Panasonic AXK5F50347YG Narrow pitch connectors (0.5mm pitch) Datasheet

AXK(5/6)F
For board-to-board For board-to-FPC
P5KF Series
Narrow pitch connectors
(0.5mm pitch)
m
3m
3.
m
8m
5.
Socket
2. Strong resistance to adverse
environments! Utilizes
“
” construction
for high contact reliability.
3. Simple lock structure provides
tactile feedback to ensure excellent
mating/unmating operation feel.
Header
5. The lower connector bottom surface
construction prevents contact and
shorts between the PCB and metal
terminals.
Benefits include freedom in pattern
wiring, helping to make PCB’s smaller.
<Socket>
<Header>
Simple lock mechanism
RoHS compliant
Connector bottom: Create any thru-hole and pattern wiring.
4. Effective mating length 0.55mm
In addition to achieving a low profile of
1.5mm between PCBs, the effective
mating length has been extended to
ensure that there is latitude for insertion.
FEATURES
1. Two-piece structure and 0.5mm
pitch.
The product lineup includes mated
heights of 1.5mm, 2.0mm and 2.5mm.
6. Gull-wing-shaped terminals to
facilitate visual inspections.
APPLICATIONS
Digital devices, such as digital still
cameras and digital video cameras.
0.55mm
ORDERING INFORMATION
AXK
4
7
Y
G
5F: Narrow Pitch Connector P5KF (0.5 mm pitch) Socket
6F: Narrow Pitch Connector P5KF (0.5 mm pitch) Header
Number of pins (2 digits)
Mated height
<Socket>
3: For mated height 1.5 mm
5: For mated height 2.0 mm and 2.5 mm
<Header>
3: For mated height 1.5 mm and 2.0 mm
5: For mated height 2.5 mm
Functions
4: Without positioning bosses
Surface treatment (Contact portion / Terminal portion)
<Socket>
7: Ni plating on base, Au plating on surface/Ni plating on base, Au plating on surface (for Ni barrier available)
Contact portion
<Socket> Y: V notch type product (chamfered on both ends)
<Header> Y: V notch type product
Packing
G: 2,000 pieces embossed tape and plastic reel × 2
Panasonic Corporation
Automation Controls Business Division
industrial.panasonic.com/ac/e/
ACCTB23E 201303-T
AXK(5/6)F
PRODUCT TYPES
Part No.
Mated height
1.5 mm
2.0 mm
2.5 mm
Packing
No. of pins
Socket
Header
10
12
14
16
18
20
22
24
26
30
32
34
40
50
60
70
80
10
12
14
16
18
20
22
24
26
30
34
40
50
60
70
80
100
10
12
14
16
20
22
24
30
34
40
50
60
70
80
100
AXK5F10347YG
AXK5F12347YG
AXK5F14347YG
AXK5F16347YG
AXK5F18347YG
AXK5F20347YG
AXK5F22347YG
AXK5F24347YG
AXK5F26347YG
AXK5F30347YG
AXK5F32347YG
AXK5F34347YG
AXK5F40347YG
AXK5F50347YG
AXK5F60347YG
AXK5F70347YG
AXK5F80347YG
AXK5F10547YG
AXK5F12547YG
AXK5F14547YG
AXK5F16547YG
AXK5F18547YG
AXK5F20547YG
AXK5F22547YG
AXK5F24547YG
AXK5F26547YG
AXK5F30547YG
AXK5F34547YG
AXK5F40547YG
AXK5F50547YG
AXK5F60547YG
AXK5F70547YG
AXK5F80547YG
AXK5F00547YG
AXK5F10547YG
AXK5F12547YG
AXK5F14547YG
AXK5F16547YG
AXK5F20547YG
AXK5F22547YG
AXK5F24547YG
AXK5F30547YG
AXK5F34547YG
AXK5F40547YG
AXK5F50547YG
AXK5F60547YG
AXK5F70547YG
AXK5F80547YG
AXK5F00547YG
AXK6F10347YG
AXK6F12347YG
AXK6F14347YG
AXK6F16347YG
AXK6F18347YG
AXK6F20347YG
AXK6F22347YG
AXK6F24347YG
AXK6F26347YG
AXK6F30347YG
AXK6F32347YG
AXK6F34347YG
AXK6F40347YG
AXK6F50347YG
AXK6F60347YG
AXK6F70347YG
AXK6F80347YG
AXK6F10347YG
AXK6F12347YG
AXK6F14347YG
AXK6F16347YG
AXK6F18347YG
AXK6F20347YG
AXK6F22347YG
AXK6F24347YG
AXK6F26347YG
AXK6F30347YG
AXK6F34347YG
AXK6F40347YG
AXK6F50347YG
AXK6F60347YG
AXK6F70347YG
AXK6F80347YG
AXK6F00347YG
AXK6F10547YG
AXK6F12547YG
AXK6F14547YG
AXK6F16547YG
AXK6F20547YG
AXK6F22547YG
AXK6F24547YG
AXK6F30547YG
AXK6F34547YG
AXK6F40547YG
AXK6F50547YG
AXK6F60547YG
AXK6F70547YG
AXK6F80547YG
AXK6F00547YG
Inner carton (1-reel)
Outer carton
2,000 pieces
4,000 pieces
Notes: 1. Regarding ordering units, During production: Please make orders in 1-reel units.
Samples for mounting confirmation: Available in units of 50 pieces. Please contact our sales office.
Samples: Small lot orders are possible. Please consult us.
2. The standard type comes without positioning bosses. Connectors with positioning bosses are available for on-demand production.
3. The 11th digit “Y” in the socket/header part number indicates the connector has a V notch. (For details, please consult one of our sales offices.)
ACCTB23E 201303-T
Panasonic Corporation
Automation Controls Business Division
industrial.panasonic.com/ac/e/
AXK(5/6)F
SPECIFICATIONS
1. Characteristics
Item
Rated current
Rated voltage
Electrical
Breakdown voltage
characteristics Insulation resistance
Specifications
0.5A/pin contact (Max. 10 A at total pin contacts)
60V AC/DC
150V AC for 1 minute
Detection current: 1mA
Min. 1,000MΩ (initial)
Using 500V DC megger
Contact resistance
Max. 90mΩ
Composite insertion force
Mechanical
Composite removal force
characteristics
Contact holding force
Min. 0.981N/pin contact
–55°C to +85°C
Storage temperature
Based on the contact resistance measurement method specified by
JIS C 5402.
Max. 0.981N/pin contacts × pin contacts (initial)
Min. 0.0588N/pin contacts × pin contacts
Ambient temperature
Soldering heat resistance
Conditions
Max. peak temperature of 260°C (on the surface
of the PC board around the connector terminals)
300°C within 5 seconds, 350°C within 3 seconds
–55°C to +85°C (product only)
–40°C to +50°C (emboss packing)
Measuring the maximum force.
As the contact is axially pull out.
No freezing at low temperatures
Infrared reflow soldering
Soldering iron
No freezing at low temperatures. No dew condensation.
Conformed to MIL-STD-202F, method 107G
Environmental Thermal shock resistance
characteristics (header and socket mated)
Humidity resistance
(header and socket mated)
Saltwater spray resistance
(header and socket mated)
H2S resistance
(header and socket mated)
Lifetime
Insertion and removal life
characteristics
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
120 hours, insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
24 hours, insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
48 hours,
contact resistance max. 90mΩ
50 times
Order Temperature (°C)
1
–55 −30
2
3
85 +30
4
–55 −30
Time (minutes)
30
Max. 5
30
Max. 5
Bath temperature 40±2°C, humidity 90 to 95% R.H.
Bath temperature 35±2°C, saltwarter concentration 5±1%
Bath temperature 40±2°C, gas concentration 3±1 ppm,
humidity 75 to 80% R.H.
Repeated insertion and removal speed of max. 200 times/hours
Mated height 1.5mm, 20 pin contacts;
Socket: 0.06g
Header: 0.04g
Unit weight
2. Material and surface treatment
Part name
Molded portion
Material
LCP resin (UL94V-0)
Contact/Post
Copper alloy
Panasonic Corporation
Surface treatment
—
Contact portion: Ni plating on base, Au plating on surface
Terminal portion: Ni plating on base, Au plating on surface (Except for thick of terminal)
The section close to the soldering portion has a nickel barrier.
(The nickel base is exposed.)
Automation Controls Business Division
industrial.panasonic.com/ac/e/
ACCTB23E 201303-T
AXK(5/6)F
DIMENSIONS (Unit: mm)
The CAD data of the products with a
CAD Data
mark can be downloaded from: http://industrial.panasonic.com/ac/e/
• Socket (Mated height: 1.5mm, 2.0mm, 2.5mm)
CAD Data
A
0.50±0.05
Dimension table (mm)
No. of pins
10
12
14
16
18
20
22
24
26
30
32
34
40
50
60
70
80
100
A
5.50
6.00
6.50
7.00
7.50
8.00
8.50
9.00
9.50
10.50
11.00
11.50
13.00
15.50
18.00
20.50
23.00
28.00
0.10
B±0.1
0.50±0.05
C
0.20±0.03
B
2.00
2.50
3.00
3.50
4.00
4.50
5.00
5.50
6.00
7.00
7.50
8.00
9.50
12.00
14.50
17.00
19.50
24.50
(0.80)
1.70
(Suction face) 4.80
4.20
5.80
(0.80)
0.12±0.03
General tolerance: ±0.2
Mated height
1.5 mm
2.0 mm, 2.5 mm
C
1.35
1.85
• Header (Mated height: 1.5mm, 2.0mm, 2.5mm)
CAD Data
A
0.10
C
1.80
0.12±0.03
3.30
0.50±0.05
0.20±0.03
B
2.00
2.50
3.00
3.50
4.00
4.50
5.00
5.50
6.00
7.00
7.50
8.00
9.50
12.00
14.50
17.00
19.50
24.50
(Suction
face)
2.50
A
5.50
6.00
6.50
7.00
7.50
8.00
8.50
9.00
9.50
10.50
11.00
11.50
13.00
15.50
18.00
20.50
23.00
28.00
0.96
No. of pins
10
12
14
16
18
20
22
24
26
30
32
34
40
50
60
70
80
100
(0.75)
0.50±0.05
Dimension table (mm)
(0.75)
B±0.1
General tolerance: ±0.2
Mated height
1.5 mm, 2.0 mm
2.5 mm
• Socket and header are mated
Mated height: 1.5 mm
1.50±0.15
ACCTB23E 201303-T
Panasonic Corporation
Mated height: 2.0 mm
2.00±0.15
Automation Controls Business Division
Mated height: 2.5 mm
2.50±0.15
industrial.panasonic.com/ac/e/
C
1.25
1.75
AXK(5/6)F
EMBOSSED TAPE DIMENSIONS (unit: mm, Common for respective contact type, socket and header)
• Tape dimensions (Conforming to JIS C 0806:1990.
However, some tapes have mounting hole pitches that do
not comply with the standard.)
Tape I
Tape II
A±0.3
Taping reel
D±1
A±0.3
C
Label
B
C
Pull out direction
4
2
12.0
1.5+0.1
0 dia.
Top cover tape
1.75
380 dia.
1.75
Pull out direction
• Plastic reel dimensions (Conforming to EIAJ ET–7200B)
4
2
Embossed carrier tape
Embossed mounting-hole
12.0
1.5+0.1
0 dia.
Dimension table (mm)
Suffix: G (1 reel, 2,000 pieces embossed tape: Plastic reel package)
Mated height
No. of pins
Type of taping
A
B
C
D
Quantity per reel
Socket and header are common:
1.5mm, 2.0mm, 2.5mm
10 to 58
60 to 70
72 to 100
Tape I
Tape II
Tape II
24.00
32.00
44.00
—
28.40
40.40
11.50
14.20
20.20
25.40
33.40
45.40
2,000 pcs.
2,000 pcs.
2,000 pcs.
Connector orientation with respect to direction of progress of embossed tape
Type
Common for P5KF
Direction of
tape progress
Socket
Header
Note: There is no indication on this product regarding top-bottom or left-right orientation.
Panasonic Corporation
Automation Controls Business Division
industrial.panasonic.com/ac/e/
ACCTB23E 201303-T
AXK(5/6)F
NOTES
• Socket
• Header
Recommended PC board pattern
(TOP VIEW)
B±0.05
0.50±0.05
0.25±0.05
0.50±0.05
B±0.05
0.50±0.05
0.25±0.05
1.60±0.05
4.30±0.05
0.50±0.05
Recommended PC board pattern
(TOP VIEW)
4.00±0.05
6.80±0.05
1. As shown below, excess force
during insertion may result in damage
to the connector or removal of the
solder. Also, to prevent connector
damage please confirm the correct
position before mating connectors.
2. Keep the PC board warp no more
than 0.03 mm in relation to the overall
length of the connector.
0.125±0.05
0.30±0.05
0.125±0.05
0.30±0.05
Recommended metal mask pattern
Recommended metal mask pattern
Metal mask thickness: When 150 µm
(Opening area ratio: 56%)
Metal mask thickness: When 150 µm
(Opening area ratio: 58%)
0.50±0.01
0.23±0.01
B±0.01
0.50±0.01
4.30±0.01
(0.85)
B±0.01
0.50±0.01
(0.85)
(0.85)
5.10±0.01
6.80±0.01
0.50±0.01
0.23±0.01
2.60±0.01
3. Recommended PC board and metal
mask patterns
Connectors are mounted with high pitch
density, intervals of 0.35 mm, 0.4 mm or
0.5 mm.
In order to reduce solder and flux rise,
solder bridges and other issues make
sure the proper levels of solder is used.
The figures to the right are recommended
metal mask patterns. Please use them as
a reference.
(0.85)
Max. 0.03mm
Recommended metal mask pattern
Recommended metal mask pattern
Metal mask thickness: When 120 µm
(Opening area ratio: 69%)
Metal mask thickness: When 120 µm
(Opening area ratio: 72%)
0.50±0.01
0.23±0.01
(1.05)
B±0.01
0.50±0.01
4.30±0.01
(1.05)
(1.05)
2.20±0.01
B±0.01
0.50±0.01
4.70±0.01
6.80±0.01
0.50±0.01
0.23±0.01
(1.05)
Max. 0.03mm
* See the dimension table on page 85 for more information on the B dimension of the socket and header.
Please refer to the latest product
specifications when designing your
product.
ACCTB23E 201303-T
Panasonic Corporation
Automation Controls Business Division
industrial.panasonic.com/ac/e/
Notes on Using Narrow pitch Connectors
Notes on Using Narrow pitch Connectors
Regarding the design of devices and PC board patterns
1) When connecting several connectors
together by stacking, make sure to
maintain proper accuracy in the design of
structure and mounting equipment so
that the connectors are not subjected to
twisting and torsional forces.
2) With mounting equipment, there may
be up to a ±0.2 to 0.3-mm error in
positioning. Be sure to design PC boards
and patterns while taking into
consideration the performance and
abilities of the required equipment.
3) Some connectors have tabs embossed
on the body to aid in positioning. When
using these connectors, make sure that
the PC board is designed with positioning
holes to match these tabs.
4) To ensure the required mechanical
strength when soldering the connector
terminals, make sure the PC board
meets recommended PC board pattern
design dimensions given.
5) For all connectors of the narrow pitch
series, to prevent the PC board from
coming off during vibrations or impacts,
and to prevent loads from falling directly
on the soldered portions, be sure to
design some means to fix the PC board
in place.
Example) Secure in place with screws
Screw
Spacer
Connector
PC board
Spacer
When connecting PC boards, take
appropriate measures to prevent the
connector from coming off.
6) Notes when using a FPC.
(1) When the connector is soldered to an
FPC board, during its insertion and
removal procedures, forces may be
applied to the terminals and cause the
soldering to come off. It is recommended
to use a reinforcement board on the
backside of the FPC board to which the
connector is being connected. Please
make the reinforcement board
dimensions bigger than the outer limits of
the recommended PC board pattern
(should be approximately 1 mm greater
than the outer limit).
Material should be glass epoxy or
polyimide, and the thickness should be
between 0.2 and 0.3 mm.
(2) Collisions, impacts, or turning of FPC
boards, may apply forces on the
connector and cause it to come loose.
Therefore, make to design retaining
plates or screws that will fix the connector
in place.
7) The narrow pitch connector series is
designed to be compact and thin.
Although ease of handling has been
taken into account, take care when
mating the connectors, as displacement
or angled mating could damage or
deform the connector.
Regarding the selection of the connector placement machine and the mounting
procedures
1) Select the placement machine taking
into consideration the connector height,
required positioning accuracy, and
packaging conditions.
2) Be aware that if the catching force of
the placement machine is too great, it
may deform the shape of the connector
body or connector terminals.
3) Be aware that during mounting,
external forces may be applied to the
connector contact surfaces and terminals
and cause deformations.
ACCTB48E 201303-T
4) Depending on the size of the
connector being used, self alignment
may not be possible. In such cases, be
sure to carefully position the terminal with
the PC board pattern.
5) The positioning bosses give an
approximate alignment for positioning on
the PC board. For accurate positioning of
the connector when mounting it to the PC
board, we recommend using an
automatic positioning machine.
Panasonic Corporation
Automation Controls Business Division
6) Excessive mounter chucking force may
deform the molded or metal part of the
connector. Consult us in advance if
chucking is to be applied.
industrial.panasonic.com/ac/e/
Notes on Using Narrow pitch Connectors
Regarding soldering
Terminal
Soldering conditions
Please use the reflow temperature profile
conditions recommended below for
reflow soldering. Please contact us
before using a temperature profile other
than that described below (e.g. lead-free
solder).
• Narrow pitch connectors
(except P8 type)
Upper limited (Solder heat resistance)
Lower limited (Solder wettability)
Temperature
Peak temperature 260°C
230°C
180°C
150°C
4) Consult us when using a screenprinting thickness other than that
recommended.
5) When mounting on both sides of the
PC board and the connector is mounting
on the underside, use adhesives or other
means to ensure the connector is
properly fixed to the PC board. (Double
reflow soldering on the same side is
possible.)
6) N2 reflow, conducting reflow soldering
in a nitrogen atmosphere, increases the
solder flow too greatly, enabling wicking
to occur. Make sure that the solder feed
rate and temperature profile are
appropriate.
Panasonic Corporation
25 sec.
70 sec.
Time
• Narrow pitch connector (P8)
Table A
Product name
Soldering iron temperature
SMD type connectors
300°C within 5 sec.
350°C within 3 sec.
2) Do not allow flux to spread onto the
connector leads or PC board. This may
lead to flux rising up to the connector
inside.
3) Touch the soldering iron to the foot
pattern. After the foot pattern and
connector terminal are heated, apply the
solder wire so it melts at the end of the
connector terminals.
Temperature
245°C max.
Apply the solder
wire here
Peak temperature
200°C
Preheating
Terminal
60 to 120 sec.
PC board
foot pattern
220°C
200°C
Preheating
60 to 120 sec.
155 to 165°C
Paste
solder
Peak temperature
2. Hand soldering
1) Set the soldering iron so that the tip
temperature is less than that given in the
table below.
So
ld
iro erin
n g
1. Reflow soldering
1) Measure the recommended profile
temperature for reflow soldering by
placing a sensor on the PC board near
the connector surface or terminals. (The
setting for the sensor will differ depending
on the sensor used, so be sure to
carefully read the instructions that comes
with it.)
2) As for cream solder printing, screen
printing is recommended.
3) To determine the relationship between
the screen opening area and the PCboard foot pattern area, refer to the
diagrams in the recommended patterns
for PC boards and metal masks. Make
sure to use the terminal tip as a reference
position when setting. Avoid an excessive
amount of solder from being applied,
otherwise, interference by the solder will
cause an imperfect contact.
Small angle as
possible up to
45 degrees
Within 30 sec.
Time
For products other than the ones above,
please refer to the latest product
specifications.
7) The temperatures are measured at the
surface of the PC board near the
connector terminals. (The setting for the
sensor will differ depending on the sensor
used, so be sure to carefully read the
instructions that comes with it.)
8) The temperature profiles given in this
catalog are values measured when using
the connector on a resin-based PC
board. When performed reflow soldering
on a metal board (iron, aluminum, etc.) or
a metal table to mount on a FPC, make
sure there is no deformation or
discoloration of the connector beforehand
and then begin mounting.
9) Consult us when using a screenprinting thickness other than that
recommended.
10) Some solder and flux types may
cause serious solder or flux creeping.
Solder and flux characteristics should be
taken into consideration when setting the
reflow soldering conditions.
Automation Controls Business Division
PC board
Pattern
4) Be aware that soldering while applying
a load on the connector terminals may
cause improper operation of the
connector.
5) Thoroughly clean the soldering iron.
6) Flux from the solder wire may get on
the contact surfaces during soldering
operations. After soldering, carefully
check the contact surfaces and clean off
any solder before use.
7) For soldering of prototype devices
during product development, you can
perform soldering at the necessary
locations by heating with a hot-air gun by
applying cream solder to the foot pattern
beforehand. However, at this time, make
sure that the air pressure does not move
connectors by carefully holding them
down with tweezers or other similar tool.
Also, be careful not to go too close to the
connectors and melt any of the molded
components.
8) If an excessive amount of solder is
applied during manual soldering, the
solder may creep up near the contact
points, or solder interference may cause
imperfect contact.
3. Solder reworking
1) Finish reworking in one operation.
2) For reworking of the solder bridge, use
a soldering iron with a flat tip. To prevent
flux from climbing up to the contact
surfaces, do not add more flux.
3) Keep the soldering iron tip temperature
below the temperature given in Table A.
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ACCTB48E 201303-T
Notes on Using Narrow pitch Connectors
Handling Single Components
1) Make sure not to drop or allow parts to
fall from work bench
2) Excessive force applied to the
terminals could cause warping, come
out, or weaken the adhesive strength of
the solder. Handle with care.
3) Repeated bending of the terminals
may cause terminals to break.
4) Do not insert or remove the connector
when it is not soldered. Forcibly applied
external pressure on the terminals can
weaken the adherence of the terminals to
the molded part or cause the terminals to
lose their evenness.
5) Excessive prying-force applied to one
end may cause product breakage and
separation of the solder joints at the
terminal.
Excessive force applied for insertion in a
pivot action as shown may also cause
product breakage.
Align the header and socket positions
before connecting them.
Cleaning flux from PC board
3) Since some powerful cleaning
solutions may dissolve molded
components of the connector and wipe
off or discolor printed letters, we
recommend aqua pura electronic parts
cleaners. Please consult us if you wish to
use other types of cleaning fluids.
4) Please note that the surfaces of
molded parts may whiten when cleaned
with alcohol.
Handling the PC board
Some connectors may change color
slightly if subjected to ultraviolet rays
during storage. This is normal and will not
affect the operation of the connector.
3) When storing the connectors with the
PC boards assembled and components
alreeady set, be careful not to stack them
up so the connectors are subjected to
excessive forces.
4) Avoid storing the connectors in
locations with excessive dust. The dust
may accumulate and cause improper
connections at the contact surfaces.
3) Before soldering, try not to insert or
remove the connector more than
absolutely necessary.
4) When coating the PC board after
soldering the connector to prevent the
deterioration of insulation, perform the
coating in such a way so that the coating
does not get on the connector.
5) There may be variations in the colors
of products from different production lots.
This is normal.
6) The connectors are not meant to be
used for switching.
7) Be sure not to allow external pressure
to act on connectors when assembling
PCBs or moving in block assemblies.
1) To increase the cleanliness of the
cleaning fluid and cleaning operations,
prepare equipment for cleaning process
beginning with boil cleaning, ultrasonic
cleaning, and then vapor cleaning.
2) Carefully oversee the cleanliness of
the cleaning fluids to make sure that the
contact surfaces do not become dirty
from the cleaning fluid itself.
• Handling the PC board after
mounting the connector
When cutting or bending the PC board
after mounting the connector, be careful
that the soldered sections are subjected
to excessive force.
The soldered areas should not be subjected to force.
Storage of connectors
1) To prevent problems from voids or air
pockets due to heat of reflow soldering,
avoid storing the connectors in areas of
high humidity. When storing the
connectors for more than six months, be
sure to consider storage area where the
humidity is properly controlled.
2) Depending on the connector type, the
color of the connector may vary from
connector to connector depending on
when it is produced.
Other Notes
1) These products are made for the
design of compact and lightweight
devices and therefore the thickness of the
molded components has been made very
thin. Therefore, be careful during
insertion and removal operations for
excessive forces applied may damage
the products.
2) Dropping of the products or rough
mishandling may bend or damage the
terminals and possibly hinder proper
reflow soldering.
ACCTB48E 201303-T
Panasonic Corporation
Automation Controls Business Division
industrial.panasonic.com/ac/e/
Notes on Using Narrow pitch Connectors
Regarding sample orders to confirm proper mounting
When ordering samples to confirm
proper mounting with the placement
machine, connectors are delivered in 50piece units in the condition given right.
Consult a sale representative for ordering
sample units.
Please refer to the latest product
specifications when designing your
product.
Condition when delivered from manufacturing
Reel
Embossed tape
amount required for
the mounting
Required number
of products for
sample production
(Delivery can also be made on a reel by
customer request.)
(Unit 50 pcs.)
Panasonic Corporation
Automation Controls Business Division
industrial.panasonic.com/ac/e/
ACCTB48E 201303-T
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