HSP061-2 2-line ESD protection for high speed lines Datasheet - production data Benefits • High ESD robustness of the equipment • Suitable for high density boards Complies with following standards • MIL-STD 883G Method 3015-7 Class 3B: – 8 kV HSP061-2M6 µQFN-6L HSP061-2N4 µQFN-4L HSP061-2P6 SOT-666 • IEC 61000-4-2 level 4: – 15 kV (air discharge) – 8 kV (contact discharge) Applications Figure 1. Functional schematic (top view) I/O1 1 6 I/O1 VBUS GND 2 5 VBUS I/O2 I/O2 3 4 I/O2 I/O1 1 6 I/O1 GND 2 5 I/O2 3 4 The HSP061-2 series is designed to protect against electrostatic discharge on sub micron technology circuits driving: • HDMI 1.3 and 1.4 • Digital Video Interface • Display Port • USB 3.0 • Serial ATA µQFN 6 leads SOT666 I/O1 NC GND • Ethernet I/O2 • HMI NC Description µQFN 4 leads The HSP061-2 is a 2-channel ESD array with a rail to rail architecture designed specifically for the protection of high speed differential lines. Features • Flow-through routing to keep signal integrity • Ultralarge bandwidth: 6 GHz • Ultralow capacitance: 0.6 pF • Low leakage current: 100 nA at 25 °C • Extended operating junction temperature range: -40 °C to 150 °C • RoHS compliant March 2014 This is information on a product in full production. The ultralow variation of the capacitance ensures very low influence on signal-skew. The large bandwidth makes it compatible with 5 Gbps. The HSP061-2P6 is housed in SOT-666. The HSP061-2M6 is packaged in µQFN-6L (1.45 x 1.0 mm) with a 500 µm pitch. The HSP061-2N4 is packaged in µQFN-4L (1.0 x 0.8 mm) with a 400 µm pitch. DocID022777 Rev 2 1/12 www.st.com Characteristics 1 HSP061-2 Characteristics Table 1. Absolute maximum ratings Tamb = 25 °C Symbol Parameter Value IEC 61000-4-2 contact discharge 8 IEC 61000-4-2 air discharge 15 Unit VPP Peak pulse voltage Ipp Repetitive peak pulse current (8/20 µs) 3 A Tj Operating junction temperature range -40 to +150 °C Tstg Storage temperature range -65 to +150 °C TL Maximum lead temperature for soldering during 10 s 260 °C kV Table 2. Electrical characteristics Tamb = 25 °C Symbol Parameter Test conditions Min. Typ. Max. VBR Breakdown voltage IR = 1 mA IRM Leakage current VRM = 3 V VCL Clamping voltage IEC 61000-4-2, +8 kV contact (IPP = 30 A), measured at 30 ns 18 CI/O - GND Capacitance (input/output to ground) VI/O = 0 V, F = 200 to 3000 MHz, VOSC = 30 mV 0.6 0.85 pF ΔCI/O - GND Capacitance variation (input/output to ground) VI/O = 0 V F = 200 to 3000 MHz, VOSC = 30 mV 0.03 0.13 pF HSP061-2M6, HSP061-2P6 5.5 HSP061-2N4 6 fC 2/12 Cut-off frequency -3 dB 6 Unit V 100 DocID022777 Rev 2 nA V GHz HSP061-2 Characteristics Figure 2. Leakage current versus junction temperature (typical values) Figure 3. S21 attenuation measurement (HSP061-2P6, HSP061-2M6) S21(db) 10.00 0.00 VR = V RM = 3 V IR (nA) - 4.00 1.00 - 8.00 0.10 - 12.00 F(Hz) Tj (°C) 0.01 25 50 75 100 125 150 Figure 4. S21 attenuation measurement (HSP061-2N4) 0 S21 (dB) - 16.00 300.0k 1.0M 3.0M 10.0M 30.0M 100.0M 300.0M 1.0G 3.0G Figure 5. Eye diagram - HDMI mask at 3.4 Gbps per channel(1) (HSP061-2P6) 250 mV/div -1 -2 -3 -4 -5 -6 -7 -8 -9 -10 300k F (Hz) 1M 3M IO1 10M 30M 100M 300M 1G IO2 3G 49 ps/div 1. HDMI specification conditions. This information can be provided for other applications. Please contact your local ST office. Figure 6. Eye diagram - HDMI mask at 3.4 Gbps Figure 7. Eye diagram - HDMI mask at 3.4 Gbps per channel(1) per channel(1) (HSP061-2M6) (HSP061-2N4) 250 mV/div 250 mV/div 49 ps/div DocID022777 Rev 2 49 ps/div 3/12 12 Ordering information scheme HSP061-2 Figure 8. ESD response to IEC 61000-4-2 (+8 kV contact discharge) Figure 9. ESD response to IEC 61000-4-2 (-8 kV contact discharge) 10V/Div 10V/Div 100ns/Div 100ns/Div 2 Ordering information scheme Figure 10. Ordering information scheme HSP 06 1 - 2 xx High speed line protection Breakdown voltage Version Number of lines Package P6 = SOT-666 M6 = µQFN-6L N4 = µQFN-4L 4/12 DocID022777 Rev 2 HSP061-2 3 Package information Package information • Epoxy meets UL94, V0 • Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 3. SOT-666 dimensions Dimensions b1 Ref. L1 Millimeters Min. Typ. Max. Inches Min. Typ. Max. A 0.45 0.60 0.018 0.024 A3 0.08 0.18 0.003 0.007 b 0.17 0.34 0.007 0.013 b1 0.19 D 1.50 1.70 0.059 0.067 E 1.50 1.70 0.059 0.067 E1 1.10 1.30 0.043 0.051 L3 b D E1 A L2 E A3 0.27 0.34 0.007 0.011 0.013 e 0.50 0.020 L1 0.19 0.007 L2 0.10 0.30 0.004 0.012 e L3 Figure 11. Footprint recommendations dimensions in mm (inches) 0.10 0.004 Figure 12. Marking for SOT-666 0.50 (0.019) 0.62 2.60 (0.024) (0.01) R 0.99 (0.039) 0.30 (0.012) DocID022777 Rev 2 5/12 12 Package information HSP061-2 Table 4. µQFN 1.45x1.00 6L dimensions Dimensions 1 2 L Ref. k Typ. Max. Min. A 0.50 0.55 0.60 0.020 0.022 0.024 A1 0.00 0.02 0.05 0.000 0.001 0.002 b 0.18 0.25 0.30 0.007 0.010 0.012 A A1 Inches Min. b e Millimeters D Typ. D 1.45 0.057 E 1.00 0.039 e 0.50 0.020 Max. N E 1 0.30 0.35 0.40 0.012 0.014 0.016 0.25 [0.010] 0.30 [0.012] 6/12 L 0.008 Figure 14. Marking for µQFN 1.45x1.00 6L 0.65 [0.026] Note: 0.20 2 Figure 13. Footprint recommendations dimensions in mm (inches) 0.50 [0.020] K 1.60 [0.063] T Product marking may be rotated by 90° for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose. DocID022777 Rev 2 HSP061-2 Package information Table 5. µQFN-4L dimensions Dimensions Ref. Side view A A1 D D2 e Bottom view k E2 E L b Millimeters Inches Min. Typ. Max. Min. Typ. A 0.45 0.50 0.55 0.018 0.020 0.022 A1 0.00 0.02 0.05 0.000 0.001 0.002 b 0.15 0.20 0.25 0.006 0.008 0.010 D 0.75 0.80 0.85 0.030 0.031 0.033 D2 0.55 0.6 0.65 0.022 0.024 0.026 e 0.35 0.40 0.45 0.014 0.016 0.018 E 0.95 1.00 1.05 0.037 0.039 0.041 E2 0.15 0.20 0.25 0.006 0.008 0.010 k 0.17 0.20 0.23 0.007 0.008 0.009 L 0.15 0.20 0.25 0.006 0.008 0.010 Figure 15. Footprint recommendations (dimensions in mm) Max. Figure 16. Marking for µQFN-4L 0.4 (0.016) Pin 1 0.4 (0.016) 0.2 (0.008) 0.2 (0.008) 1.4 (0.055) 1 0.6 (0.024) Note: Product marking may be rotated by 90° for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose. DocID022777 Rev 2 7/12 12 Recommendation on PCB assembly HSP061-2 4 Recommendation on PCB assembly 4.1 Stencil opening design 1. General recommendation on stencil opening design a) Stencil opening dimensions: L (Length), W (Width), T (Thickness). Figure 17. Stencil opening dimensions L T b) W General design rule Stencil thickness (T) = 75 ~ 125 µm W Aspect Ratio = ----- ≥ 1.5 T L×W Aspect Area = ---------------------------- ≥ 0.66 2T ( L + W ) 2. Reference design a) Stencil opening thickness: 100 µm b) Stencil opening for leads: Opening to footprint ratio is 90%. Figure 18. Recommended stencil window position for µQFN-6L 7 µm 7 µm 620 µm 650 µm 15 µm 236 µm 15 µm Footprint 250 µm Stencil window Footprint 8/12 DocID022777 Rev 2 HSP061-2 Recommendation on PCB assembly Figure 19. Recommended stencil window position for µQFN-4L T=100 µm and opening ratio is 100% 430 µm 0.4 0.4 0.2 0.2 1.4 0.6 180 µm 580 µm 0.6 200 µm Footprint Stencil windo w Footprint 4.2 4.3 Solder paste 1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004. 2. “No clean” solder paste is recommended. 3. Offers a high tack force to resist component movement during high speed. 4. Solder paste with fine particles: powder particle size is 20-45 µm. Placement 1. Manual positioning is not recommended. 2. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering. 3. Standard tolerance of ± 0.05 mm is recommended. 4. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force DocID022777 Rev 2 9/12 12 Recommendation on PCB assembly HSP061-2 can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 4.4 4.5 5. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. PCB design preference 1. To control the solder paste amount, the closed via is recommended instead of open vias. 2. The position of tracks and open vias in the solder area should be well balanced. The symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. Reflow profile Figure 20. ST ECOPACK® recommended soldering reflow profile for PCB mounting Temperature (°C) 260°C max 255°C 220°C 180°C 125 °C 2°C/s recommended 2°C/s recommended 6°C/s max 6°C/s max 3°C/s max 3°C/s max 0 0 1 2 3 4 5 10-30 sec 90 to 150 sec Note: 10/12 6 7 Time (min) 90 sec max Minimize air convection currents in the reflow oven to avoid component movement. DocID022777 Rev 2 HSP061-2 5 Ordering information Ordering information Table 6. Ordering information Order code Marking Package Weight Base qty Delivery mode HSP061-2P6 R SOT-666 2.85 mg 3000 Tape and reel (7”) HSP061-2M6 T (1) µQFN-6L 2.3 mg 3000 Tape and reel (7”) HSP061-2N4 1(1) µQFN-4L 1.17 mg 10000 Tape and reel (7”) 1. The marking can be rotated by multiple of 90° to differentiate assembly location 6 Revision history Table 7. Document revision history Date Revision Changes 07-Feb-2012 1 Initial release. 19-Mar-2014 2 Minor text changes. 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