LINER LTC3210 Main/cam led controller in 3mm ã 3mm qfn Datasheet

LTC3210
MAIN/CAM LED Controller
in 3mm × 3mm QFN
DESCRIPTIO
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FEATURES
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Low Noise Charge Pump Provides High Efficiency
with Automatic Mode Switching
Multimode Operation: 1x, 1.5x, 2x
Individual Full-Scale Current Set Resistors
Up to 500mA Total Output Current
Single Wire EN/Brightness Control for MAIN and
CAM LEDs (8 Brightness Steps)
64:1 Brightness Control Range for MAIN Display
Four 25mA Low Dropout MAIN LED Outputs
One 400mA Low Dropout CAM LED Output
Low Noise Constant Frequency Operation*
Low Shutdown Current: 3µA
Internal Soft-Start Limits Inrush Current During
Startup and Mode Switching
Open/Short LED Protection
No Inductors
3mm × 3mm 16-Lead Plastic QFN Package
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APPLICATIO S
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Multi-LED Light Supply for Cellphones/DSCs/PDAs
, LTC and LT are registered trademarks of Linear Technology Corporation.
All other trademarks are the property of their respective owners.
*Protected by U.S. Patents, including 6411531.
The LTC®3210 is a low noise charge pump DC/DC converter
designed to drive four MAIN LEDs and one high current
CAM LED for camera lighting. The LTC3210 requires only
four small ceramic capacitors and two current set resistors to form a complete LED power supply and current
controller.
Built-in soft-start circuitry prevents excessive inrush current during start-up and mode changes. High switching
frequency enables the use of small external capacitors.
Independent MAIN and CAM full-scale current settings
are programmed by two external resistors. Shutdown
mode and current output levels are selected via two logic
inputs.
The full-scale current through the LEDs is programmed
via external resistors. ENM and ENC are toggled to adjust
the LED currents via internal counters and DACs. The
part is shut down when both ENM and ENC are low for
150µs (typ).
The charge pump optimizes efficiency based on the voltage across the LED current sources. The part powers up
in 1x mode and will automatically switch to boost mode
whenever any enabled LED current source begins to enter dropout. The LTC3210 is available in a 3mm × 3mm
16-lead QFN package.
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TYPICAL APPLICATIO
C2
2.2µF
4-LED MAIN Display
Efficiency vs VBAT Voltage
C3
2.2µF
100
C1P
VBAT
C1M
C2P
MAIN
CAM
CPO
VBAT
C1
2.2µF
C2M
C4
2.2µF
LTC3210
MLED1
MLED2
MLED3
ENM
ENM
MLED4
ENC
ENC
CLED
RM
30.1k
1%
RC
GND
24.3k
1%
3210 TA01
EFFICIENCY (PLED/PIN) (%)
90
80
70
60
50
40
30
20 4 LEDs AT 9mA/LED
10 (TYP VF AT 9mA = 3V, NICHIA NSCW100)
TA = 25°C
0
3.0 3.2 3.4 3.6 3.8 4.0 4.2
VBAT (V)
4.4
3210 TA01b
3210f
1
LTC3210
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ABSOLUTE
AXI U RATI GS
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PACKAGE/ORDER I FOR ATIO
(Note 1)
VBAT, CPO to GND ........................................ –0.3V to 6V
ENM, ENC ................................... –0.3V to (VBAT + 0.3V)
ICPO (Note 2) ........................................................600mA
IMLED1-4 .................................................................30mA
ICLED (Note 2) ......................................................450mA
CPO Short-Circuit Duration .............................. Indefinite
Operating Temperature Range (Note 3) ...–40°C to 85°C
Storage Temperature Range...................–65°C to 125°C
C2M
C1M
VBAT
C2P
TOP VIEW
16 15 14 13
C1P 1
12 GND
CPO 2
11 CLED
17
ENM 3
10 ENC
MLED1 4
RC
6
7
8
MLED2
MLED3
MLED4
RM
9
5
UD PACKAGE
16-LEAD (3mm × 3mm) PLASTIC QFN
TJMAX = 125°C, θJA = 68°C/W
EXPOSED PAD IS GND (PIN 17)
MUST BE SOLDERED TO PCB
ORDER PART NUMBER
UD PART MARKING
LTC3210EUD
LBXH
Order Options Tape and Reel: Add #TR
Lead Free: Add #PBF Lead Free Tape and Reel: Add #TRPBF
Lead Free Part Marking: http://www.linear.com/leadfree/
Consult LTC Marketing for parts specified with wider operating temperature ranges.
ELECTRICAL CHARACTERISTICS
The ● denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C.VBAT = 3.6V, C1 = C2 = C3 = C4 = 2.2µF, RM = 30.1k, RC = 24.3k,
ENM = high, unless otherwise noted.
PARAMETER
CONDITIONS
MIN
●
VBAT Operating Voltage
IVBAT Operating Current
ICPO = 0, 1x Mode, MLED LSB Setting
ICPO = 0, 1.5x Mode
ICPO = 0, 2x Mode
VBAT Shutdown Current
ENM = ENC = LOW
●
LED Current Ratio (IMLED/IRM)
IMLED = Full Scale
●
LED Dropout Voltage
Mode Switch Threshold, IMLED = Full Scale
LED Current Matching
Any Two Outputs, IMLED = Full Scale
MLED Current, 3-Bit Exponential DAC
1 ENM Strobe (FS)
2 ENM Strobes
3 ENM Strobes
4 ENM Strobes
5 ENM Strobes
6 ENM Strobes
7 ENM Strobes (FS/64)
TYP
2.9
MAX
4.5
0.375
2.5
4.5
UNITS
V
mA
mA
mA
3
6
µA
515
567
A/A
MLED1, MLED2, MLED3, MLED4 Current
463
100
mV
1
%
20
10
5
2.5
1.25
0.625
0.312
mA
mA
mA
mA
mA
mA
mA
3210f
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LTC3210
ELECTRICAL CHARACTERISTICS
The ● denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C.VBAT = 3.6V, C1 = C2 = C3 = C4 = 2.2µF, RM = 30.1k, RC = 24.3k,
ENM = high, unless otherwise noted.
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
6750
7500
8250
A/A
CLED Current
●
LED Current Ratio (ICLED/IRC)
ICLED = Full Scale
LED Dropout Voltage
Mode Switch Threshold, ICLED = Full Scale
500
mV
CLED Current, 3-Bit Linear DAC
1 ENC Strobe (FS)
7 ENC Strobes (FS/7)
380
54
mA
mA
1x Mode Output Voltage
ICPO = 0mA
VBAT
V
1.5x Mode Output Voltage
ICPO = 0mA
4.55
V
2x Mode Output Voltage
ICPO = 0mA
5.05
V
0.5
Ω
Charge Pump (CPO)
1x Mode Output Impedance
1.5x Mode Output Impedance
VBAT = 3.4V, VCPO = 4.6V (Note 4)
3.15
Ω
2x Mode Output Impedance
VBAT = 3.2V, VCPO = 5.1V (Note 4)
3.95
Ω
CLOCK Frequency
0.8
MHz
Mode Switching Delay
0.4
ms
ENC, ENM
VIL
●
VIH
●
1.4
ENM = ENC = 3.6V
●
10
ENM = ENC = 0V
●
–1
tPW
Minimum Pulse Width
●
60
tSD
Low Time to Shutdown (ENC and ENM = Low)
●
50
150
250
µs
tEN
Current Source Enable Time
(ENC or ENM = High) (Note 5)
●
50
150
250
µs
VRM, VRC
●
1.16
1.20
1.24
V
IRM, IRC
●
70
µA
IIH
IIL
0.4
V
V
15
20
µA
1
µA
ENC, ENM Timing
ns
RM, RC
Note 1: Absolute Maximum Ratings are those values beyond which the life
of a device may become impaired.
Note 2: Based on long-term current density limitations. Assumes an
operating duty cycle of ≤10% under absolute maximum conditions
for durations less than 10 seconds. Maximum current for continuous
operation is 300mA.
Note 3: The LTC3210E is guaranteed to meet performance specifications
from 0°C to 70°C. Specifications over the –40°C to 85°C ambient
operating temperature range are assured by design, characterization and
correlation with statistical process controls.
Note 4: 1.5x mode output impedance is defined as (1.5VBAT – VCPO)/IOUT.
2x mode output impedance is defined as (2VBAT – VCPO)/IOUT.
Note 5: If the part has been shut down then the initial enable time is about
100µs longer due to the bandgap enable time.
3210f
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LTC3210
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TYPICAL PERFOR A CE CHARACTERISTICS
Dropout Time from Shutdown
EN
2V/DIV
Dropout Time When Enabled
2X
CPO
1V/DIV
TA = 25°C unless otherwise stated.
1.5X
VBAT = 3.6V
ICPO = 200mA
CCPO = 2.2µF
2X
CPO
1V/DIV
1X
1.5x CPO Ripple
1.5X
1X
ENC
2V/DIV
MODE
RESET
VCPO
50mV/DIV
AC
COUPLED
MODE
RESET
ENM = HIGH
500µs/DIV
250µs/DIV
3210 G01
SWITCH RESISTANCE (Ω)
0.65
VCPO
20mV/DIV
AC
COUPLED
0.60
VBAT = 3.3V
0.55
VBAT = 3.6V
0.50
VBAT = 3.9V
0.45
500ns/DIV
3210 G04
0.40
–40
3.8
VBAT = 3.2V
VBAT = 3.1V
VBAT = 3V
3.6
0
100
10
35
TEMPERATURE (°C)
60
3.4
3.2
3.0
2.8
2.6
2.4
–40
85
200
300
400
LOAD CURRENT (mA)
500
4.4
85
3210 G06
C2 = C3 = C4 = 2.2µF
5.0
4.0
3.8
3.6
VBAT = 3.6V
4.9
4.8
VBAT = 3.5V
4.7
VBAT = 3.4V
4.6
VBAT = 3.3V
4.5
VBAT = 3.2V
4.4
3.4
VBAT = 3.1V
4.3
4.2
10
60
5.1
4.2
–15
35
2x Mode CPO Voltage
vs Load Current
5.2
3.2
–40
10
TEMPERATURE (˚C)
VBAT = 3V
VCPO = 4.8V
C2 = C3 = C4 = 2.2µF
35
60
85
TEMPERATURE (˚C)
3210 G07
–15
3210 G05
CPO VOLTAGE (V)
VBAT = 3.6V
OPEN LOOP OUTPUT RESISTANCE (Ω)
CPO VOLTAGE (V)
VBAT = 3.3V
VBAT = 3.4V
VBAT = 3.5V
4.2
4.0
4.6
C2 = C3 = C4 = 2.2µF
4.4
–15
VBAT = 3V
VCPO = 4.2V
C2 = C3 = C4 = 2.2µF
3.6
2x Mode Charge Pump Open-Loop
Output Resistance vs Temperature
(2VBAT – VCPO)/ICPO
1.5x Mode CPO Voltage
vs Load Current
4.6
3.8
ICPO = 200mA
OPEN LOOP OUTPUT RESISTANCE (Ω)
0.70
VBAT = 3.6V
ICPO = 200mA
CCPO = 2.2µF
3210 G03
1.5x Mode Charge Pump Open-Loop
Output Resistance vs Temperature
(1.5VBAT – VCPO)/ICPO
1x Mode Switch Resistance
vs Temperature
2x CPO Ripple
4.8
500ns/DIV
3210 G02
3210 G08
VBAT = 3V
0
100
300
400
200
LOAD CURRENT (mA)
500
3210 G09
3210f
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LTC3210
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TYPICAL PERFOR A CE CHARACTERISTICS
CLED Pin Dropout Voltage
vs CLED Pin Current
MLED Pin Dropout Voltage
vs MLED Pin Current
300
200
100
0
100
150 200 250 300 350
CLED PIN CURRENT (mA)
400
850
VBAT = 3.6V
90
840
80
70
60
50
40
30
770
0
760
800
780
TA = 25°C
2
0
4
6 8 10 12 14 16 18 20
MLED PIN CURRENT (mA)
2.7
TA = 85°C
20
4.5
VBAT = 3.6V
RM = 33.2k
RC = 24.3k
740
720
700
680
660
640
2.0
4.2
1.5x Mode Supply Current vs ICPO
(IVBAT – 1.5ICPO)
SUPPLY CURRENT (mA)
VBAT CURRENT (µA)
3.0
3.3
3.6
3.9
VBAT VOLTAGE (V)
3.0
3210 G12
760
TA = –40°C
15
10
5
620
600
3.9
3.6
3.3
VBAT VOLTAGE (V)
4.2
4.5
0
3.0
2.7
3.6
3.9
3.3
VBAT VOLTAGE (V)
4.2
3210 G13
0
100
300
400
200
LOAD CURRENT (mA)
500
3210 G15
CLED Pin Current
vs CLED Pin Voltage
2x Mode Supply Current vs ICPO
(IVBAT – 2ICPO)
20
4.5
3210 G14
400
VBAT = 3.6V
VBAT = 3.6V
360
15
CLED PIN CURRENT (mA)
3.0
SUPPLY CURRENT (mA)
VBAT SHUTDOWN CURRENT (µA)
TA = –40°C
790
1x Mode No Load VBAT Current
vs VBAT Voltage
4.0
1.5
2.7
800
3210 G11
5.0
2.5
TA = 85°C
810
10
VBAT Shutdown Current
vs VBAT Voltage
3.5
820
780
20
3210 G10
4.5
TA = 25°C
830
FREQUENCY (kHz)
400
50
Oscillator Frequency
vs VBAT Voltage
100
VBAT = 3.6V
MLED PIN DROPOUT VOLTAGE (mV)
CLED PIN DROPOUT VOLTAGE (mV)
500
TA = 25°C unless otherwise stated.
10
5
320
280
240
200
160
120
80
40
0
0
100
300
400
200
LOAD CURRENT (mA)
500
3210 G16
0
0
0.2
0.6
0.8
0.4
CLED PIN VOLTAGE (V)
1
3210 G17
3210f
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LTC3210
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TYPICAL PERFOR A CE CHARACTERISTICS
TA = 25°C unless otherwise stated.
MLED Pin Current
vs MLED Pin Voltage
CLED Current
vs ENC Strobe Pulses
22
400
VBAT = 3.6V
20
18
16
CLED CURRENT (mA)
MLED PIN CURRENT (mA)
VBAT = 3.6V
RC = 24.3k
350
14
12
10
8
6
300
250
200
150
100
4
50
2
0
0.00 0.02 0.04 0.06 0.08 0.10 0.12 0.14 0.16 0.18 0.20
MLED PIN VOLTAGE (V)
0
0
7
6
4
3
2
5
NUMBER OF ENC STROBE PULSES
3210 G18
3210 G19
MLED Current
vs ENM Strobe Pulses
Efficiency vs VBAT Voltage
20
90
VBAT = 3.6V
RM = 33.2k
18
80
EFFICIENCY (PLED /PIN) (%)
16
MLED CURRENT (mA)
1
14
12
10
8
6
4
70
60
50
40
30
20
10
2
0
0
0
4
5
6
3
2
7
NUMBER OF ENM STROBE PULSES
1
3210 G20
300mA LED CURRENT
(TYP VF AT 300mA = 3.1V, AOT-2015HPW
TA = 25°C
2.9 3.05 3.2 3.35 3.5 3.65 3.8 3.95 4.1 4.25 4.4
VBAT (V)
3210 G21
3210f
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LTC3210
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PI FU CTIO S
C1P, C2P, C1M, C2M (Pins 1, 16, 14, 13): Charge Pump
Flying Capacitor Pins. A 2.2µF X7R or X5R ceramic capacitor should be connected from C1P to C1M and C2P
to C2M.
CPO (Pin 2): Output of the Charge Pump Used to Power
All LEDs. This pin is enabled or disabled using the ENM
and ENC inputs. A 2.2µF X5R or X7R ceramic capacitor
should be connected to ground.
ENM, ENC (Pins 3, 10): Inputs. The ENM and ENC pins
are used to program the LED output currents. Each input
is strobed up to 7 times to decrement the internal 3-bit
DACs from full-scale to 1LSB. The counter will stop at
1 LSB if the strobing continues. The pin must be held
high after the final desired positive strobe edge. The data
is transferred after a 150µs (typ) delay. Holding the ENM
or ENC pin low will set the LED current to 0 and will reset
the counter after 150µs (typ). If both inputs are held low
for longer than 150µs (typ) the part will go into shutdown.
The charge pump mode is reset to 1x whenever ENC goes
low or when the part is in shutdown mode.
MLED1, MLED2, MLED3, MLED4 (Pins 4, 5, 6, 7):
Outputs. MLED1 to MLED4 are the MAIN current source
outputs. The LEDs are connected between CPO (anodes)
and MLED1-4 (cathodes). The current to each LED output
is set via the ENM input, and the programming resistor
connected between RM and GND. Each of the four LED
outputs can be disabled by connecting the output directly
to CPO. A 10µA current will flow through each directly
connected LED output.
RM, RC (Pins 8, 9): LED Current Programming Resistor
Pins. The RM and RC pins will servo to 1.2V. Resistors
connected between each of these pins and GND are used
to set the CLED and MLED current levels. Connecting
a resistor 12k or less will cause the LTC3210 to enter
overcurrent shutdown.
CLED (Pin 11): Output. CLED is the CAM current source
output. The LED is connected between CPO (anode) and
CLED (cathode). The current to the LED output is set via
the ENC input, and the programming resistor connected
between RC and GND.
GND (Pin 12): Ground. This pin should be connected to
a low impedance ground plane.
VBAT (Pin 15): Supply voltage. This pin should be bypassed
with a 2.2µF, or greater low ESR ceramic capacitor.
Exposed Pad (Pin 17): This pad should be connected
directly to a low impedance ground plane for optimal
thermal and electrical performance.
3210f
7
LTC3210
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BLOCK DIAGRA
C1P
C1M
C2P
C2M
1
14
16
13
800kHz
OSCILLATOR
12 GND
VBAT 15
2
CPO
4
MLED1
5
MLED2
6
MLED3
7
MLED4
CHARGE PUMP
–
+
+
ENABLE CP
1.215V
–
TIMER
ENABLE MAIN
500Ω
RM
8
ENM
3
3-BIT
DOWN
COUNTER
250k
+
–
3-BIT
EXPONENTIAL
DAC
MLED
CURRENT
SOURCES
4
1.215V
TIMER
SHUTDOWN
TIMER
ENABLE CAM
500Ω
RC
9
ENC 10
250k
3-BIT
DOWN
COUNTER
3-BIT
LINEAR
DAC
CLED
CURRENT
SOURCE
11 CLED
3210 BD
3210f
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LTC3210
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OPERATIO
Power Management
The LTC3210 uses a switched capacitor charge pump to
boost CPO to as much as 2 times the input voltage up to
5.1V. The part starts up in 1x mode. In this mode, VBAT is
connected directly to CPO. This mode provides maximum
efficiency and minimum noise. The LTC3210 will remain in
1x mode until an LED current source drops out. Dropout
occurs when a current source voltage becomes too low
for the programmed current to be supplied. When dropout
is detected, the LTC3210 will switch into 1.5x mode. The
CPO voltage will then start to increase and will attempt
to reach 1.5x VBAT up to 4.6V. Any subsequent dropout
will cause the part to enter the 2x mode. The CPO voltage
will attempt to reach 2x VBAT up to 5.1V. The part will be
reset to 1x mode whenever the part is shut down or when
ENC goes low.
A two phase nonoverlapping clock activates the charge
pump switches. In the 2x mode the flying capacitors are
charged on alternate clock phases from VBAT to minimize
input current ripple and CPO voltage ripple. In 1.5x mode the
flying capacitors are charged in series during the first clock
phase and stacked in parallel on VBAT during the second
phase. This sequence of charging and discharging the flying
capacitors continues at a constant frequency of 800kHz.
current is achieved ENM is stopped high. The output current then changes to the programmed value after 150µs
(typ). The counter will stop when the LSB is reached. The
output current is set to 0 when ENM is toggled low after
the output has been enabled. If strobing is started within
150µs (typ), after ENM has been set low, the counter will
continue to count down. After 150µs (typ) the counter
is reset.
The CLED current is delivered by a programmable current
source. Eight linear current settings (0mA to 380mA, RC
= 24.3k) are available by strobing the ENC pin. Each positive strobe edge decrements a 3-bit down counter which
controls a 3-bit linear DAC. When the desired current is
reached, ENC is stopped high. The output current then
changes to the programmed value after 150µs (typ). The
counter will stop when the LSB is reached. The output
current is set to 0 when ENC is toggled low after the output
has been enabled. If strobing is started within 150µs (typ)
after ENC has been set low, the counter will continue to
count down. After 150µs (typ) the counter is reset.
The full-scale output current is calculated as follows:
MLED full-scale output current
= (1.215V/(RM + 500)) • 515
CLED full-scale output current
= (1.215V/(RC + 500)) • 7500
LED Current Control
The MLED currents are delivered by the four programmable
current sources. Eight current settings (0mA to 20mA,
RM = 30.1k) are available by strobing the ENM pin. Each
positive strobe edge decrements a 3-bit down counter
which controls an exponential DAC. When the desired
tPW ≥ 60ns
When both ENM and ENC are held low for 150µs (typ)
the part will go into shutdown. See Figure 1 for timing
information.
ENC resets the mode to 1x on a falling edge.
tEN 150µs (TYP)
tSD 150µs (TYP)
ENM
OR ENC
PROGRAMMED
CURRENT
LED
CURRENT
ENM = ENC = LOW
SHUTDOWN
3210 F01
Figure 1. Current Programming and Shutdown Timing Diagram
3210f
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LTC3210
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OPERATIO
Soft-Start
However, for a given ROL, the amount of current available
will be directly proportional to the advantage voltage of
1.5VBAT – CPO for 1.5x mode and 2VBAT – CPO for 2x
mode. Consider the example of driving white LEDs from
a 3.1V supply. If the LED forward voltage is 3.8V and the
current sources require 100mV, the advantage voltage for
1.5x mode is 3.1V • 1.5 – 3.8V – 0.1V or 750mV. Notice
that if the input voltage is raised to 3.2V, the advantage
voltage jumps to 900mV— a 20% improvement in available strength.
Initially, when the part is in shutdown, a weak switch
connects VBAT to CPO. This allows VBAT to slowly charge
the CPO output capacitor to prevent large charging
currents.
The LTC3210 also employs a soft-start feature on its
charge pump to prevent excessive inrush current and
supply droop when switching into the step-up modes. The
current available to the CPO pin is increased linearly over
a typical period of 150µs. Soft-start occurs at the start of
both 1.5x and 2x mode changes.
From Figure 2, for 1.5x mode the available current is given by:
IOUT =
Charge Pump Strength and Regulation
Regulation is achieved by sensing the voltage at the CPO
pin and modulating the charge pump strength based
on the error signal. The CPO regulation voltages are set
internally, and are dependent on the charge pump modes
as shown in Table 1.
For 2x mode, the available current is given by:
(2V
– VCPO )
IOUT = BAT
ROL
Notice that the advantage voltage in this case is 3.1V • 2
– 3.8V – 0.1V = 2.3V. ROL is higher in 2x mode but a significant overall increase in available current is achieved.
Table 1. Charge Pump Output Regulation Voltages
Charge Pump Mode
Regulated VCPO
1.5x
4.55V
2x
5.05V
(1.5VBAT – VCPO )
ROL
Typical values of ROL as a function of temperature are
shown in Figure 3 and Figure 4.
Shutdown Current
When the LTC3210 operates in either 1.5x mode or 2x mode,
the charge pump can be modeled as a Thevenin-equivalent
circuit to determine the amount of current available from
the effective input voltage and effective open-loop output
resistance, ROL (Figure 2).
In shutdown mode all the circuitry is turned off and the
LTC3210 draws a very low current from the VBAT supply.
Furthermore, CPO is weakly connected to VBAT. The
LTC3210 enters shutdown mode when both the ENM
and ENC pins are brought low for 150µs (typ). ENM and
ENC have 250k internal pull down resistors to define
the shutdown state when the drivers are in a high impedance state.
ROL is dependent on a number of factors including the
switching term, 1/(2fOSC • CFLY), internal switch resistances and the nonoverlap period of the switching circuit.
ROL
+
–
1.5VBAT OR 2VBAT
+
CPO
–
Figure 2. Charge Pump Thevenin-Equivalent Circuit
3210f
10
LTC3210
U
OPERATIO
Thermal Protection
The LTC3210 has built-in overtemperature protection.
At internal die temperatures of around 150°C thermal
shutdown will occur. This will disable all of the current
sources and charge pump until the die has cooled by
about 15°C. This thermal cycling will continue until the
fault has been corrected.
Mode Switching
The LTC3210 will automatically switch from 1x mode
to 1.5x mode and subsequently to 2x mode whenever
a dropout condition is detected at an LED pin. Dropout
occurs when a current source voltage becomes too low
for the programmed current to be supplied. The time
from drop-out detection to mode switching is typically
0.4ms.
The part is reset back to 1x mode when the part is shut
down (ENM = ENC = Low) or on the falling edge of ENC.
An internal comparator will not allow the main switches to
connect VBAT and CPO in 1x mode until the voltage at the
CPO pin has decayed to less than or equal to the voltage
at the VBAT pin.
4.6
VBAT = 3V
VCPO = 4.2V
3.6
C2 = C3 = C4 = 2.2µF
OPEN LOOP OUTPUT RESISTANCE (Ω)
OPEN LOOP OUTPUT RESISTANCE (Ω)
3.8
3.4
3.2
3.0
2.8
2.6
2.4
–40
–15
10
35
TEMPERATURE (˚C)
60
85
3210 F03
4.4
VBAT = 3V
VCPO = 4.8V
C2 = C3 = C4 = 2.2µF
4.2
4.0
3.8
3.6
3.4
3.2
–40
–15
10
35
60
85
TEMPERATURE (˚C)
3210 F04
Figure 3. Typical 1.5x ROL vs Temperature
Figure 4. Typical 2x ROL vs Temperature
3210f
11
LTC3210
U
W
U
U
APPLICATIO S I FOR ATIO
VBAT, CPO Capacitor Selection
The style and value of the capacitors used with the LTC3210
determine several important parameters such as regulator
control loop stability, output ripple, charge pump strength
and minimum start-up time.
To reduce noise and ripple, it is recommended that low
equivalent series resistance (ESR) ceramic capacitors are
used for both CVBAT and CCPO. Tantalum and aluminum
capacitors are not recommended due to high ESR.
The value of CCPO directly controls the amount of output
ripple for a given load current. Increasing the size of CCPO
will reduce output ripple at the expense of higher start-up
current. The peak-to-peak output ripple of the 1.5x mode
is approximately given by the expression:
VRIPPLE(P −P) =
IOUT
(3 f0SC • C CPO )
(3)
Where fOSC is the LTC3210 oscillator frequency or typically
800kHz and CCPO is the output storage capacitor.
The output ripple in 2x mode is very small due to the fact
that load current is supplied on both cycles of the clock.
Both style and value of the output capacitor can significantly affect the stability of the LTC3210. As shown in the
Block Diagram, the LTC3210 uses a control loop to adjust
the strength of the charge pump to match the required
output current. The error signal of the loop is stored
directly on the output capacitor. The output capacitor
also serves as the dominant pole for the control loop. To
prevent ringing or instability, it is important for the output
capacitor to maintain at least 1.3µF of capacitance over
all conditions.
In addition, excessive output capacitor ESR >100mΩ will
tend to degrade the loop stability. Multilayer ceramic chip
capacitors typically have exceptional ESR performance and
when combined with a tight board layout will result in very
good stability. As the value of CCPO controls the amount of
output ripple, the value of CVBAT controls the amount of
ripple present at the input pin(VBAT). The LTC3210’s input
current will be relatively constant while the charge pump is
either in the input charging phase or the output charging
phase but will drop to zero during the clock nonoverlap
times. Since the nonoverlap time is small (~35ns), these
missing “notches” will result in only a small perturbation
on the input power supply line. Note that a higher ESR
capacitor such as tantalum will have higher input noise
due to the higher ESR. Therefore, ceramic capacitors are
recommended for low ESR. Input noise can be further
reduced by powering the LTC3210 through a very small
series inductor as shown in Figure 5. A 10nH inductor
will reject the fast current notches, thereby presenting a
nearly constant current load to the input power supply.
For economy, the 10nH inductor can be fabricated on the
PC board with about 1cm (0.4") of PC board trace.
VBAT
LTC3210
GND
3210 F05
Figure 5. 10nH Inductor Used for Input Noise
Reduction (Approximately 1cm of Board Trace)
3210f
12
LTC3210
U
W
U
U
APPLICATIO S I FOR ATIO
Flying Capacitor Selection
Layout Considerations and Noise
Warning: Polarized capacitors such as tantalum or
aluminum should never be used for the flying capacitors since their voltage can reverse upon start-up of the
LTC3210. Ceramic capacitors should always be used for
the flying capacitors.
Due to the high switching frequency and the transient
currents produced by the LTC3210, careful board layout
is necessary. A true ground plane and short connections
to all capacitors will improve performance and ensure
proper regulation under all conditions.
The flying capacitors control the strength of the charge
pump. In order to achieve the rated output current it is
necessary to have at least 1.6µF of capacitance for each
of the flying capacitors. Capacitors of different materials
lose their capacitance with higher temperature and voltage
at different rates. For example, a ceramic capacitor made
of X7R material will retain most of its capacitance from
–40°C to 85°C whereas a Z5U or Y5V style capacitor will
lose considerable capacitance over that range. Capacitors
may also have a very poor voltage coefficient causing them
to lose 60% or more of their capacitance when the rated
voltage is applied. Therefore, when comparing different
capacitors, it is often more appropriate to compare the
amount of achievable capacitance for a given case size
rather than comparing the specified capacitance value. For
example, over rated voltage and temperature conditions,
a 1µF, 10V, Y5V ceramic capacitor in a 0603 case may not
provide any more capacitance than a 0.22µF, 10V, X7R
available in the same case. The capacitor manufacturer’s
data sheet should be consulted to determine what value
of capacitor is needed to ensure minimum capacitances
at all temperatures and voltages.
The flying capacitor pins C1P, C2P, C1M and C2M will
have high edge rate waveforms. The large dv/dt on these
pins can couple energy capacitively to adjacent PCB runs.
Magnetic fields can also be generated if the flying capacitors
are not close to the LTC3210 (i.e., the loop area is large).
To decouple capacitive energy transfer, a Faraday shield
may be used. This is a grounded PCB trace between the
sensitive node and the LTC3210 pins. For a high quality
AC ground, it should be returned to a solid ground plane
that extends all the way to the LTC3210.
Table 2 shows a list of ceramic capacitor manufacturers
and how to contact them:
Table 2. Recommended Capacitor Vendors
AVX
www.avxcorp.com
Kemet
www.kemet.com
Murata
www.murata.com
Taiyo Yuden
www.t-yuden.com
Vishay
www.vishay.com
The following guidelines should be followed when designing a PCB layout for the LTC3210:
• The exposed pad should be soldered to a large copper
plane that is connected to a solid, low impedance ground
plane using plated through-hole vias for proper heat
sinking and noise protection.
• Input and output capacitors must be placed close to
the part.
• The flying capacitors must be placed close to the part.
The traces from the pins to the capacitor pad should
be as wide as possible.
• VBAT, CPO traces must be wide to minimize inductance
and handle high currents.
• LED pads must be large and connected to other layers
of metal to ensure proper heat sinking.
• RM and RC pins are sensitive to noise and capacitance.
The resistors should be placed near the part with minimum line width.
3210f
13
LTC3210
U
W
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U
APPLICATIO S I FOR ATIO
Power Efficiency
To calculate the power efficiency (η) of a white LED
driver chip, the LED power should be compared to the
input power. The difference between these two numbers
represents lost power whether it is in the charge pump
or the current sources. Stated mathematically, the power
efficiency is given by:
η=
P LED
PIN
The efficiency of the LTC3210 depends upon the mode in
which it is operating. Recall that the LTC3210 operates
as a pass switch, connecting VBAT to CPO, until dropout
is detected at the LED pin. This feature provides the optimum efficiency available for a given input voltage and
LED forward voltage. When it is operating as a switch, the
efficiency is approximated by:
η=
PLED
PIN
=
(VLED • ILED ) VLED
=
(VBAT • IBAT ) VBAT
since the input current will be very close to the sum of
the LED currents.
At moderate to high output power, the quiescent current
of the LTC3210 is negligible and the expression above is
valid.
Once dropout is detected at any LED pin, the LTC3210
enables the charge pump in 1.5x mode.
In 1.5x boost mode, the efficiency is similar to that of a
linear regulator with an effective input voltage of 1.5 times
the actual input voltage. This is because the input current
for a 1.5x charge pump is approximately 1.5 times the
load current. In an ideal 1.5x charge pump, the power
efficiency would be given by:
PLED
(VLED • ILED )
VLED
ηIDEAL =
=
=
PIN
(VBAT • (1.5)• ILED ) (1.5 • VBAT )
Similarly, in 2x boost mode, the efficiency is similar to
that of a linear regulator with an effective input voltage
of 2 times the actual input voltage. In an ideal 2x charge
pump, the power efficiency would be given by:
ηIDEAL =
PLED
PIN
=
(VLED • ILED )
VLED
=
(VBAT • (2)• ILED ) (2 • VBAT )
Thermal Management
For higher input voltages and maximum output current,
there can be substantial power dissipation in the LTC3210.
If the junction temperature increases above approximately
150°C the thermal shut down circuitry will automatically
deactivate the output current sources and charge pump.
To reduce maximum junction temperature, a good thermal
connection to the PC board is recommended. Connecting
the Exposed Pad to a ground plane and maintaining a solid
ground plane under the device will reduce the thermal
resistance of the package and PC board considerably.
3210f
14
LTC3210
U
PACKAGE DESCRIPTIO
UD Package
16-Lead Plastic QFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1691)
0.70 ±0.05
3.50 ± 0.05
1.45 ± 0.05
2.10 ± 0.05 (4 SIDES)
PACKAGE OUTLINE
0.25 ±0.05
0.50 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
3.00 ± 0.10
(4 SIDES)
BOTTOM VIEW—EXPOSED PAD
PIN 1 NOTCH R = 0.20 TYP
OR 0.25 × 45° CHAMFER
R = 0.115
TYP
0.75 ± 0.05
15
16
PIN 1
TOP MARK
(NOTE 6)
0.40 ± 0.10
1
1.45 ± 0.10
(4-SIDES)
2
(UD16) QFN 0904
0.200 REF
0.00 – 0.05
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WEED-2)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
0.25 ± 0.05
0.50 BSC
3210f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
15
LTC3210
U
TYPICAL APPLICATIO
3-LED MAIN, One LED Camera
C2
2.2µF
C1P
VBAT
C3
2.2µF
C1M
C2P
CAM
CPO
VBAT
C1
2.2µF
MAIN
C2M
C4
2.2µF
LTC3210
MLED1
MLED2
MLED3
ENM
ENM
MLED4
ENC
ENC
CLED
RM
RC
30.1k
1%
MLED4 DISABLED
3210 TA02
GND
24.3k
1%
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PART NUMBER
DESCRIPTION
COMMENTS
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MAIN/CAM LED Controller with 64-Step Brightness
Control
VIN: 2.9V to 4.5V, IQ = 400µA, 3-Bit DAC Brightness Control for MAIN and
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VIN: 2.9V to 4.5V, Single Output, 3 × 3 DFN Package
LTC3215
700mA Low Noise High Current LED Charge Pump
VIN: 2.9V to 4.4V, VOUT(MAX) = 5.5V, IQ = 300µA, ISD < 2.5µA, DFN Package
LTC3216
1A Low Noise High Current LED Charge Pump with
Independent Flash/Torch Current Control
VIN: 2.9V to 4.4V, VOUT(MAX) = 5.5V, IQ = 300µA, ISD < 2.5µA, DFN Package
LTC3217
600mA Low Noise Multi-LED Camera Light
VIN: 2.9V to 4.4V, IQ = 400µA, Four 100mA Outputs, QFN Package
LTC3440/LTC3441
600mA/1.2A IOUT, 2MHz/1MHz, Synchronous
Buck-Boost DC/DC Converter
VIN: 2.4V to 5.5V, VOUT(MAX) = 5.25V, IQ = 25µA/50µA, ISD <1µA,
MS/DFN Packages
LTC3443
600mA/1.2A IOUT, 600kHz, Synchronous
Buck-Boost DC/DC Converter
VIN: 2.4V to 5.5V, VOUT(MAX) = 5.25V, IQ = 28µA, ISD <1µA, DFN Package
LTC3453
1MHz, 800mA Synchronous Buck-Boost High
Power LED Driver
VIN(MIN): 2.7V to 5.5V, VIN(MAX): 2.7V to 4.5V, IQ = 2.5mA, ISD < 6µA,
QFN Package
LT3467/LT3467A
1.1A (ISW), 1.3/2.1MHz, High Efficiency Step-Up
DC/DC Converters with Integrated Soft-Start
VIN: 2.4V to 16V, VOUT(MAX) = 40V, IQ = 1.2mA, ISD < 1µA, ThinSOT Package
LT3479
3A, 42V, 3.5MHz Boost Converter
VIN: 2.5V to 24V, VOUT(MAX) = 40V, IQ = 2µA, ISD < 1µA DFN, TSSOP Packages
3210f
16 Linear Technology Corporation
LT 0106 • PRINTED IN USA
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900
●
FAX: (408) 434-0507 ● www.linear.com
© LINEAR TECHNOLOGY CORPORATION 2006
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