Freescale MC146010ED Low power cmos photoelectric smoke detector ic Datasheet

Document Number: MC146010
Rev. 1.0, 5/2007
Freescale Semiconductor
Technical Data
Low Power CMOS Photoelectric
Smoke Detector IC
The MC146010 is an advanced smoke detector component containing
sophisticated very-low power analog and digital circuitry. The IC, when used with
an infrared photoelectric chamber and a small number of external components,
will detect smoke by sensing scattered light from smoke particles. When
detection occurs, a pulsating alarm is sounded via on-chip push-pull drivers and
an external piezoelectric transducer.
The MC146010 provides both audible and visual alarms. Upon sensing a
normal smoke level, both alarms will be activated. It is possible to mute the
audible alarm for approximately eight minutes through the Integrated Mute
Function (IMF), although the LED will continue to flash at a high rate. This feature
is resettable through a pushbutton test. The IMF feature will be overridden by
remote smoke, high smoke level, timeout or reset.
The Alarm memory feature will allow for identification of an alarming detector.
Through a pushbutton test, the LED will flash rapidly if there was a previous
alarm condition detected at the unit.
The variable-gain photo amplifier allows direct interface to IR detector
(photodiode). The gain settings are determined by external capacitors and
compensation resistors. A two stage speed-up is incorporated into the smoke
monitor to minimize time and help reduce false triggering. Further reduction of
false triggering is also addressed with the double sample chamber sensitivity and
double I/O sample.
MC146010
LOW POWER CMOS
PHOTOELECTRIC SMOKE
DETECTOR IC
16
1
ED SUFFIX
PLASTIC DIP
98ASB42431B
16
Features
•
•
•
•
•
•
•
•
•
•
•
Integrated Mute Function (IMF) to Temporarily Disable Horn
Alarm Memory to Help Identify Alarming Unit
Speed-Up Sampling Rate After First Detection of Smoke
Double Sample for Degraded Chamber Sensitivity Monitor
Digital Noise Filter on the I/O Pin
Power-Up and Power-Down RESET
Low-Battery Trip Point Set Externally
Temporal Horn Pattern
Operating Temperature: -10 to 75°C
Operating Voltage Range: 6.0 to 12 V
Average Supply Current: 6.5 µA
ORDERING INFORMATION
Device
Temp. Range
MC146010ED
Package
Plastic Dip
-10 to 75°C
MCZ146010EG/R2
SOIC Package
© Freescale Semiconductor, Inc., 2007. All rights reserved.
1
EG SUFFIX
SOIC PACKAGE
98ASB42567B
C1 C2
2
1
OSC
12
13
R1
16
TEST
STROBE
-
GAIN
AMP
SMOKE
COMP
VDD - 3.5 V
VDD - 4.0 V
REF
+
GATE
ON/OFF
OSC
TIMING
LOGIC
ALARM,
MUTE,
& RESET
LOGIC
LOW SUPPLY
3
ZERO
DETECT
GATE
ON/OFF
7
8
HORN MODULATOR
AND DRIVER
9
10
6
VDD - 5.0 V
REF
11
4
I/O
BRASS
SILVER
FEEDBACK
IRED
LED
COMP
+
LOW-SUPPLY 15
TRIP
PIN 5 = VDD
PIN 14 = VSS
Figure 1. Block Diagram
C1
1
16
TEST/MUTE
C2
2
15
LOW-SUPPLY
TRIP
DETECT
3
14
VSS
STROBE
4
13
R1
VDD
5
12
OSC
IRED
6
11
LED
I/O
7
10
FEEDBACK
BRASS
8
9
SILVER
Figure 2. Pin Assignment (16-Pin DIP)
MC146010
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Freescale Semiconductor
Table 1. Maximum Ratings(1) (Voltages Referenced to VSS)
Symbol
Parameter
VDD
DC Supply Voltage
VIN
DC Input Voltage
IIN
Value
Unit
-0.5 to +12
V
-0.25 to VDD +0.25
-0.25 to VDD +0.25
-0.25 to VDD +10
-15 to +25
-1.0 to VDD +0.25
V
DC Input Current, per Pin
±10
mA
IOUT
DC Output Current, per Pin
±25
mA
IDD
DC Supply Current, VDD/VSS pins
(15 Seconds in Reverse Dir.)
+25 Forward
-150 Reverse
mA
PD
Power Dissipation
1200(2)
350(3)
mW
Tstg
Storage Temperature
-55 to +125
°C
TA
Operating Temperature
-25 to +75
°C
TL
Lead Temperature, 1 mm from case for 10 seconds
260
°C
C1, C2, Detect
Osc, Low-Supply Trip
I/O
Feedback
Test
† in Stil Air, 5 sec.
†† Continuous
1. Maximum ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the limits in
the electrical characteristics tables.
2. Derating: -12 mW/°C from 25°C to 60°C.
3. Derating: -3.5 mW/°C from 25°C to 60°C.
This device contains protection circuitry to guard against
damage due to high static voltages or electric fields.
However, precautions must be taken to avoid applications of
voltages any higher than maximum rated voltages to this
high-impedance circuit. For proper operation, VIN and VOUT
should be constrained to a range of VSS ≤ (VIN or
VOUT) ≤ VDD except for I/O pin which can exceed VDD, and
the Test/Mute input, which can go below VSS.
Unused inputs must always be tied to an appropriate logic
voltage level (e.g. either VSS or VDD). Unused outputs and/or
an unused I/O must be left open.
Table 2. Electrical Characteristics (Voltages Referenced to VSS, TA = -10 to 60°C unless otherwise indicated.)
Symbol
Parameter
Test Condition
Test
Pin
VDD
Min
—
—
Low Supply Trip: VIN = VDD/3
15
—
Max
Unit
6.0
12
V
7.2
7.8
V
VDD
Power Supply Voltage Range
VTH
Supply Threshold Voltage, Low Supply Alarm
IDD
Average Operating Supply Current
(per Package)
(Does not include Current through D3-IR Emitter)
Standby
Configured per Figure 5
—
—
12
9.0
—
—
9.0
7.0
µA
IDD
Peak Supply Current (per Package)
(Does not include IRED Current into base of Q1)
During Strobe On, IRED Off
Configured per Figure 5
During Strobe On, IRED On
Configured per Figure 5
—
12
—
1.25
mA
—
12
—
2.5
VIL
Low Level Input Voltage
I/O
Feedback
Test
7.0
10
16
9.0
9.0
9.0
—
—
—
1.5
2.7
0.5
V
VIM
Mid Level Input Voltage
Test
16
9.0
2.0
VDD-2.0
V
VIH
High Level Input Voltage
I/O
Feedback
Test
7.0
10
16
9.0
9.0
9.0
3.2
6.3
8.5
—
—
—
V
IIN
Input Current
VIN = VSS or VDD
VIN = VSS or VDD
VIN = VSS or VDD
VIN = VSS or VDD
3.12
15
10
16
12
12
12
12
-100
-100
-100
-100
+100
+100
+100
+100
nA
IIL
Test Mode Input Current
VIN = VSS or VDD
16
12
-100
-1.0
µA
OSC, Detect
Low-Supply Trip
Feedback
Test
MC146010
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Freescale Semiconductor
3
Table 2. Electrical Characteristics (Voltages Referenced to VSS, TA = -10 to 60°C unless otherwise indicated.) (continued)
Symbol
IIH
Parameter
Test
Pin
Test Condition
Pull-Down Current
Test
I/O
VIN = VDD
I/O VIN = VDD
I/O VIN = 17 V
16
7.0
VDD
Min
Max
Unit
12
9.0
9.0
12
—
0.5
25
—
-1.0
1.0
100
140
µA
µA
VOL
Low-Level Output Voltage
LED
Silver, Brass
IOUT = 10 mA
IOUT = 16 mA
11
8.9
6.5
6.5
—
—
0.6
1.0
V
VOH
High-Level Output Voltage
Silver, Brass
IOUT = -16 mA
8.9
6.5
5.5
—
V
VOUT
Output Voltage
Strobe
(For Line Regulation, See Pin Descriptions)
Inactive, IOUT = 1.0 µA
Active, IOUT = 100 to 500 µA
(Load Regulation)
4.0
9.0
—
9.0
VDD-0.1
VDD-5.4
—
VDD-4.6
V
IOH
High-Level Output Current
Local Smoke, VOUT = 4.5 V
Local Smoke, VOUT = VSS
(Short Circuit Current)
7.0
—
6.5
12
-4.0
—
—
-16
mA
IOZ
Off-State Output Leakage Current
VOUT = VSS or VDD
11
12
—
±100
nA
VOL
Active
1.0 mA
—
6.5
—
0.5
V
VIC
Common Mode
Voltage Range
C1, C2, Detect
Local Smoke, Pushbutton, or
Chamber Sensitivity Test
—
—
VDD-4.0
VDD-2.0
V
Internal
Local Smoke, Pushbutton, or
Chamber Sensitivity Test
—
—
VDD-3.9
VDD -3.1
V
Internal
Local Smoke, Pushbutton, or
Chamber Sensitivity Test
—
—
VREF0.52
VREF-0.48
V
VREF
Smoke Comparator
Reference Voltage
VREF-HI High Smoke Comparator
Reference Voltage
I/O
LED
* TA = 25°C Only
Table 3. AC Electrical Characteristics (Refer to Timing Diagram Figure 3 and Figure 4. TA = 25°C, VDD = 9.0 V,
Component Values from Figure 5.)
Test Condition
Clocks
Min(1)
Typ(2)
Max(1)
Unit
Free-running Saw tooth
Measured at Pin 12
1.0
9.5
10.5
11.5
ms
No Local Smoke, and No
Remote Smoke
4096
38.9
43
47.1
s
3
Remote Smoke, but No Local
Smoke
—
—
—
—
4
Local Smoke
64
0.6
0.67
0.74
5
Pushbutton Test
64
0.6
0.67
0.74
?
Pushbutton Test with
Alarm Memory
4.0
38
42
46
ms
Remote Smoke but No Local
Smoke
1.0
9.5
10.5
11.5
ms
Smoke Test
1024
9.67
10.8
11.83
s
8
Chamber Sensitivity Test,
Without Local Smoke
4096
38.9
43
47.1
9
Local Smoke, in Speed-Up
128
1.2
1.3
1.5
Pushbutton Test
128
1.2
1.3
1.5
No.
Symbol
1
1/fOSC
2
tLED
6
tw(LED),
tw(stb)
7
tIRED
Parameter
Oscillator period
LED Pulse Period
LED Pulse Width and Strobe Pulse
Width
IRED Pulse Period
10
tw(IRED)
IRED Pulse Width
Tf*
94
—
116
µs
11
tMOD
Silver and Brass Modulation Period
Local or Remote Smoke
32
304
336
368
ms
12
tON/tMOD
Silver and Brass Duty Cycle Local or
Remote Smoke
—
73
75
77
%
MC146010
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Freescale Semiconductor
Table 3. AC Electrical Characteristics (Refer to Timing Diagram Figure 3 and Figure 4. TA = 25°C, VDD = 9.0 V,
Component Values from Figure 5.) (continued)
No.
Symbol
Parameter
Test Condition
Clocks
Min(1)
Typ(2)
Max(1)
Unit
13
tCH
Silver and Brass Chirp Pulse Period
Low Supply or Degraded
Chamber Sensitivity
4096
38.9
43
47.1
s
14
tW(CH)
Silver and Brass Chirp Pulse Width
Low Supply or Degraded
Chamber Sensitivity
1.0
9.5
10.5
11.5
ms
15
tRR
Rising Edge on IO to Smoke Alarm
Response Time
Remote Smoke, No local
smoke
—
—
2 sec(3)
—
16
tstb
Strobe Out Pulse Period
Smoke Test
1024
9.67
10.8
11.83
s
17
Chamber Sensitivity Test
Without Local Smoke
4096
38.9
43
47.1
s
18
Low Supply Test Without Local
Smoke
4096
38.9
43
47.1
s
19
Pushbutton Test/Speed-Up
128
1.2
1.3
1.5
s
Local smoke
—
7.0
10
14
min
20
tMUTE
Mute time
1. Oscillator period T (T = Tr + Tf) is determined by the external components R1, R2 and C3 where Tr = (0.6931)R2*C3 and Tf = (0.6931)R1*C3.
The other timing characteristics are some multiple of the oscillator timing shown in the table. The timing shown should accommodate the
NFPA72, ANSI S3.41, and ISO8201 audible emergency evacuation signals.
2. Typicals are not guaranteed.
3. Time is typical-depends on what point in cycle the signal is applied.
MC146010
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Freescale Semiconductor
5
Figure 3. Typical Standby Timing Diagram MC146010 Device
MC146010
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Freescale Semiconductor
16
6
2
Power-on
Reset
1
17
No Low Supply
Chamber Sensitivity OK
6
7
Notes: Numbers refer to the AC Electrical Characteristics Table
Illustration is not to scale.
Silver, Brass
Enable
(Internal)
LED
(Pin 11)
Strobe
(Pin 4)
IRED
(Pin 6)
Smoke Test
(Internal)
Chamber Test
(Internal)
Low Supply Test
(Internal)
OSC
(Pin 12)
9
5
Chirps
Indicate
Low Supply
13
18
14
Chirps
Indicate
Degraded
Chamber
Sensitivity
13
IRED
STROBE_ENA
LED
HORN
IO
SMOKE
HI_SMOKE
CHMFAULT
LB1
HUSH
TEST_IN
CH1
600u
650u
Time (Seconds)
700u
750u
Figure 4. Typical Local Smoke Timing MC146010 Device
MC146010
Sensors
Freescale Semiconductor
7
Silence Feature
(Option)
C1
R8
8.2 kΩ
C2
D2
IR Detector
Reverse
Polarity
Protect. SW1
Circuit
D1
Pushbutton
Test
VSS
DETECT
VDD
Q1
Silence
Button
LOWBATT
C3 = 1500 pF
MC146010
D3
IR Current
4.7 to 22 Ω
TEST & SILENCE
C2
R6
100 kΩ
SW2
R16 = 3.0 MΩ
C1
STROBE
IR Emitter
To other
MC146010(s)
Escape light(s)
Auxiliary Alarm(s)
Remote(s)
And/Or Dialer
9.0 V
B1
R14
R11
R10
4.7 kΩ
C5
100 µF
+
1 MΩ
R9
5.0 kΩ
R12
1.0 kΩ
R15
C4
22 µF
R1
R1 = 100 kΩ
R7
47 kΩ
R2 = 10 MΩ
OSC
IRED
R3 = 470 Ω
D4
LED
I/O
BRASS
FEEDBACK
SILVER
Visible
LED
R4 = 2.2 MΩ
C6
0.01 µF
HORN
X1
R5 = 100 kΩ
Figure 5. Typical Battery Powered Application
#
*
†
**
Values for R4, R5 and C6 may differ depending on type of horn used.
C2 and R13 are used for coarse sensitivity adjustment. Typical values are shown.
R9 is for fine sensitivity adjustment (optional). If fixed resistors are used, R8 = 12k, R10 is 5.6k to 10k and R9 is eliminated.
Components necessary to utilize IMF feature.
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Freescale Semiconductor
PIN DESCRIPTIONS
C1 (PIN 1)
A capacitor connected to this pin as shown in Figure 5
determines the gain of the on-chip photo amplifier during
pushbutton test and chamber sensitivity test (high gain). The
capacitor value is chosen such that the alarm tripped from
background reflections in the chamber during pushbutton
test.
AV = 1+(C1/10) where C1 is in pF. CAUTION: The value of
the closed-loop gain should not exceed 10,000.
Resistor R15 should be installed in series with C1 for lower
gains. R15 =[1/(12√C1]-680 where R15 is in ohms and C1 is
in farads.
C2 (PIN 2)
A capacitor connected to this pin as shown in Figure 5
determines the gain of the on-chip photo amplifier during
pushbutton test and chamber sensitivity tests.
AV = 1+(C2/10) where C1 is in pF. This gain increases
about 10% during IRED pulse, after two consecutive local
smoke detections.
For proper compensation, resistor R14 must be installed in
series with C2. R14 =[1/(12√C2]-680 where R14 is in ohms
and C1 is in farads.
DETECT (PIN 3)
This input to the high-gain pulse amplifier is tied to the
cathode of an external photodiode. The photodiode should
have low capacitance and low dark leakage current. The
diode must be shunted by a load resistor and is operated at
zero bias.
The Detect input must be ac/dc decoupled from all other
signals, VDD and VSS. Lead length and/or foil traces to this
pin must be minimized also. See Figure 3.
The device has a sampling speed-up mode after the first
smoke sample is detected. The speed-up frequency is one
smoke sample about every 2 seconds for the duration of a
smoke condition. It will take no-smoke samples to return to a
standby mode. Once out of a smoke condition, the IC will
continue to sample for smoke about every 8 seconds.
STROBE (PIN 4)
This output provides the strobed, regulated voltage
referenced to VDD. The temperature coefficient of this voltage
is ±0.2%/°C maximum from -10 to 60°C. The supply-voltage
coefficient (line regulation) is ±0.2%/V maximum from 6.0 to
12 V. Strobe is tied to external resistor string R8, R9 and R10.
VDD (PIN 5)
This pin is connected to the positive supply potential and
may range from +6.0 to +12 V with respect to VSS.
CAUTION:
In battery-powered applications, reversepolarity protection must be provided externally.
IRED (PIN 6)
This output provides pulsed base current for external NPN
transistor Q1 used as the infrared emitter driver. Q1 must
have a β ≥ 100. At 10 mA, the temperature coefficient of the
output voltage is typically +0.5%/°C from -10 to 60°C. The
supply-voltage coefficient (line regulation) is ±0.2%/V
maximum from 6.0 to 12 V. The IRED pulse width (activehigh) is determined by external components R1 and C3. With
a 100 kΩ/1500 pF combination, the nominal width is 105 µs.
To minimize noise impact, IRED is active near the end of
strobe pulses for smoke tests, chamber sensitivity test, and
pushbutton test. For the above mentioned width, IRED will be
active for the last 105 µs of strobe pulse.
I/O (PIN 7)
This pin can be used to connect up to 40 units together in
a wired-OR configuration for common signaling. VSS is used
as the return. An on-chip current sink minimizes noise pickup
during non-smoke conditions and eliminates the need for an
external pull-down resistor to complete the wired-OR.
Remote units at lower supply voltages do not draw excessive
current from a sending unit at higher supply voltage.
I/O can also be used to activate escape lights, auxiliary
alarms, remote alarms and/or auto-dialers.
As an input, this pin feeds a positive-edge-triggered flipflop whose output is sampled nominally every 1 second
during standby (using typical component values). Once the
first I/O remote smoke sample is detected, a second sample
approximately 10 ms later will happen to confirm a remote
smoke condition. If both samples are found to be high, the
unit will start sounding an alarm.
I/O is disabled by the on-chip power-on reset to eliminate
nuisance signaling during battery changes or system powerup.
If unused, I/O must be left unconnected.
BRASS (PIN 8)
This half of the push-pull driver output is connected to the
metal support electrode of the piezoelectric audio transducer
and to the horn-starting resistor. A continuous modulated
tone from the transducer is a smoke alarm indicating either
local or remote smoke. A short beep or chirp is a trouble
alarm indicating a low supply or degraded chamber
sensitivity. A series of short beeps or chirps during a
pushbutton test indicate a previous alarm for detected smoke
(Alarm memory feature).
SILVER (PIN 9)
This half of the push-pull driver output is connected to the
ceramic electrode of a piezoelectric transducer and to the
horn-starting capacitor.
FEEDBACK (PIN 10)
This input is connected to both the feedback electrode of
a self-resonating piezoelectric transducer and the hornstarting resistor and capacitor through current limiting resistor
R4. If unused, the pin must be tied to VSS or VDD.
LED (PIN11)
This active-low open drain output directly drives an
external visible LED at the pulse rate indicated below. The
pulse width is equal to the OSC period.
MC146010
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Freescale Semiconductor
9
The load for the low-supply test is non-coincident with the
smoke tests, chamber sensitivity test, pushbutton test, or any
alarm signals.
The LED also provides a visual indication of the detector
status as follows, assuming the component values shown in
Figure 4:
Standby (includes low-supply and chamber sensitivity
tests) — Pulses every 32.4 seconds.
Local Smoke — Pulses every 2.0 seconds (typical)
Mute — Pulses every 2.0 seconds (typical)
Remote Smoke — No Pulses
Pushbutton test — Pulses every 2.0 seconds
OSC (PIN 12)
This pin is used in conjunction with external resistor R2
(7.5 MΩ) to VDD and external capacitor C3 (1500 pF) to VDD
to form an oscillator with a nominal period of 7.9 msec
(typical).
R1 (PIN 13)
This pin is use din conjunction with resistor R1(100 kΩ) to
pin 12 and C3 (1500 pF, see pin 12 description) to determine
the IRED pulse width. With this RC combination, the nominal
pulse width is 105 µs.
VSS (PIN 14)
This pin is the negative supply potential and the return for
the I/O pin. Pin 14 is usually tied to Ground.
LOW-SUPPLY TRIP (PIN 15)
This pin is connected to an external voltage which
determines the low-supply alarm threshold. The trip voltage
is obtained through a resistor divider connected between the
VDD and LED pins. The low-supply alarm threshold voltage
(in volts) = (5R7/R6)+5 where R6 and R7 are in the same
units.
TEST/MUTE (PIN 16)
This input has an on-chip pull-down device and is used to
manually invoke a test mode, a mute mode, or a calibration
mode.
The Pushbutton Test mode is initiated by a high level at
Pin 16 (usually a depression of a S.P.S.T. normally-open
pushbutton switch to VDD). After one oscillator cycle, the
IRED pulses approximately every 1.0 second, regardless of
the presence of smoke. Additionally, the amplifier gain is
increased by automatic selection of C1. Therefore the
background reflections in the smoke chamber may be
interpreted as smoke, generating a simulated smoke
condition. After the second IRED pulse, a successful test
activates the horn-driver and I/O circuits. The active I/O
allows remote signaling for a system testing. When the
Pushbutton Test switch is released, the Test input returns to
VSS due to the on-chip pull-down device. After one oscillator
cycle, the amplifier gain returns to normal, thereby removing
the simulated smoke condition. After two additional IRED
pulses, less than three seconds, the IC exits the alarm mode
and returns to standby timing.
The Pushbutton Test will also activate the Alarm Memory
feature. If there was a previous alarm detected by the unit,
the horn will chirp every ¼ second as long as the Test Button
is pressed. Upon releasing of the Test Button, Alarm memory
will be reset. Subsequent pressing of the Test Button will
result in a Pushbutton Test for simulated smoke.
Pressing the Test Button while in the MUTE mode will
result in resetting of MUTE (and additionally a normal
Pushbutton Test).
The MUTE mode (IMF) is initiated by a mid level voltage
(around ½ VDD) at pin 16. A parallel Mute Button to an
existing Test Button needs to be installed at the test pin. A
smoke condition must be present for the MUTE mode to be
activated. If a no smoke condition gets detected while in the
MUTE mode, the IMF 8 minute window gets reset. The unit
will return to Standby mode.
Once in the MUTE mode, the audible smoke alarm (horn)
is temporarily disabled for approximately 8 minutes while
smoke condition is being detected. A visual smoke alarm will
remain (LED flashing) during MUTE mode. A high smoke
voltage reference will also be activated at this time.
Simultaneous smoke and high smoke sampling will allow the
unit to enable the horn driver in case a high smoke condition
occurs during MUTE where the high smoke threshold is
crossed.
The MUTE mode can be overridden by the following
conditions: 1) a no smoke condition is detected, 2) high
smoke level detected, 3) remote smoke detected through I/O,
4) reset through test Button, 5) timeout of 8 minute window.
To help prevent a jammed Mute Button condition, the divider
string on the Mute Button should include a resistor to VDD,
R15 (around 10 MΩ) and a resistor R16 (4.7 MΩ) and
capacitor, C7 (0.047 mF) in series to VSS.
CALIBRATION
To facilitate checking the sensitivity and calibrating smoke
detectors, the MC146010 can be placed in Calibration mode.
In this mode, certain device pins are controlled/reconfigured
as shown in Table 4. To place the part in Calibration mode,
Pin 16 (Test/ Mute) must be pulled below VSS pin with 100 µA
continuously drawn out of the pin for at least one cycle of the
OSC pin. To exit this mode, the Test/ Mute pin is floated for at
least one OSC cycle.
In the Calibration mode, the IRED pulse rate is increased.
An IRED pulse occurs every clock cycle. Also, Strobe is
always Active Low. It is recommended to short R12 (Figure 5)
in this mode. This will allow for a similar recovery of the
emitter circuitry as in normal operation. Pin 1, pin 2, and
pin 12 should be buffered with a unity gain amplifier to
measure their outputs.
MC146010
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Freescale Semiconductor
Table 4. MC146010 Test Mode Logic Table
Pin
Function
Type
Logic
Description
Pin 16, TEST
Test Mode 1 Trigger
Input
None
Set a –Ve voltage to the pin and source 100 µA from
the pin to start Test Mode 1.
Pin 12, OSC CAP
Clock Input
Input
0
Internal clock low
1
Internal clock high
Pin 5, VDD
Chip Power
Pin 14, VSS
Chip Ground
Pin 11, LED
Built-in-Test for HUSH
Timer
Output
Output pulse active low for 8 Clocks every 128
Clocks.
Pin 4, STROBE
Analog Ground
Output
Output low when pin 12 is low.
Pin 6, IRED
IRED
Output
Pin 3, DETECT
Smoke Sensing Input
Input
0
Output low when pin 12 is low.
1
Output high (3.0 V) when pin 12 is high.
NO SMK: VDD-2.5 V – (1/Hi Gain)
SMK: VDD-2.5 V –(1/Low Gain)
HI SMK: VDD-2.5 V – (2/Low Gain)
Pin 8, BRASS
Pin 9, SILVER
Pin 7, I/O
Smoke Latch Indicator
Photo-Comparator
Indicator
Photo-Amp Routing
Enable
Output
Output
Input
0
Output low when smoke latch not set.
1
Output high when smoke latch set.
0
Output low when photo comparator not set.
1
Output high when photo comparator set.
0
Disable the function of Pin 1, 2, 10 and 15 in Test
Mode 1.
1
Enable photoamplifier output routed to the pins and
enable pins 1, 2, 10 and 15 in test Mode 1.
Pin 15, LOW_BATT
Low Battery Trip Point
Input
Control photo amp. Gain and output routing
Pin 10, FEEDBACK
Feedback
Input
Control hysteresis
MC146010
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Figure 6. Recommended PCB layout
MC146010
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PACKAGE DIMENSIONS
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PACKAGE DIMENSIONS
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SOIC PACKAGE
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MC146010
Rev. 1.0
5/2007
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