TI LM2904AVQDRQ1 Dual operational amplifier Datasheet

SLOS414E − MAY 2003 − REVISED JUNE 2004
D Qualification in Accordance With
D
D
D
D
D
D
D Low Input Bias and Offset Parameters:
AEC-Q100†
Qualified for Automotive Applications
Customer-Specific Configuration Control
Can Be Supported Along With
Major-Change Approval
ESD Protection Exceeds 500 V Per
MIL-STD-883, Method 3015; Exceeds 200 V
Using Machine Model (C = 200 pF, R = 0)
Low Supply-Current Drain Independent of
Supply Voltage . . . 0.7 mA Typ
Common-Mode Input Voltage Range
Includes Ground, Allowing Direct Sensing
Near Ground
Differential Input Voltage Range Equal to
Maximum-Rated Supply Voltage:
− Non-V Devices . . . ±26 V
− V-Suffix Devices . . . ±32 V
D
D
− Input Offset Voltage . . . 3 mV Typ
− Input Offset Current . . . 2 nA Typ
− Input Bias Current . . . 20 nA Typ
Open-Loop Differential Voltage
Amplification . . . 100 V/mV Typ
Internal Frequency Compensation
D OR PW PACKAGE
(TOP VIEW)
1OUT
1IN−
1IN+
GND
1
8
2
7
3
6
4
5
VCC
2OUT
2IN−
2IN+
† Contact factory for details. Q100 qualification data available on
request.
description/ordering information
This device consists of two independent, high-gain, frequency-compensated operational amplifiers designed
to operate from a single supply over a wide range of voltages. Operation from split supplies is possible as long
as the difference between the two supplies is 3 V to 26 V (3 V to 32 V for V-suffix devices), and VCC is at least
1.5 V more positive than the input common-mode voltage. The low supply-current drain is independent of the
magnitude of the supply voltage.
Applications include transducer amplifiers, dc amplification blocks, and all the conventional operational
amplifier circuits that now can be implemented more easily in single-supply-voltage systems. For example,
these devices can be operated directly from the standard 5-V supply used in digital systems and easily provide
the required interface electronics without additional ±5-V supplies.
The LM2904Q is manufactured to demanding automotive requirements.
ORDERING INFORMATION
TA
−40°C to 125°C
VIOmax
AT 25°C
MAX VCC
7 mV
26 V
SOIC (D)
Tape and reel
LM2904QDRQ1
2904Q1
7 mV
26 V
TSSOP (PW)
Tape and reel
LM2904QPWRQ1
2904Q1
7 mV
32 V
SOIC (D)
Tape and reel
LM2904VQDRQ1
2904VQ1
7 mV
32 V
TSSOP (PW)
Tape and reel
LM2904VQPWRQ1
2904VQ1
2 mV
32 V
SOIC (D)
Tape and reel
LM2904AVQDRQ1
2904AVQ
2 mV
32 V
TSSOP (PW)
Tape and reel
LM2904AVQPWRQ1
PACKAGE‡
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
2904AVQ
‡ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2004, Texas Instruments Incorporated
!" #!$% &"'
&! #" #" (" " ") !"
&& *+' &! #", &" ""%+ %!&"
", %% #""'
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1
SLOS414E − MAY 2003 − REVISED JUNE 2004
symbol (each amplifier)
IN+
+
IN−
−
OUT
schematic (each amplifier)
VCC+
≈6-µA
Current
Regulator
≈6-µA
Current
Regulator
≈100-µA
Current
Regulator
OUT
IN−
≈50-µA
Current
Regulator
IN+
GND (or VCC−)
To Other Amplifier
COMPONENT COUNT
Epi-FET
Diodes
Resistors
Transistors
Capacitors
2
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2
7
51
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SLOS414E − MAY 2003 − REVISED JUNE 2004
absolute maximum ratings over operating free-air temperature (unless otherwise noted)†
Supply voltage, VCC (see Note 1): Non-V devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 V
V-suffix devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 V
Differential input voltage, VID (see Note 2): Non-V devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±26 V
V-suffix devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±32 V
Input voltage range, VI (either input): Non-V devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 26 V
V-suffix devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 32 V
Duration of output short circuit (one amplifier) to ground at (or below) 25°C
free-air temperature (VCC ≤ 15 V) (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Unlimited
Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Package thermal impedance, θJA (see Notes 4 and 5): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . 149°C/W
Operating free-air temperature range, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 125°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, except differential voltages and VCC specified for measurement of IOS, are with respect to the network ground
terminal.
2. Differential voltages are at IN+ with respect to IN−.
3. Short circuits from outputs to VCC can cause excessive heating and eventual destruction.
4. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
5. The package thermal impedance is calculated in accordance with JESD 51-7.
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SLOS414E − MAY 2003 − REVISED JUNE 2004
electrical characteristics at specified free-air temperature, VCC = 5 V (unless otherwise noted)
TEST CONDITIONS†
PARAMETER
VIO
aV
IO
VCC = 5 V to
MAX,
VIC = VICR(min),
VO = 1.4 V
Input offset voltage
Non-A devices
A-suffix devices
VO = 1.4 V
aI
IO
Average temperature coefficient of
input offset current
IIB
Input bias current
IB
Drift
VICR
VO = 1.4 V
High-level output voltage
Full range
Full range
7
25°C
2
Full range
5
VCC = MAX,
Non-V devices
RL = 2 kΩ
VCC = MAX,
V-suffix devices
RL = 2 kΩ
RL ≥ 10 kΩ
10
25°C
−20
RL ≥ 10 kΩ
µV/°C
50
50
nA
pA/°C
−250
−500
50
25°C
0 to
VCC−1.5
Full range
0 to
VCC−2
Full range
mV
150
Full range
25°C
2
300
Full range
VCC = 5 V to MAX
UNIT
4
Full range
RL ≥ 10 kΩ
VOH
7
10
Full range
Common-mode input voltage range
MAX
3
1
25°C
V-suffix devices
TYP§
Full range
25°C
Average temperature coefficient of
input offset voltage
Input offset current
MIN
25°C
Non-V devices
IIO
TA‡
nA
pA/°C
V
VCC−1.5
22
23
24
V
26
Full range
27
28
VOL
Low-level output voltage
RL ≤ 10 kΩ
Full range
Large-signal differential
voltage amplification
VCC = 15 V, VO = 1 V to 11 V,
RL = ≥ 2 kΩ
25°C
25
AVD
Full range
15
CMRR
Common-mode rejection ratio
VCC = 5 V to MAX,
VIC = VICR(min)
25°C
65
80
dB
kSVR
Supply-voltage rejection ratio
(∆VDD/∆VIO)
VCC = 5 V to MAX
25°C
65
100
dB
VO1/VO2
Crosstalk attenuation
f = 1 kHz to 20 kHz
25°C
120
dB
VCC = 15 V, VID = 1 V, VO = 0
IO
IOS
ICC
Output current
Short-circuit output current
Supply current (two amplifiers)
VCC = 15 V, VID = −1 V, VO = 15 V
VID = −1 V,
VO = 200 mV
VCC at 5 V, GND at −5 V, VO = 0
VO = 2.5 V,
No load
VCC = MAX, VO = 0.5 VCC, No load
5
25°C
−20
Full range
−10
25°C
10
Full range
5
25°C
12
25°C
Full range
20
mV
100
V/mV
−30
mA
20
µA
40
±40
±60
0.7
1.2
1
2
mA
mA
† All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. MAX VCC for
testing purposes is 26 V for non-V devices and 32 V for V-suffix devices.
‡ Full range is −40°C to 125°C for LM2904Q.S
§ All typical values are at TA = 25°C.
4
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SLOS414E − MAY 2003 − REVISED JUNE 2004
operating conditions, VCC = ±15 V, TA = 25°C
PARAMETER
TEST CONDITIONS
TYP
UNIT
SR
Slew rate at unity gain
RL = 1 MΩ, CL = 30 pF, VI = ±10 V
(see Figure 1)
0.3
V/µs
B1
Unity-gain bandwidth
RL = 1 MΩ, CL = 20 pF (see Figure 1)
0.7
MHz
Equivalent input noise voltage
RS = 100 Ω, VI = 0 V, f = 1 kHz
(see Figure 2)
40
nV/√Hz
Vn
VCC+
−
VI
VO
+
CL
VCC−
RL
Figure 1. Unity-Gain Amplifier
900 Ω
VCC+
100 Ω
VI = 0 V
RS
−
+
VO
VCC−
Figure 2. Noise-Test Circuit
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5
PACKAGE OPTION ADDENDUM
www.ti.com
4-Mar-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
LM2904AVQDRQ1
ACTIVE
SOIC
D
8
2500
Pb-Free
(RoHS)
CU NIPDAU
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
LM2904AVQPWRQ1
ACTIVE
TSSOP
PW
8
LM2904QDRQ1
ACTIVE
SOIC
D
8
2000
None
CU NIPDAU
Level-1-250C-UNLIM
2500
Pb-Free
(RoHS)
CU NIPDAU
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
LM2904QPWRQ1
ACTIVE
TSSOP
PW
8
LM2904VQDRQ1
ACTIVE
SOIC
D
8
2000
None
CU NIPDAU
Level-1-250C-UNLIM
2500
Pb-Free
(RoHS)
CU NIPDAU
Level-2-250C-1 YEAR/
Level-1-235C-UNLIM
LM2904VQPWRQ1
ACTIVE
TSSOP
PW
8
2000
None
CU NIPDAU
Level-1-250C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
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