ONSEMI MC14504BD

MC14504B
Hex Level Shifter for TTL to
CMOS or CMOS to CMOS
The MC14504B is a hex non–inverting level shifter using CMOS
technology. The level shifter will shift a TTL signal to CMOS logic
levels for any CMOS supply voltage between 5 and 15 volts. A control
input also allows interface from CMOS to CMOS at one logic level to
another logic level: Either up or down level translating is
accomplished by selection of power supply levels VDD and VCC. The
VCC level sets the input signal levels while VDD selects the output
voltage levels.
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MARKING
DIAGRAMS
16
• UP Translates from a Low to a High Voltage or DOWN Translates
•
•
•
•
•
PDIP–16
P SUFFIX
CASE 648
from a High to a Low Voltage
Input Threshold Can Be Shifted for TTL Compatibility
No Sequencing Required on Power Supplies or Inputs for Power Up
or Power Down
3 to 18 Vdc Operation for VDD and VCC
Diode Protected Inputs to VSS
Capable of Driving Two Low–Power TTL Loads or One Low–Power
Schottky TTL Load Over the Rated Temperature Range
MC14504BCP
AWLYYWW
1
16
SOIC–16
D SUFFIX
CASE 751B
14504B
AWLYWW
1
16
TSSOP–16
DT SUFFIX
CASE 948F
14
504B
ALYW
MAXIMUM RATINGS (Voltages Referenced to VSS) (Note 2.)
Symbol
Parameter
Value
Unit
VCC
DC Supply Voltage Range
– 0.5 to +18.0
V
VDD
DC Supply Voltage Range
– 0.5 to +18.0
V
Vin
Input Voltage Range
(DC or Transient)
– 0.5 to +18.0
V
Vout
Output Voltage Range
(DC or Transient)
– 0.5 to VDD + 0.5
V
Input or Output Current
(DC or Transient) per Pin
± 10
mA
PD
Power Dissipation,
per Package (Note 3.)
500
mW
TA
Ambient Temperature Range
– 55 to +125
°C
Tstg
Storage Temperature Range
– 65 to +150
°C
TL
Lead Temperature
(8–Second Soldering)
260
°C
Iin, Iout
This device contains protection circuitry to guard against damage due to high
static voltages or electric fields. However, precautions must be taken to avoid
applications of any voltage higher than maximum rated voltages to this
high–impedance circuit. For proper operation, Vin and Vout should be constrained
to the range VSS
(Vin or Vout)
VDD.
Unused inputs must always be tied to an appropriate logic voltage level (e.g.,
either VSS or VDD). Unused outputs must be left open.
v
 Semiconductor Components Industries, LLC, 2000
March, 2000 – Rev. 3
16
SOEIAJ–16
F SUFFIX
CASE 966
MC14504B
AWLYWW
1
2. Maximum Ratings are those values beyond which damage to the device
may occur.
3. Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C
v
1
1
A
= Assembly Location
WL or L = Wafer Lot
YY or Y = Year
WW or W = Work Week
ORDERING INFORMATION
Device
Package
Shipping
MC14504BCP
PDIP–16
2000/Box
MC14504BD
SOIC–16
48/Rail
MC14504BDR2
SOIC–16
2500/Tape & Reel
MC14504BDT
TSSOP–16
96/Rail
MC14504BF
SOEIAJ–16
See Note 1.
MC14504BFEL
SOEIAJ–16
See Note 1.
1. For ordering information on the EIAJ version of
the SOIC packages, please contact your local
ON Semiconductor representative.
Publication Order Number:
MC14504B/D
MC14504B
PIN ASSIGNMENT
VCC
1
16
VDD
Aout
2
15
Fout
Ain
3
14
Fin
Bout
4
13
MODE
Bin
5
12
Eout
Cout
6
11
Ein
Cin
7
10
Dout
VSS
8
9
Din
LOGIC DIAGRAM
VCC
VDD
LEVEL
SHIFTER
INPUT
OUTPUT
TTL/CMOS
MODE SELECT
MODE
Mode Select
Input Logic
Levels
Output Logic
Levels
1 (VCC)
TTL
CMOS
0 (VSS)
CMOS
CMOS
1/6 of package shown.
http://onsemi.com
2
MC14504B
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ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
– 55_C
25_C
VCC
Vdc
VDD
Vdc
Min
Max
Min
VOL
—
—
—
5.0
10
15
—
—
—
0.05
0.05
0.05
—
—
—
VOH
—
—
—
5.0
10
15
4.95
9.95
14.95
—
—
—
5.0
5.0
5.0
5.0
10
10
15
10
15
15
—
—
—
—
—
5.0
5.0
5.0
5.0
10
10
15
10
15
15
—
—
—
—
IOL
Input Current
Input Capacitance (Vin = 0)
125_C
Max
Min
Max
Unit
0
0
0
0.05
0.05
0.05
—
—
—
0.05
0.05
0.05
Vdc
4.95
9.95
14.95
5.0
10
15
—
—
—
4.95
9.95
14.95
—
—
—
Vdc
0.8
0.8
1.5
1.5
3.0
—
—
—
—
—
1.3
1.3
2.25
2.25
4.5
0.8
0.8
1.5
1.5
3.0
—
—
—
—
—
0.8
0.8
1.4
1.5
2.9
2.0
2.0
3.6
3.6
7.1
—
—
—
—
—
2.0
2.0
3.5
3.5
7.0
1.5
1.5
2.75
2.75
5.5
—
—
—
—
—
2.0
2.0
3.5
3.5
7.0
—
—
—
—
—
5.0
5.0
10
15
– 3.0
– 0.64
– 1.6
– 4.2
—
—
—
—
– 2.4
– 0.51
– 1.3
– 3.4
– 4.2
– 0.88
– 2.25
– 8.8
—
—
—
—
– 1.7
– 0.36
– 0.9
– 2.4
—
—
—
—
—
—
—
5.0
10
15
0.64
1.6
4.2
—
—
—
0.51
1.3
3.4
0.88
2.25
8.8
—
—
—
0.36
0.9
2.4
—
—
—
mAdc
Iin
—
15
—
± 0.1
—
± 0.00001
± 0.1
—
± 1.0
µAdc
Cin
—
—
—
—
—
5.0
7.5
—
—
pF
IDD or
ICC
—
—
—
5.0
10
15
—
—
—
0.05
0.10
0.20
—
—
—
0.0005
0.0010
0.0015
0.05
0.10
0.20
—
—
—
1.5
3.0
6.0
µAdc
Quiescent Current
(Per Package)
TTL–CMOS Mode
IDD
5.0
5.0
5.0
5.0
10
15
—
—
—
0.5
1.0
2.0
—
—
—
0.0005
0.0010
0.0015
0.5
1.0
2.0
—
—
—
3.8
7.5
15
µAdc
Quiescent Current
(Per Package)
TTL–CMOS Mode
ICC
5.0
5.0
5.0
5.0
10
15
—
—
—
5.0
5.0
5.0
—
—
—
2.5
2.5
2.5
5.0
5.0
5.0
—
—
—
6.0
6.0
6.0
mAdc
Characteristic
Output Voltage
Vin = 0 V
Symbol
“0” Level
“1” Level
Vin = VCC
Input Voltage
“0” Level
(VOL = 1.0 Vdc) TTL–CMOS
(VOL = 1.5 Vdc) TTL–CMOS
(VOL = 1.0 Vdc) CMOS–CMOS
(VOL = 1.5 Vdc) CMOS–CMOS
(VOL = 1.5 Vdc) CMOS–CMOS
VIL
Input Voltage
“1” Level
(VOH = 9.0 Vdc) TTL–CMOS
(VOH = 13.5 Vdc) TTL–CMOS
(VOH = 9.0 Vdc) CMOS–CMOS
(VOH = 13.5 Vdc) CMOS–CMOS
(VOH = 13.5 Vdc) CMOS–CMOS
VIH
Output Drive Current
(VOH = 2.5 Vdc)
(VOH = 4.6 Vdc)
(VOH = 9.5 Vdc)
(VOH = 13.5 Vdc)
IOH
(VOL = 0.4 Vdc)
(VOL = 0.5 Vdc)
(VOL = 1.5 Vdc)
Quiescent Current
(Per Package)
CMOS–CMOS Mode
Source
Sink
Typ
(4.)
Vdc
Vdc
mAdc
4. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
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3
MC14504B
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SWITCHING CHARACTERISTICS (CL = 50 pF, TA = 25_C)
Characteristic
Propagation Delay, High to Low
Propagation Delay, Low to High
Output Rise and Fall Time
Limits
Symbol
Shifting Mode
VCC
Vdc
VDD
Vdc
Min
Typ (5.)
Max
Unit
tPHL
TTL – CMOS
VDD > VCC
5.0
5.0
10
15
—
—
140
140
280
280
ns
CMOS – CMOS
VDD > VCC
5.0
5.0
10
10
15
15
—
—
—
120
120
70
240
240
140
CMOS – CMOS
VCC > VDD
10
15
15
5.0
5.0
10
—
—
—
185
185
175
370
370
350
TTL – CMOS
VDD > VCC
5.0
5.0
10
15
—
—
170
160
340
320
CMOS – CMOS
VDD > VCC
5.0
5.0
10
10
15
15
—
—
—
170
170
100
340
340
200
CMOS – CMOS
VCC > VDD
10
15
15
5.0
5.0
10
—
—
—
275
275
145
550
550
290
ALL
—
—
—
5.0
10
15
—
—
—
100
50
40
200
100
80
tPLH
tTLH, tTHL
5. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
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4
ns
ns
MC14504B
7
VSp , INPUT SWITCHPOINT VOLTAGE (Vdc)
VSp , INPUT SWITCHPOINT VOLTAGE (Vdc)
7
6
VCC = 10 V
5
4
3
VCC = 5 V
2
1
6
5
4
3
2
1
0
0
0
5
10
15
VDD, SUPPLY VOLTAGE (Vdc)
20
0
Figure 1. Input Switchpoint CMOS to CMOS Mode
20
20
ÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉ
15
10
5
5
10
15
VDD, SUPPLY VOLTAGE (Vdc)
20
Figure 2. Input Switchpoint TTL to CMOS Mode
VDD, SUPPLY VOLTAGE (Vdc)
VDD, SUPPLY VOLTAGE (Vdc)
VCC = 5 V
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
15
10
0
5
0
0
5
10
15
VCC, SUPPLY VOLTAGE (Vdc)
20
0
Figure 3. Operating Boundary CMOS to CMOS Mode
5
10
15
VCC, SUPPLY VOLTAGE (Vdc)
20
Figure 4. Operating Boundary TTL to CMOS Mode
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5
MC14504B
PACKAGE DIMENSIONS
PDIP–16
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
–A–
16
9
1
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
B
F
C
DIM
A
B
C
D
F
G
H
J
K
L
M
S
L
S
–T–
SEATING
PLANE
K
H
G
D
M
J
16 PL
0.25 (0.010)
M
T A
M
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
9
–B–
1
P
8 PL
0.25 (0.010)
8
M
B
S
G
R
K
F
X 45 _
C
SEATING
PLANE
J
M
D
16 PL
0.25 (0.010)
MILLIMETERS
MIN
MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
SOIC–16
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B–05
ISSUE J
–A–
–T–
INCHES
MIN
MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0.305
0_
10 _
0.020
0.040
M
T B
S
A
S
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6
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.229
0.244
0.010
0.019
MC14504B
PACKAGE DIMENSIONS
TSSOP–16
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948F–01
ISSUE O
16X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
V
S
S
S
K
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
K1
2X
L/2
16
9
J1
B
–U–
L
SECTION N–N
J
PIN 1
IDENT.
8
1
N
0.25 (0.010)
0.15 (0.006) T U
S
A
–V–
M
N
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH. PROTRUSIONS OR GATE BURRS. MOLD
FLASH OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
F
DETAIL E
–W–
C
0.10 (0.004)
–T– SEATING
PLANE
DETAIL E
H
D
G
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7
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
MIN
MAX
4.90
5.10
4.30
4.50
–––
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.18
0.28
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
INCHES
MIN
MAX
0.193
0.200
0.169
0.177
–––
0.047
0.002
0.006
0.020
0.030
0.026 BSC
0.007
0.011
0.004
0.008
0.004
0.006
0.007
0.012
0.007
0.010
0.252 BSC
0_
8_
MC14504B
PACKAGE DIMENSIONS
SOEIAJ–16
F SUFFIX
PLASTIC EIAJ SOIC PACKAGE
CASE 966–01
ISSUE O
16
LE
9
Q1
M_
E HE
1
L
8
DETAIL P
Z
D
e
VIEW P
A
A1
b
0.13 (0.005)
c
M
0.10 (0.004)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
DIM
A
A1
b
c
D
E
e
HE
L
LE
M
Q1
Z
MILLIMETERS
MIN
MAX
–––
2.05
0.05
0.20
0.35
0.50
0.18
0.27
9.90
10.50
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10 _
0_
0.70
0.90
–––
0.78
INCHES
MIN
MAX
–––
0.081
0.002
0.008
0.014
0.020
0.007
0.011
0.390
0.413
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10 _
0_
0.028
0.035
–––
0.031
ON Semiconductor and
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MC14504B/D