ON MC14094BFELG 8−stage shift/store register with three−state output Datasheet

MC14094B
8−Stage Shift/Store Register
with Three−State Outputs
The MC14094B combines an 8−stage shift register with a data latch
for each stage and a 3−state output from each latch.
Data is shifted on the positive clock transition and is shifted from the
seventh stage to two serial outputs. The QS output data is for use in
high−speed cascaded systems. The QS output data is shifted on the
following negative clock transition for use in low−speed cascaded
systems.
Data from each stage of the shift register is latched on the negative
transition of the strobe input. Data propagates through the latch while
strobe is high.
Outputs of the eight data latches are controlled by 3−state buffers
which are placed in the high−impedance state by a logic Low on
Output Enable.
Features
• 3−State Outputs
• Capable of Driving Two Low−Power TTL Loads or One Low−Power
http://onsemi.com
MARKING
DIAGRAMS
PDIP−16
P SUFFIX
CASE 648
16
MC14094BCP
AWLYYWWG
1
16
SOIC−16
D SUFFIX
CASE 751B
14094BG
AWLYWW
1
Schottky TTL Load Over the Rated Temperature Range
• Input Diode Protection
• Data Latch
• Dual Outputs for Data Out on Both Positive and
•
•
•
16
Negative Clock Transitions
Useful for Serial−to−Parallel Data Conversion
Pin−for−Pin Compatible with CD4094B
Pb−Free Packages are Available*
1
16
SOEIAJ−16
F SUFFIX
CASE 966
MAXIMUM RATINGS (Voltages Referenced to VSS)
Symbol
VDD
Parameter
Unit
−0.5 to +18.0
V
V
Input or Output Current
(DC or Transient) per Pin
± 10
mA
PD
Power Dissipation, per Package
(Note 1)
500
mW
Iin, Iout
DC Supply Voltage Range
Value
−0.5 to VDD + 0.5
Vin, Vout
Input or Output Voltage Range
(DC or Transient)
14
094B
ALYW
TSSOP−16
DT SUFFIX
CASE 948F
MC14094B
ALYWG
1
A
WL, L
YY, Y
WW, W
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Indicator
TA
Ambient Temperature Range
−55 to +125
°C
ORDERING INFORMATION
Tstg
Storage Temperature Range
−65 to +150
°C
TL
Lead Temperature
(8−Second Soldering)
260
°C
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
1. Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C
This device contains protection circuitry to guard against damage due to high
static voltages or electric fields. However, precautions must be taken to avoid
applications of any voltage higher than maximum rated voltages to this
high−impedance circuit. For proper operation, Vin and Vout should be constrained
to the range VSS v (Vin or Vout) v VDD.
Unused inputs must always be tied to an appropriate logic voltage level
(e.g., either VSS or VDD). Unused outputs must be left open.
© Semiconductor Components Industries, LLC, 2005
August, 2005 − Rev. 6
1
*For additional information on our Pb−Free strategy
and soldering details, please download the
ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
Publication Order Number:
MC14094B/D
MC14094B
PIN ASSIGNMENT
STROBE
1
16
DATA
2
15
CLOCK
3
14
VDD
OUTPUT
ENABLE
Q5
Q1
4
13
Q6
Q2
5
12
Q7
Q3
6
11
Q8
Q4
7
10
Q′S
VSS
8
9
QS
TRUTH TABLE
Clock
Parallel Outputs
Output
Enable
Strobe
0
Serial Outputs
Data
Q1
QN
QS*
Q′S
X
X
Z
Z
Q7
No Chg.
0
X
X
Z
Z
No Chg.
Q7
1
0
X
No Chg.
No Chg.
Q7
No Chg.
1
1
0
0
QN−1
Q7
No Chg.
1
1
1
1
QN−1
Q7
No Chg.
1
1
1
No Chg.
No Chg.
No Chg.
Q7
Z = High Impedance
X = Don’t Care
* At the positive clock edge, information in the 7th shift register stage is transferred to Q8 and QS.
ORDERING INFORMATION
Package
Shipping †
MC14094BCP
PDIP−16
500 Units / Rail
MC14094BCPG
PDIP−16
(Pb−Free)
500 Units / Rail
MC14094BD
SOIC−16
48 Units / Rail
MC14094BDG
SOIC−16
(Pb−Free)
48 Units / Rail
MC14094BDR2
SOIC−16
2500 Units / Tape & Reel
MC14094BDR2G
SOIC−16
(Pb−Free)
2500 Units / Tape & Reel
MC14094BDTR2
TSSOP−16*
2500 Units / Tape & Reel
MC14094BF
SOEIAJ−16
50 Units / Rail
MC14094BFG
SOEIAJ−16
(Pb−Free)
50 Units / Rail
MC14094BFEL
SOEIAJ−16
2000 Units / Tape & Reel
MC14094BFELG
SOEIAJ−16
(Pb−Free)
2000 Units / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*This package is inherently Pb−Free.
http://onsemi.com
2
MC14094B
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ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
Characteristic
Output Voltage
Vin = VDD or 0
Symbol
− 55_C
25_C
125_C
VDD
Vdc
Min
Max
Min
Typ (2)
Max
Min
Max
Unit
“0” Level
VOL
5.0
10
15
−
−
−
0.05
0.05
0.05
−
−
−
0
0
0
0.05
0.05
0.05
−
−
−
0.05
0.05
0.05
Vdc
“1” Level
VOH
5.0
10
15
4.95
9.95
14.95
−
−
−
4.95
9.95
14.95
5.0
10
15
−
−
−
4.95
9.95
14.95
−
−
−
Vdc
Input Voltage
“0” Level
(VO = 4.5 or 0.5 Vdc)
(VO = 9.0 or 1.0 Vdc)
(VO = 13.5 or 1.5 Vdc)
VIL
5.0
10
15
−
−
−
1.5
3.0
4.0
−
−
−
2.25
4.50
6.75
1.5
3.0
4.0
−
−
−
1.5
3.0
4.0
“1” Level
VIH
5.0
10
15
3.5
7.0
11
−
−
−
3.5
7.0
11
2.75
5.50
8.25
−
−
−
3.5
7.0
11
−
−
−
5.0
5.0
10
15
– 3.0
– 0.64
– 1.6
– 4.2
−
−
−
−
– 2.4
– 0.51
– 1.3
– 3.4
– 4.2
– 0.88
– 2.25
– 8.8
−
−
−
−
– 1.7
– 0.36
– 0.9
– 2.4
−
−
−
−
IOL
5.0
10
15
0.64
1.6
4.2
−
−
−
0.51
1.3
3.4
0.88
2.25
8.8
−
−
−
0.36
0.9
2.4
−
−
−
mAdc
Input Current
Iin
15
−
± 0.1
−
± 0.00001
± 0.1
−
± 1.0
mAdc
Input Capacitance
(Vin = 0)
Cin
−
−
−
−
5.0
7.5
−
−
pF
Quiescent Current
(Per Package)
IDD
5.0
10
15
−
−
−
5.0
10
20
−
−
−
0.005
0.010
0.015
5.0
10
20
−
−
−
150
300
600
mAdc
Total Supply Current (3) (4)
(Dynamic plus Quiescent,
Per Package)
(CL = 50 pF on all outputs, all
buffers switching)
IT
5.0
10
15
3−State Output Leakage Current
ITL
15
Vin = 0 or VDD
(VO = 0.5 or 4.5 Vdc)
(VO = 1.0 or 9.0 Vdc)
(VO = 1.5 or 13.5 Vdc)
Output Drive Current
(VOH = 2.5 Vdc)
(VOH = 4.6 Vdc)
(VOH = 9.5 Vdc)
(VOH = 13.5 Vdc)
(VOL = 0.4 Vdc)
(VOL = 0.5 Vdc)
(VOL = 1.5 Vdc)
Vdc
Vdc
IOH
Source
Sink
mAdc
IT = (4.1 mA/kHz) f + IDD
IT = (14 mA/kHz) f + IDD
IT = (140 mA/kHz) f + IDD
−
± 0.1
−
± 0.0001
± 0.1
mAdc
−
± 3.0
2. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
3. The formulas given are for the typical characteristics only at 25_C.
4. To calculate total supply current at loads other than 50 pF:
IT(CL) = IT(50 pF) + (CL – 50) Vfk
where: IT is in mA (per package), CL in pF, V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.001.
http://onsemi.com
3
mA
MC14094B
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SWITCHING CHARACTERISTICS (5) (CL = 50 pF, TA = 25_C)
Characteristic
Symbol
Output Rise and Fall Time
tTLH, tTHL = (1.35 ns/pF) CL + 33 ns
tTLH, tTHL = (0.6 ns/pF) CL + 20 ns
tTLH, tTHL = (0.4 ns/pF) CL + 20 ns
tTLH,
tTHL
Propagation Delay Time
Clock to Serial out QS
tPLH, tPHL = (0.90 ns/pF) CL + 305 ns
tPLH, tPHL = (0.36 ns/pF) CL + 107 ns
tPLH, tPHL = (0.26 ns/pF) C L + 82 ns
tPLH,
tPHL
VDD
Vdc
Min
Typ (6)
Max
5.0
10
15
−
−
−
100
50
40
200
100
80
Unit
ns
ns
5.0
10
15
−
−
−
350
125
95
600
250
190
Clock to Serial out Q’S
tPLH, tPHL = (0.90 ns/pF) CL + 350 ns
tPLH, tPHL = (0.36 ns/pF) CL + 149 ns
tPLH, tPHL = (0.26 ns/pF) CL + 62 ns
5.0
10
15
−
−
−
230
110
75
460
220
150
Clock to Parallel out
tPLH, tPHL = (0.90 ns/pF) CL + 375 ns
tPLH, tPHL = (0.35 ns/pF) CL + 177 ns
tPLH, tPHL = (0.26 ns/pF) CL + 122 ns
5.0
10
15
−
−
−
420
195
135
840
390
270
Strobe to Parallel out
tPLH, tPHL = (0.90 ns/pF) CL + 245 ns
tPLH, tPHL = (0.36 ns/pF) C L + 127 ns
tPLH, tPHL = (0.26 ns/pF) CL + 87 ns
5.0
10
15
−
−
−
290
145
100
580
290
200
tPHZ,
tPZL
5.0
10
15
−
−
−
140
75
55
280
150
110
tPLZ,
tPZH
5.0
10
15
−
−
−
225
95
70
450
190
140
Setup Time
Data in to Clock
tsu
5.0
10
15
125
55
35
60
30
20
−
−
−
ns
Hold Time
Clock to Data
th
5.0
10
15
0
20
20
– 40
– 10
0
−
−
−
ns
Clock Pulse Width, High
tWH
5.0
10
15
200
100
83
100
50
40
−
−
−
ns
Clock Rise and Fall Time
tr(cl)
tf(cl)
5
10
15
−
−
−
−
−
−
15
5.0
4.0
ms
fcl
5.0
10
15
−
−
−
2.5
5.0
6.0
1.25
2.5
3.0
MHz
tWL
5.0
10
15
200
80
70
100
40
35
−
−
−
ns
Output Enable to Output
tPHZ, tPZL = (0.90 ns/pF) CL + 95 ns
tPHZ, tPZL = (0.36 ns/PF) CL + 57 ns
tPHZ, tPZL = (0.26 ns/pF) CL + 42 ns
tPLZ, tPZH = (0.90 ns/pF) CL + 180 ns
tPLZ, tPZH = (0.36 ns/pF) CL + 77 ns
tPLZ, tPZH = (0.26 ns/pF) CL + 57 ns
Clock Pulse Frequency
Strobe Pulse Width
5. The formulas given are for the typical characteristics only at 25_C.
6. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
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4
MC14094B
3−STATE TEST CIRCUIT
FOR tPHZ AND tPZH
VSS
FOR tPLZ AND tPZL
VDD
O.E.
1k
DATA
OUTPUT
ST
50 pF
CLOCK
BLOCK DIAGRAM
REGISTER STAGE 1
CLOCK
2
CLOCK
CLOCK
CLOCK
CLOCK
2
3
4
5
6
7
8
STROBE STROBE
4
Q1
STROBE
REGISTER STAGE 2
LATCH 2
3−STATE BUFFER2
5
Q2
REGISTER STAGE 3
LATCH 3
3−STATE BUFFER3
6
Q3
REGISTER STAGE 4
LATCH 4
3−STATE BUFFER4
7
Q4
REGISTER STAGE 5
LATCH 5
3−STATE BUFFER5
14
Q5
REGISTER STAGE 6
LATCH 6
3−STATE BUFFER6
13
Q6
REGISTER STAGE 7
LATCH 7
3−STATE BUFFER7
12
Q7
LATCH 8
3−STATE BUFFER8
11
Q8
10
Q′S
9
QS
REGISTER STAGE 8
CLOCK
*
CLOCK
*
STROBE
CLOCK
1
VDD
*
OUTPUT
ENABLE
3
3−STATE BUFFER 1
STROBE
*
SERIAL
DATA IN
15
LATCH 1
CLOCK
STROBE
STROBE STROBE
CLOCK
CLOCK
CLOCK
CLOCK
CLOCK
*Input Protection Diodes
CLOCK
STROBE
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5
MC14094B
DYNAMIC TIMING DIAGRAM
tWH
3
CLOCK
50%
90%
50%
10%
th
tsu
2
tf
tr
DATA IN
tWL
1
STROBE
15
OUTPUT
ENABLE
N
50%
tPLH
Q1 ³ Q7
tTLH
9
QS
tPHL
tPLH
tPHZ
90%
90%
50%
10%
10%
tTHL
tPZL
tPLZ
90%
10%
10%
tPHL
tPLH
50%
50%
tPLH
10 Q′S
tPZH
90%
50%
tPHL
50%
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6
MC14094B
PACKAGE DIMENSIONS
PDIP−16
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648−08
ISSUE T
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS
WHEN FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE
MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
−A−
16
9
1
8
B
F
C
L
DIM
A
B
C
D
F
G
H
J
K
L
M
S
S
−T−
SEATING
PLANE
K
H
G
D
M
J
16 PL
0.25 (0.010)
T A
M
M
INCHES
MIN
MAX
0.740 0.770
0.250 0.270
0.145 0.175
0.015 0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008 0.015
0.110 0.130
0.295 0.305
0_
10 _
0.020 0.040
MILLIMETERS
MIN
MAX
18.80 19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
SOIC−16
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B−05
ISSUE J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
−A−
16
9
−B−
1
P
8 PL
0.25 (0.010)
8
M
B
S
G
R
K
F
X 45 _
C
−T−
SEATING
PLANE
J
M
D
16 PL
0.25 (0.010)
M
T B
S
A
S
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7
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.229
0.244
0.010
0.019
MC14094B
PACKAGE DIMENSIONS
TSSOP−16
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948F−01
ISSUE A
16X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
V
S
S
S
K
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
ÇÇÇ
K1
2X
L/2
16
9
J1
B
−U−
L
SECTION N−N
J
PIN 1
IDENT.
8
1
N
0.15 (0.006) T U
S
0.25 (0.010)
A
−V−
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH. PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
M
N
F
DETAIL E
−W−
C
0.10 (0.004)
−T− SEATING
PLANE
H
D
DETAIL E
G
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8
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
MIN
MAX
4.90
5.10
4.30
4.50
−−−
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.18
0.28
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
INCHES
MIN
MAX
0.193 0.200
0.169 0.177
−−− 0.047
0.002 0.006
0.020 0.030
0.026 BSC
0.007
0.011
0.004 0.008
0.004 0.006
0.007 0.012
0.007 0.010
0.252 BSC
0_
8_
MC14094B
PACKAGE DIMENSIONS
SOEIAJ−16
F SUFFIX
PLASTIC EIAJ SOIC PACKAGE
CASE 966−01
ISSUE O
16
LE
9
Q1
M_
E HE
1
8
L
DETAIL P
Z
D
e
VIEW P
A
DIM
A
A1
b
c
D
E
e
HE
L
LE
M
Q1
Z
A1
b
0.13 (0.005)
c
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
0.10 (0.004)
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9
MILLIMETERS
MIN
MAX
−−−
2.05
0.05
0.20
0.35
0.50
0.18
0.27
9.90
10.50
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10 _
0_
0.70
0.90
−−−
0.78
INCHES
MIN
MAX
−−− 0.081
0.002
0.008
0.014
0.020
0.007
0.011
0.390
0.413
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10 _
0_
0.028
0.035
−−− 0.031
MC14094B
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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MC14094B/D
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