PROTEC ESD4-LFC Low capacitance flip chip tvs array Datasheet

05210
ESD4-LFC
Only One Name Means ProTek’Tion™
LOW CAPACITANCE flip chip tvs array
Description
The ESD4-LFC is a low capacitance flip chip transient voltage suppressor array, designed to protect portable devices
from the effects of Electrostatic Discharge (ESD) and Electrical Fast Transients (EFT). This series meets the IEC 610004-2 and 61000-4-4 requirements. This device is ideally suited for portable devices, PCMCIA and SMART phones.
The ESD4-LFC features superior clamping performance, low leakage current characteristics and a response time of less
than a nanosecond. Their low inductance virtually eliminates overshoot voltage due to package inductance.
5 Bump package
Features
applications
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Compatible with IEC 61000-4-2 (ESD): Air 15kV, Contact 8kV
Compatible with IEC 61000-4-4 (EFT): 40A, 5/50ns
ESD Protection > 25 kilovolts
Unidirectional Configuration
Low Capacitance: 15pF
Protection for 4 Data Lines
RoHS Compliant
REACH Compliant
SMART Phones
I/O Port Interfaces
Portable Devices
Ground Positioning Systems (GPS)
SMART Cards
Mechanical characteristics
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5 Bump Flip Chip Package
Approximate Weight: 0.73 milligrams
Lead-Free Plating
Solder Reflow Temperature:
Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C
Flammability Rating UL 94V-0
8mm Tape per EIA Standard 481
circuit diagram
G1
05210.R4 1/11
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05210
ESD4-LFC
Only One Name Means ProTek’Tion™
typical device characteristics
MAXIMUM RATINGS @ 25°C Unless Otherwise Specified
PARAMETER
DC Power Rating
Operating Temperature
Storage Temperature
SYMBOL
VALUE
UNITS
P
200
mW
TA
-40 to 85
°C
TSTG
-55 to 150
°C
ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified
PART
NUMBER
ESD4-LFC
marking
code
RATED
STAND-OFF
VOLTAGE
MINIMUM
BREAKDOWN
VOLTAGE
MAXIMUM
CLAMPING
VOLTAGE
TYPICAL
FORWARD
VOLTAGE
MAXIMUM
LEAKAGE
CURRENT
V WM
VOLTS
@ 1mA
V(BR)
VOLTS
@ I P = 10mA
VC
VOLTS
@ 10mA
Vf
VOLTS
@ 3.3v
ID
µA
TYPICAL
CAPACITANCE
PER LINE
(Note 1)
@2.5V, 1MHz
C
pF
5.0
6.0
8
0.8
0.1
15
4L
notes
1. ±20% tolerance.
figure 1
capacitance vs reverse voltage
(Normalized to Capactiance at 2.5v dc & 25°c)
Cj - Capacitance (Normalized)
1.6
1.2
0.8
0.4
0
0
1
2
3
4
5
6
VR - Reverse Voltage - Volts
05210.R4 1/11
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05210
ESD4-LFC
Only One Name Means ProTek’Tion™
SOLDER REFLOW INFORMATION
printed circuit board recommendations
parameter
value
Pad Size on PCB
0.275mm
Pad Shape
Round
Pad Definition
Non-Solder Mask Defined Pads
Solder Mask Opening
0.325mm Round
Solder Stencil Thickness
0.150mm
Solder Stencil Aperture Opening (Laser cut, 5% tapered walls)
0.330mm Round
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance - Edge To Corner Ball
±50µm
Solder Ball Side Coplanarity
±20µm
Maximum Dwell Time Above Liquidous (183°C)
60 seconds
Soldering Maximum Temperature
270°C
Requirements
recommended non-solder mask
defined pad illustration
Temperature:
TP for Lead-Free (Sn/Ag/Cu): 260-270°C
TP for Tin-Lead: 240-245°C
Preheat time and temperature depends on solder paste and flux activation temperature, component size, weight, surface area and plating.
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Mask Opening
0.325mm DIA.
Solder Stencil Opening
0.330mm DIA.
Maximum Solder Reflow
(35-53°C Above Maximum Solder Melt Temp)
TP
Solder Melt
(Maximum Temp)
Temperature - °C
Ramp-Up
Ramp-Down
Preheat
(Stay Below Flux Activation Temp)
30-60 seconds
05210.R4 1/11
Ramp-Up
15 seconds
(Minimize)
Page 3
Solder-Time
15-20 seconds
Ramp-Down
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05210
ESD4-LFC
Only One Name Means ProTek’Tion™
5 BUMP package information
BOTTOM VIEW
A
outline dimensions
dim
millimeters
inches
min
max
min
max
A
0.914
1.016
0.036
0.040
B
1.285
1.375
0.0506
0.0541
C
0.495
0.505
0.0195
0.0199
D
0.245
0.255
0.0096
0.0100
E
0.430
0.440
0.0169
0.0173
F
0.430
0.440
0.0169
0.0173
G
0.180
0.280
0.0071
0.0110
H
0.180
0.280
0.0071
0.0110
I
0.432
0.559
0.017
0.022
J
0.330
0.457
0.013
0.018
G
C
SIDE VIEW
E
O
F
G
B
H
I
1
2
I
SOLDER BUMPS
D
Notes
J
1. Controlling dimensions in millimeters.
2. Solder bumps (63/67 Sn/Pb) 0.30 dia.
layout dimensions
dim
millimeters
A
inches
min
max
min
max
A
0.25
0.25
0.010
0.010
B
0.50
0.50
0.020
0.020
C
0.86
0.86
0.034
0.034
Non solder mask
defined pad 0.275mm
C
Notes
Solder mask opening
0.325mm
Solder stencil
opening 0.330mm
1. Controlling dimensions in millimeters
B
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05210
ESD4-LFC
Only One Name Means ProTek’Tion™
TAPE AND REEL information
D
t
P2
Top Cover
Tape
10 Pitches Cumulative
Tolerance on tape ± 0.2
E
P0
A0
F
K0
W
B0
Orientation Dot
P
User Direction of Feed
specifications
Reel Dia.
Tape
Width
A0
178(7”)
8
1.08±0.05
B0
K0
D
E
F
W
P0
P2
P
tmax
1.60±0.05 0.72 ± 0.05 1.50 ± 0.10 1.75 ± 0.10 3.50 ± 0.05 8.00 ± 0.30 4.00 ± 0.10 2.00 ± 0.05 4.00 ± 0.10 0.20±0.025
Notes
1.
2.
3.
4.
Dimensions in millimeters.
Top view of tape. Solder bumps are face down in tape package.
Surface mount product is taped and reeled in accordance with EIA 481.
8mm plastic tape: 7” Reels - 3,000 pieces per reel.
Package outline, pad layout and tape specifications per document number 06055.R2 9/09.
ORDERING INFORMATION
base PART NUMBER
LEADFREE SUFFIX
TAPE SUFFIX
QTY/REEL
REEL SIZE
TUBE qty
ESD4-LFC
-LF
-T73
3,000
7”
n/a
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05210
ESD4-LFC
Only One Name Means ProTek’Tion™
company information
COMPANY PROFILE
ProTek Devices, based in Tempe, Arizona USA, is a manufacturer of Transient Voltage Suppression (TVS) products designed specifically for
the protection of electronic systems from the effects of lightning, Electrostatic Discharge (ESD), Nuclear Electromagnetic Pulse (NEMP), inductive switching and EMI/RFI. With over 25 years of engineering and manufacturing experience, ProTek designs TVS devices that provide
application specific protection solutions for all electronic equipment/systems.
ProTek Devices Analog Products Division, also manufactures analog interface, control, RF and power management products.
CONTACT US
Corporate Headquarters
2929 South Fair Lane
Tempe, Arizona 85282
USA
By Telephone
General: 602-431-8101
Sales: 602-414-5109
Customer Service: 602-414-5114
By Fax
General: 602-431-2288
By E-mail:
Sales: [email protected]
Customer Service: [email protected]
Technical Support: [email protected]
Web
www.protekdevices.com
www.protekanalog.com
COPYRIGHT © ProTek Devices 2007 - This literature is subject to all applicable copyright laws and is not for resale in any manner.
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice.
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice and that the final judgement concerning selection and specifications is the buyer’s and that in furnishing engineering
and technical assistance. ProTek assumes no responsibility with respect to the selection or specifications of such products. ProTek makes no warranty, representation or guarantee regarding the suitability of
its products for any particular purpose, nor does ProTek assume any liability arising out of the application or use of any product or circuit and specifically disclaims any and all liability without limitation special,
consequential or incidental damages.
LIFE SUPPORT POLICY: ProTek Devices products are not authorized for use in life support systems without written consent from the factory.
PATENT INFORMATION: This device is patented under U.S. Patent No. Des. “D456,367S”.
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