Anpec APW7145QAI-TRG 3a, 12v, synchronous-rectified buck converter Datasheet

APW7145
3A, 12V, Synchronous-Rectified Buck Converter
Features
General Description
•
Wide Input Voltage from 4.3V to 14V
The APW7145 is a 3A synchronous-rectified Buck con-
•
Output Current up to 3A
•
Adjustable Output Voltage from 0.8V to VIN
verter with integrated 55mΩ power MOSFETs. The
APW7145, designed with a current-mode control scheme,
can convert wide input voltage of 4.3V to 14V to the output voltage adjustable from 0.8V to VIN to provide excel-
- ±2% System Accuracy
•
55mΩ Integrated Power MOSFETs
•
High Efficiency up to 95%
lent output voltage regulation.
For high efficiency over all load current range, the
APW7145 is equipped with an automatic Skip/PWM mode
operation. At light load, the IC operates in the Skip mode,
- Automatic Skip/PWM Mode Operation
•
Current-Mode Operation
which keeps a constant minimum inductor peak current,
to reduce switching losses. At heavy load, the IC works in
- Easy Feedback Compensation
- Stable with Low ESR Output Capacitors
PWM mode, which inductor peak current is programmed
by the COMP voltage, to provide high efficiency and ex-
- Fast Load/Line Transient Response
•
Power-On-Reset Monitoring
•
Fixed 500kHz Switching Frequency in PWM Mode
•
Built-in Digital Soft-Start and Soft-Stop
•
Current-Limit Protection with Frequency Foldback
•
118% Over-Voltage Protection
•
Hiccup-Mode 50% Under-Voltage Protection
•
Over-Temperature Protection
•
<3µA Quiescent Current in Shutdown Mode
•
SOP-8P and Compact 4mmx4mm DFN-8
cellent output voltage regulation.
The APW7145 is also equipped with power-on-reset, softstart, soft-stop, and whole protections (under-voltage,
over-voltage, over-temperature, and current-limit) into a
single package. In shutdown mode, the supply current
drops below 3µA.
This device, available SOP-8P and DFN4x4-8 packages,
provides a very compact system solution with minimal
external components and PCB area.
(DFN4x4-8) Packages
•
100
Lead Free and Green Devices Available
90
(RoHS Compliant)
80
70
Applications
60
VIN=5V, VOUT=3.3V, L1=2.2µF
50
•
VIN=12V, VOUT=5V, L1=6.8µF
OLPC, UMPC
40
VIN=12V, VOUT=3.3V, L1=4.7µF
•
Notebook Computer
30
VIN=5V, VOUT=1.2V, L1=2.2µF
•
Handheld Portable Device
•
Step-Down Converters Requiring High Efficiency
20
10
0
0.001
and 3A Output Current
VIN=12V, VOUT=2V, L1=3.3µF
0.01
0.1
1
10
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise
customers to obtain the latest version of relevant information to verify before placing orders.
Copyright  ANPEC Electronics Corp.
Rev. A.3- Sep., 2008
1
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APW7145
Pin Configuration
APW7145
APW7145
NC
VIN
AGND
FB
1
2
3
4
8
7
6
5
9
LX
NC
VIN
AGND
FB
PGND
LX
EN
COMP
1
2
3
4
8
7
6
5
PGND
LX
EN
COMP
DFN 4x4-8 Top View
SOP-8P Top View
The Pin 7 must be connected to the Exposed Pad
Ordering and Marking Information
Package Code
KA : SOP-8P
QA: DFN4x4-8
Operating Ambient Temperature Range
I : -40 to 85 oC
Handling Code
TR : Tape & Reel
Assembly Material
L : Lead Free Device
G : Halogen and Lead Free Device
APW7145
Assembly Material
Handling Code
Temperature Range
Package Code
APW7145 KA :
APW7145
XXXXX
XXXXX - Date Code
APW7145 QA :
APW7145
XXXXX
XXXXX - Date Code
Note : ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish;
which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and
halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed
1500ppm by weight).
Absolute Maximum Ratings
Symbol
VIN
VLX
(Note 1)
Parameter
VIN Supply Voltage (VIN to AGND)
LX to GND Voltage
PGND to AGND Voltage
EN to AGND Voltage
FB, COMP to AGND Voltage
PD
Power Dissipation
Rating
Unit
-0.3 ~ 15
V
> 100ns
-1 ~ VIN+1
< 100ns
- 5 ~ VIN+5
V
-0.3 ~ +0.3
V
-0.3 ~ VIN+0.3
V
-0.3 ~ 6
V
Internally Limited
W
150
o
-65 ~ 150
o
TSDR
Maximum Lead Soldering Temperature, 10 Seconds
260
Note 1 : Stresses above those listed in bsolute Maximum Ratings may cause permanent damage to the device.
o
Maximum Junction Temperature
TSTG
Storage Temperature
Copyright  ANPEC Electronics Corp.
Rev. A.3- Sep., 2008
2
C
C
C
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APW7145
Thermal Characteristics
Symbol
Parameter
Typical Value
Unit
Junction-to-Ambient Thermal Resistance in Free Air (Note 2)
θJA
SOP-8P
50
DFN4x4-8
65
SOP-8P
20
DFN4x4-8
30
o
C/W
Junction-to-Case Resistance in Free Air (Note 3)
θJC
o
C/W
Note 2 : θJA is measured with the component mounted on a high effective thermal conductivity test board in free air.
Note 3 : The case temperature is measured at the center of the exposed pad on the underside of the SOP-8P and DFN4x4-8
packages.
Recommended Operating Conditions (Note 4)
Symbol
Range
Unit
VIN Supply Voltage
4.3 ~ 14
V
VOUT
Converter Output Voltage
0.8 ~ VIN
V
IOUT
Converter Output Current
0~3
A
CIN
Converter Input Capacitor (MLCC)
8 ~ 50
µF
Converter Output Capacitor
20 ~ 1000
µF
Effective Series Resistance
0 ~ 60
mΩ
Converter Output Inductor
1 ~ 22
µH
1 ~ 20
kΩ
VIN
COUT
LOUT
Parameter
Resistance of the Feedback Resistor connected from FB to GND
TA
TJ
Ambient Temperature
Junction Temperature
-40 ~ 85
o
-40 ~ 125
o
C
C
Note 4: Refer to the Typical Application Circuits
Electrical Characteristics
Refer to the “Typical Application Circuits”. These specifications apply over VIN=12V, VOUT=3.3V and TA= -40 ~ 85°C, unless otherwise
specified. Typical values are at TA=25°C.
Symbol
Parameter
APW7145
Test Conditions
Unit
Min.
Typ.
Max.
SUPPLY CURRENT
IVIN
IVIN_SD
VIN Supply Current
VFB = VREF +50mV, VEN=3V, LX=NC
-
0.5
1.5
mA
VIN Shutdown Supply Current
VEN = 0V
-
-
3
µA
3.9
4.1
4.3
V
-
0.5
-
V
V
POWER-ON-RESET (POR) VOLTAGE THRESHOLD
VIN POR Voltage Threshold
VIN rising
VIN POR Hysteresis
REFERENCE VOLTAGE
VREF
Reference Voltage
Output Voltage Accuracy
Regulated on FB pin
-
0.8
-
TJ = 25oC, IOUT=10mA, VIN=12V
-1.0
-
+1.0
IOUT=10mA~3A, VIN=4.75~14V
-2.0
-
+2.0
%
Line Regulation
VIN = 4.75V to 14V
-
+0.02
-
%/V
Load Regulation
IOUT = 0.5A ~ 3A
-
-0.04
-
%/A
Copyright  ANPEC Electronics Corp.
Rev. A.3- Sep., 2008
3
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APW7145
Electrical Characteristics (Cont.)
Refer to the “Typical Application Circuits”. These specifications apply over VIN=12V, VOUT=3.3V and TA= -40 ~ 85°C, unless otherwise
specified. Typical values are at TA=25°C.
Symbol
Parameter
APW7145
Test Conditions
Unit
Min.
Typ.
Max.
450
500
550
kHz
-
80
-
kHz
OSCILLATOR AND DUTY CYCLE
FOSC
TON_MIN
Oscillator Frequency
TJ = -40 ~ 125oC, VIN = 4.75 ~ 14V
Foldback Frequency
VOUT = 0V
Maximum Converter’s Duty
-
99
-
%
Minimum Pulse Width of LX
-
150
-
ns
CURRENT-MODE PWM CONVERTER
Gm
Error Amplifier Transconductance
VFB=VREF±50mV
-
200
-
µA/V
Error Amplifier DC Gain
COMP = NC
-
80
-
dB
-
0.1
-
V/A
Between VIN and Exposed Pad,
VIN = 5V, TJ=25°C
-
70
100
Between VIN and Exposed Pad,
VIN = 12V, TJ=25°C
-
55
80
Between GND and Exposed Pad,
VIN = 5V, TJ=25°C
-
55
80
Between GND and Exposed Pad,
VIN = 12V, TJ=25°C
-
45
60
Current-Sense to COMP Voltage
Transresistance
High-Side Switch Resistance
Low-Side Switch Resistance
mΩ
mΩ
PROTECTIONS
High-Side Switch Current-limit
Peak Current
5
6.5
8
A
VTH_UV
FB Under-Voltage Threshold
VFB falling
45
50
55
%
VTH_OV
FB Over-Voltage Threshold
VFB rising
%
ILIM
TOTP
114
118
122
FB Under-Voltage Debounce
-
1
-
µs
Over-Temperature Trip Point
-
150
-
o
Over-Temperature Hysteresis
TD
Dead-Time
VLX = -0.7V
C
-
40
-
o
-
20
-
ns
1.5
2
2.5
ms
0.5
-
-
V
-
-
2.1
V
-
-
2
µA
-100
-
+100
nA
-100
-
+100
nA
C
SOFT-START, SOFT-STOP, ENABLE, AND INPUT CURRENTS
TSS
Soft-Start / Soft-Stop Interval
EN Shutdown Voltage Threshold
VEN falling
EN Enable Voltage Threshold
High-side Switch Leakage Current
IFB
FB Pin Input Current
IEN
EN Pin Input Current
Copyright  ANPEC Electronics Corp.
Rev. A.3- Sep., 2008
VEN = 0V, VLX = 0V
VEN = 0V ~ VIN
4
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APW7145
Typical Operating Characteristics
(Refer to the application circuit 1 in the section “Typical Application Circuits”, VIN=12V, VOUT=3.3V, L1=4.7µH)
Output Current vs. Output Voltage
3.4
90
3.38
Output Voltage, VOUT (V)
Efficiency (%)
Output Current vs. Efficiency
100
80
70
60
VIN=5V, VOUT=3.3V, L1=2.2µF
50
VIN=12V, VOUT=5V, L1=6.8µF
40
VIN=12V, VOUT=3.3V, L1=4.7µF
30
VIN=5V, VOUT=1.2V, L1=2.2µF
20
3.36
3.34
3.32
3.3
3.28
3.26
3.24
10
VIN=12V, VOUT=2V, L1=3.3µF
0
0.001
3.22
3.2
0.01
0.1
1
10
0
1
Output Current, IOUT(A)
Current Limit Level (Peak Current)
3.4
IOUT=500mA
3.38
Output Voltage, VOUT (V)
Current Limit Level, ILIM(A)
3
Output Voltage vs. Supply Voltage
vs. Junction Temperature
7
2
Output Current, IOUT(A)
7.5
7
6.5
6
3.36
3.34
3.32
3.3
3.28
3.26
3.24
3.22
5.5
3.2
-40
-20
0
20
40
60
80
100 120 140
4
6
Junction Temperature, TJ (oC)
10
12
14
Reference Voltage vs. Junction Temperature
VIN Input Current vs. Supply Voltage
2.0
0.816
VFB=0.85V
0.812
Reference Voltage, VREF (V)
VIN Input Current, IVIN(mA)
8
Supply Voltage, VIN (V)
1.5
1.0
0.5
2
4
6
8
10
12
14
Supply Voltage, VIN (V)
Copyright  ANPEC Electronics Corp.
Rev. A.3- Sep., 2008
0.804
0.800
0.796
0.792
0.788
0.784
-50
0.0
0
0.808
-25
0
25
50
75
100
125
150
o
Junction Temperature, TJ ( C)
5
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APW7145
Typical Operating Characteristics (Cont.)
(Refer to the application circuit 1 in the section “Typical Application Circuits”, VIN=12V, VOUT=3.3V, L1=4.7µH)
Oscillator Frequency vs.
Junction Temperature
Oscillator Frequency, FOSC(KHz)
550
540
530
520
510
500
490
480
470
460
450
-50
-25
0
25
50
75
100
125
150
o
Junction Temperature, TJ ( C)
Copyright  ANPEC Electronics Corp.
Rev. A.3- Sep., 2008
6
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APW7145
Operating Waveforms
(Refer to the application circuit 1 in the section “Typical Application Circuits”, VIN=12V, VOUT=3.3V, L1=4.7µH)
Power On
Power Off
IOUT=3A
IOUT=3A
VIN
VIN
1
1
VOUT
VOUT
2
2
IL1
IL1
3
3
CH1 : VIN , 5V/div
CH2 : VOUT , 2V/div
CH3 : IL1 , 2A/div
Time : 1ms/div
CH1 : VIN , 5V/div
CH2 : VOUT , 2V/div
CH3 : IL1 , 2A/div
Time : 10ms/div
Shutdown
Enable
IOUT=3A
1
IOUT=3A
VEN
VEN
1
VOUT
VOUT
2
2
IL1
IL1
3
3
CH1 : VEN , 5V/div
CH2 : VOUT , 2V/div
CH3 : IL1, 2A/div
Time : 100µs/div
CH1 : VEN , 5V/div
CH2 : VOUT , 2V/div
CH3 : IL1 , 2A/div
Time : 1ms/div
Copyright  ANPEC Electronics Corp.
Rev. A.3- Sep., 2008
7
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APW7145
Operating Waveforms (Cont.)
(Refer to the application circuit 1 in the section “Typical Application Circuits”, VIN=12V, VOUT=3.3V, L1=4.7µH)
Short Current
Short Circuit
IOUT =3~7A
VOUT is shorted to GND by a short wire
VLx
1
VLX
1
VOUT
VOUT
2
2
IL1
IL1
3
3
CH1 : VLX , 10V/div
CH2 : VOUT , 2V/div
CH3 : IL1 , 5A/div
Time : 20µs/div
CH1 : VLX , 5V/div
CH2 : VOUT , 200mV/div
CH3 : IL1 , 5A/div
Time : 5ms/div
Load Transient Response
Load Transient Response
1
IOUT= 50mA-> 3A ->50mA
IOUT rising/falling time=10µs
VOUT
IOUT= 0.5A-> 3A ->0.5A
IOUT rising/falling time=10µs
1
VOUT
IL1
IL1
2
2
CH1 : VOUT , 200mV/div
CH1 : VOUT , 100mV/div
CH2 : IL1 , 2A/div
CH2 : IL1 , 2A/div
Time : 100µs/div
Time : 100µs/div
Copyright  ANPEC Electronics Corp.
Rev. A.3- Sep., 2008
8
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APW7145
Operating Waveforms (Cont.)
(Refer to the application circuit 1 in the section “Typical Application Circuits”, VIN=12V, VOUT=3.3V, L1=4.7µH)
Switching Waveform
Switching Waveform
VLX
IOUT=0.2A
VLX
IOUT=3A
1
1
IL1
IL1
2
2
CH1 : VLX , 5V/div
CH2 : IL1 , 2A/div
Time : 1µs/div
CH1 : VLX , 5V/div
CH2 : IL1 , 2A/div
Time : 1µs/div
Line Transient
VIN= 5~12V
Over Voltage Protection
VIN
VIN rising/falling time=20µs
VIN
VOUT
1
1
VOUT
2
2
VLX
3
IL1
4
IL1
3
IOUT=-1A
CH1 : VIN , 5V/div
CH2 : VOUT , 50mV/div (Voffset=3.3V)
CH3 : IL1 , 2A/div
Time : 100µs/div
Copyright  ANPEC Electronics Corp.
Rev. A.3- Sep., 2008
CH1 : VIN , 5V/div
CH2 : VOUT , 2V/div
CH3 : VLX , 5V/div
CH4 : IL1 , 5A/div
Time : 20µs/div
9
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APW7145
Pin Description
PIN
FUNCTION
NO.
NAME
1
NC
No Connection.
2
VIN
Power Input. VIN supplies the power (4.3V to 14V) to the control circuitry, gate drivers
and step-down converter switches. Connecting a ceramic bypass capacitor and a
suitably large capacitor between VIN and both of AGND and PGND to eliminate
switching noise and voltage ripple on the input to the IC.
3
AGND
4
FB
Output Feedback Input. The APW7145 senses the feedback voltage via FB and
regulates the voltage at 0.8V. Connecting FB with a resistor-divider from the converter’s
output sets the output voltage from 0.8V to VIN.
5
COMP
Output of the error amplifier. Connecting a series RC network from COMP to GND to
compensate the regulation control loop. In some cases, an additional capacitor from
COMP to GND is required.
6
EN
Enable Input. EN is a digital input that turns the regulator on or off. Drive EN high to turn
on the regulator, drive it low to turn it off. Connecting this pin to VIN if it is not used.
7
LX
Power Switching Output. LX is the junction of the high-side and low-side power
MOSFETs to supply power to the output LC filter.
8
PGND
Power Ground of the APW7145, which is the source of the N-channel power MOSFET.
Connect this pin to the system ground with lowest impedance.
9
(Exposed Pad)
LX
Power Switching Output. LX is the Drain of the P-channel MOSFET to supply power to
the output. The Exposed Pad provides current with lower impedance than the Pin 7.
Connecting the pad to output LC filter via a top-layer thermal pad on PCBs. The PCB will
be a heat sink of the IC.
Ground of MOSFET Gate Drivers and Control Circuitry.
Block Diagram
VIN
Current Sense
Amplifier
Power-OnReset
Zero-Crossing
Comparator
POR
OVP
118%VREF
50%VREF
UVP
UG
Soft-Start /
Soft-Stop
and
Fault Logic
Gate
Driver
Soft-Start /
Soft-Stop
FB
Inhibit
LX
Gate
Control
Gm
VREF
VIN
Current
Limit
Error
Amplifier
VIN
LG
Current
Compartor
COMP
Gate
Driver
PGND
Slope
Compensation
EN
Enable
1.5V
Copyright  ANPEC Electronics Corp.
Rev. A.3- Sep., 2008
OverTemperature
Protection
FB
10
Oscillator
500kHz
AGND
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APW7145
Typical Application Circuit
1. 4.3~14V Single Power Input Step-down Converter (with a Ceramic Output Capacitor)
VIN
C1
2
VIN
L1
3A
Enable
6
LX
EN
U1
LX
APW7145
Shutdown
PGND
5
VOUT
7
8
C2
COMP
R3
(±
5%)
C3
(±30%)
9
FB
AGND
3
R1
±
1%
4
R2
±1%
C4
(±
30%, Optional)
a. Cost-effective Feedback Compensation (C4 is no connection)
V IN(V)
V OUT(V)
12
5
12
L1(µF)
C2(µF)
C2 ESR(mΩ)
R1(kΩ)
R2(kΩ)
R3(kΩ)
C3(pF)
6.8
22
5
63.0
12
33.0
820
5
6.8
44
3
63.0
12
68.0
820
12
3.3
4.7
22
5
46.9
15
27.0
1000
12
3.3
4.7
44
3
46.9
15
56.0
1000
12
2
3.3
22
5
30.0
20
18.0
1800
12
2
3.3
44
3
30.0
20
33.0
1800
12
1.8
3.3
22
5
18.8
15
15.0
1800
12
1.8
3.3
44
3
18.8
15
30.0
1800
5
3.3
2.2
22
5
46.9
15
27.0
470
5
3.3
2.2
44
3
46.9
15
56.0
470
5
1.8
2.2
22
5
25.0
20
15.0
820
5
1.8
2.2
44
3
25.0
20
30.0
820
5
1.5
2.2
22
5
21.9
25
12.0
1000
5
1.5
2.2
44
3
21.9
25
24.0
1000
5
1.2
2.2
22
5
7.5
15
10.0
1200
5
1.2
2.2
44
3
7.5
15
20.0
1200
Copyright  ANPEC Electronics Corp.
Rev. A.3- Sep., 2008
11
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APW7145
Typical Application Circuit (Cont.)
b. Fast-Transient-Response Feedback Compensation (C4 is connected)
VIN(V)
VOUT(V)
L1(µH)
C2(µF)
C2 ESR(mΩ)
R1(kΩ)
R2(kΩ)
R3(kΩ)
C3(pF)
C4(pF)
12
5
6.8
22
5
63.0
12
43
680.0
27
12
5
6.8
44
3
63.0
12
82
680.0
27
12
3.3
4.7
22
5
46.9
15
27
1000.0
27
12
3.3
4.7
44
3
46.9
15
56
1000.0
27
12
2
3.3
22
5
30.0
20
18
1800.0
27
12
2
3.3
44
3
30.0
20
33
1800.0
27
12
1.8
3.3
22
5
18.8
15
15
1800.0
33
12
1.8
3.3
44
3
18.8
15
30
1800.0
33
5
3.3
2.2
22
5
46.9
15
27
470.0
27
5
3.3
2.2
44
3
46.9
15
56
470.0
27
5
1.8
2.2
22
5
25.0
20
15
820.0
56
5
1.8
2.2
44
3
25.0
20
30
820.0
56
5
1.5
2.2
22
5
22
25
12
1000
56
5
1.5
2.2
44
3
22
25
24
1000
56
5
1.2
2.2
22
5
7.5
15
10
1200
180
5
1.2
2.2
44
3
7.5
15
20
1200
270
2. +12V Single Power Input Step-down Converter (with an Electrolytic Output Capacitor)
C1
2.2µF
2
VIN
C5
470µF
VIN
12V
L1
4.7µH /3A
Enable
6
LX
EN
U1
LX
APW7145
Shutdown
PGND
5
Copyright  ANPEC Electronics Corp.
Rev. A.3- Sep., 2008
8
R1
46.9K
1%
COMP
R3
100K
C3
1000pF
9
7
FB
AGND
3
4
VOUT
3.3V/3A
C2
470µF
(ESR=30mΩ)
R2
15K
1%
12
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APW7145
Function Description
VIN Power-On-Reset (POR)
The APW7145 keeps monitoring the voltage on the VIN
pin to prevent wrong logic operations which may occur
The under-voltage threshold is 50% of the nominal output voltage. The undervoltage comparator has a built-in
2µs noise filter to prevent the chips from wrong UVP shut-
when VIN voltage is not high enough for the internal control circuitry to operate. The VIN POR has a rising thresh-
down caused by noise. The under-voltage protection
works in a hiccup mode without latched shutdown. The
old of 4.1V (typical) with 0.5V of hysteresis.
During start-up, the VIN voltage must exceed the enable
IC will initiate a new soft-start process at the end of the
preceding delay.
voltage threshold. Then, the IC starts a start-up process
and ramps up the output voltage to the voltage target.
Over-Voltage Protection (OVP)
The over-voltage function monitors the output voltage by
Digital Soft-Start
FB pin. When the FB voltage increase over 118% of the
reference voltage due to the high-side MOSFET failure,
The APW7145 has a built-in digital soft-start to control the
rise rate of the output voltage and limit the input current
or for other reasons, the over-voltage protection comparator will force the low-side MOSFET gate driver high. This
surge during start-up. During soft-start, an internal voltage
ramp (VRAMP), connected to one of the positive inputs of
action actively pulls down the output voltage and eventually attempts to blow the internal bonding wires. As soon
the error amplifier, rises up from 0V to 0.95V to replace the
reference voltage (0.8V) until the voltage ramp reaches
as the output voltage is within regulation, the OVP comparator is disengaged. The chip will restore its normal
the reference voltage.
During soft-start without output overvoltage, the APW7145
operation. This OVP scheme only clamps the voltage overshoot and does not invert the output voltage when other-
converter’s sinking capability is disabled until the output
voltage reaches the voltage target.
wise activated with a continuously high output from lowside MOSFET driver - a common problem for OVP
Digital Soft-Stop
schemes with a latch.
At the moment of shutdown controlled by EN signal,
undervoltage event, or over-temperature protection, the
Over-Temperature Protection (OTP)
APW7145 initiates a digital soft-stop process to discharge
the output voltage in the output capacitors. Certainly, the
The over-temperature circuit limits the junction temperature of the APW7145. When the junction temperature ex-
load current also discharges the output voltage.
During soft-stop, the internal voltage ramp (VRAMP) falls
ceeds TJ = +150oC, a thermal sensor turns off the both
power MOSFETs, allowing the devices to cool. The ther-
down from 0.95V to 0V to replace the reference voltage.
Therefore, the output voltage falls down slowly at light load.
mal sensor allows the converters to start a start-up process and regulate the output voltage again after the junc-
After the soft-stop interval elapses, the soft-stop process
ends and the the IC turns on the low-side power MOSFET.
tion temperature cools by 40 oC. The OTP is designed
with a 40 oC hysteresis to lower the average TJ during
Output Undervoltage Protection (UVP)
continuous thermal overload conditions, increasing lifetime of the APW7145.
In the operational process, if a short-circuit occurs, the
output voltage will drop quickly. Before the current-limit
Enable/Shutdown
circuit responds, the output voltage will fall out of the required regulation range. The undervoltage continually
Driving EN to the ground initiates a soft-stop process
and then places the APW7145 in shutdown. When in
monitors the FB voltage after soft-start is completed. If a
load step is strong enough to pull the output voltage lower
shutdown, after the soft-stop process is completed, the
internal power MOSFETs turns off, all internal circuitry
than the under-voltage threshold, the IC shuts down
converter’s output.
shuts down and the quiescent supply current reduces to
less than 3mA.
Copyright  ANPEC Electronics Corp.
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APW7145
Function Description (Cont.)
Current-Limit Protection
The APW7145 monitors the output current, flowing through
the high-side power MOSFET, and limits the current peak
at current-limit level to prevent loads and the IC from damages during overload or short-circuit conditions.
Frequency Foldback
The foldback frequency is controlled by the FB voltage.
When the output is shortened to the ground, the frequency
of the oscillator will be reduced to 80kHz. This lower frequency allows the inductor current to safely discharge,
thereby preventing current runaway. The oscillator’s frequency will gradually increase to its designed rate when
the feedback voltage on FB again approaches 0.8V.
Copyright  ANPEC Electronics Corp.
Rev. A.3- Sep., 2008
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APW7145
Application Information
T=1/FOSC
Setting Output Voltage
The regulated output voltage is determined by:
VOUT = 0.8 ⋅ (1 +
VLX
R1
)
R2
DT
(V)
I
IOUT
IL
Suggested R2 is in the range from 1K to 20kΩ. For
portable applications, a 10K resistor is suggested for R2.
To prevent stray pickup, please locate resistors R1 and R2
IOUT
IQ1
close to APW7145.
I
ICOUT
Input Capacitor Selection
VOUT
Use small ceramic capacitors for high frequency
decoupling and bulk capacitors to supply the surge current
needed each time the P-channel power MOSFET (Q1)
turns on. Place the small ceramic capacitors physically
VOUT
Figure 1. Converter Waveforms
close to the VIN and between the VIN and the GND.
Output Capacitor Selection
The important parameters for the bulk input capacitor are
the voltage rating and the RMS current rating. For reliable
An output capacitor is required to filter the output and supply the load transient current. The filtering requirements
operation, select the bulk capacitor with voltage and
current ratings above the maximum input voltage and larg-
are the function of the switching frequency and the ripple
current (∆I). The output ripple is the sum of the voltages,
est RMS current required by the circuit. The capacitor voltage rating should be at least 1.25 times greater than the
having phase shift, across the ESR, and the ideal output
capacitor. The peak-to-peak voltage of the ESR is calcu-
maximum input voltage and a voltage rating of 1.5 times is
a conservative guideline. The RMS current (IRMS) of the
lated as the following equations:
bulk input capacitor is calculated as the following equation:
IRMS = IOUT ⋅ D ⋅ (1- D)
(A)
where D is the duty cycle of the power MOSFET.
For a through hole design, several electrolytic capacitors
may be needed. For surface mount designs, solid tanta-
D=
VOUT
VIN
........... (1)
∆I =
VOUT ·(1 - D)
FOSC ·L
........... (2)
VESR = ∆I. ⋅ ESR
The peak-to-peak voltage of the ideal output capacitor is
calculated as the following equation:
lum capacitors can be used, but caution must be exercised with regard to the capacitor surge current rating.
∆VCOUT =
VIN
VIN
IQ1
CIN
LX
Q2
........... (4)
is much smaller than the V ESR and can be ignored.
Therefore, the AC peak-to-peak output voltage (∆VOUT ) is
IOUT
VOUT
L
ICOUT
∆I
(V)
8 ⋅ FOSC ⋅ COUT
For the applications using bulk capacitors, the ∆V COUT
Q1
IL
........... (3)
shown as below:
ESR
∆VOUT = ∆ I ⋅ ESR
(V)
........... (5)
COUT
Copyright  ANPEC Electronics Corp.
Rev. A.3- Sep., 2008
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APW7145
Application Information (Cont.)
Output Capacitor Selection (Cont.)
VOUT ·(VIN - VOUT )
≤ 1.2
500000 ·L ·VIN
For the applications using ceramic capacitors, the VESR is
much smaller than the ∆V COUT and can be ignored.
L≥
Therefore, the AC peak-to-peak output voltage (∆VOUT ) is
close to ∆VCOUT .
VOUT ·(VIN - VOUT )
600000 ·VIN
........... (6)
(H)
where VIN = VIN(MAX)
The load transient requirements are the function of the
Layout Consideration
slew rate (di/dt) anddisengaged\the magnitude of the transient load current. These requirements are generally met
In high power switching regulator, a correct layout is
important to ensure proper operation of the regulator. In
with a mix of capacitors and careful layout. High frequency
capacitors initially supply the transient and slow the cur-
general, interconnecting impedance should be minimized
by using short and wide printed circuit traces. Signal and
rent load rate seen by the bulk capacitors. The bulk filter
capacitor values are generally determined by the ESR
power grounds are to be kept separating and finally com bined using ground plane construction or
(Effective Series Resistance) and voltage rating requirements rather than actual capacitance requirements.
single point grounding. Figure 2 illustrates the layout,
with bold lines indicating high current paths. Components
High frequency decoupling capacitors should be placed
along the bold lines should be placed close together.
Below is a checklist for your layout:
as close to the power pins of the load as physically possible.
Be careful not to add inductance in the circuit board wiring
1. Firstly, to initial the layout by placing the power
that could cancel the usefulness of these low inductance
components. An aluminum electrolytic capacitor’s ESR
components. Orient the power circuitry to achieve a
clean power flow path. If possible, make all the con-
value is related to the case size with lower ESR available
in larger case sizes. However, the Equivalent Series
nections on one side of the PCB with wide and copper filled areas.
Inductance (ESL) of these capacitors increases with case
size and can reduce the usefulness of the capacitor to high
slew-rate transient loading.
Inductor Value Calculation
+
VIN
-
1
2
NC VIN
The operating frequency and inductor selection are in-
6
terrelated in that higher operating frequencies permit the
use of a smaller inductor for the same amount of inductor
EN
5
COMP
C3
+
7
C 2 Load
VOUT
PGND
FB
R3
equation (2) shows that the inductance value has a direct
effect on ripple current.
L1
9
U1
APW7145
Compensation
Network
ripple current. However, this is at the expense of efficiency
due to an increase in MOSFET gate charge losses. The
C1
LX
LX
AGND
3
-
8
R1
4
R2
C4(Optional)
Feedback
Divider
Accepting larger values of ripple current allows the use of
low inductances, but results in higher output voltage ripple
Figure 2. Current Path Diagram
and greater core losses. A reasonable starting point for
setting ripple current is ∆I ≤ 0.4 ⋅ IOUT(MAX) . Please be no-
2. In Figure 2, the loops with same color bold lines conduct high slew rate current. These interconnecting im-
ticed that the maximum ripple current occurs at the maximum input voltage. The minimum inductance of the in-
pedances should be minimized by using wide and
short printed circuit traces.
ductor is calculated by using the following equation:
Copyright  ANPEC Electronics Corp.
Rev. A.3- Sep., 2008
16
www.anpec.com.tw
APW7145
Application Information (Cont.)
Layout Consideration (Cont.)
3. Keep the sensitive small signal nodes (FB and COMP)
away from switching nodes (LX or others) on the PCB.
Therefore, place the feedback divider and the feedback compensation network close to the IC to avoid
switching noise. Connect the ground of feedback
divider directly to the AGND pin of the IC using a
dedicated ground trace.
4. Place the decoupling ceramic capacitor C1 near the
VIN as close as possible. Use a wide power ground
plane to connect the C1 and C2 to provide a low impedance path between the components for large and
high slew rate current.
VIN
VOUT
Ground
C2
C1
1
2
3
4
7
VLX
L1
8
5
6
APW7145
SOP-8P
For dissipating heat
VIN
Ground
VOUT
Ground
C2
C1
1
2
3
4
7
VLX
L1
8
6
5
APW7145
DFN4x4
For dissipating heat
Ground
Figure 3. Recommended Layout Diagram
Copyright  ANPEC Electronics Corp.
Rev. A.3- Sep., 2008
17
www.anpec.com.tw
APW7145
Package Information
SOP-8P
D
SEE VIEW
A
E
E2
THERMAL
PAD
E1
D1
h X 45
°
c
A
0.25
b
L
0
GAUGE PLANE
SEATING PLANE
A1
A2
e
VIEW A
S
Y
M
B
O
L
SOP-8P
MILLIMETERS
MIN.
MAX.
A
A1
INCHES
MAX.
MIN.
0.063
1.60
0.006
0.000
0.15
0.00
0.049
A2
1.25
b
0.31
0.51
0.012
0.020
c
0.17
0.25
0.007
0.010
D
4.80
5.00
0.189
0.197
D1
2.25
3.50
0.098
0.138
E
5.80
6.20
0.228
0.244
E1
3.80
4.00
0.150
0.157
E2
2.00
3.00
0.079
0.118
e
h
1.27 BSC
0.25
0.050 BSC
0.50
0.010
0.020
0.050
8o
L
0.40
1.27
0.016
0
0o
8o
0o
Note : 1. Follow JEDEC MS-012 BA.
2. Dimension "D" does not include mold flash, protrusions
or gate burrs. Mold flash, protrusion or gate burrs shall not
exceed 6 mil per side .
3. Dimension "E" does not include inter-lead flash or protrusions.
Inter-lead flash and protrusions shall not exceed 10 mil per side.
Copyright  ANPEC Electronics Corp.
Rev. A.3- Sep., 2008
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APW7145
Package Information
DFN4x4-8
A
Pin 1
b
E
D
D2
A1
A3
L K
E2
Pin 1
Corner
e
S
Y
M
B
O
L
DFN4x4-8
MILLIMETERS
INCHES
MIN.
MAX.
MIN.
MAX.
A
0.80
1.00
0.031
0.039
A1
0.00
0.05
0.000
0.002
0.014
A3
0.20 REF
0.008 REF
b
0.25
0.35
0.010
D
3.90
4.10
0.154
0.161
D2
3.10
3.30
0.122
0.130
E
3.90
4.10
0.154
0.161
E2
2.40
2.60
0.094
0.102
e
0.80 BSC
L
0.40
K
0.20
0.031 BSC
0.016
0.60
0.024
0.008
Note : 1. Followed from JEDEC MO-229 VGGB.
Copyright  ANPEC Electronics Corp.
Rev. A.3- Sep., 2008
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APW7145
Carrier Tape & Reel Dimensions
P0
P2
P1
A
B0
W
F
E1
OD0
K0
A0
A
OD1 B
B
T
SECTION A-A
SECTION B-B
H
A
d
T1
Application
A
H
T1
C
d
D
W
E1
F
330.0±2.00
50 MIN.
12.4+2.00
-0.00
13.0+0.50
-0.20
1.5 MIN.
20.2 MIN.
12.0±0.30
1.75±0.10
5.5±0.05
P0
P1
P2
D0
D1
T
A0
B0
K0
4.0±0.10
8.0±0.10
2.0±0.05
1.5+0.10
-0.00
1.5 MIN.
0.6+0.00
-0.40
6.40±0.20
5.20±0.20
2.10±0.20
A
H
T1
C
d
D
W
E1
F
330.0±2.00
50 MIN.
12.4+2.00
-0.00
13.0+0.50
-0.20
1.5 MIN.
20.2 MIN.
12.0±0.30
1.75±0.10
5.5±0.05
P0
P1
P2
D0
D1
T
A0
B0
K0
4.0±0.10
8.0±0.10
2.0±0.05
1.5+0.10
-0.00
1.5 MIN.
0.6+0.00
-0.40
4.30±0.20
4.30±0.20
1.30±0.20
SOP-8(P)
Application
DFN4x4-8
(mm)
Devices Per Unit
Package Type
Unit
Quantity
SOP-8P
Tape & Reel
2500
DFN4x4-8
Tape & Reel
3000
Copyright  ANPEC Electronics Corp.
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APW7145
Taping Direction Information
SOP-8P
USER DIRECTION OF FEED
DFN4x4-8
USER DIRECTION OF FEED
Copyright  ANPEC Electronics Corp.
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APW7145
Reflow Condition
(IR/Convection or VPR Reflow)
tp
TP
Critical Zone
TL to TP
Temperature
Ramp-up
TL
tL
Tsmax
Tsmin
Ramp-down
ts
Preheat
25
t 25°C to Peak
Time
Reliability Test Program
Test item
SOLDERABILITY
HOLT
PCT
TST
ESD
Latch-Up
Method
MIL-STD-883D-2003
MIL-STD-883D-1005.7
JESD-22-B, A102
MIL-STD-883D-1011.9
MIL-STD-883D-3015.7
JESD 78
Description
245°C, 5 sec
1000 Hrs Bias @125°C
168 Hrs, 100%RH, 121°C
-65°C~150°C, 200 Cycles
VHBM > 2KV, VMM > 200V
10ms, 1tr > 100mA
Classification Reflow Profiles
Profile Feature
Average ramp-up rate
(TL to TP)
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (min to max) (ts)
Time maintained above:
- Temperature (TL)
- Time (tL)
Peak/Classification Temperature (Tp)
Time within 5°C of actual
Peak Temperature (tp)
Ramp-down Rate
Sn-Pb Eutectic Assembly
Pb-Free Assembly
3°C/second max.
3°C/second max.
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
183°C
60-150 seconds
217°C
60-150 seconds
See table 1
See table 2
10-30 seconds
20-40 seconds
6°C/second max.
6°C/second max.
6 minutes max.
8 minutes max.
Time 25°C to Peak Temperature
Notes: All temperatures refer to topside of the package. Measured on the body surface.
Copyright  ANPEC Electronics Corp.
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APW7145
Classification Reflow Profiles (Cont.)
Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures
3
Package Thickness
Volume mm
<350
<2.5 mm
240 +0/-5°C
≥2.5 mm
225 +0/-5°C
3
Volume mm
≥350
225 +0/-5°C
225 +0/-5°C
Table 2. Pb-free Process – Package Classification Reflow Temperatures
3
3
3
Package Thickness
Volume mm
Volume mm
Volume mm
<350
350-2000
>2000
<1.6 mm
260 +0°C*
260 +0°C*
260 +0°C*
1.6 mm – 2.5 mm
260 +0°C*
250 +0°C*
245 +0°C*
≥2.5 mm
250 +0°C*
245 +0°C*
245 +0°C*
*Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the
stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C)
at the rated MSL level.
Customer Service
Anpec Electronics Corp.
Head Office :
No.6, Dusing 1st Road, SBIP,
Hsin-Chu, Taiwan
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,
Sindian City, Taipei County 23146, Taiwan
Tel : 886-2-2910-3838
Fax : 886-2-2917-3838
Copyright  ANPEC Electronics Corp.
Rev. A.3- Sep., 2008
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