Cypress CY7C374I-66AI Ultralogic 128-macrocell flash cpld Datasheet

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CY7C374i
UltraLogic™ 128-Macrocell Flash CPLD
Features
Functional Description
•
•
•
•
128 macrocells in eight logic blocks
64 I/O pins
5 dedicated inputs including 4 clock pins
In-System Reprogrammable (ISR™) Flash technology
— JTAG interface
• Bus Hold capabilities on all I/Os and dedicated inputs
• No hidden delays
• High speed
— fMAX = 125 MHz
— tPD = 10 ns
— tS = 5.5 ns
— tCO = 6.5 ns
• Fully PCI compliant
• 3.3V or 5.0V I/O operation
• Available in 84-pin PLCC, 84-pin CLCC, and 100-pin
TQFP packages
• Pin compatible with the CY7C373i
The CY7C374i is an In-System Reprogrammable Complex
Programmable Logic Device (CPLD) and is part of the
FLASH370i™ family of high-density, high-speed CPLDs. Like
all members of the FLASH370i family, the CY7C374i is designed to bring the ease of use as well as PCI Local Bus Specification support and high performance of the 22V10 to
high-density CPLDs.
Like all of the UltraLogic™ FLASH370i devices, the CY7C374i
is electrically erasable and In-System Reprogrammable (ISR),
which simplifies both design and manufacturing flows thereby
reducing costs. The Cypress ISR function is implemented
through a JTAG serial interface. Data is shifted in and out
through the SDI and SDO pin. The ISR interface is enabled
using the programming voltage pin (ISREN). Additionally, because of the superior routability of the FLASH370i devices, ISR
often allows users to change existing logic designs while simultaneously fixing pinout assignments.
The 128 macrocells in the CY7C374i are divided between
eight logic blocks. Each logic block includes 16 macrocells, a
72 x 86 product term array, and an intelligent product term
allocator.
CLOCK
INPUTS INPUTS
Logic Block Diagram
1
4
INPUT/CLOCK
MACROCELLS
4
INPUT
MACROCELL
4
I/O0–I/O7
8 I/Os
LOGIC
BLOCK
A
8 I/Os
I/O8–I/O15
LOGIC
BLOCK
8 I/Os
LOGIC
BLOCK
C
8 I/Os
I/O24–I/O31
LOGIC
BLOCK
D
LOGIC
BLOCK
36
PIM
16
B
I/O16–I/O23
36
LOGIC
BLOCK
36
16
16
36
36
16
16
36
36
8 I/Os
I/O48–I/O55
G
LOGIC
BLOCK
8 I/Os
I/O40–I/O47
F
8 I/Os
LOGIC
BLOCK
I/O32–I/O39
E
16
16
I/O56–I/O63
H
16
36
8 I/Os
7C374i-1
32
32
Selection Guide
7C374i–125
7C374i–100
7C374i–83
7C374i–66
7C374iL–66
10
12
15
20
20
Minimum Set-Up, tS (ns)
5.5
6
8
10
10
Maximum Clock to Output[1], tCO (ns)
6.5
7
8
10
10
Typical Supply Current, ICC (mA)
125
125
125
125
75
[1]
Maximum Propagation Delay , tPD (ns)
Note:
1. The 3.3V I/O mode timing adder, t3.3IO, must be added to this specification when VCCIO = 3.3V.
Cypress Semiconductor Corporation
•
3901 North First Street
•
San Jose
• CA 95134 •
408-943-2600
October 1995 – Revised December 19, 1997
CY7C374i
Pin Configurations
I/O 63
I/O 62
I/O
61
I/O 60
I/O
59
I/O
58
I/O
57
I/O
56
GND
I/O55
I/O54 /SDI
I/O53
I/O52
I/O51
I/O50
I/O49
I/O48
CLK3/I 4
GND
VCCIO
CLK2/I 3
I/O47
I/O46
I/O45
I/O44
I/O43
I/O42
I/O41
I/O40
I/O26 /SMODE
I/O27
I/O28
I/O29
I/O30
I/O31
I2
VCCIO
GND
VCCINT
I/O32
I/O33
I/O34
I/O35
I/O36
I/O37
I/O38 /SDO
I/O39
GND
11 10 9 8 7 6 5 4 3 2 1 84 83 82 81 80 79 78 77 76 75
74
12
73
13
72
14
71
15
70
16
69
17
68
18
67
19
66
20
65
21
64
22
63
23
62
24
61
25
60
26
59
27
58
28
57
29
56
30
55
31
54
32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53
I/O24
I/O25
I/O8
I/O9
I/O10 /SCLK
I/O11
I/O12
I/O13
I/O14
I/O15
CLK0/I 0
VCCIO
GND
CLK1/I 1
I/O16
I/O17
I/O18
I/O19
I/O20
I/O21
I/O22
I/O23
GND
I/O 2
I/O 1
I/O 0
VCCIO
GND
VCCINT
ISR EN
GND
I/O 7
I/O 6
I/O 5
I/O 4
I/O 3
PLCC
Top View
7C374i-2
PGA
Bottom View
L
I/O23
I/O25
I/O26 I/O28
SMODE
I/O31
I/O33
VCC
I/O34
I/O36
I/O37
I/O39
K
I/O21
GND
I/O24
I/O30
I2
I/O32
I/O35
I/O38 GND
SDO
I/O41
J
I/O20
I/O22
I/O29
VCC
GND
I/O40
I/O42
H
I/O18
I/O19
I/O43
I/O44
G
CLK1
/ I1
I/O16
GND
CLK2
/I3
I/O46
I/O47
F
I/O17
CLK0
/I0
VCC
VCC
I/O45
GND
E
I/O15
I/O14
I/O13
I/O49
I/O48
CLK3
/I4
D
I/O12
I/O11
I/O51
I/O50
C
I/O10
I/O8
SCLK
B
I/O9
GND
I/O6
A
I/O7
I/O5
1
2
I/O27
I/O1
VCC
ISREN
I/O3
I/O0
I/O61
I/O62
I/O59
I/O56
GND
I/O53
I/O4
I/O2
VCC
GND
I/O63
I/O60
I/O58
I/O57
I/O55
3
4
5
6
8
9
10
7
I/O54
I/O52
SDI
11
7C374i–3
2
CY7C374i
Pin Configurations (continued)
I/O 62
I/O
61
I/O 60
I/O 59
I/O
58
I/O
57
I/O
56
GND
NC
I/O 63
VCCINT
NC
GND
ISREN
I/O 0
VCCIO
I/O 4
I/O 3
I/O 2
I/O 1
I/O
7
I/O 6
I/O 5
NC
VCCIO
TQFP
Top View
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
SDI
VCCIO
I/O55
I/O54
I/O53
I/O52
I/O51
I/O50
I/O49
I/O48
CLK3 /I4
GND
NC
VCCIO
CLK2 /I3
I/O47
I/O46
I/O45
I/O44
I/O43
I/O42
I/O41
I/O40
GND
NC
SDO
VCCIO
NC
GND
VCCINT
I/O32
I/O33
I/O34
I/O35
I/O36
I/O37
I/O38
I/O39
VCCIO
I/O30
I/O31
I2
26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
SMODE
GND
I/O24
I/O25
I/O26
I/O27
I/O28
I/O29
I/O 62
I/O
61
I/O 60
I/O
59
I/O
58
I/O
57
I/O
56
I/O 63
11 10 9 8 7 6 5 4 3 2 1 84 83 82 81 80 79 78 77 76 75
74
12
73
13
72
14
71
15
70
16
69
17
68
18
67
19
66
20
65
21
64
22
63
23
62
24
61
25
60
26
59
27
58
28
57
29
56
30
55
31
54
32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53
I/O26 /SMODE
I/O27
I/O28
I/O29
I/O30
I/O31
I2
VCC
GND
VCC
I/O32
I/O33
I/O34
I/O35
I/O36
I/O37
I/O38 /SDO
I/O39
GND
I/O8
I/O9
I/O10 /SCLK
I/O11
I/O12
I/O13
I/O14
I/O15
CLK0/I 0
VCC
GND
CLK1/I 1
I/O16
I/O17
I/O18
I/O19
I/O20
I/O21
I/O22
I/O23
GND
I/O 2
I/O 1
I/O 0
VCC
GND
VCC
ISREN
GND
I/O 7
I/O 6
I/O 5
I/O 4
I/O 3
CLCC
Top View
I/O24
I/O25
SCLK
GND
I/O8
I/O9
I/O10
I/O11
I/O12
I/O13
I/O14
I/O15
CLK0 /I0
VCCIO
N/C
GND
CLK1 /I1
I/O16
I/O17
I/O18
I/O19
I/O20
I/O21
I/O22
I/O23
VCCIO
NC
GND
I/O55
I/O54 /SDI
I/O53
I/O52
I/O51
I/O50
I/O49
I/O48
CLK3/I 4
GND
VCC
CLK2/I 3
I/O47
I/O46
I/O45
I/O44
I/O43
I/O42
I/O41
I/O40
7C374i-2
3
7C374i-4
CY7C374i
Functional Description (continued)
boring macrocell. The output of all buried macrocells is sent
directly to the PIM regardless of its configuration.
The logic blocks in the FLASH370i architecture are connected
with an extremely fast and predictable routing resource—the
Programmable Interconnect Matrix (PIM). The PIM brings flexibility, routability, speed, and a uniform delay to the interconnect.
Programmable Interconnect Matrix
The Programmable Interconnect Matrix (PIM) connects the
eight logic blocks on the CY7C374i to the inputs and to each
other. All inputs (including feedbacks) travel through the PIM.
There is no speed penalty incurred by signals traversing the
PIM.
Like all members of the FLASH370i family, the CY7C374i is rich
in I/O resources. Every two macrocells in the device feature
an associated I/O pin, resulting in 64 I/O pins on the
CY7C374i. In addition, there is one dedicated input and four
input/clock pins.
Programming
For an overview of ISR programming, refer to the F LASH370i
Family data sheet and for ISR cable and software specifications, refer to ISR data sheets. For a detailed description of
ISR capabilities, refer to the Cypress application note, “An Introduction to In System Reprogramming with FLASH370i.”
Finally, the CY7C374i features a very simple timing model.
Unlike other high-density CPLD architectures, there are no
hidden speed delays such as fanout effects, interconnect delays, or expander delays. Regardless of the number of resources used or the type of application, the timing parameters
on the CY7C374i remain the same.
PCI Compliance
The FLASH370i family of CMOS CPLDs are fully compliant with
the PCI Local Bus Specification published by the PCI Special
Interest Group. The simple and predictable timing model of
FLASH370i ensures compliance with the PCI AC specifications
independent of the design. On the other hand, in CPLD and
FPGA architectures without simple and predictable timing, PCI
compliance is dependent upon routing and product term distribution.
Logic Block
The number of logic blocks distinguishes the members of the
FLASH370i family. The CY7C374i includes eight logic blocks.
Each logic block is constructed of a product term array, a product term allocator, and 16 macrocells.
Product Term Array
The product term array in the FLASH370i logic block includes
36 inputs from the PIM and outputs 86 product terms to the
product term allocator. The 36 inputs from the PIM are available in both positive and negative polarity, making the overall
array size 72 x 86. This large array in each logic block allows
for very complex functions to be implemented in single passes
through the device.
3.3V or 5.0V I/O Operation
The FLASH370i family can be configured to operate in both 3.3V
and 5.0V systems. All devices have two sets of VCC pins: one
set, VCCINT, for internal operation and input buffers, and
another set, VCCIO, for I/O output drivers. VCCINT pins must
always be connected to a 5.0V power supply. However, the
VCCIO pins may be connected to either a 3.3V or 5.0V power
supply, depending on the output requirements. When V CCIO
pins are connected to a 5.0V source, the I/O voltage levels are
compatible with 5.0V systems.
When V CCIO pins are
connected to a 3.3V source, the input voltage levels are
compatible with both 5.0V and 3.3V systems, while the output
voltage levels are compatible with 3.3V systems. There will be
an additional timing delay on all output buffers when operating
in 3.3V I/O mode. The added flexibility of 3.3V I/O capability
is available in commercial and industrial temperature ranges.
Product Term Allocator
The product term allocator is a dynamic, configurable resource
that shifts product terms to macrocells that require them. Any
number of product terms between 0 and 16 inclusive can be
assigned to any of the logic block macrocells (this is called
product term steering). Furthermore, product terms can be
shared among multiple macrocells. This means that product
terms that are common to more than one output can be implemented in a single product term. Product term steering and
product term sharing help to increase the effective density of
the FLASH370i CPLDs. Note that product term allocation is
handled by software and is invisible to the user.
Bus Hold Capabilities on all I/Os and Dedicated Inputs
Half of the macrocells on the CY7C374i have I/O pins associated with them. The input to the macrocell is the sum of between 0 and 16 product terms from the product term allocator.
The I/O macrocell includes a register that can be optionally
bypassed, polarity control over the input sum-term, and two
global clocks to trigger the register. The macrocell also features a separate feedback path to the PIM so that the register
can be buried if the I/O pin is used as an input.
In addition to ISR capability, a new feature called bus-hold has
been added to all FLASH370i I/Os and dedicated input pins.
Bus-hold, which is an improved version of the popular internal
pull-up resistor, is a weak latch connected to the pin that does
not degrade the device’s performance. As a latch, bus-hold
recalls the last state of a pin when it is three-stated, thus reducing system noise in bus-interface applications. Bus-hold
additionally allows unused device pins to remain unconnected
on the board, which is particularly useful during prototyping as
designers can route new signals to the device without cutting
trace connections to VCC or GND.
Buried Macrocell
Design Tools
The buried macrocell is very similar to the I/O macrocell.
Again, it includes a register that can be configured as combinatorial, as a D flip-flop, a T flip-flop, or a latch. The clock for
this register has the same options as described for the I/O
macrocell. One difference on the buried macrocell is the addition of input register capability. The user can program the buried macrocell to act as an input register (D-type or latch)
whose input comes from the I/O pin associated with the neigh-
Development software for the CY7C371i is available from Cypress’s Warp2®, Warp2Sim™, and Warp3® software packages. All of these products are based on the IEEE-standard
VHDL language. Cypress also actively supports third-party design tools from companies such as Synopsys, Mentor Graphics, Cadence, and Synario. Please refer to third-party tool support for further information.
I/O Macrocell
4
CY7C374i
Maximum Ratings
Static Discharge Voltage ........................................... >2001V
(per MIL-STD-883, Method 3015)
(Above which the useful life may be impaired. For user guidelines, not tested.)
Latch-Up Current..................................................... >200 mA
Storage Temperature ................................. –65°C to +150°C
Operating Range
Ambient Temperature with
Power Applied ............................................. –55°C to +125°C
Range
Ambient
Temperature
VCC
VCCINT
Supply Voltage to Ground Potential ............... –0.5V to +7.0V
Commercial
0°C to +70°C
5V ± .25V
5V ± .25V
OR
3.3V ± .3V
Industrial
−40°C to +85°C
5V ± .5V
5V ± .5V
OR
3.3V ± .3V
Military[2]
–55°C to +125°C
5V ± .5V
DC Voltage Applied to Outputs
in High Z State ............................................... –0.5V to +7.0V
DC Input Voltage............................................ –0.5V to +7.0V
DC Program Voltage .....................................................12.5V
Output Current into Outputs......................................... 16 mA
VCCIO
Electrical Characteristics Over the Operating Range[3, 4]
Parameter
VOH
Description
Output HIGH Voltage
Test Conditions
VCC = Min.
Min.
[5]
IOH = –3.2 mA (Com’l/Ind)
Typ.
Max.
2.4
V
IOH = –2.0 mA (Mil)
VOHZ
VOL
Output HIGH Voltage
with Output Disabled[9]
Output LOW Voltage
VCC = Max.
VCC = Min.
Unit
V
IOH = 0 µA (Com’l/Ind)
4.0
V
IOH = –50 µA (Com’l/Ind)[5, 6]
3.6
V
0.5
V
[5, 6]
IOL = 16 mA (Com’l/Ind)
[5]
IOL = 12 mA (Mil)
V
[7]
VIH
Input HIGH Voltage
Guaranteed Input Logical HIGH voltage for all inputs
2.0
7.0
V
VIL
Input LOW Voltage
Guaranteed Input Logical LOW voltage for all inputs[7]
–0.5
0.8
V
IIX
Input Load Current
VI = Internal GND, VI = VCC
–10
+10
µA
IOZ
Output Leakage Current
VCC = Max., VO = GND or VO = VCC, Output Disabled
–50
+50
µA
–125
µA
–160
mA
125
200
mA
Com’l “L” –66
75
125
mA
Military
125
250
mA
VCC = Max., VO = 3.3V, Output Disabled
IOS
Output Short
Circuit Current[8, 9]
VCC = Max., VOUT = 0.5V
ICC
Power Supply Current
VCC = Max., IOUT = 0 mA,
f = 1 MHz, VIN = GND, VCC
[6]
0
–70
–30
Com’l/Ind.
[10]
IBHL
Input Bus Hold LOW
Sustaining Current
VCC = Min., VIL = 0.8V
+75
µA
IBHH
Input Bus Hold HIGH
Sustaining Current
VCC = Min., VIH = 2.0V
–75
µA
IBHLO
Input Bus Hold LOW
Overdrive Current
VCC = Max.
+500
µA
IBHHO
Input Bus Hold HIGH
Overdrive Current
VCC = Max.
–500
µA
Notes:
2. TA is the “instant on” case temperature.
3. See the last page of this specification for Group A subgroup testing information.
4. If VCCIO is not specified, the device can be operating in either 3.3V or 5V I/O mode; VCC=VCCINT.
5. IOH = –2 mA, I OL = 2 mA for SDO.
6. When the I/O is three-stated, the bus-hold circuit can weakly pull the I/O to a maximum of 4.0V if no leakage current is allowed. This voltage is lowered significantly
by a small leakage current. Note that all I/Os are three-stated during ISR programming. Refer to the application note “Understanding Bus Hold” for additional
information.
7. These are absolute values with respect to device ground. All overshoots due to system or tester noise are included.
8. Not more than one output should be tested at a time. Duration of the short circuit should not exceed 1 second. VOUT = 0.5V has been chosen to avoid test
problems caused by tester ground degradation.
9. Tested initially and after any design or process changes that may affect these parameters.
10. Measured with 16-bit counter programmed into each logic block.
5
CY7C374i
Capacitance[9]
Parameter
Description
Test Conditions
CI/O[11, 12]
Input Capacitance
VIN = 5.0V at f=1 MHz
CCLK
Clock Signal Capacitance
VIN = 5.0V at f = 1 MHz
Min.
Max.
Unit
8
pF
5
12
pF
Inductance[9]
Parameter
L
Description
Maximum Pin Inductance
Test Conditions
100-PinTQFP
84-Lead
PLCC
84-Lead
CLCC
Unit
8
8
5
nH
VIN = 5.0V at f = 1 MHz
Endurance Characteristics[9]
Parameter
N
Description
Maximum Reprogramming Cycles
Test Conditions
Max.
Unit
Normal Programming Conditions
100
Cycles
AC Test Loads and Waveforms
238Ω (COM'L)
319Ω (MIL)
238Ω (COM'L)
319Ω (MIL)
5V
5V
OUTPUT
90%
170Ω (COM'L)
236Ω (MIL)
OUTPUT
170Ω (COM'L)
236Ω (MIL)
35 pF
INCLUDING
JIG AND
SCOPE
ALL INPUT PULSES
3.0V
5 pF
GND
Equivalent to:
OUTPUT
10%
<2ns
INCLUDING
JIG AND
SCOPE
(a)
90%
10%
<2ns
(c)
(b)
7C374i-6
7C374i-5
THÉVENIN EQUIVALENT
99Ω (COM'L)
136Ω (MIL) 2.08V (COM'L)
2.13V (MIL)
Parameter[13]
VX
tER(–)
1.5V
Output Waveform Measurement Level
VOH
–0.5V
tER(+)
2.6V
–0.5V
VX
VX
VOH
tEA(+)
1.5V
–0.5V
VOH
VX
tEA(–)
Vthc
VX
–0.5V
Notes:
11. CI/O for the CLCC package are 12 pF Max
12. CI/O for dedicated Inputs, and for I/O pins with JTAG functionality is 12 pF Max., and for ISREN is 15 pF Max.
13. tER measured with 5-pF AC Test Load and tEA measured with 35-pF AC Test Load.
6
VOH
CY7C374i
Switching Characteristics Over the Operating Range[14]
Parameter
Description
7C374i–125
7C374i–100
7C374i–83
7C374i–66
7C374iL–66
Min.
Min.
Min.
Min.
Max.
Max.
Max.
Max.
Unit
Combinatorial Mode Parameters
tPD
Input to Combinatorial Output[1]
10
12
15
20
ns
tPDL
Input to Output Through Transparent Input or
Output Latch[1]
13
15
18
22
ns
tPDLL
Input to Output Through Transparent Input
and Output Latches[1]
15
16
19
24
ns
tEA
Input to Output Enable[1]
14
16
19
24
ns
tER
Input to Output Disable
14
16
19
24
ns
Input Registered/Latched Mode Parameters
tWL
Clock or Latch Enable Input LOW Time[9]
3
3
4
5
ns
tWH
Clock or Latch Enable Input HIGH Time[9]
3
3
4
5
ns
tIS
Input Register or Latch Set-Up Time
2
2
3
4
ns
tIH
Input Register or Latch Hold Time
2
2
3
4
ns
tICO
Input Register Clock or Latch Enable to Combinatorial Output[1]
14
16
19
24
ns
tICOL
Input Register Clock or Latch Enable to Output Through Transparent Output Latch [1]
16
18
21
26
ns
6.5
7
8
10
ns
Output Registered/Latched Mode Parameters
tCO
Clock or Latch Enable to Output[1]
tS
Set-Up Time from Input to Clock or Latch Enable
tH
Register or Latch Data Hold Time
tCO2
Output Clock or Latch Enable to Output Delay
(Through Memory Array) [1]
tSCS
Output Clock or Latch Enable to Output Clock
or Latch Enable (Through Memory Array)
8
10
12
15
ns
tSL
Set-Up Time from Input Through Transparent
Latch to Output Register Clock or Latch Enable
10
12
15
20
ns
tHL
Hold Time for Input Through Transparent
Latch from Output Register Clock or Latch
Enable
0
0
0
0
ns
fMAX1
Maximum Frequency with Internal Feedback
(Least of 1/tSCS, 1/(tS + tH), or 1/tCO)[9]
125
100
83
66
MHz
fMAX2
Maximum Frequency Data Path in Output
Registered/Latched Mode (Lesser of 1/(tWL +
tWH), 1/(tS + tH), or 1/tCO)
158.3
143
125
100
MHz
fMAX3
Maximum Frequency with External Feedback
(Lesser of 1/(tCO + tS) and 1/(tWL + tWH))
83.3
76.9
67.5
50
MHz
tOH–tIH
37x
Output Data Stable from Output Clock Minus
Input Register Hold Time for 7C37x[9, 15]
0
0
0
0
ns
8
10
12
15
ns
125
100
83.3
66.6
MHz
5.5
6
0
8
0
14
10
0
16
ns
0
19
ns
24
ns
Pipelined Mode Parameters
tICS
Input Register Clock to Output Register Clock
fMAX4
Maximum Frequency in Pipelined Mode
(Least of 1/(tCO + tIS), 1/tICS, 1/(tWL + tWH),
1/(tIS + tIH), or 1/tSCS)
Notes:
14. All AC parameters are measured with 16 outputs switching and 35-pF AC Test Load.
15. This specification is intended to guarantee interface compatibility of the other members of the CY7C370i family with the CY7C374i. This specification is met
for the devices operating at the same ambient temperature and at the same power supply voltage.
7
CY7C374i
Switching Characteristics Over the Operating Range[14] (continued)
Parameter
Description
7C374i–125
7C374i–100
7C374i–83
7C374i–66
7C374iL–66
Min.
Min.
Min.
Min.
Max.
Max.
Max.
Max.
Unit
Reset/Preset Parameters
tRW
Asynchronous Reset Width[9]
10
12
15
20
ns
tRR
Asynchronous Reset Recovery Time[9]
12
14
17
22
ns
[1]
tRO
Asynchronous Reset to Output
tPW
Asynchronous Preset Width[9]
16
10
tPR
Asynchronous Preset Recovery Time
tPO
Asynchronous Preset to Output[1]
[9]
18
12
12
14
16
21
15
17
18
26
ns
20
ns
22
21
ns
26
ns
Tap Controller Parameter
fTAP
Tap Controller Frequency
500
500
500
500
kHz
3.3V I/O Mode Parameters
t3.3IO
3.3V I/O mode timing adder
1
1
1
1
ns
Switching Waveforms
Combinatorial Output
INPUT
tPD
COMBINATORIAL
OUTPUT
7C374i-7
Registered Output
INPUT
tH
tS
CLOCK
tCO
REGISTERED
OUTPUT
tWL
tWH
CLOCK
7C374i-8
Latched Output
INPUT
tS
tH
LATCH ENABLE
tPDL
tCO
LATCHED
OUTPUT
7C374i-9
8
CY7C374i
Switching Waveforms (continued)
Registered Input
REGISTERED
INPUT
tIH
tIS
INPUT REGISTER
CLOCK
tICO
COMBINATORIAL
OUTPUT
tWL
tWH
CLOCK
7C374i-10
Latched Input
LATCHED INPUT
tIS
tIH
LATCH ENABLE
tPDL
tICO
COMBINATORIAL
OUTPUT
tWH
tWL
LATCH ENABLE
7C374i-11
Latched Input and Output
LATCHED INPUT
tPDLL
LATCHED
OUTPUT
tICOL
tSL
tHL
INPUT LATCH
ENABLE
tICS
OUTPUT LATCH
ENABLE
tWH
tWL
LATCH ENABLE
7C374i-12
9
CY7C374i
Switching Waveforms (continued)
Asynchronous Reset
tRW
INPUT
tRO
REGISTERED
OUTPUT
tRR
CLOCK
7C374i-13
Asynchronous Preset
tPW
INPUT
tPO
REGISTERED
OUTPUT
tPR
CLOCK
7C374i-14
Output Enable/Disable
INPUT
tER
tEA
OUTPUTS
7C374i-16
10
CY7C374i
Ordering Information
Speed
(MHz)
125
100
83
66
Ordering Code
Package
Name
CY7C374i–125AC
A100
CY7C374i–125JC
J83
CY7C374i–100AC
A100
CY7C374i–100JC
J83
CY7C374i–83AC
A100
CY7C374i–83JC
J83
CY7C374i–83AI
A100
Package Type
100-Pin Thin Quad Flat Pack
Operating
Range
Commercial
84-Lead Plastic Leaded Chip Carrier
100-Pin Thin Quad Flat Pack
Commercial
84-Lead Plastic Leaded Chip Carrier
100-Pin Thin Quad Flat Pack
Commercial
84-Lead Plastic Leaded Chip Carrier
100-Pin Thin Quad Flat Pack
CY7C374i–83JI
J83
84-Lead Plastic Leaded Chip Carrier
CY7C374i-83GMB
G84
84-Pin Ceramic Pin Grid Array
CY7C374i–83YMB
Y84
84-Pin Ceramic Leaded Chip Carrier
CY7C374i–66AC
A100
100-Pin Thin Quad Flat Pack
CY7C374i–66JC
J83
CY7C374i–66AI
A100
CY7C374i–66JI
J83
84-Lead Plastic Leaded Chip Carrier
CY7C374i-66GMB
G84
84-Pin Ceramic Pin Grid Array
CY7C374i–66YMB
Y84
84-Pin Ceramic Leaded Chip Carrier
CY7C374iL–66AC
A100
100-Pin Thin Quad Flat Pack
CY7C374iL–66JC
J83
Industrial
Military
Commercial
84-Lead Plastic Leaded Chip Carrier
100-Pin Thin Quad Flat Pack
Industrial
Military
Commercial
84-Lead Plastic Leaded Chip Carrier
MILITARY SPECIFICATIONS
Group A Subgroup Testing
Switching Characteristics
DC Characteristics
Parameter
Subgroups
tPD
9, 10, 11
Parameter
Subgroups
tPDL
9, 10, 11
VOH
1, 2, 3
tPDLL
9, 10, 11
VOL
1, 2, 3
tCO
9, 10, 11
VIH
1, 2, 3
tICO
9, 10, 11
VIL
1, 2, 3
tICOL
9, 10, 11
IIX
1, 2, 3
tS
9, 10, 11
IOZ
1, 2, 3
tSL
9, 10, 11
1, 2, 3
tH
9, 10, 11
tHL
9, 10, 11
tIS
9, 10, 11
tIH
9, 10, 11
tICS
9, 10, 11
tEA
9, 10, 11
tER
9, 10, 11
ICC1
Document #: 38-00496-C
ISR, UltraLogic, FLASH370, FLASH370i, and Warp2Sim are trademarks of Cypress Semiconductor Corporation.
Warp2 and Warp3 are registered trademarks of Cypress Semiconductor Corporation.
11
CY7C374i
Package Diagrams
100-Pin Thin Quad Flat Pack A100
84-Pin Grid Array (Cavity Up) G84
12
CY7C374i
Package Diagrams (continued)
84-Lead Plastic Leaded Chip Carrier J83
84-Pin Ceramic Leaded Chip Carrier Y84
© Cypress Semiconductor Corporation, 1997. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.
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