Rohm BH6733HFV Silicon monolithic integrated circuit Datasheet

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STRUCTURE
Silicon Monolithic Integrated Circuit
PRODUCT SERIES
Single-Phase Full-Wave Motor Driver for Fan Motor
TYPE
BH6766FVM
FEATURES
Soft switched drive
〇ABSOLUTE MAXIMUM RATINGS
Symbol
Limit
Unit
Supply voltage
Vcc
7
V
Power dissipation
Pd
585*
mW
Topr
-40~+105
℃
Parameter
Operating temperature
Storage temperature
Output current
FG signal output current
Tstg
-55~+150
℃
Iomax
630**
mA
IFG
5
mA
7
V
150
℃
Unit
V
V
VFG
FG signal output voltage
Tjmax
Junction temperature
*
Reduce by 4.68mW/℃ over 25℃.
(On 70.0mm×70.0mm×1.6mm glass epoxy board)
** This value is not to exceed Pd. Vcc=4.0V~6.0V
At Vcc=2.0V~4.0V,output current tolerance reduces.
〇OPERATING CONDITIONS
Parameter
Symbol
Operating supply voltage range
Vcc
Limit
2.0~6.0
Hall input voltage range
VH
0.4~Vcc-1.1
*This product is not designed for production against radioactive rays.
REV. E
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〇ELECTRICAL CHARACTERISTICS (Unless otherwise specified Ta=25℃,Vcc=5V)
Min.
Limit
Typ.
Max.
Icc
VHOFS
-
5
-
8
±6
mA
mV
VO
-
0.6
0.9
V
GIO
VFGL
IFGL
VHYS
VHB
45
±5
1.1
48
±10
1.3
51
0.3
5
±15
1.5
dB
V
μA
mV
V
Symbol
Parameter
Circuit current
Input offset voltage
Output voltage
Unit
Conditions
Io=250mA
Upper and Lower total
Input-output Gain
FG low voltage
FG leak current
Input hysteresis voltage
Hall bias voltage
IFG=3mA
VFG=7V
IHB=-5mA
〇PACKAGE OUTLINES
0.29 ± 0.15
0.6 ± 0.2
8
2.8 ± 0.1
4.0 ± 0.2
2.9 ± 0.1
5
H 6 7
6
6
1
4
0.9Max.
0.75 ± 0.05
0.08 ± 0.05
0.475
Lot No.
0.145 +0.05
−0.03
0.22 +0.05
−0.04
0.08 M
0.08 S
0.65
MSOP8(UNIT:mm)
〇BLOCK DIAGRAM
〇Terminal name
OUT2
GND
150kΩ
1
Pin No.
8
500Ω
1
2
3
4
5
6
7
8
+
H+
2
Hall
Bias
OUT1
7
TSD
+
HB
-
Vcc
500Ω
3
6
150kΩ
H-
4
+
-
FG
5
REV. E
Terminal
name
OUT2
H+
HB
HFG
Vcc
OUT1
GND
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〇CAUTIONS ON USE
1) Absolute maximum ratings
An excess in the absolute maximum rations, such as supply voltage, temperature range of operating conditions, etc.,
can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open
circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit
protection devices, such as fuses.
2) Connecting the power supply connector backward
Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power
supply lines. An external direction diode can be added.
3) Power supply line
Back electromotive force causes regenerated current to power supply line, therefore take a measure such as placing
a capacitor between power supply and GND for routing regenerated current. And fully ensure that the capacitor
characteristics have no problem before determine a capacitor value. (when applying electrolytic capacitors,
capacitance characteristic values are reduced at low temperatures)
4) GND potential
The potential of GND pin must be minimum potential in all operating conditions. Also ensure that all terminals except
GND terminal do not fall below GND voltage including transient characteristics. However, it is possible that the motor
output terminal may deflect below GND because of influence by back electromotive force of motor. Malfunction may
possibly occur depending on use condition, environment, and property of individual motor. Please make fully
confirmation that no problem is found on operation of IC.
5) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation(Pd) in actual operating
conditions.
6) Inter-pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any
connection error or if pins are shorted together.
7) Actions in strong electromagnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to
malfunction.
8) ASO
When using the IC, set the output transistor so that it does not exceed absolute maximum rations or ASO.
9) Thermal shut down circuit
The IC incorporates a built-in thermal shutdown circuit (TSD circuit). Operation temperature is 175℃(typ.) and has a
hysteresis width of 25℃(typ.). When IC chip temperature rises and TSD circuit works, the output terminal becomes
an open state. TSD circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect
the IC or guarantee its operation. Do not continue to use the IC after operation this circuit or use the IC in an
environment where the operation of this circuit is assumed.
10) Testing on application boards
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to
stress. Always discharge capacitors after each process or step. Always turn the IC’s power supply off before
connecting it to or removing it from a jig or fixture during the inspection process. Ground the IC during assembly
steps as an antistatic measure. Use similar precaution when transporting or storing the IC.
11) GND wiring pattern
When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns,
placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage
variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to
change the GND wiring pattern of any external components, either.
12) Capacitor between output and GND
When a large capacitor is connected between output and GND, if Vcc is shorted with 0V or GND for some cause, it
is possible that the current charged in the capacitor may flow into the output resulting in destruction. Keep the
capacitor between output and GND below 100uF.
13) IC terminal input
When Vcc voltage is not applied to IC, do not apply voltage to each input terminal. When voltage above Vcc or
below GND is applied to the input terminal, parasitic element is actuated due to the structure of IC. Operation of
parasitic element causes mutual interference between circuits, resulting in malfunction as well as destruction in the
last. Do not use in a manner where parasitic element is actuated.
REV. E
Notice
Notes
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R1120A
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