Elpida HB52R1289E22-B6B 1 gb registered sdram dimm 1 gb registered sdram dimm (36 pcs of 64 m ã 4 components) pc100 sdram Datasheet

HB52R1289E22-A6B/B6B
1 GB Registered SDRAM DIMM
128-Mword × 72-bit, 100 MHz Memory Bus, 2-Bank Module
(36 pcs of 64 M × 4 Components)
PC100 SDRAM
E0017H20 (Ver. 2.0)
Aug. 20, 2001 (K)
Description
The HB52R1289E22 belongs to 8-byte DIMM (Dual In-line Memory Module) family, and has been
developed as an optimized main memory solution for 8-byte processor applications. The HB52R1289E22 is a
64M × 72 × 2-bank Synchronous Dynamic RAM Module, mounted 36 pieces of 256-Mbit SDRAM
(HM5225405BTB) sealed in TCP package, 1 piece of PLL clock driver, 3 pieces register driver and 1 piece of
serial EEPROM (2-kbit) for Presence Detect (PD). An outline of the HB52R1289E22 is 168-pin socket type
package (dual lead out). Therefore, the HB52R1289E22 makes high density mounting possible without
surface mount technology. The HB52R1289E22 provides common data inputs and outputs. Decoupling
capacitors are mounted beside TCP on the module board.
Note: Do not push the cover or drop the modules in order to protect from mechanical defects, which would
be electrical defects.
Features
• Fully compatible with : JEDEC standard outline 8-byte DIMM
: Intel PCB Reference design (Rev. 1.2)
• 168-pin socket type package (dual lead out)
 Outline: 133.37 mm (length) × 38.10 mm (Height) × 4.80 mm (Thickness)
 Lead pitch: 1.27 mm
• 3.3 V power supply
• Clock frequency: 100 MHz (max)
• LVTTL interface
• Data bus width: × 72 ECC
• Single pulsed RAS
• 4 Banks can operates simultaneously and independently
• Burst read/write operation and burst read/single write operation capability
• Programmable burst length: 1/2/4/8
Elpida Memory, Inc. is a joint venture DRAM company of NEC Corporation and Hitachi, Ltd.
HB52R1289E22-A6B/B6B
• 2 variations of burst sequence
 Sequential
 Interleave
• Programmable CE latency : 3/4 (HB52R1289E22-A6B)
: 4 (HB52R1289E22-B6B)
• Byte control by DQMB
• Refresh cycles: 8192 refresh cycles/64 ms
• 2 variations of refresh
 Auto refresh
 Self refresh
Ordering Information
Type No.
Frequency
CE latency
Package
HB52R1289E22-A6B
100 MHz
3/4
168-pin dual lead out socket type Gold
HB52R1289E22-B6B
100 MHz
4
Contact pad
Pin Arrangement
1 pin 10 pin 11 pin
40 pin 41 pin
85 pin 94 pin 95 pin 124 pin 125 pin
Data Sheet E0017H20
2
84 pin
168 pin
HB52R1289E22-A6B/B6B
Pin No.
Pin name
Pin No.
Pin name
Pin No.
Pin name
Pin No.
Pin name
1
VSS
43
VSS
85
VSS
127
VSS
2
DQ0
44
NC
86
DQ32
128
CKE0
3
DQ1
45
S2
87
DQ33
129
S3
4
DQ2
46
DQMB2
88
DQ34
130
DQMB6
5
DQ3
47
DQMB3
89
DQ35
131
DQMB7
6
VCC
48
NC
90
VCC
132
NC
7
DQ4
49
VCC
91
DQ36
133
VCC
8
DQ5
50
NC
92
DQ37
134
NC
9
DQ6
51
NC
93
DQ38
135
NC
10
DQ7
52
CB2
94
DQ39
136
CB6
11
DQ8
53
CB3
95
DQ40
137
CB7
12
VSS
54
VSS
96
VSS
138
VSS
13
DQ9
55
DQ16
97
DQ41
139
DQ48
14
DQ10
56
DQ17
98
DQ42
140
DQ49
15
DQ11
57
DQ18
99
DQ43
141
DQ50
16
DQ12
58
DQ19
100
DQ44
142
DQ51
17
DQ13
59
VCC
101
DQ45
143
VCC
18
VCC
60
DQ20
102
VCC
144
DQ52
19
DQ14
61
NC
103
DQ46
145
NC
20
DQ15
62
NC
104
DQ47
146
NC
21
CB0
63
NC
105
CB4
147
REGE
22
CB1
64
VSS
106
CB5
148
VSS
23
VSS
65
DQ21
107
VSS
149
DQ53
24
NC
66
DQ22
108
NC
150
DQ54
25
NC
67
DQ23
109
NC
151
DQ55
26
VCC
68
VSS
110
VCC
152
VSS
27
W
69
DQ24
111
CE
153
DQ56
28
DQMB0
70
DQ25
112
DQMB4
154
DQ57
29
DQMB1
71
DQ26
113
DQMB5
155
DQ58
30
S0
72
DQ27
114
S1
156
DQ59
31
NC
73
VCC
115
RE
157
VCC
32
VSS
74
DQ28
116
VSS
158
DQ60
33
A0
75
DQ29
117
A1
159
DQ61
34
A2
76
DQ30
118
A3
160
DQ62
35
A4
77
DQ31
119
A5
161
DQ63
Data Sheet E0017H20
3
HB52R1289E22-A6B/B6B
Pin No.
Pin name
Pin No.
Pin name
Pin No.
Pin name
Pin No.
Pin name
36
A6
78
VSS
120
A7
162
VSS
37
A8
79
CK2
121
A9
163
CK3
38
A10 (AP)
80
NC
122
BA0
164
NC
39
BA1
81
WP
123
A11
165
SA0
40
VCC
82
SDA
124
VCC
166
SA1
41
VCC
83
SCL
125
CK1
167
SA2
42
CK0
84
VCC
126
A12
168
VCC
Pin Description
Pin name
Function
A0 to A12
Address input
Row address
A0 to A12
Column address
A0 to A9, A11
BA0/BA1
Bank select address
DQ0 to DQ63
Data input/output
CB0 to CB7
Check bit (Data input/output)
S0 to S3
Chip select input
RE
Row enable (RAS) input
CE
Column enable (CAS) input
W
Write enable input
DQMB0 to DQMB7
Byte data mask
CK0 to CK3
Clock input
CKE0
Clock enable input
WP
BA0/BA1
Write protect for serial PD
1
REGE*
Register/Buffer enable
SDA
Data input/output for serial PD
SCL
Clock input for serial PD
SA0 to SA2
Serial address input
VCC
Primary positive power supply
VSS
Ground
NC
No connection
Note:
1. REGE ≥ V IH: Register mode.
REGE ≤ V IL: Buffer mode.
Data Sheet E0017H20
4
HB52R1289E22-A6B/B6B
Serial PD Matrix*1
Byte No. Function described
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Hex value Comments
0
Number of bytes used by
module manufacturer
1
0
0
0
0
0
0
0
80
128
1
Total SPD memory size
0
0
0
0
1
0
0
0
08
256 byte
2
Memory type
0
0
0
0
0
1
0
0
04
SDRAM
3
Number of row addresses bits
0
0
0
0
1
1
0
1
0D
13
4
Number of column addresses
bits
0
0
0
0
1
0
1
1
0B
11
5
Number of banks
0
0
0
0
0
0
1
0
02
2
6
Module data width
0
1
0
0
1
0
0
0
48
72 bit
7
Module data width (continued)
0
0
0
0
0
0
0
0
00
0 (+)
8
Module interface signal levels
0
0
0
0
0
0
0
1
01
LVTTL
9
SDRAM cycle time
(highest CE latency)
10 ns
1
0
1
0
0
0
0
0
A0
CL = 3
10
SDRAM access from Clock
(highest CE latency)
6 ns
0
1
1
0
0
0
0
0
60
*3
11
Module configuration type
0
0
0
0
0
0
1
0
02
ECC
12
Refresh rate/type
1
0
0
0
0
0
1
0
82
Normal
(7.8125 µs)
Self refresh
13
SDRAM width
0
0
0
0
0
1
0
0
04
64M × 4
14
Error checking SDRAM width
0
0
0
0
0
1
0
0
04
×4
15
SDRAM device attributes:
0
minimum clock delay for back-toback random column addresses
0
0
0
0
0
0
1
01
1 CLK
16
SDRAM device attributes:
Burst lengths supported
0
0
0
0
1
1
1
1
0F
1, 2, 4, 8
17
SDRAM device attributes:
number of banks on SDRAM
device
0
0
0
0
0
1
0
0
04
4
18
SDRAM device attributes:
CE latency
(-A6B)
0
0
0
0
0
1
1
0
06
2/3
0
0
0
0
0
1
0
0
04
3
0
0
0
0
0
0
0
1
01
0
(-B6B)
19
SDRAM device attributes:
S latency
Data Sheet E0017H20
5
HB52R1289E22-A6B/B6B
Byte No. Function described
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Hex value Comments
20
SDRAM device attributes:
W latency
0
0
0
0
0
0
0
1
01
0
21
SDRAM device attributes
0
0
0
1
1
1
1
1
1F
Registered
22
SDRAM device attributes:
General
0
0
0
0
1
1
1
0
0E
VCC ± 10%
23
SDRAM cycle time
(2nd highest CE latency)
(-A6B) 10 ns
1
0
1
0
0
0
0
0
A0
CL = 2
0
0
0
0
0
0
0
0
00
0
1
1
0
0
0
0
0
60
0
0
0
0
0
0
0
0
00
(-B6B) Undefined
24
SDRAM access from Clock
(2nd highest CE latency)
(-A6B) 6 ns
(-B6B) Undefined
25
SDRAM cycle time
(3rd highest CE latency)
Undefined
0
0
0
0
0
0
0
0
00
26
SDRAM access from Clock
(3rd highest CE latency)
Undefined
0
0
0
0
0
0
0
0
00
27
Minimum row precharge time
0
0
0
1
0
1
0
0
14
20 ns
28
Row active to row active min
0
0
0
1
0
1
0
0
14
20 ns
29
RE to CE delay min
0
0
0
1
0
1
0
0
14
20 ns
30
Minimum RE pulse width
0
0
1
1
0
0
1
0
32
50 ns
31
Density of each bank on module 1
0
0
0
0
0
0
0
80
2 bank
512M byte
32
Address and command signal
input setup time
0
0
1
0
0
0
0
0
20
2 ns* 3
33
Address and command signal
input hold time
0
0
0
1
0
0
0
0
10
1 ns* 3
34
Data signal input setup time
0
0
1
0
0
0
0
0
20
2 ns* 3
35
Data signal input hold time
0
0
0
1
0
0
0
0
10
1 ns* 3
36 to 61 Superset information
0
0
0
0
0
0
0
0
00
Future use
62
SPD data revision code
0
0
0
1
0
0
1
0
12
Rev. 1.2A
63
Checksum for bytes 0 to 62
(-A6B)
0
0
1
0
0
1
0
0
24
36
0
0
1
0
0
0
1
0
22
34
Manufacturer’s JEDEC ID code
0
0
0
0
0
1
1
1
07
HITACHI
65 to 71 Manufacturer’s JEDEC ID code
0
0
0
0
0
0
0
0
00
72
×
×
×
×
×
×
×
×
××
(-B6B)
64
Manufacturing location
Data Sheet E0017H20
6
* 4 (ASCII8bit code)
HB52R1289E22-A6B/B6B
Byte No. Function described
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Hex value Comments
73
Manufacturer’s part number
0
1
0
0
1
0
0
0
48
H
74
Manufacturer’s part number
0
1
0
0
0
0
1
0
42
B
75
Manufacturer’s part number
0
0
1
1
0
1
0
1
35
5
76
Manufacturer’s part number
0
0
1
1
0
0
1
0
32
2
77
Manufacturer’s part number
0
1
0
1
0
0
1
0
52
R
78
Manufacturer’s part number
0
0
1
1
0
0
0
1
31
1
79
Manufacturer’s part
0
0
1
1
0
0
1
0
32
2
80
Manufacturer’s part number
0
0
1
1
1
0
0
0
38
8
81
Manufacturer’s part number
0
0
1
1
1
0
0
1
39
9
82
Manufacturer’s part number
0
1
0
0
0
1
0
1
45
E
83
Manufacturer’s part number
0
0
1
1
0
0
1
0
32
2
84
Manufacturer’s part number
0
0
1
1
0
0
1
0
32
2
85
Manufacture’s part number
0
0
1
0
1
1
0
1
2D
—
86
Manufacturer’s part number
(-A6B)
0
1
0
0
0
0
0
1
41
A
0
1
0
0
0
0
1
0
42
B
(-B6B)
87
Manufacturer’s part number
0
0
1
1
0
1
1
0
36
6
88
Manufacturer’s part number
0
1
0
0
0
0
1
0
42
B
89
Manufacturer’s part number
0
0
1
0
0
0
0
0
20
(Space)
90
Manufacturer’s part number
0
0
1
0
0
0
0
0
20
(Space)
91
Revision code
0
0
1
1
0
0
0
0
30
Initial
92
Revision code
0
0
1
0
0
0
0
0
20
(Space)
93
Manufacturing date
×
×
×
×
×
×
×
×
××
Year code
(BCD)*5
94
Manufacturing date
×
×
×
×
×
×
×
×
××
Week code
(BCD) *5
95 to 98 Assembly serial number
*7
99 to 125 Manufacturer specific data
—
—
—
—
—
—
—
—
—
*6
126
Intel specification frequency
0
1
1
0
0
1
0
0
64
100 MHz
127
Intel specification CE#
latency support
(-A6B)
1
0
0
0
0
1
1
1
87
CL = 2/3
1
0
0
0
0
1
0
1
85
CL = 3
(-B6B)
Notes: 1. All serial PD data are not protected. 0: Serial data, “driven Low”, 1: Serial data, “driven High”
These SPD are based on Intel specification (Rev.1.2A).
2. Regarding byte32 to 35, based on JEDEC Committee Ballot JC42.5-97-119.
3. Byte10, 23, 24, 32 through 35 are component spec.
4. Byte72 is manufacturing location code. (ex: In case of Japan, byte72 is 4AH. 4AH shows “J” on
ASCII code.)
Data Sheet E0017H20
7
HB52R1289E22-A6B/B6B
5. Regarding byte93 and 94, based on JEDEC Committee Ballot JC42.5-97-135. BCD is “Binary
Coded Decimal”.
6. All bits of 99 through 125 are not defined (“1” or “0”).
7. Bytes 95 through 98 are assembly serial number.
Data Sheet E0017H20
8
HB52R1289E22-A6B/B6B
Block Diagram
RS0
RS1
RDQMB0
RDQMB4
DQMB CS
4
10 Ω
DQ0 to DQ3
I/O0
to I/O3
D0
DQMB CS
4
10 Ω
DQ4 to DQ7
I/O0
to I/O3
D1
DQMB CS
I/O0
to I/O3
4
10 Ω
4
10 Ω
4
10 Ω
4
10 Ω
4
10 Ω
4
10 Ω
4
10 Ω
4
10 Ω
I/O0
to I/O3
D9
4
10 Ω
DQ8 to DQ11
I/O0
to I/O3
D2
DQMB CS
4
10 Ω
DQ12 to DQ15
I/O0
to I/O3
D3
DQMB CS
DQ36 to DQ39
I/O0
to I/O3
D27
DQMB CS
DQMB CS
D19
D10
I/O0
to I/O3
4
10 Ω
I/O0
to I/O3
D4
DQMB CS
DQMB CS
D20
I/O0
to I/O3
DQ40 to DQ43
D28
D21
I/O0
to I/O3
DQ44 to DQ47
I/O0
to I/O3
I/O0
to I/O3
D22
CB4 to CB7
I/O0
to I/O3
D29
DQMB CS
D12
I/O0
to I/O3
DQMB CS
DQMB CS
I/O0
to I/O3
I/O0
to I/O3
DQMB CS
D11
DQMB CS
DQMB CS
RS2
RS3
RDQMB2
D30
DQMB CS
D13
I/O0
to I/O3
D31
RDQMB6
DQMB CS
4
10 Ω
DQ16 to DQ19
I/O0
to I/O3
D5
DQMB CS
4
10 Ω
I/O0
to I/O3
D6
DQMB CS
I/O0
to I/O3
DQ48 to DQ51
I/O0
to I/O3
D14
I/O0
to I/O3
DQMB CS
DQMB CS
I/O0
to I/O3
DQMB CS
DQMB CS
D23
D24
DQ52 to DQ55
RDQMB3
I/O0
to I/O3
D32
DQMB CS
D15
I/O0
to I/O3
D33
RDQMB7
DQMB CS
4
10 Ω
DQ24 to DQ27
I/O0
to I/O3
D7
DQMB CS
4
10 Ω
DQ28 to DQ31
I/O0
to I/O3
D8
DQMB CS
I/O0
to I/O3
DQ56 to DQ59
I/O0
to I/O3
D16
R
E
G
I
S
T
E
R
10k
D26
DQ60 to DQ63
RS0, RS1, RS2, RS3
RDQMB0 to RDQMB7
RBA0 to RBA1 -> BA0 to BA1: SDRAMs D0 to D35 CK1
RA0 to RA12 -> A0 to A12: SDRAMs D0 to D35
to CK3
RRAS -> RAS: SDRAMs D0 to D35
RCAS -> CAS: SDRAMs D0 to D35
VCC
RCKE0 -> CKE: SDRAMs D0 to D35
0.0022 µF × 26 pcs
RW -> WE: SDRAMs D0 to D35
VSS
Serial PD
SCL
SCL
SDA
U0
A0
A1
I/O0
to I/O3
DQMB CS
DQMB CS
I/O0
to I/O3
DQMB CS
DQMB CS
D25
SDA
WP
A2
D34
DQMB CS
D17
I/O0
to I/O3
R1
CK0
S0, S1, S2, S3
DQMB0 to DQMB7
BA0 to BA1
A0 to A12
RE
CE
CKE0
W
VCC
REGE
PLL CK
I/O0
to I/O3
RDQMB5
DQMB CS
DQ20 to DQ23
10 Ω
DQMB CS
RDQMB1
CB0 to CB3
4
DQ32 to DQ35
I/O0
to I/O3
DQMB CS
DQMB CS
D18
I/O0
to I/O3
D35
PLL
12 pF
CK : SDRAMs
(D0 to D35)
Register
R2 to R4
VSS
12 pF
VCC (D0 to D35, U0)
0.22 µF × 19 pcs
VSS (D0 to D35, U0)
* D0 to D35: HM5225405
PLL: 2510
Register: 162835
U0: 2-kbit EEPROM
47 kΩ
SA0 SA1 SA2 VSS
Notes:
1. The SDA pull-up resistor is required due to the open-drain/open-collector output.
2. The SCL pull-up resistor is recommended because of the normal SCL line inacitve "high" state.
Data Sheet E0017H20
9
HB52R1289E22-A6B/B6B
Absolute Maximum Ratings
Parameter
Symbol
Value
Unit
Note
Voltage on any pin relative to V SS
VT
–0.5 to VCC + 0.5
(≤ 4.6 (max))
V
1
Supply voltage relative to VSS
VCC
–0.5 to +4.6
V
1
Short circuit output current
Iout
50
mA
Power dissipation
PT
18.0
W
Operating temperature
Topr
0 to +55
°C
Storage temperature
Tstg
–50 to +100
°C
Note:
1. Respect to V SS
DC Operating Conditions (Ta = 0 to +55°C)
Parameter
Symbol
Min
Max
Unit
Notes
Supply voltage
VCC
3.0
3.6
V
1, 2
VSS
0
0
V
3
Input high voltage
VIH
2.0
VCC
V
1, 4
Input low voltage
VIL
0
0.8
V
1, 5
Ambient illuminance
—
—
100
lx
Notes: 1.
2.
3.
4.
5.
All voltage referred to VSS
The supply voltage with all VCC and V CCQ pins must be on the same level.
The supply voltage with all VSS and VSS Q pins must be on the same level.
VIH (max) = VCC + 2.0 V for pulse width ≤ 3 ns at VCC.
VIL (min) = VSS – 2.0 V for pulse width ≤ 3 ns at VSS .
Data Sheet E0017H20
10
HB52R1289E22-A6B/B6B
DC Characteristics (Ta = 0 to 55°C, VCC = 3.3 V ± 0.3 V, VSS = 0 V)
HB52R1289E22
-A6B
-B6B
Parameter
Symbol
Min
Max
Min
Max
Unit
Test conditions
Notes
Operating current
(CE latency = 3)
—
2945
—
—
mA
Burst length = 1
t RC = min
1, 2, 3
I CC1
(CE latency = 4)
I CC1
—
2945
—
2945
mA
Standby current in power I CC2P
down
—
803
—
803
mA
CKE = VIL, t CK = 12
ns
6
Standby current in power I CC2PS
down (input signal stable)
—
767
—
767
mA
CKE = VIL, t CK = ∞
7
Standby current in non
power down
I CC2N
—
1415
—
1415
mA
CKE, S = VIH,
t CK = 12 ns
4
Active standby current in
power down
I CC3P
—
839
—
839
mA
CKE = VIL, t CK = 12
ns
1, 2, 6
Active standby current in
non power down
I CC3N
—
1775
—
1775
mA
CKE, S = VIH,
t CK = 12 ns
1, 2, 4
t CK = min, BL = 4
1, 2, 5
I CC4
—
2945
—
—
mA
(CE latency = 4)
I CC4
—
2945
—
2945
mA
Refresh current
(CE latency = 3)
t RC = min
3
I CC5
—
5195
—
—
mA
(CE latency = 4)
I CC5
—
5195
—
5195
mA
Self refresh current
I CC6
—
803
—
803
mA
VIH ≥ VCC – 0.2 V
VIL ≤ 0.2 V
8
Input leakage current
I LI
–10
10
–10
10
µA
0 ≤ Vin ≤ VCC
Output leakage current
I LO
–10
10
–10
10
µA
0 ≤ Vout ≤ VCC
DQ = disable
Output high voltage
VOH
2.4
—
2.4
—
V
I OH = –4 mA
Output low voltage
VOL
—
0.4
—
0.4
V
I OL = 4 mA
Burst operating current
(CE latency = 3)
Notes: 1. I CC depends on output load condition when the device is selected. ICC (max) is specified at the
output open condition.
2. One bank operation.
3. Input signals are changed once per one clock.
4. Input signals are changed once per two clocks.
5. Input signals are changed once per four clocks.
6. After power down mode, CK operating current.
7. After power down mode, no CK operating current.
8. After self refresh mode set, self refresh current.
Data Sheet E0017H20
11
HB52R1289E22-A6B/B6B
Capacitance (Ta = 25°C, VCC = 3.3 V ± 0.3 V)
Parameter
Symbol
Max
Unit
Notes
Input capacitance (Address)
CI1
25
pF
1, 2, 4
Input capacitance (RE, CE, W)
CI2
25
pF
1, 2, 4
Input capacitance (CKE)
CI3
45
pF
1, 2, 4
Input capacitance (S)
CI4
20
pF
1, 2, 4
Input capacitance (CK)
CI5
45
pF
1, 2, 4
Input capacitance (DQMB)
CI6
20
pF
1, 2, 4
Input/Output capacitance (DQ)
CI/O1
25
pF
1, 2, 3, 4
Notes: 1.
2.
3.
4.
Capacitance measured with Boonton Meter or effective capacitance measuring method.
Measurement condition: f = 1 MHz, 1.4 V bias, 200 mV swing.
DQMB = VIH to disable Data-out.
This parameter is sampled and not 100% tested.
AC Characteristics (Ta = 0 to 55°C, VCC = 3.3 V ± 0.3 V, VSS = 0 V)
HB52R1289E22
-A6B/B6B
Parameter
Symbol
PC100
Symbol
Min
Max
Unit
Notes
System clock cycle time
(CE latency = 3)
t CK
Tclk
10
—
ns
1
(CE latency = 4)
t CK
Tclk
10
—
ns
CK high pulse width
t CKH
Tch
4
—
ns
1
CK low pulse width
t CKL
Tcl
4
—
ns
1
Access time from CK
(CE latency = 3)
t AC
Tac
—
7.5
ns
1, 2
(CE latency = 4)
t AC
Tac
—
7.5
ns
Data-out hold time
t OH
Toh
2.1
—
ns
1, 2
CK to Data-out low impedance
t LZ
1.1
—
ns
1, 2, 3
CK to Data-out high impedance
t HZ
—
7.5
ns
1, 4
Data-in setup time
t DS
Tsi
2.9
—
ns
1
Data in hold time
t DH
Thi
3.4
—
ns
1
Address setup time
t AS
Tsi
2.6
—
ns
1
Address hold time
t AH
Thi
3.0
—
ns
1, 5
CKE setup time
t CES
Tsi
2.6
—
ns
1, 5
CKE setup time for power down exit
t CESP
Tpde
2.6
—
ns
1
Data Sheet E0017H20
12
HB52R1289E22-A6B/B6B
AC Characteristics (Ta = 0 to 55°C, VCC = 3.3 V ± 0.3 V, VSS = 0 V) (cont)
HB52R1289E22
-A6B/B6B
Parameter
Symbol
PC100
Symbol
Min
Max
Unit
Notes
CKE hold time
t CEH
Thi
3.0
—
ns
1
Command setup time
t CS
Tsi
2.6
—
ns
1
Command hold time
t CH
Thi
3.0
—
ns
1
Ref/Active to Ref/Active command period t RC
Trc
70
—
ns
1
Active to precharge command period
t RAS
Tras
50
120000
ns
1
Active command to column command
(same bank)
t RCD
Trcd
20
—
ns
1
Precharge to active command period
t RP
Trp
20
—
ns
1
Write recovery or data-in to precharge
lead time
t DPL
Tdpl
20
—
ns
1
Active (a) to Active (b) command period
t RRD
Trrd
20
—
ns
1
Transition time (rise to fall)
tT
1
5
ns
Refresh period
t REF
—
64
ms
Notes: 1.
2.
3.
4.
5.
AC measurement assumes t T = 1 ns. Reference level for timing of input signals is 1.5 V.
Access time is measured at 1.5 V. Load condition is C L = 50 pF.
t LZ (min) defines the time at which the outputs achieves the low impedance state.
t HZ (max) defines the time at which the outputs achieves the high impedance state.
t CES defines CKE setup time to CK rising edge except power down exit command.
Test Conditions
• Input and output timing reference levels: 1.5 V
• Input waveform and output load: See following figures
• Ambient illuminance: Under 100 lx
2.4 V
input
0.4 V
DQ
2.0 V
0.8 V
CL
t
T
tT
Data Sheet E0017H20
13
HB52R1289E22-A6B/B6B
Relationship Between Frequency and Minimum Latency
Parameter
HB52R1289E22
Frequency (MHz)
-A6B/B6B
tCK (ns)
PC100
Symbol Symbol 10
Notes
Active command to column command (same bank)
I RCD
2
1
Active command to active command (same bank)
I RC
7
= [IRAS + IRP]
1
Active command to precharge command (same bank)
I RAS
5
1
Precharge command to active command (same bank)
I RP
2
1
Write recovery or data-in to precharge command
(same bank)
I DPL
2
1
Active command to active command (different bank)
I RRD
2
1
Self refresh exit time
I SREX
Tsrx
2
2
Last data in to active command
(Auto precharge, same bank)
I APW
Tdal
4
= [IDPL + IRP]
Self refresh exit to command input
I SEC
7
= [IRC]
3
Precharge command to high impedance
(CE latency = 3)
I HZP
Troh
3
I HZP
Troh
4
(CE latency = 4)
Tdpl
Last data out to active command (auto precharge)
(same bank)
I APR
0
Last data out to precharge (early precharge)
(CE latency = 3)
I EP
–2
I EP
–3
(CE latency = 4)
Column command to column command
I CCD
Tccd
1
Write command to data in latency
I WCD
Tdwd
1
DQMB to data in
I DID
Tdqm
1
DQMB to data out
I DOD
Tdqz
3
CKE to CK disable
I CLE
Tcke
2
Register set to active command
I RSA
Tmrd
1
S to command disable
I CDD
0
Power down exit to command input
I PEC
1
Burst stop to output valid data hold
(CE latency = 3)
I BSR
2
I BSR
3
(CE latency = 4)
Data Sheet E0017H20
14
HB52R1289E22-A6B/B6B
Parameter
HB52R1289E22
Frequency (MHz)
-A6B/B6B
tCK (ns)
Burst stop to output high impedance
(CE latency = 3)
(CE latency = 4)
Burst stop to write data ignore
PC100
Symbol Symbol 10
I BSH
3
I BSH
4
I BSW
1
Notes
Notes: 1. I RCD to IRRD are recommended value.
2. Be valid [DESL] or [NOP] at next command of self refresh exit.
3. Except [DEDL] and [NOP]
Data Sheet E0017H20
15
HB52R1289E22-A6B/B6B
Pin Functions
CK0 to CK3 (input pin): CK is the master clock input to this pin. The other input signals are referred at CK
rising edge.
S0 to S3 (input pin): When S is Low, the command input cycle becomes valid. When S is High, all inputs
are ignored. However, internal operations (bank active, burst operations, etc.) are held.
RE, CE and W (input pins): Although these pin names are the same as those of conventional DRAMs, they
function in a different way. These pins define operation commands (read, write, etc.) depending on the
combination of their voltage levels. For details, refer to the command operation section.
A0 to A12 (input pins): Row address (AX0 to AX12) is determined by A0 to A12 level at the bank active
command cycle CK rising edge. Column address (AY0 to AY9, AY11) is determined by A0 to A9, A11 level
at the read or write command cycle CK rising edge. And this column address becomes burst access start
address. A10 defines the precharge mode. When A10 = High at the precharge command cycle, all banks are
precharged. But when A10 = Low at the precharge command cycle, only the bank that is selected by
BA0/BA1 (BA) is precharged.
BA0/BA1 (input pin): BA0/BA1 are bank select signal (BA). The memory array is divided into bank 0,
bank 1, bank 2 and bank 3. If BA0 is Low and BA1 is Low, bank 0 is selected. If BA0 is High and BA1 is
Low, bank 1 is selected. If BA0 is Low and BA1 is High, bank 2 is selected. If BA0 is High and BA1 is
High, bank 3 is selected.
CKE0 (input pin): This pin determines whether or not the next CK is valid. If CKE is High, the next CK
rising edge is valid. If CKE is Low, the next CK rising edge is invalid. This pin is used for power-down and
clock suspend modes.
DQMB0 to DQMB7 (input pins): Read operation: If DQMB is High, the output buffer becomes High-Z. If
the DQMB is Low, the output buffer becomes Low-Z.
Write operation: If DQMB is High, the previous data is held (the new data is not written). If DQMB is Low,
the data is written.
DQ0 to DQ63, CB0 to CB7 (input/output pins): Data is input to and output from these pins.
VCC (power supply pins): 3.3 V is applied.
VSS (power supply pins): Ground is connected.
REGE (input pins): If REGE is High, the register is ″registered″ mode. If REGE is Low, the register is
″buffered″ mode.
Detailed Operaion Part
Refer to the HM5225165B/HM5225805B/HM5225405B-75/A6/B6 datasheet (E0082H).
Data Sheet E0017H20
16
HB52R1289E22-A6B/B6B
Physical Outline
Unit: mm
Front side
133.37
4.80
3.00
4.00 min
127.35
3.00
Component area
(Front)
1
84
B
C
11.43
8.89
A
36.83
1.27 ± 0.10
54.61
Back side
2 – φ 3.00
38.10
FULL R
FULL R
4.175
3.175
6.35
6.35
2.00 ± 0.10
3.125 ± 0.125
1.27
Detail C
3.125 ± 0.125
1.00 ± 0.05
Detail B
0.20 ± 0.15
2.50 ± 0.20
Detail A
17.80
85
4.00
168
Component area
(Back)
2.00 ± 0.10
Note: Tolerance on all dimensions ± 0.15 unless otherwise specified.
Data Sheet E0017H20
17
HB52R1289E22-A6B/B6B
Cautions
1. Elpida Memory, Inc. neither warrants nor grants licenses of any rights of Elpida Memory, Inc.’s or any
third party’s patent, copyright, trademark, or other intellectual property rights for information contained in
this document. Elpida Memory, Inc. bears no responsibility for problems that may arise with third party’s
rights, including intellectual property rights, in connection with use of the information contained in this
document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Elpida Memory, Inc. makes every attempt to ensure that its products are of high quality and reliability.
However, contact Elpida Memory, Inc. before using the product in an application that demands especially
high quality and reliability or where its failure or malfunction may directly threaten human life or cause
risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Elpida Memory, Inc.
particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Elpida Memory, Inc. bears no responsibility for failure or damage
when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally
foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as
fail-safes, so that the equipment incorporating Elpida Memory, Inc. product does not cause bodily injury,
fire or other consequential damage due to operation of the Elpida Memory, Inc. product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Elpida Memory, Inc..
7. Contact Elpida Memory, Inc. for any questions regarding this document or Elpida Memory, Inc.
semiconductor products.
Data Sheet E0017H20
18
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