MADP-042XX5-13060 Series
SURMOUNTTM PIN Diodes:
RoHS
Package Dimensions ODS-1306 Style1,2,3
Features
Rev. V8
Surface Mount
No Wirebonds Required
Rugged Silicon-Glass Construction
Silicon Nitride Passivation
Polymer Scratch Protection
Low Parasitic Capacitance and Inductance
High Average and Peak Power Handling
RoHS Compliant
Description
This device is a silicon, glass PIN diode surmount
chip fabricated with MACOM’s patented HMICTM
process. This device features two silicon pedestals
embedded in a low loss, low dispersion glass. The
diode is formed on the top of one pedestal and
connections to the backside of the device are
facilitated by making the pedestal sidewalls
electrically conductive. Selective backside
metallization is applied producing a surface mount
device. This vertical topology provides for
exceptional heat transfer. The topside is fully
encapsulated with silicon nitride and has an
additional polymer layer for moisture, scratch and
impact protection. These protective coatings prevent
damage to the junction and the anode air-bridge
during handling and assembly.
G
D
DIM
E
F
INCHES
MM
MIN
MAX
MIN
MAX
A
0.040
0.042
1.025
1.075
Applications
B
0.021
0.023
0.525
0.575
These packageless devices are suitable for
moderate incident power applications, ≤10 W CW or
where the peak power is ≤50 W, pulse width is
≤1 μs, and duty cycle is ≤0.01 %. Their low parasitic
inductance, 0.4 nH, and excellent RC constant,
make these devices a superior choice for higher
frequency switch elements when compared to their
plastic package counterparts.
C
0.004
0.008
0.102
0.203
D
0.013
0.015
0.325
0.375
E
0.011
0.013
0.275
0.325
F
0.013
0.015
0.325
0.375
G
0.019
0.021
0.475
0.525
1. Backside metal: 0.1 μm thick.
2. Yellow hatched areas indicate backside ohmic gold contacts.
3. All devices have the same outline dimensions (A to G).
Ordering Information
Gel Pack
Tape and Reel,
Pocket Tape
MADP-042305-130600
MADP-042305-13060P
MADP-042405-130600
MADP-042405-13060P
MADP-042505-130600
MADP-042505-13060P
MADP-042905-130600
MADP-042905-13060P
1
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MADP-042XX5-13060 Series
SURMOUNTTM PIN Diodes:
RoHS
Rev. V8
Electrical Specifications @ TAMB = +25°C 4,5,6,7
Symbol
Parameter
Conditions
Units
CT
Capacitance
-10 V, 1 MHz
-10 V, 1 GHz
-40 V, 1 MHz
-40 V, 1 GHz
RS
Resistance
VF
MADP-042305-13060
MADP-042505-13060
Min.
Typ.
Max.
Min.
Typ.
Max.
pF
—
0.14
0.15
0.13
0.14
0.22
—
0.22
—
—
0.28
0.28
0.27
0.27
0.40
—
0.40
—
+20 mA, 1 GHz
+50 mA, 1 GHz
Ω
—
1.32
1.18
—
—
0.83
0.76
—
Forward Voltage
+10 mA
V
—
0.87
1.00
—
0.84
1.00
IR
Reverse Leakage Current
-80 V
µA
—
—
10
—
—
10
IIP3
Input Third Order
Intercept Point
F1 = 1000 MHz
F2 = 1010 MHz
Input Power = +20 dBm
IBIAS = +20 mA
dBm
—
72
—
—
76
—
θ
CW Thermal Resistance
—
°C/W
—
145
—
—
115
—
TL
Lifetime
+10 mA / -6 mA
( 50% - 90% V )
ns
—
180
—
—
210
—
Symbol
Parameter
Conditions
Units
CT
Capacitance
-10 V, 1 MHz
-10 V, 1 GHz
-40 V, 1 MHz
-40 V, 1 GHz
RS
Resistance
VF
4.
5.
6.
7.
MADP-042405-13060
Min.
Typ.
Max.
pF
—
0.61
0.61
0.57
0.58
0.75
—
0.75
—
+20 mA, 1 GHz
+50 mA, 1 GHz
Ω
—
0.62
0.58
Forward Voltage
+10 mA
V
—
IR
Reverse Leakage Current
-80 V
µA
IIP3
Input Third Order
Intercept Point
F1 = 1000 MHz
F2 = 1010 MHz
Input Power = +20 dBm
IBIAS = +20 mA
θ
CW Thermal Resistance
TL
Lifetime
MADP-042905-13060
Min.
Typ.
Max.
—
0.06
0.18
—
0.18
—
—
—
3.14
2.60
—
0.82
1.00
—
0.93
1.00
—
—
10
—
—
10
dBm
—
80
—
—
65
—
—
°C/W
—
100
—
—
185
—
+10 mA / -6 mA
( 50% - 90% V )
ns
—
255
—
—
140
—
Total capacitance (CT) is equivalent to the sum of junction capacitance (CJ) and parasitic capacitance (Cpar).
Series resistance (RS) is equivalent to the total diode resistance: RS = RJ (Junction Resistance) + RC ( Ohmic Resistance)
RS and CT are measured on an HP4291A Impedance Analyzer with die mounted in an ODS-1134 package.
Theta (θ) is measured with the die mounted in an ODS-1134 package.
2
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MADP-042XX5-13060 Series
SURMOUNTTM PIN Diodes:
RoHS
Rev. V8
Absolute Maximum Ratings8,9
Parameter
Absolute Maximum
CW Incident Power
MADP-042305
MADP-042405
MADP-042505
MADP-042905
40 dBm
44 dBm
43 dBm
35 dBm
Forward Current
250 mA
Reverse Voltage
-80 V
Operating Temperature
-55°C to +125°C
Storage Temperature
-55°C to +150°C
Junction Temperature
+175°C
Mounting Temperature
+280°C for 10 seconds
8. Exceeding any one or combination of these limits may cause
permanent damage to this device.
9. MACOM does not recommend sustained operation near these
survivability limits.
Static Sensitivity
These electronic devices are sensitive to
electrostatic discharge (ESD) and can be damaged
by static electricity. Proper ESD control techniques
should be used when handling these devices.
Handling Procedures
All semiconductor chips should be handled with care
to avoid damage or contamination from perspiration
and skin oils. The use of plastic tipped tweezers or
vacuum pickups is strongly recommended for
individual components. Bulk handling should insure
that abrasion and mechanical shock are minimized.
Bonding Techniques
Attachment to a circuit board is made simple through
the use of surface mount technology. Mounting pads
are conveniently located on the bottom surface of
these devices and are removed from the active
junction locations. These devices are well suited for
solder attachment onto hard and soft substrates.
The use of 80Au/20Sn, or RoHS compliant solders
is recommended. For applications where the
average power is ~1 W, conductive silver epoxy may
also be used. Cure per manufacturers
recommended time and temperature. Typically
1 hour at 150°C.
When soldering these devices to a hard substrate,
hot gas die bonding is preferred. A vacuum tip
pick-up tool and a force of 60 to100 grams applied to
the top surface of the device is recommended.
When soldering to soft substrates, such as Duroid, it
is recommended to use a soft solder at the circuit
board to mounting pad interface. Position the die so
that its mounting pads are aligned with the circuit
board mounting pads. While applying a downward
force perpendicular to the top surface of the die,
apply heat near the circuit trace and diode mounting
pad. The solder connection to the two pads should
not be made one at a time as this will create unequal
heat flow and thermal stress to the part. Solder
reflow should not be performed by causing heat to
flow through the top surface of the die to the back.
Since the HMIC glass is transparent, the edges of
the mounting pads can be visually inspected through
the die after attachment is completed.
Typical re-flow profiles for Sn60/Pb40 and RoHS
compliant solders is provided in Application Note
M538 , “Surface Mounting Instructions“ and can
v i e we d
on
the
MACOM
we b s i t e
@
www.macom.com
3
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MADP-042XX5-13060 Series
SURMOUNTTM PIN Diodes:
RoHS
Rev. V8
Typical Performance @ TAMB = +25 °C
Capacitance @ 1 GHz
Resistance @ 1 GHz
0.8
10.0
0.7
0.5
MADP-042305
MADP-042405
MADP-042505
MADP-042905
0.4
RS (ohm)
CT (pF)
0.6
0.3
1.0
0.2
MADP-042305
MADP-042405
MADP-042505
MADP-042905
0.1
0.0
0
5
10
15
20
25
30
35
0.1
0.001
40
0.01
Voltage (V)
Capacitance @ 40 V
0.8
0.8
0.6
0.6
MADP-042305
MADP-042405
MADP-042505
MADP-042905
CT (pF)
CT (pF)
Capacitance @ 10 V
0.4
0.2
MADP-042305
MADP-042405
MADP-042505
MADP-042905
0.4
0.2
0.0
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0.0
0.0
1.8
0.2
0.4
Frequency (GHz)
4.5
3.4
3.4
MADP-042305
MADP-042405
MADP-042505
MADP-042905
RS (ohm)
RS (ohm)
0.8
1.0
1.2
1.4
1.6
1.8
1.4
1.6
1.8
Resistance @ 20 mA
4.5
2.2
0.6
Frequency (GHz)
Resistance @ 10 mA
MADP-042305
MADP-042405
MADP-042505
MADP-042905
2.2
1.1
1.1
0.0
0.0
4
0.1
Current (A)
0.2
0.4
0.6
0.8
1.0
1.2
Frequency (GHz)
1.4
1.6
1.8
0.0
0.0
0.2
0.4
0.6
0.8
1.0
1.2
Frequency (GHz)
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MADP-042XX5-13060 Series
SURMOUNTTM PIN Diodes:
RoHS
Rev. V8
M/A-COM Technology Solutions Inc. All rights reserved.
Information in this document is provided in connection with M/A-COM Technology Solutions Inc ("MACOM")
products. These materials are provided by MACOM as a service to its customers and may be used for
informational purposes only. Except as provided in MACOM's Terms and Conditions of Sale for such products or
in any separate agreement related to this document, MACOM assumes no liability whatsoever. MACOM
assumes no responsibility for errors or omissions in these materials. MACOM may make changes to
specifications and product descriptions at any time, without notice. MACOM makes no commitment to update
the information and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future
changes to its specifications and product descriptions. No license, express or implied, by estoppels or otherwise,
to any intellectual property rights is granted by this document.
THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR
IMPLIED, RELATING TO SALE AND/OR USE OF MACOM PRODUCTS INCLUDING LIABILITY OR
WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, CONSEQUENTIAL OR
INCIDENTAL DAMAGES, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR
OTHER INTELLECTUAL PROPERTY RIGHT. MACOM FURTHER DOES NOT WARRANT THE ACCURACY
OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN
THESE MATERIALS. MACOM SHALL NOT BE LIABLE FOR ANY SPECIAL, INDIRECT, INCIDENTAL, OR
CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS,
WHICH MAY RESULT FROM THE USE OF THESE MATERIALS.
MACOM products are not intended for use in medical, lifesaving or life sustaining applications. MACOM
customers using or selling MACOM products for use in such applications do so at their own risk and agree to
fully indemnify MACOM for any damages resulting from such improper use or sale.
5
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support