, TSTG
Value
1.4
90
-55 to +150
Units
W
°C/W
°C
TA = 25°C
TA = 70°C
ID
Pulsed Drain Current
A
A
Thermal Characteristics
Characteristic
Total Power Dissipation (Note 4)
Thermal Resistance, Junction to Ambient
Operating and Storage Temperature Range
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic
OFF CHARACTERISTICS (Note 5)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current TJ = 25°C
Gate-Source Leakage
Symbol
Min
Typ
Max
Unit
BVDSS
IDSS
-20
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
-1.0
±100
±800
V
μA
IGSS
nA
ON CHARACTERISTICS (Note 5)
Gate Threshold Voltage
VGS(th)
-0.4
-0.6
-0.9
V
Static Drain-Source On-Resistance
RDS (ON)
⎯
60
73
92
75
96
140
mΩ
gFS
VSD
⎯
⎯
7
⎯
⎯
-1.0
S
V
Ciss
Coss
Crss
RG
Qg
Qgs
Qgd
tD(on)
tr
tD(off)
tf
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
627
64
53
44.9
6.5
0.9
1.5
12.5
10.3
46.5
22.2
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
pF
pF
pF
Ω
nC
nC
nC
ns
ns
ns
ns
Forward Transconductance
Diode Forward Voltage (Note 5)
DYNAMIC CHARACTERISTICS (Note 6)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Notes:
Test Condition
VGS = 0V, ID = -250μA
VDS = -16V, VGS = 0V
VGS = ±8V, VDS = 0V
VGS = ±12V, VDS = 0V
VDS = VGS, ID = -250μA
VGS = -4.5V, ID = -1.5A
VGS = -2.5V, ID = -1.2A
VGS = -1.8V, ID = -1.2A
VDS = -10V, ID = -1.5A
VGS = 0V, IS = -1.0A
VDS = -10V, VGS = 0V
f = 1.0MHz
VGS = 0V, VDS = 0V, f = 1.0MHz
VGS = -4.5V, VDS = -10V, ID = -3A
VDS = -10V, VGS = -4.5V,
RL = 10Ω, RG = 1.0Ω, ID = -1A
4. Device mounted on 1in2 FR-4 PCB with 2 oz. Copper. t ≤ 10 sec.
5. Short duration pulse test used to minimize self-heating effect.
6. Guaranteed by design. Not subject to product testing.
DMP2160U
Document number: DS31586 Rev. 6 - 2
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DMP2160U
10
10
VDS = -5V
VGS = 3.0V
VGS = 3.0V
8
-ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
8
VGS = 3.0V
VGS = 2.5V
VGS = 2.0V
6
4
VGS = 1.5V
2
6
4
TA = 150°C
2
TA = 125°C
TA = 85°C
TA = 25°C
0
0
1
2
3
4
VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 1 Typical Output Characteristics
0
5
TA = -55°C
0
0.5
1
1.5
2
2.5
-VGS, GATE SOURCE VOLTAGE (V)
3
Fig. 2 Typical Transfer Characteristics
1,200
1.6
1,000
1.4
VGS = -2.5V
ID = -2A
1.2
C, CAPACITANCE (pF)
RDS(ON), DRAIN-SOURCE
ON-RESISTANCE (NORMALIZED)
f = 1MHz
VGS = -4.5V
ID = -4.5A
1.0
0.8
800
600
Ciss
400
200
0.6
-50
Coss
Crss
0
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Fig. 3 On-Resistance Variation with Temperature
0
4
8
12
16
VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 4 Typical Capacitance
20
10
1
0.9
-IS, SOURCE CURRENT (A)
-VGS(TH), GATE THRESHOLD VOLTAGE (V)
VGS = 0V
0.8
0.7
ID = 1mA
0.6
0.5
ID = 250µA
0.4
8
6
4
T A = 25°C
2
0.3
0.2
-50
0
-25
0
25
50
75 100 125 150
TA, AMBIENT TEMPERATURE (°C)
Fig. 5 Gate Threshold Variation vs. Ambient Temperature
DMP2160U
Document number: DS31586 Rev. 6 - 2
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0
0.2 0.4 0.6 0.8
1
1.2
1.4
-VSD, SOURCE-DRAIN VOLTAGE (V)
Fig. 6 Diode Forward Voltage vs. Current
1.6
August 2011
© Diodes Incorporated
DMP2160U
r(t), TRANSIENT THERMAL RESISTANCE
1
D = 0.7
D = 0.5
D = 0.3
0.1
D = 0.9
D = 0.1
D = 0.05
RθJA(t) = r(t) * RθJA
RθJA = 338°C/W
D = 0.02
0.01
P(pk)
D = 0.01
t1
t2
TJ - T A = P * RθJA(t)
Duty Cycle, D = t1/t2
D = 0.005
D = Single Pulse
0.001
0.00001
0.0001
0.001
0.01
0.1
1
10
t1, PULSE DURATION TIME (s)
100
1,000
10,000
Fig. 7 Transient Thermal Response
Package Outline Dimensions
SOT23
Dim
Min
Max
Typ
A
0.37
0.51
0.40
B
1.20
1.40
1.30
C
2.30
2.50
2.40
D
0.89
1.03 0.915
F
0.45
0.60 0.535
G
1.78
2.05
1.83
H
2.80
3.00
2.90
J
0.013 0.10
0.05
K
0.903 1.10
1.00
K1
0.400
L
0.45
0.61
0.55
M
0.085 0.18
0.11
0°
8°
α
All Dimensions in mm
A
B C
H
K
M
K1
D
F
J
L
G
Suggested Pad Layout
Y
Z
C
X
DMP2160U
Document number: DS31586 Rev. 6 - 2
Dimensions Value (in mm)
Z
2.9
X
0.8
Y
0.9
C
2.0
E
1.35
E
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DMP2160U
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INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
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without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
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written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
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the
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acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
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information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2011, Diodes Incorporated
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DMP2160U
Document number: DS31586 Rev. 6 - 2
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