LIGITEK LSD315-64-XX-RP25-PF Single digit led display (0.36 inch) Datasheet

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
SINGLE DIGIT LED DISPLAY (0.36 Inch)
Pb
Lead-Free Parts
LSD315/64-XX/RP25-PF
DATA SHEET
DOC. NO
: QW0905- LSD315/64-XX/RP25-PF-08
REV.
:
DATE
: 11 - Jan.- 2008
A
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 1/8
PART NO. LSD315/64-XX/RP25-PF
Package Dimensions
7.5
(0.295")
8.48
(0.334")
PIN 1
Ø0.45 TYP
PIN 10
14.0
(0.551")
9.14
(0.36")
PIN 5
2.54X4=
10.16(0.4")
PIN 6
ψ1.1(0.043")
LSD315/64-XX/RP25-PF
LIGITEK
2.5±0.5
5.04
(0.198")
Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25(0.01") unless otherwise noted.
2.Specifications are subject to change without notice.
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Property of Ligitek Only
Page 2/8
PART NO. LSD315/64-XX/RP25-PF
Internal Circuit Diagram
LSD3154-XX/RP25-PF
1,6
A
B
10 9
C D E
8
5
4
F
G DP
3
2
7
LSD3164-XX/RP25-PF
1,6
A
B
10 9
C D E
8
5
4
F
2
G DP
3
7
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PART NO. LSD315/64-XX/RP25-PF
Electrical Connection
PIN NO.
LSD3154-XX/RP25-PF
PIN NO.
LSD3164-XX/RP25-PF
1
Common Cathode
1
Common Anode
2
Anode F
2
Cathode F
3
Anode G
3
Cathode G
4
Anode E
4
Cathode E
5
Anode D
5
Cathode D
6
Common Cathode
6
Common Anode
7
Anode DP
7
Cathode DP
8
Anode C
8
Cathode C
9
Anode B
9
Cathode B
10
Anode A
10
Cathode A
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PART NO. LSD315/64-XX/RP25-PF
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Symbol
Parameter
UNIT
Orange
Forward Current Per Chip
IF
15
mA
Peak Forward Current Per
Chip (Duty 1/10,0.1ms
Pulse Width)
IFP
50
mA
Power Dissipation Per Chip
PD
50
mW
Ir
10
μA
Operating Temperature
Topr
-25 ~ +85
℃
Storage Temperature
Tstg
-25 ~ +85
℃
Reverse Current Per Any Chip
Part Selection And Application Information(Ratings at 25℃)
CHIP
PART NO
Material
common
λP △λ
cathode
(nm) (nm)
Emitted or anode
Vf(v)
Iv(mcd)
Min.
Typ.
Min.
Typ.
1.7
2.1
0.8
1.75
IV-M
Common
Cathode
LSD3154-XX/RP25-PF
GaAsP/GaP Orange
LSD3164-XX/RP25-PF
Electrical
635
45
Common
Anode
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ± 15% testing tolerance.
2:1
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PART NO. LSD315/64-XX/RP25-PF
Page 5/8
Test Condition For Each Parameter
Symbol
Unit
Test Condition
Forward Voltage Per Chip
Vf
volt
If=10mA
Luminous Intensity Per Chip
Iv
mcd
If=10mA
Dominant Wavelength
λP
nm
If=20mA
△λ
nm
If=20mA
Ir
μA
Vr=5V
Parameter
Spectral Line Half-Width
Reverse Current Any Chip
Luminous Intensity Matching Ratio
IV-M
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PART NO. LSD315/64-XX/RP25-PF
Page6/8
Typical Electro-Optical Characteristics Curve
E CHIP
Fig.2 Relative Intensity vs. Forward Current
Relative Intensity
Normalize @20mA
Forward Current(mA)
Fig.1 Forward current vs. Forward Voltage
Forward Current(mA)
Forward Voltage(V)
Ambient Temperature( ℃)
Ambient Temperature( ℃)
Fig.5 Relative Intensity vs. Wavelength
Relative Intensity@20mA
Fig.4 Relative Intensity vs. Temperature
Relative Intensity@20mA
Normalize @25℃
Forward Voltage@20mA
Normalize @25℃
Fig.3 Forward Voltage vs. Temperature
1.0
0.5
0.0
550
600
650
700
Wavelength (nm)
750
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PART NO. LSD315/64-XX/RP25-PF
Soldering Condition(Pb-Free)
1.Iron:
Soldering Iron:30W Max
Temperature 350 °C Max
Soldering Time:3 Seconds Max(One time only)
Distance:Solder Temperature 1/16 Inch Below Seating
Plane For 3 Seconds At 260 ° C
2.Wave Soldering Profile
Dip Soldering
Preheat: 120° C Max
Preheat time: 60seconds Max
Ramp-up
2°C/sec(max)
Ramp-Down:-5°C/sec(max)
Solder Bath:260° C Max
Dipping Time:3 seconds Max
Distance:Solder Temperature 1/16 Inch Below Seating
Plane For 3 Seconds At 260°C
Temp(° C)
260° C3sec Max
260°
5° /sec
max
120°
25°
0° 0
2° /sec
max
Preheat
50
100
60 Seconds Max
Note: 1.Wave solder should not be made more than one time.
2.You can just only select one of the soldering conditions as above.
150
Time(sec)
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PART NO. LSD315/64-XX/RP25-PF
Reliability Test:
Test Item
Test Condition
Description
Reference
Standard
Operating Life Test
1.Under Room Temperature
2.If=10mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=105 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
MIL-STD-883:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
High Temperature
High Humidity Test
1.Ta=65 ℃±5℃
2.RH=90 %~95%
3.t=240hrs ±2hrs
The purpose of this test is the resistance
of the device under tropical for hours.
Thermal Shock Test
1.Ta=105 ℃±5 ℃&-40 ℃±5 ℃
(10min) (10min)
2.total 10 cycles
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solderability Test
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
This test intended to see soldering well
performed or not.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
JIS C 7021: B-12
MIL-STD-202:103B
JIS C 7021: B-11
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