CALMIRCO CM1426-08CP Lcd and camera emi filter array with esd protection Datasheet

PRELIMINARY
CM1426
LCD and Camera EMI Filter Array with ESD Protection
Features
Product Description
•
The CM1426 is a family of pi-style EMI filter arrays with
ESD protection, which integrates four, six and eight filters (C-R-C) in a Chip Scale Package with 0.50mm
pad pitch. The CM1426 has component values of
8.5pF-100Ω-8.5pF per channel. The CM1426 has a
cut-off frequency of 230MHz and can be used in applications where the data rates are as high as 92Mbps.
The parts include avalanche-type ESD diodes on every
pin, which provide a very high level of protection for
sensitive electronic components that may be subjected
to electrostatic discharge (ESD). The ESD protection
diodes safely dissipate ESD strikes of ±8kV, well
beyond the maximum requirement of the IEC61000-42 international standard. Using the MIL-STD-883
(Method 3015) specification for Human Body Model
(HBM) ESD, the pins are protected for contact discharges at greater than ±15kV.
•
•
•
•
•
•
•
•
•
•
Four, six and eight channels of EMI filtering with
integrated ESD protection
0.5mm pitch, 10-bump, 1.96mm x 1.33mm footprint Chip Scale Package (CM1426-04)
0.5mm pitch, 15-bump, 2.96mm x 1.33mm footprint Chip Scale Package (CM1426-06)
0.5mm pitch, 20-bump, 3.96mm x 1.33mm footprint Chip Scale Package (CM1426-08)
Pi-style EMI filters in a capacitor-resistor-capacitor
(C-R-C) network
±8kV ESD protection on each channel
(IEC 61000-4-2 Level 4, contact discharge)
±15kV ESD protection on each channel (HBM)
Greater than 20dB attenuation (typical) at 1 GHz
Chip Scale Package features extremely low
lead inductance for optimum filter and ESD
performance
Optiguard™ coated for improved reliability at
assembly
Lead-free version available
These devices are particularly well-suited for portable
electronics (e.g. wireless handsets, PDAs, notebook
computers) because of their small package and easyto-use pin assignments. In particular, the CM1426 is
ideal for EMI filtering and protecting data and control
lines for the I/O data ports, LCD display and camera
interface in mobile handsets.
Applications
•
•
•
•
•
•
LCD and Camera data lines in mobile handsets
I/O port protection for mobile handsets, notebook
computers, PDAs etc.
EMI filtering for data ports in cell phones, PDAs or
notebook computers.
Wireless handsets
Handheld PCs/PDAs
LCD and camera modules
The CM1426 incorporates Optiguard™ which results in
improved reliability at assembly. The CM1426 is available in a space-saving, low-profile Chip Scale Package
with optional lead-free finishing.
Electrical Schematic
100Ω
FILTER+ESDn*
(Pins A1-An)
8.5pF
8.5pF
FILTER+ESDn*
(Pins C1-Cn)
GND*
(Pins B1-Bm)
* See Package/Pinout Diagram
1 of 4, 6 or 8 EMI/RFI + ESD Channels
for expanded pin information.
© 2005 California Micro Devices Corp. All rights reserved.
08/30/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
1
PRELIMINARY
CM1426
PACKAGE / PINOUT DIAGRAMS
BOTTOM VIEW
TOP VIEW
(Bumps Up View)
(Bumps Down View)
Orientation
Marking
(see note 2)
1
2
3
4
FILTER1
FILTER2
FILTER3
FILTER4
C1
C2
C3
C4
A
GND
N264
B
GND
B1
C
B2
FILTER1
FILTER2
FILTER3
FILTER4
A1
A2
A3
A4
FILTER1
FILTER2
FILTER3
FILTER4
FILTER5
FILTER6
C1
C2
C3
C4
C5
C6
Orientation
Marking
A1
CM1426-04CS/CP
10 Bump CSP Package
Orientation
Marking
(see note 2)
1
2
3
4
5
6
A
GND
N266
B
GND
B1
B2
B3
FILTER1
FILTER2
FILTER3
FILTER4
FILTER5
FILTER6
A1
A2
A3
A4
A5
A6
FILTER1
FILTER2
FILTER3
FILTER4
FILTER5
FILTER6
FILTER7
C1
C2
C3
C4
C5
C6
C7
Orientation
Marking
C
GND
A1
CM1426-06CS/CP
15 Bump CSP Package
Orientation
Marking
(see note 2)
1
2
3
4
5
6
7
8
A
GND
N268
B
GND
B1
Orientation
Marking
C
GND
B2
FILTER8
C8
GND
B3
B4
FILTER1
FILTER2
FILTER3
FILTER4
FILTER5
FILTER6
FILTER7
FILTER8
A1
A2
A3
A4
A5
A6
A7
A8
A1
CM1426-08CS/CP
20 Bump CSP Package
Notes:
1) These drawings are not to scale.
2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
PIN DESCRIPTIONS
PIN(s)
NAME
A1
FILTER1
A2
FILTER2
A3
DESCRIPTION
PIN(s)
NAME
DESCRIPTION
Filter + ESD Channel 1
C1
FILTER1
Filter + ESD Channel 1
Filter + ESD Channel 2
C2
FILTER2
Filter + ESD Channel 2
FILTER3
Filter + ESD Channel 3
C3
FILTER3
Filter + ESD Channel 3
A4
FILTER4
Filter + ESD Channel 4
C4
FILTER4
Filter + ESD Channel 4
A5
FILTER5
Filter + ESD Channel 5
C5
FILTER5
Filter + ESD Channel 5
A6
FILTER6
Filter + ESD Channel 6
C6
FILTER6
Filter + ESD Channel 6
A7
FILTER7
Filter + ESD Channel 7
C7
FILTER7
Filter + ESD Channel 7
A8
FILTER8
Filter + ESD Channel 8
C8
FILTER8
Filter + ESD Channel 8
B1-B4
GND
Device Ground
© 2005 California Micro Devices Corp. All rights reserved.
2
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
08/30/05
PRELIMINARY
CM1426
Ordering Information
PART NUMBERING INFORMATION
Lead-free Finish2
Standard Finish
Bumps
Package
Ordering Part
Number1
Part Marking
Ordering Part
Number1
10
CSP
CM1426-04CS
N264
CM1426-04CP
N264
15
CSP
CM1426-06CS
N266
CM1426-06CP
N266
20
CSP
CM1426-08CS
N268
CM1426-08CP
N268
Part Marking
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
UNITS
-65 to +150
°C
DC Power per Resistor
100
mW
DC Package Power Rating
500
mW
RATING
UNITS
-40 to +85
°C
Storage Temperature Range
STANDARD OPERATING CONDITIONS
PARAMETER
Operating Temperature Range
ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE1)
SYMBOL
R
PARAMETER
CONDITIONS
Resistance
MIN
TYP
MAX
UNITS
80
100
120
Ω
Total Channel Capacitance
At 2.5VDC Reverse
Bias, 1MHz, 30mVAC
13.6
17
20.4
pF
C
Capacitance C1
At 2.5VDC Reverse
Bias, 1MHz, 30mVAC
6.8
8.5
10.2
pF
VDIODE
Standoff Voltage
IDIODE=10μA
6.0
ILEAK
Diode Leakage Current (reverse bias)
VDIODE= 3.3V
0.1
1
μA
VSIG
Signal Clamp Voltage
Positive Clamp
Negative Clamp
ILOAD = 10mA
ILOAD = -10mA
6.8
-0.8
9.0
-0.4
V
V
VESD
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883, Method
3015
b) Contact Discharge per IEC 61000-4-2 Level 4
CTOTAL
5.6
-1.5
V
Notes 2 and 3
±15
kV
±8
kV
© 2005 California Micro Devices Corp. All rights reserved.
08/30/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
3
PRELIMINARY
CM1426
ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE1)
RDYN
fC
Dynamic Resistance
Positive
Negative
Cut-off Frequency
ZSOURCE=50Ω, ZLOAD=50Ω
2.3
0.9
Ω
Ω
230
MHz
R=100Ω, C=17pF
Note 1: TA=25°C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Note 3: These parameters are guaranteed by design and characterization.
© 2005 California Micro Devices Corp. All rights reserved.
4
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
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Fax: 408.263.7846
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www.calmicro.com
08/30/05
PRELIMINARY
CM1426
Performance Information
Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment)
Figure 1. Insertion Loss vs. Frequency (A1-C1 to GND B1)
Figure 2. Insertion Loss vs. Frequency (A2-C2 to GND B1)
© 2005 California Micro Devices Corp. All rights reserved.
08/30/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
5
PRELIMINARY
CM1426
Performance Information (cont’d)
Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment)
Figure 3. Insertion Loss vs. Frequency (A3-C3 to GND B2)
Figure 4. Insertion Loss vs. Frequency (A4-C4 to GND B2)
© 2005 California Micro Devices Corp. All rights reserved.
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490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
08/30/05
PRELIMINARY
CM1426
Performance Information (cont’d)
Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment)
Figure 5. Insertion Loss vs. Frequency (A5-C5 to GND B3)
Figure 6. Insertion Loss vs. Frequency (A6-C6 to GND B3)
© 2005 California Micro Devices Corp. All rights reserved.
08/30/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
7
PRELIMINARY
CM1426
Performance Information (cont’d)
Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment)
Figure 7. Insertion Loss vs. Frequency (A7-C7 to GND B4)
Figure 8. Insertion Loss vs. Frequency (A8-C8 to GND B4)
© 2005 California Micro Devices Corp. All rights reserved.
8
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
08/30/05
PRELIMINARY
CM1426
Performance Information (cont’d)
Capacitance (Normalized)
Typical Diode Capacitance vs. Input Voltage
DC Voltage
Figure 9. Filter Capacitance vs. Input Voltage over Temperature
(normalized to capacitance at 2.5VDC and 25°C)
© 2005 California Micro Devices Corp. All rights reserved.
08/30/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
9
PRELIMINARY
CM1426
Application Information
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages
offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
Pad Size on PCB
0.275mm
Pad Shape
Round
Pad Definition
Non-Solder Mask defined pads
Solder Mask Opening
0.325mm Round
Solder Stencil Thickness
0.125mm - 0.150mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
0.330mm Round
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance — Edge To Corner Ball
+50μm
Solder Ball Side Coplanarity
+20μm
Maximum Dwell Time Above Liquidous (183°C)
60 seconds
Maximum Soldering Temperature for Eutectic Devices using a Eutectic Solder Paste
240°C
Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste
260°C
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Stencil Opening
0.330mm DIA.
Solder Mask Opening
0.325mm DIA.
Figure 10. Recommended Non-Solder Mask Defined Pad Illustration
Temperature (°C)
250
200
150
100
50
0
Figure 11. Eutectic (SnPb) Solder
Ball Reflow Profile
1:00.0
2:00.0
3:00.0
Time (minutes)
4:00.0
Figure 12. Lead-free (SnAgCu) Solder
Ball Reflow Profile
© 2005 California Micro Devices Corp. All rights reserved.
10 490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
08/30/05
PRELIMINARY
CM1426
Mechanical Details
CSP Mechanical Specifications
CM1426 devices are supplied in custom Chip Scale
Packages (CSP). Dimensions are presented below.
For complete information on CSP packaging, see the
California Micro Devices CSP Package Information
document.
CM1426-04 Mechanical Specifications
The package dimensions for the CM1426-04 are presented below.
Mechanical Package Diagrams
PACKAGE DIMENSIONS
Package
Custom CSP
Bumps
10
Min
Nom
Max
A1
1.915
1.960
2.005
0.0754 0.0772 0.0789
A2
1.285
1.330
1.375
0.0506 0.0524 0.0541
B
B1
0.495
0.500
0.505
0.0195 0.0197 0.0199
A
B2
0.245
0.250
0.255
0.0096 0.0098 0.0100
B3
0.430
0.435
0.440
0.0169 0.0171 0.0173
B4
0.430
0.435
0.440
0.0169 0.0171 0.0173
C1
0.180
0.230
0.280
0.0071 0.0091 0.0110
C2
0.180
0.230
0.280
0.0071
D1
0.575
0.644
0.714
0.0226 0.0254 0.0281
D2
0.368
0.419
0.470
0.0145 0.0165 0.0185
C
A2
0.091
Max
1
2
3
4
C2
# per tape and
reel
Nom
C1
B2
B1
Inches
Min
OptiGuardTM
Coating
A1
B4
B3
Dim
Millimeters
BOTTOM VIEW
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
0.0110
D1
D2
SIDE
VIEW
DIMENSIONS IN MILLIMETERS
Package Dimensions for CM1426-04
Chip Scale Package
3500 pieces
Controlling dimension: millimeters
CSP Tape and Reel Specifications
PART NUMBER
CHIP SIZE (mm)
POCKET SIZE (mm)
B0 X A0 X K0
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P0
P1
CM1426-04
1.96 x 1.33 x 0.644
2.08 x 1.45 x 0.71
8mm
178mm (7")
3500
4mm
4mm
10 Pitches cumulative
tolerance on tape
±0.2 mm
Po
Top
Cover
Tape
Ao
W
Bo
Ko
For tape feeder reference
only including draft.
Concentric around B.
Embossment
Center lines
of cavity
P1
User direction of feed
Figure 13. Tape and Reel Mechanical Data
© 2005 California Micro Devices Corp. All rights reserved.
08/30/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
11
PRELIMINARY
CM1426
Mechanical Details (cont’d)
CM1426-06 Mechanical Specifications
The package dimensions for the CM1426-06 are presented below.
Mechanical Package Diagrams
PACKAGE DIMENSIONS
Package
Custom CSP
Bumps
15
C1
Millimeters
Inches
Nom
Max
A1
2.915
2.960
3.005
0.1148 0.1165 0.1183
A2
1.285
1.330
1.375
0.0506 0.0524 0.0541
B1
0.495
0.500
0.505
0.0195 0.0197 0.0199
B2
0.245
0.250
0.255
0.0096 0.0098 0.0100
B3
0.430
0.435
0.440
0.0169 0.0171 0.0173
B4
0.430
0.435
0.440
0.0169 0.0171 0.0173
C1
0.180
0.230
0.280
0.0071 0.0091 0.0110
C2
0.180
0.230
0.280
0.0071
D1
0.575
0.644
0.714
0.0226 0.0254 0.0281
D2
0.368
0.419
0.470
0.0145 0.0165 0.0185
B
A2
Max
C2
Nom
0.091
B2
B1
C
Min
# per tape and
reel
Min
OptiGuardTM
Coating
A1
B4
B3
Dim
BOTTOM VIEW
A
1
2
3
4
5
6
D1
D2
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
SIDE
VIEW
DIMENSIONS IN MILLIMETERS
0.0110
Package Dimensions for
CM1426-06 Chip Scale Package
3500 pieces
Controlling dimension: millimeters
CSP Tape and Reel Specifications
PART NUMBER
CHIP SIZE (mm)
POCKET SIZE (mm)
B0 X A0 X K0
CM1426-06
2.96 x 1.33 x 0.644
3.10 x 1.45 x 0.74
TAPE WIDTH
W
REEL
DIAMETER
QTY
PER
REEL
P0
P1
8mm
178mm (7")
3500
4mm
4mm
10 Pitches cumulative
tolerance on tape
±0.2 mm
Po
Top
Cover
Tape
Ao
W
Bo
Ko
For tape feeder reference
only including draft.
Concentric around B.
Embossment
Center lines
of cavity
P1
User direction of feed
Figure 14. Tape and Reel Mechanical Data
© 2005 California Micro Devices Corp. All rights reserved.
12 490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
08/30/05
PRELIMINARY
CM1426
Mechanical Details (cont’d)
CM1426-08 Mechanical Specifications
The package dimensions for the CM1426-08 are presented below.
Mechanical Package Diagrams
PACKAGE DIMENSIONS
Custom CSP
Bumps
20
Inches
Nom
Max
Min
3.915
3.960
4.005
Nom
B
Max
A
1.285
1.330
1.375
0.0506 0.0524 0.0541
B1
0.495
0.500
0.505
0.0195 0.0197 0.0199
B2
0.245
0.250
0.255
0.0096 0.0098 0.0100
B3
0.430
0.435
0.440
0.0169 0.0171 0.0173
B4
0.430
0.435
0.440
0.0169 0.0171 0.0173
C1
0.180
0.230
0.280
0.0071 0.0091 0.0110
C2
0.180
0.230
0.280
0.0071
D1
0.575
0.644
0.714
0.0226 0.0254 0.0281
D2
0.368
0.419
0.470
0.0145 0.0165 0.0185
# per tape and
reel
A
0.1541 0.1559 0.1577
A2
0.091
A2
A1
C
Millimeters
Min
B2
B1
C2
Dim
A1
C1
B4
B3
Package
OptiGuardTM
Coating
BOTTOM VIEW
1
2
3
4
5
6
7
8
D1
D2
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
SIDE
VIEW
DIMENSIONS IN MILLIMETERS
Package Dimensions for
CM1426-08 Chip Scale Package
0.0110
3500 pieces
Controlling dimension: millimeters
CSP Tape and Reel Specifications
PART NUMBER
CHIP SIZE (mm)
POCKET SIZE (mm)
B0 X A0 X K0
TAPE
WIDTH W
REEL
DIAMETER
QTY PER
REEL
P0
P1
CM1426-08
3.96 x 1.33 x 0.644
4.11 x 1.57 x 0.76
8mm
178mm (7")
3500
4mm
4mm
10 Pitches cumulative
tolerance on tape
±0.2 mm
Po
Top
Cover
Tape
Ao
W
Bo
Ko
For tape feeder reference
only including draft.
Concentric around B.
Embossment
Center lines
of cavity
P1
User direction of feed
Figure 15. Tape and Reel Mechanical Data
© 2005 California Micro Devices Corp. All rights reserved.
08/30/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.calmicro.com
13
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