DIODES DMN32D2LFB4

DMN32D2LFB4
N-CHANNEL ENHANCEMENT MODE FIELD EFFECT TRANSISTOR
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Features
Mechanical Data
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N-Channel MOSFET
Low On-Resistance
Very Low Gate Threshold Voltage, 1.2V max
Low Input Capacitance
Fast Switching Speed
Low Input/Output Leakage
Ultra-Small Surface Mount Package
ESD Protected Gate
Lead Free By Design/RoHS Compliant (Note 2)
"Green" Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
Case: DFN1006H4-3
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Terminal Connections: See Diagram
Terminals: Finish – NiPdAu over Copper leadframe. Solderable
per MIL-STD-202, Method 208
Marking Information: See Page 3
Ordering Information: See Page 3
Weight: 0.001 grams (approximate)
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Drain
DFN1006H4-3
Body
Diode
S
Gate
D
Gate
Protection
Diode
BOTTOM VIEW
ESD PROTECTED
Maximum Ratings
Equivalent Circuit
TOP VIEW
@TA = 25°C unless otherwise specified
Characteristic
Symbol
VDSS
VGSS
ID
Drain Source Voltage
Gate-Source Voltage
Drain Current (Note 1)
Thermal Characteristics
PD
RθJA
TJ, TSTG
Operating and Storage Temperature Range
Electrical Characteristics
350
357
mW
°C/W
-55 to +150
°C
Symbol
Min
Typ
Max
Unit
BVDSS
IDSS
30
⎯
⎯
⎯
IGSS
⎯
⎯
⎯
1
±10
±500
V
μA
μA
nA
VGS = 0V, ID = 10μA
VDS = 30V, VGS = 0V
VGS = ±10V, VDS = 0V
VGS = ±5V, VDS = 0V
VGS(th)
0.6
V
2.2
1.5
1.2
Ω
|Yfs|
VSD
⎯
⎯
⎯
⎯
⎯
⎯
1.2
⎯
⎯
⎯
100
0.5
⎯
1.4
mS
V
VDS = VGS, ID = 250μA
VGS = 1.8V, ID = 20mA
VGS = 2.5V, ID = 20mA
VGS = 4.0V, ID = 100mA
VDS =10V, ID = 0.1A
VGS = 0V, IS = 115mA
Ciss
Coss
Crss
⎯
⎯
⎯
39
10
3.6
⎯
⎯
⎯
pF
pF
pF
Turn-on Time
ton
⎯
11
⎯
nS
Turn-off Time
toff
⎯
51
⎯
nS
@ TC = 25°C
Gate-Body Leakage
ON CHARACTERISTICS (Note 4)
Gate Threshold Voltage
Static Drain-Source On-Resistance
RDS (ON)
Forward Transconductance
Source-Drain Diode Forward Voltage
DYNAMIC CHARACTERISTICS
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Switching Time
Unit
V
V
mA
@TA = 25°C unless otherwise specified
Characteristic
OFF CHARACTERISTICS (Note 4)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Value
30
±10
300
@TA = 25°C unless otherwise specified
Total Power Dissipation (Note 1) @TA = 25°C
Thermal Resistance, Junction to Ambient (Note 1)
Notes:
G
Source
Test Condition
VDS = 3V, VGS = 0V
f = 1.0MHz
VDD = 5V, ID = 10 mA,
VGS = 0-5V
1. Device mounted on FR-4 PCB, pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can be found on our website at
http://www.diodes.com/datasheets/ap02001.pdf.
2. No purposefully added lead.
3. Diodes Inc.’s “Green” policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
4. Short duration pulse test used to minimize self-heating effect.
DMN32D2LFB4
Document number: DS31124 Rev. 5 - 2
1 of 5
www.diodes.com
June 2009
© Diodes Incorporated
DMN32D2LFB4
DMN32D2LFB4
Document number: DS31124 Rev. 5 - 2
2 of 5
www.diodes.com
June 2009
© Diodes Incorporated
DMN32D2LFB4
RDS(ON), STATIC DRAIN-SOURCE
ON-RESISTANCE (NORMALIZED)
1.8
1.6
VGS = 4V
ID = 100mA
1.4
VGS = 2.5V
ID = 20mA
VGS = 1.8V
ID = 20mA
1.2
1
0.8
0.6
-75
-50 -25
0
25 50 75 100 125 150
TA, AMBIENT TEMPERATURE (C°)
Fig. 7 Normalized Static Drain-Source On-Resistance
vs. Ambient Temperature
50
f = 1 MHz
40
CT, CAPACITANCE (pF)
Ciss
30
20
10
Coss
Crss
0
0
Ordering Information
20
(Note 5)
Part Number
DMN32D2LFB4-7
Notes:
5
10
15
VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 10 Typical Capacitance
Case
DFN1006H4-3
Packaging
3000/Tape & Reel
5. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
Marking Information
DV
DMN32D2LFB4
Document number: DS31124 Rev. 5 - 2
DV = Product Type Marking Code
3 of 5
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June 2009
© Diodes Incorporated
DMN32D2LFB4
Package Outline Dimensions
A
A1
D
b1
E
e
b2
L2
L3
DFN1006H4-3
Dim Min
Max
Typ
A
0.40
⎯
⎯
A1
0
0.05 0.02
b1
0.10 0.20 0.15
b2
0.45 0.55 0.50
D
0.95 1.075 1.00
E
0.55 0.675 0.60
e
0.35
⎯
⎯
L1
0.20 0.30 0.25
L2
0.20 0.30 0.25
L3
0.40
⎯
⎯
All Dimensions in mm
L1
Suggested Pad Layout
C
Dimensions
Z
G1
G2
X
X1
Y
C
X1
X
G2
G1
Y
Value (in mm)
1.1
0.3
0.2
0.7
0.25
0.4
0.7
Z
DMN32D2LFB4
Document number: DS31124 Rev. 5 - 2
4 of 5
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June 2009
© Diodes Incorporated
DMN32D2LFB4
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B.
A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2009, Diodes Incorporated
www.diodes.com
DMN32D2LFB4
Document number: DS31124 Rev. 5 - 2
5 of 5
www.diodes.com
June 2009
© Diodes Incorporated