PANJIT 3EZ62

DATA SHEET
3EZ6.8~3EZ100
GLASS PASSIVATED JUNCTION SILICON ZENER DIODES
3.0 Watts
VOLTAGE
POWER
6.8 to 100 Volts
DO-15
Unit: inch(mm)
FEATURES
• Low profile package
.034(.86)
1.0(25.4)MIN.
• Built-in strain relief
• Glass passivated iunction
• Low inductance
• Typical ID less than 1.0µA above 11V
.028(.71)
.300(7.6)
• High temperature soldering : 260°C /10 seconds at terminals
• Pb free product are available : 99% Sn above can meet RoHS
environment substance directive request
.230(5.8)
• Plastic package has Underwriters Laboratory Flammability
Classification 94V-O
.140(3.6)
MECHANICALDATA
1.0(25.4)MIN.
.104(2.6)
Case: JEDEC DO-15, Molded plastic over passivated junction
Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
Polarity: Color band denotes positive end (cathode)
Standard packing: 52mm tape
Weight: 0.015 ounce, 0.04 gram
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified.
P aram eter
S ym bol
Value
U nits
P w ak P ulse P ow erD issipation on TA =50O C (N otes A )
D erate above 70O C
PD
3.0
24.0
W atts
m W /O C
P eak Forw ard S urge C urrent8.3m s single halfsine-w ave
superim posed on rated load (JE D E C m ethod)
IFSM
15
A m ps
TJ,TSTG
-55 to + 150
O perating Junction and S torage Tem perature R ange
O
C
NOTES:
A.Mounted on 5.0mm2 (.013mm thick) land areas.
B.Measured on8.3ms, and single half sine-wave or equivalent square wave ,duty cycle=4 pulses per minute maximum
REV.0-JUN.9.2005
PAGE . 1
N o m i na l Ze ne r V o l t a g e
Part Number
V Z @ IZT
Max Reverse
Leakage Current
M a x i m u m Z e n e r Im p e d a n c e
Z ZT @ IZT
IZT
Z ZK @ IZK
IZK
IR @VR
Marking
C ode
No m. V
M i n. V
M a x. V
O hm s
mA
O hm s
mA
µA
V
3EZ6.8
6.8
6.46
7.14
2.0
110.0
700
1.00
5.0
4.0
3EZ6.8
3EZ7.5
7.5
7.13
7.88
2.0
100.0
700
0.50
5.0
5.0
3EZ7.5
3EZ8.2
8.2
7.79
8.61
2.0
91.0
700
0.50
5.0
6.0
3EZ8.2
3EZ8.7
8.7
8.27
9.14
2.0
85.0
700
0.50
4.0
6.6
3EZ8.7
3EZ9.1
9.1
8.65
9.56
3.0
82.0
700
0.50
3.0
7.0
3EZ9.1
3EZ10
10.0
9.50
10.5
4.0
75.0
700
0.25
3.0
7.6
3EZ10
3EZ11
11.0
10.45
11.55
4.0
68.0
700
0.25
1.0
8.4
3EZ11
3EZ12
12.0
11.4
12.6
5.0
63.0
700
0.25
1.0
9.1
3EZ12
3EZ13
13.0
12.35
13.65
5.0
58.0
700
0.25
0.5
9.9
3EZ13
3EZ14
14.0
13.3
14.7
5.0
53.0
700
0.25
0.5
10.6
3EZ14
3EZ15
15.0
14.25
15.75
6.0
50.0
700
0.25
0.5
11.4
3EZ15
3EZ16
16.0
15.2
16.8
6.0
47.0
700
0.25
0.5
12.2
3EZ16
3EZ17
17.0
16.15
17.85
6.0
44.0
750
0.25
0.5
13.0
3EZ17
3EZ18
18.0
17.1
18.9
6.0
42.0
750
0.25
0.5
13.7
3EZ18
3EZ19
19.0
18.05
19.95
7.0
40.0
750
0.25
0.5
14.4
3EZ19
3EZ20
20.0
19.0
21.0
7.0
37.0
750
0.25
0.5
15.2
3EZ20
3EZ22
22.0
20.9
23.1
8.0
34.0
750
0.25
0.5
16.7
3EZ22
3EZ24
24.0
22.8
25.2
9.0
31.0
750
0.25
0.5
18.2
3EZ24
3EZ25
25.0
23.75
26.55
10
30.0
750
0.25
0.5
19.0
3EZ25
3EZ27
27.0
25.65
28.35
10
28.0
750
0.25
0.5
20.6
3EZ27
3EZ28
28.0
26.6
29.4
12.0
27.0
750
0.25
0.5
21.0
3EZ28
3EZ30
30.0
28.5
31.5
16.0
25.0
1000
0.25
0.5
22.5
3EZ30
3EZ33
33.0
31.35
34.65
20.0
23.0
1000
0.25
0.5
25.1
3EZ33
3EZ36
36.0
34.2
37.8
22.0
21.0
1000
0.25
0.5
27.4
3EZ36
3EZ39
39.0
37.05
40.95
28.0
19.0
1000
0.25
0.5
29.7
3EZ39
3EZ43
43.0
40.85
45.15
33.0
17.0
1500
0.25
0.5
32.7
3EZ43
3EZ47
47.0
44.65
49.35
38.0
16.0
1500
0.25
0.5
35.8
3EZ47
3EZ51
51.0
48.45
53.55
45.0
15.0
1500
0.25
0.5
38.8
3EZ51
3EZ56
56.0
53.20
58.8
50.0
13.0
2000
0.25
0.5
42.6
3EZ56
3EZ60
60.0
57.00
63.0
53.0
12.5
2000
0.25
0.5
45.6
3EZ60
3EZ62
62.0
58.90
65.1
55.0
12.0
2000
0.25
0.5
47.1
3EZ62
3EZ68
68.0
64.60
71.4
70.0
11.0
2000
0.25
0.5
51.7
3EZ68
3EZ75
75.0
71.25
78.75
85.0
10.0
2000
0.25
0.5
56.0
3EZ75
3EZ82
82.0
77.90
86.1
95.0
9.1
3000
0.25
0.5
62.2
3EZ82
3EZ87
87.0
82.65
91.35
100
8.5
3000
0.25
0.5
66.1
3EZ87
3EZ91
91.0
86.45
95.55
115
8.2
3000
0.25
0.5
69.2
3EZ91
3EZ100
100.0
95.00
105
160
7.5
3000
0.25
0.5
76.0
3EZ100
3.0 Watt ZENER
REV.0-JUN.9.2005
PAGE . 2
1000
500
300
200
100
50
30
20
10
APPLICATION NOTE:
Since the actual voltage available from a given zener diode is temperature dependent, it is necessary to determinejunction
temperature under any set of operating conditions in order to calculate its value. The following procedure is recommended:
Lead Temperature, T L , should be determined from:
T L = q LA P D + T A
O
q L A is the lead-to-ambient thermal resistance ( C/W) and Pd is the power dissipation. The value for q L A will vary and depends
on the device mounting method. q L A is generally 30-40 OC/W for the various clips and tie points in common use and for printed
circuit board wiring.
The temperature of the lead can also be measured using a thermocouple placed on the lead as close as possible to the tie poin
The thermal mass connected to the tie point is normally large enough so that it will not significantly respond to heat surges
generated in the diode as a result of pulsed operation once steady-state conditions are achieved. Using the measured value of
TL, the junction temperature may be determined by:
T J = T L + D T JL
D T JL is the increase in junction temperature above the lead temperature and may be found from Figure 2 for a train of power puls
or from Figure 10 for dc power.
D T JL = q J L P D
For worst-case design, using expected limits of I Z , limits of P D and the extremes of T J ( D T J ) may be estimated. Changes in volta
V Z , can then be found from:
DV = qV Z DT J
q V Z , the zener voltage temperature coefficient, is found from Figures 5 and 6.
Under high power-pulse operation, the zener voltage will vary with time and may also be affected significantly by the zener resis
For best regulation, keep current excursions as low as possible.
Data of Figure 2 should not be used to compute surge capa-bility. Surge limitations are given in Figure 3. They are lower than w
be expected by considering only junction temperature, as current crowding effects cause temperatures to be extremely high in s
spots resulting in device degradation should the limits of Figure 3 be exceeded.
REV.0-JUN.9.2005
PAGE . 3
REV.0-JUN.9.2005
PAGE . 4