Etron EM565168 512k x 16 pseudo sram Datasheet

EtronTech
EM565168
512K x 16 Pseudo SRAM
Rev 1.0
Features
Sep. 2003
Pin Assignment 48-Ball BGA, Top View
• Organized as 512K words by 16 bits
• Fast Cycle Time : 55ns, 70ns
• Standby Current : 100uA
•Deep power-down Current : 10uA (Memory cell data invalid)
• Byte data control: LB# (DQ0 - 7), UB# (DQ8 - 15)
• Compatible with low power SRAM
• Single Power Supply Voltage : 3.0V±0.3V
• Package Type : 48-ball FBGA, 6x8mm
• Lead Free Package available - EM565168BC-XXG,
(G : indicates Lead Free Package)
Pin Description
Symbol
Function
A0 – A18
Address Inputs
DQ0 – DQ15
Data Inputs/Outputs
CE1#
Chip Enable
CE2
Deep Power Down
OE#
Output Enable
WE#
Write Control
LB#
Lower Byte Control
UB#
Upper Byte Control
VCC
Power Supply
VSS
Ground
1
2
3
4
5
6
A
LB#
OE#
A0
A1
A2
CE2
B
DQ8
UB#
A3
A4
CE1#
DQ0
C
DQ9
DQ10
A5
A6
DQ1
DQ2
D
VSS
DQ11
A17
A7
DQ3
VCC
E
VCC
DQ12
NC
A16
DQ4
VSS
F
DQ14
DQ13
A14
A15
DQ5
DQ6
G
DQ15
NC
A12
A13
WE#
DQ7
H
A18
A8
A9
A10
A11
NC
Ordering Information
Part Number
Speed
Package
EM565168BC-55/55G
55 ns
6x8 BGA; G: lead free
EM565168BC-70/70G
70 ns
6x8 BGA; G: lead free
Overview
The EM565168 is a 8M-bit Pseudo SRAM organized as 512K words by 16 bits. It is designed with advanced
CMOS technology specified RAM featuring low power static RAM compatible function and pin configuration.
This device operates from a single power supply. Advanced circuit technology provides both high speed and
low power. It is automatically placed in low-power mode when CE1# or both UB# and LB# are asserted high or
CE2 is asserted low. There are three control inputs. CE1# and CE2 are used to select the device, and output
enable (OE#) provides fast memory access. Data byte control pins (LB#,UB#) provide lower and upper byte
access. This device is well suited to various microprocessor system applications where high speed, low power
and battery backup are required. And, with a guaranteed wide operating range, the EM565168 can be used in
environments exhibiting extreme temperature conditions.
Pin Location
Symbol Location Symbol Location Symbol Location Symbol Location Symbol
A0
A3
A8
H2
A16
E4
DQ3
D5
DQ11
A1
A4
A9
H3
A17
D3
DQ4
E5
DQ12
A2
A5
A10
H4
A18
H1
DQ5
F5
DQ13
A3
B3
A11
H5
NC
G2
DQ6
F6
DQ14
A4
B4
A12
G3
NC
H6
DQ7
G6
DQ15
A5
C3
A13
G4
DQ0
B6
DQ8
B1
CE1#
A6
C4
A14
F3
DQ1
C5
DQ9
C1
CE2
A7
D4
A15
F4
DQ2
C6
DQ10
C2
OE#
Location Symbol Location
D2
WE#
G5
E2
LB#
A1
F2
UB#
B2
F1
VCC
D6
G1
VCC
E1
B5
GND
D1
A6
GND
E6
A2
NC
E3
Etron Technology, Inc.
No. 6, Technology Rd. V, Science-Based Industrial Park, Hsinchu, Taiwan 30077, R.O.C.
TEL: (886)-3-5782345
FAX: (886)-3-5778671
Etron Technology, Inc., reserves the right to make changes to its products and specifications without notice.
EtronTech
EM565168
Block Diagram
Standby/Deep Power
Down Mode Control
VCC
VSS
Refresh Control
Memory Cell Array
Refresh
Counter
A0 – A18
Row
Address
Decoder
512K x 16
Input
Data
Control
Sense AMP
Address
Buffer
DQ0 – DQ7
DQ8 – DQ15
Output
Data
Control
Column Decoder
Address Buffer
CE1#
CE2
OE#
Control
Logic
WE#
LB#
UB#
2
Rev 1.0
Sep. 2003
EtronTech
EM565168
Operating Mode
CE1# CE2 OE# WE# LB# UB# DQ0~DQ7 DQ8~DQ15
Mode
Power
H
H
X
X
X
X
High-Z
High-Z
Deselect
Standby
X
L
X
X
X
X
High-Z
High-Z
Deselect
Deep Power Down
L
H
X
X
H
H
High-Z
High-Z
Deselect
Standby
L
H
H
H
L
X
High-Z
High-Z
Output Disabled
Active
L
H
H
H
X
L
High-Z
High-Z
Output Disabled
Active
L
H
L
H
L
H
D-out
High-Z
Lower Byte Read
Active
L
H
L
H
H
L
High-Z
D-out
Upper Byte Read
Active
L
H
L
H
L
L
D-out
D-out
Word Read
Active
L
H
X
L
L
H
D-in
High-Z
Lower Byte Write
Active
L
H
X
L
H
L
High-Z
D-in
Upper Byte Write
Active
L
H
X
L
L
L
D-in
D-in
Word Write
Active
Note: X=don’t care. H=logic high. L=logic low.
Absolute Maximum Ratings
1)
Supply voltage, VCC
-0.2 to +3.6V
Input voltages, VIN
-0.2 to VCC + 0.3V
Input and output voltages, VIN, VOUT
-2.0 to +3.6V*
Output short circuit current ISH
100 mA
Operating temperature, TA
-25 to +85°C
Storage temperature, TSTRG
-65 to +125°C
Soldering Temperature (10s), TSOLDER
260°C
Power dissipation, PD
1W
Note: Absolute maximum DC requirements contains stress ratings only. Functional operation at the absolute
maximum limits is not implied or guaranteed. Extended exposure to maximum ratings may affect device
reliability.
Recommended DC Operating Conditions
Symbol
Parameter
Min.
Typ.
Max.
Unit
VCC
Power Supply Voltage
2.7
3.0
3.3
V
VSS
Ground
0
−
0
VIH
VIL
Input High Voltage
Input Low Voltage
2.2
2)
-0.2
V
1)
−
VCC+0.2
V
−
+0.6
V
Notes:
1. Overshoot: VCC + 2.0V in case of pulse width ≤ 20ns
2. Undershoot: -2.0V in case of pulse width ≤ 20ns
3. Overshoot and undershoot are sampled, not 100% tested.
3
Rev 1.0
Sep. 2003
EtronTech
EM565168
DC Characteristics
Symbol
Parameter
Test Conditions
Min.
Max.
Unit
ILI
Input Leakage
Current
VIN = VSS to VDD
-1
1
µA
ILO
Output Leakage
Current
VIO = VSS to VDD
CE1# = VIH, CE2 = VIL or
-1
1
µA
OE# = VIH or WE# = VIL
ICC1
Operating Current @
Min Cycle Time
ICC2
Operating Current @
Max Cycle Time
(1µs)
Cycle time = Min., 100%
duty, IIO = 0mA, CE1# =
VIL, CE2 = VIH, VIN =
VIH or VIL
35
55ns
−
mA
25
70ns
Cycle time = 1µs, 100% duty
ISB1
Standby Current
(CMOS)
IIO = 0mA, CE1# ≤ 0.2V,
CE2 ≥ VDD -0.2V, VIN ≤ 0.2V
or VIN ≥ VDD -0.2V
−
3
mA
−
100
µA
10
µA
CE1# = VDD – 0.2V and
CE2 = VDD – 0.2V,
Other inputs = VSS ~ VCC
ISBD
Deep Power Down
CE2 ≤ 0.2V, Other inputs =
VSS ~ VCC
VOL
Output Low Voltage
IOL = 2.1mA
−
0.4
V
VOH
Output High Voltage
IOH = -1.0mA
2.4
−
V
Capacitance (Ta = 25°C; f = 1 MHz)
Parameter
Input capacitance
Output capacitance
Symbol
Min
Typ
Max
Unit
Test Conditions
CIN
−
−
8
pF
VIN = GND
COUT
−
−
10
pF
VOUT = GND
Notes: These parameters are sampled and not 100% tested.
4
Rev 1.0
Sep. 2003
EtronTech
EM565168
AC Characteristics and Operating Conditions (Ta = -25°C to 85°C, VCC = 2.7V to 3.3V)
Symbol
-55
Parameter
-70
Unit
Min
Max
Min
Max
Read Cycle
tRC
Read cycle time
55
−
70
−
ns
tAA
Address access time
−
55
−
70
ns
tCO1
Chip Enable (CE1#) Access Time
−
55
−
70
ns
tCO2
Chip Enable (CE2) Access Time
−
55
−
70
ns
tOE
Output enable access time
−
25
−
35
ns
tBA
Data Byte Control Access Time
−
55
−
70
ns
tLZ
Chip Enable Low to Output in Low-Z
10
−
10
−
ns
tOLZ
Output enable Low to Output in Low-Z
5
−
5
−
ns
tBLZ
Data Byte Control Low to Output in Low-Z
10
−
10
−
ns
tHZ
Chip Enable High to Output in High-Z
−
20
−
25
ns
tOHZ
Output Enable High to Output in High-Z
−
20
−
25
ns
tBHZ
Data Byte Control High to Output in High-Z
−
20
−
25
ns
tOH
Output Data Hold Time
10
−
10
−
ns
Write Cycle
tWC
Write Cycle Time
55
−
70
−
ns
tWP
Write Pulse Width
45
−
50
−
ns
tAW
Address Valid to End of Write
45
−
60
−
ns
tCW
Chip Enable to End of Write
45
−
60
−
ns
tBW
Data Byte Control to End of Write
45
−
60
−
ns
tAS
Address Setup Ttime
0
−
0
−
ns
tWR
Write Recovery Time
0
−
0
−
ns
tWHZ
WE# Low to Output in High-Z
−
20
−
20
ns
tOW
WE# High to Output in Low-Z
5
−
5
−
ns
tDW
Data to Write Overlap
30
−
30
−
ns
tDH
Data Hold Time
0
−
0
−
ns
AC Test Condition
• Output load : 50pF + one TTL gate
• Input pulse level : 0.4V, 2.4
• Timing measurements : 0.5 x VCC
• tR, tF : 5ns
5
Rev 1.0
Sep. 2003
EtronTech
EM565168
AC Test Loads
RL = 50 Ω
VL = 1.5 V
DOUT
1
CL
Z0 = 50 Ω
= 50 pF
Note:
1. Including scope and jig capacitance
State Diagram
Deep Power Down Exit Sequence
Deep Power
Down Mode
CE2=VIH
Power
on
Deep Power Down Entry Sequence
CE1# = VIH or VIL,
CE2=VIH
CE2=VIL
Initial State
(Wait 200µs)
Active
CE2=VIH, CE1# =VIH
or UB#, LB# =VIH
CE1# =VIL, CE2=VIH,
UB# & LB# or/and LB# = VIL
Power Up Sequence
CE2=VIL
Standby
Mode
Standby Mode Characteristics
Power Mode
Memory Cell Data
Standby Current (µA)
Wait Time (µs)
Standby
Valid
100
0
Deep Power Down
Invalid
10
200
6
Rev 1.0
Sep. 2003
EtronTech
EM565168
Timing Diagrams
Read Cycle 1 – Addressed Controlled
1)
tRC
Address
tAA
tOH
tOH
Data Out
Previous Data Valid
Read Cycle 2 – CE1# Controlled
Data Valid
2)
tRC
Address
tAA
tOH
tCO
tLZ
CE1#
tHZ
tBA
tBLZ
UB#, LB#
tOE
tBHZ
OE#
tOHZ
tOLZ
Data Out
High-Z
Data Valid
High-Z
Notes:
1. CE1# = OE# = VIL, CE2 = WE# = VIH, UB# or/and LB# = VIL
2. CE2 = WE# = VIH
7
Rev 1.0
Sep. 2003
EtronTech
EM565168
Write Cycle 1 – WE# Controlled
1) 2)
tWC
Address
tWR
tAW
tCW
CE1#
UB#, LB#
tBW
WE#
tWP
tAS
Data In
tDH
tDW
High-Z
High-Z
Data Valid
tWHZ
tOW
Data Out
Data Undefined
Write Cycle 2 – CE1# Controlled
1) 2)
tWC
Address
tWR
tAW
tAS
CE1#
tCW
UB#, LB#
tBW
WE#
tWP
tDW
Data In
Data Out
tDH
Data Valid
High-Z
8
Rev 1.0
Sep. 2003
EtronTech
EM565168
Write Cycle 3 – UB#, LB# Controlled
1) 2)
tWC
Address
tWR
tAW
tCW
CE1#
UB#, LB#
tBW
tAS
WE#
tWP
tDH
tDW
Data In
Data Out
Data Valid
High-Z
Notes:
1. CE2 = VIH
2. CE2 = WE# = VIH
9
Rev 1.0
Sep. 2003
EtronTech
EM565168
Deep Power Down Mode
200µs
~
CE2
1µs
Normal Operation Suspend
Mode
Deep Power
Down Mode
Wake Up
Normal Operation
~
CE1#
Power Up
200µs
~
VCC
CE2
CE1#
10
Rev 1.0
Sep. 2003
EtronTech
EM565168
Avoid Timing
Etron Pseudo SRAM has a timing which is not supported at read operation. If your system has multiple
invalid address signal shorter than tRC during over 15µs at read operation shown as in Abnormal Timing, it
requires a normal read timing at leat during 15 µs shown as in Avoidable timing 1 or toggle CE1# to high (
tRC) one time at least shown as in Avoidable Timing 2.
≧
Abnormal Timing
≧ 15µs
CE1#
WE#
< tRC
Address
Avoidable Timing 1
≧ 15µs
CE1#
WE#
≧ tRC
Address
Avoidable Timing 2
≧ 15µs
≧ tRC
CE1#
WE#
< tRC
Address
11
Rev 1.0
Sep. 2003
EtronTech
EM565168
Package Diagrams
48-Ball BGA
Units in mm
BOTTOM VIEW
TOP VIEW
C
PIN 1 CORNER
0.15
S
C
A
3
4
5
6
6
5
4
B
0.05(48X)
3
2
1
0.1
2
S
0.30
PIN 1 CORNER
1
0.075
8.0
±
-B0.02
0.75
±
0.03
0.52
3.75
-A6.0 ± 0.1
0.23
±
0.12MAX
0.04
0.05
SEATING PLANE
±
0.32
0.15
1.20 MAX
-C-
12
Rev 1.0
Sep. 2003
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