STMicroelectronics M28W320CB 32 mbit (2mb x16, boot block) 3v supply flash memory Datasheet

M28W320CT
M28W320CB
32 Mbit (2Mb x16, Boot Block) Low Voltage Flash Memory
PRELIMINARY DATA
■
SUPPLY VOLTAGE
– VDD = 2.7V to 3.6V: for Program, Erase and
Read
– VDDQ = 1.65V or 2.7V: Input/Output option
– VPP = 12V: optional Supply Voltage for fast
Program
■
µBGA
ACCESS TIME
– 2.7V to 3.6V: 90ns
– 2.7V to 3.6V: 100ns
■
PROGRAMMING TIME:
TSOP48 (N)
12 x 20mm
µBGA47 (GB)
8 x 6 solder balls
– 10µs typical
– Double Word Programming Option
■
PROGRAM/ERASE CONTROLLER (P/E.C.)
■
COMMON FLASH INTERFACE
■
MEMORY BLOCKS
Figure 1. Logic Diagram
– Parameter Blocks (Top or Bottom location)
– Main Blocks
■
BLOCK PROTECTION UNPROTECTION
VDD VDDQ VPP
– All Blocks protected at Power Up
– Any combination of blocks can be protected
– WP for block locking
■
SECURITY
21
A0-A20
– 64-bit user Programmable OTP cells
W
– 64-bit unique device identifier
E
– One Parameter Block Permanently Lockable
G
■
AUTOMATIC STAND-BY MODE
■
PROGRAM and ERASE SUSPEND
RP
■
100,000 PROGRAM/ERASE CYCLES per
BLOCK
WP
■
20 YEARS of DATA RETENTION
– Defectivity below 1ppm/year
■
ELECTRONIC SIGNATURE
16
DQ0-DQ15
M28W320CT
M28W320CB
VSS
AI03521
– Manufacturer Code: 20h
– Top Device Code, M28W320CT: 88BAh
– Bottom Device Code, M28W320CB: 88BBh
May 2000
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice.
1/42
M28W320CT, M28W320CB
Figure 2. µBGA Connections (Top view through package)
1
2
3
A
A13
A11
A8
B
A14
A10
W
C
A15
A12
A9
D
A16
DQ14
DQ5
E
VDDQ
DQ15
F
VSS
DQ7
4
5
6
7
8
V PP
WP
A19
A7
A4
RP
A18
A17
A5
A2
A20
A6
A3
A1
DQ11
DQ2
DQ8
E
A0
DQ6
DQ12
DQ3
DQ9
DQ0
VSS
DQ13
DQ4
VDD
DQ10
DQ1
G
AI02686
Figure 3. TSOP Connections
A15
A14
A13
A12
A11
A10
A9
A8
NC
A20
W
RP
VPP
WP
A19
A18
A17
A7
A6
A5
A4
A3
A2
A1
1
Table 1. Signal Names
48
12 M28W320CT 37
13 M28W320CB 36
24
25
AI03522
2/42
A16
VDDQ
VSS
DQ15
DQ7
DQ14
DQ6
DQ13
DQ5
DQ12
DQ4
VDD
DQ11
DQ3
DQ10
DQ2
DQ9
DQ1
DQ8
DQ0
G
VSS
E
A0
A0-A20
Address Inputs
DQ0-DQ7
Data Input/Output, Command Inputs
DQ8-DQ15
Data Input/Output
E
Chip Enable
G
Output Enable
W
Write Enable
RP
Reset
WP
Write Protect
VDD
Supply Voltage
VDDQ
Power Supply for
Input/Output Buffers
VPP
Optional Supply Voltage for
Fast Program & Erase
VSS
Ground
NC
Not Connected Internally
M28W320CT, M28W320CB
Table 2. Absolute Maximum Ratings (1)
Symbol
Value
Unit
Ambient Operating Temperature (2)
–40 to 85
°C
TBIAS
Temperature Under Bias
–40 to 125
°C
TSTG
Storage Temperature
–55 to 155
°C
–0.6 to VDDQ+0.6
V
Supply Voltage
–0.6 to 4.1
V
Program Voltage
–0.6 to 13
V
TA
V IO
VDD, VDDQ
V PP
Parameter
Input or Output Voltage
Note: 1. Except for the rating ”Operating Temperature Range”, stresses above those listed in the Table ”Absolute Maximum Ratings” may
cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions
above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality documents.
2. Depends on range.
DESCRIPTION
The M28W320C is a 32 Mbit non-volatile Flash
memory that can be erased electrically at the block
level and programmed in-system on a Word-byWord basis. The device is offered in the TSOP48
(10 x 20mm) and the µBGA47, 0.75mm ball pitch
packages. When shipped, all bits of the
M28W320C are in the 1 state.
The array matrix organisation allows each block to
be erased and reprogrammed without affecting
other blocks. All blocks are protected against programming and erase at Power UP. Blocks can be
unprotected to make changes in the application
and then reprotected. A parameter block ”Security
Block” can be permanently protected against programming and erase in order to increase the data
security. Each block can be programmed and
erased over 100,000 cycles. VDDQ allows to drive
the I/O pin down to 1.65V. An optional 12V VPP
power supply is provided to speed up the program
phase at customer production line environment.
An internal Command Interface (C.I.) decodes the
instructions to access/modify the memory content.
The Program/Erase Controller (P/E.C.) automatically executes the algorithms taking care of the
timings necessary for program and erase operations. Verification is performed too, unburdening
the microcontroller, while the Status Register
tracks the status of the operation.
The following instructions are executed by the
M28W320C: Read Array, Read Electronic Signature, Read Status Register, Clear Status Register,
Program, Double Word Program, Block Erase,
Program/Erase Suspend, Program/Erase Resume, CFI Query, Block Protect, Block Lock, Block
Unprotect, Protection Program.
Organisation
The M28W320C is organised as 2 Mbit by 16 bits.
A0-A20 are the address lines; DQ0-DQ15 are the
Data Input/Output. Memory control is provided by
Chip Enable E, Output Enable G and Write Enable
W inputs. The Program and Erase operations are
managed automatically by the P/E.C. Block protection against Program or Erase provides additional data security.
Memory Blocks
The device features an asymmetrical blocked architecture. The M28W320C has an array of 71
blocks: 8 Parameter Blocks of 4 KWord and 63
Main Blocks of 32 KWord. M28W320CT has the
Parameter Blocks at the top of the memory address space while the M28W320CB locates the
Parameter Blocks starting from the bottom. The
memory maps are shown in Tables 3 and 4.
All Blocks are protected at power up. Instruction
are provided to protect, unprotect any block in the
application. A second register locks the protection
status while WP is low (see Block Protection Description). Each block can be erased separately.
Erase can be suspended in order to perform either
read or program in any other block and then resumed. Program can be suspended to read data in
any other block and then resumed.
The architecture includes a 128 bits Protection
register that are divided into Two 64-bits segment.
In the first one, starting from address 81h to 84h,
is written a unique device number, while the second one, starting from 85h to 88h, is programmable by the user. The user programmable segment
can be permanently protected programming the
bit.1 of the Protection Lock Register (see protection register and Security Block). The parameter
block (# 0) is a security block. It can be permanently protected by the user programming the bit.2 of
the Protection Lock Register (see protection register and Security Block).
3/42
M28W320CT, M28W320CB
Table 3. Top Boot Block Addresses,
M28W320CT
36
32
120000-127FFF
35
32
118000-11FFFF
#
Size
(KWord)
Address Range
34
32
110000-117FFF
70
4
1FF000-1FFFFF
33
32
108000-10FFFF
32
100000-107FFF
69
4
1FE000-1FEFFF
32
68
4
1FD000-1FDFFF
31
32
0F8000-0FFFFF
32
0F00000-F7FFF
67
4
1FC000-1FCFFF
30
66
4
1FB000-1FBFFF
29
32
0E8000-0EFFFF
32
0E0000-0E7FFF
65
4
1FA000-1FAFFF
28
64
4
1F9000-1F9FFF
27
32
0D8000-0DFFFF
1F8000-1F8FFF
26
32
0D0000-0D7FFF
25
32
0C8000-0CFFFF
24
32
0C0000-0C7FFF
32
0B8000-0BFFFF
63
4
62
32
1F0000-1F7FFF
61
32
1E8000-1EFFFF
60
32
1E0000-1E7FFF
23
59
32
1D8000-1DFFFF
22
32
0B0000-0B7FFF
32
0A8000-0AFFFF
58
32
1D0000-1D7FFF
21
57
32
1C8000-1CFFFF
20
32
0A0000-0A7FFF
1C0000-1C7FFF
19
32
098000-09FFFF
18
32
090000-097FFF
17
32
088000-08FFFF
32
080000-087FFF
56
32
55
32
1B8000-1BFFFF
54
32
1B0000-1B7FFF
53
32
1A8000-1AFFFF
16
52
32
1A0000-1A7FFF
15
32
078000-07FFFF
14
32
070000-077FFF
51
32
198000-19FFFF
50
32
190000-197FFF
13
32
068000-06FFFF
32
060000-067FFF
058000-05FFFF
49
32
188000-18FFFF
12
48
32
180000-187FFF
11
32
178000-17FFFF
10
32
050000-057FFF
32
048000-04FFFF
47
32
46
32
170000-177FFF
9
45
32
168000-16FFFF
8
32
040000-047FFF
7
32
038000-03FFFF
44
32
160000-167FFF
43
32
158000-15FFFF
6
32
030000-037FFF
5
32
028000-02FFFF
4
32
020000-027FFF
32
018000-01FFFF
42
32
150000-157FFF
41
32
148000-14FFFF
40
32
140000-147FFF
3
39
32
138000-13FFFF
2
32
010000-017FFF
130000-137FFF
1
32
008000-00FFFF
128000-12FFFF
0
32
000000-007FFF
38
37
4/42
32
32
M28W320CT, M28W320CB
Table 4. Bottom Boot Block Addresses,
M28W320CB
#
Size
(KWord)
Address Range
70
32
1F8000-1FFFFF
69
32
1F0000-1F7FFF
68
32
1E8000-1EFFFF
67
32
1E0000-1E7FFF
66
32
1D8000-1DFFFF
65
32
1D0000-1D7FFF
64
32
1C8000-1CFFFF
63
32
1C0000-1C7FFF
62
32
1B8000-1BFFFF
61
32
1B0000-1B7FFF
60
32
1A8000-1AFFFF
59
32
1A0000-1A7FFF
58
32
198000-19FFFF
57
32
190000-197FFF
56
32
188000-18FFFF
55
32
180000-187FFF
54
32
178000-17FFFF
53
32
170000-177FFF
52
32
168000-16FFFF
51
32
160000-167FFF
50
32
158000-15FFFF
49
32
150000-157FFF
48
32
148000-14FFFF
47
32
140000-147FFF
46
32
138000-13FFFF
45
32
130000-137FFF
44
32
128000-12FFFF
43
32
120000-127FFF
42
32
118000-11FFFF
41
32
110000-117FFF
40
32
108000-10FFFF
39
32
100000-107FFF
38
37
32
32
0F8000-0FFFFF
0F0000-0F7FFF
36
32
35
32
0E8000-0EFFFF
0E0000-0E7FFF
34
32
0D8000-0DFFFF
33
32
0D0000-0D7FFF
32
32
0C8000-0CFFFF
31
32
0C0000-0C7FFF
30
32
0B8000-0BFFFF
29
32
0B0000-0B7FFF
28
32
0A8000-0AFFFF
27
32
0A0000-0A7FFF
26
32
098000-09FFFF
25
32
090000-097FFF
24
32
088000-08FFFF
23
32
080000-087FFF
22
32
078000-07FFFF
21
32
070000-077FFF
20
32
068000-06FFFF
19
32
060000-067FFF
18
32
058000-05FFFF
17
32
050000-057FFF
16
32
048000-04FFFF
15
32
040000-047FFF
14
32
038000-03FFFF
13
32
030000-037FFF
12
32
028000-02FFFF
11
32
020000-027FFF
10
32
018000-01FFFF
9
32
010000-017FFF
8
32
008000-00FFFF
7
4
007000-007FFF
6
4
006000-006FFF
5
4
005000-005FFF
4
4
004000-004FFF
3
4
003000-003FFF
2
4
002000-002FFF
1
4
001000-001FFF
0
4
000000-000FFF
5/42
M28W320CT, M28W320CB
SIGNAL DESCRIPTIONS
See Figure 1 and Table 1.
Address Inputs (A0-A20). The address signals
are inputs driven with CMOS voltage levels. They
are latched during a write operation.
Data Input/Output (DQ0-DQ15). The data inputs, a word to be programmed or a command to
the C.I., are latched on the Chip Enable E or Write
Enable W rising edge, whichever occurs first. The
data output from the memory Array, the Electronic
Signature, the block protection status or Status
Register is valid when Chip Enable E and Output
Enable G are active. The output is high impedance
when the chip is deselected, the outputs are disabled or RP is tied to VIL. Commands are issued
on DQ0-DQ7.
Chip Enable (E). The Chip Enable input activates the memory control logic, input buffers, decoders and sense amplifiers. E at VIH deselects
the memory and reduces the power consumption
to the stand-by level. E can also be used to control
writing to the command register and to the memory array, while W remains at VIL.
Output Enable (G). The Output Enable controls
the data Input/Output buffers.
Write Enable (W). This input controls writing to
the Command Register, Input Address and Data
latches.
Write Protect (WP). This input gives an additional hardware protection level against program or
erase when pulled at VIL, as described in the Block
Protection description.
Reset Input (RP). The RP input provides hardware reset of the memory. When RP is at VIL, the
6/42
memory is in reset mode: the outputs are put to
High-Z and the current consumption is minimised.
When RP is at VIH, the device is in normal operation. Exiting reset mode the device enters read array mode.
VDD Supply Voltage (2.7V to 3.6V). VDD
provides the power supply to the internal core of the
memory device. It is the main power supply for all
operations (Read, Program and Erase). It ranges
from 2.7V to 3.6V.
VDDQ Supply Voltage (1.65V to VDD). VDDQ
provides the power supply to the I/O pins and enables all Outputs to be powered independently
from V DD. VDDQ can be tied to VDD or it can use a
separate supply. It can be powered either from
1.65V to VDD.
VPP Program Supply Voltage (12V). VPP is both
a control input and a power supply pin. The two
functions are selected by the voltage range applied to the pin.
If VPP is kept in a low voltage range (0V to 3.6V)
VPP is seen as a control input. In this case a voltage lower than VPPLK gives an absolute protection
against program or erase, while VPP > VPP1 enables these functions. VPP value is only sampled
at the beginning of a program or erase; a change
in its value after the operation has been started
does not have any effect and program or erase are
carried on regularly.
If VPP is used in the range 11.4V to 12.6V acts as
a power supply pin. In this condition VPP value
must be stable until P/E algorithm is completed
(see Table 24 and 25).
VSS Ground. VSS is the reference for all the voltage measurements.
M28W320CT, M28W320CB
DEVICE OPERATIONS
Four control pins rule the hardware access to the
Flash memory: E, G, W, RP. The following operations can be performed using the appropriate bus
cycles: Read, Write the Command of an Instruction, Output Disable, Stand-by, Reset (see Table
5).
Read. Read operations are used to output the
contents of the Memory Array, the Electronic Signature, the Status Register and the CFI. Both Chip
Enable (E) and Output Enable (G) must be at VIL
in order to perform the read operation. The Chip
Enable input should be used to enable the device.
Output Enable should be used to gate data onto
the output independently of the device selection.
The data read depend on the previous command
written to the memory (see instructions RD, RSIG,
RSR, RCFI). Read Array is the default state of the
device when exiting reset or after power-up.
Write. Write operations are used to give Commands to the memory or to latch Input Data to be
programmed. A write operation is initiated when
Chip Enable E and Write Enable W are at VIL with
Output Enable G at VIH. Commands, Input Data
and Addresses are latched on the rising edge of W
or E, whichever occur first.
Output Disable. The data outputs are high impedance when the Output Enable G is at VIH.
Stand-by. Stand-by disables most of the internal
circuitry allowing a substantial reduction of the current consumption. The memory is in stand-by
when Chip Enable E is at VIH and the device is in
read mode. The power consumption is reduced to
the stand-by level and the outputs are set to high
impedance, independently from the Output Enable
G or Write Enable W inputs. If E switches to VIH
during program or erase operation, the device enters in stand-by when finished.
Reset. During Reset mode all internal circuits are
switched off, the memory is deselected and the
outputs are put in high impedance. The memory is
in Reset mode when RP is at VIL. The power consumption is reduced to the stand-by level, independently from the Chip Enable E, Out-put Enable
G or Write Enable W inputs. If RP is pulled to VSS
during a Program or Erase, this operation is aborted and the memory content is no longer valid as it
has been compromised by the aborted operation.
(1)
Table 5. User Bus Operations
E
G
W
RP
WP
VPP
DQ0-DQ15
Read
VIL
VIL
VIH
VIH
X
Don’t Care
Data Output
Write
VIL
VIH
V IL
VIH
X
VDD or VPPH
Data Input
Output Disable
VIL
VIH
VIH
VIH
X
Don’t Care
Hi-Z
Stand-by
VIH
X
X
VIH
X
Don’t Care
Hi-Z
X
X
X
VIL
X
Don’t Care
Hi-Z
Operation
Reset
Note: 1. X = VIL or VIH, VPPH = 12V ± 5%.
Table 6. Read Electronic Signature (RSIG Instruction)
Code
Device
E
G
W
A0
A1
A2-A7
A8-A11
A12-A20
DQ0-DQ7
DQ8-DQ15
VIL
VIL
VIH
VIL
VIL
0
Don’t Care
Don’t Care
20h
00h
M28W320CT
VIL
VIL
VIH
VIH
VIL
0
Don’t Care
Don’t Care
BAh
88h
M28W320CB
VIL
VIL
VIH
VIH
VIL
0
Don’t Care
Don’t Care
BBh
88h
Manufact.
Code
Device
Code
7/42
M28W320CT, M28W320CB
Table 7. Read Block Signature (RSIG Instruction)
Block Status
E
G
W
A0
A1
A2-A7
Protected Block
VIL
V IL
VIH
VIL
VIH
0
Unprotected Block
VIL
V IL
VIH
VIL
VIH
Locked Block
VIL
V IL
VIH
VIL
VIH
A8-A11
A12-A20
DQ0
DQ1
DQ2-DQ15
Don’t Care Block Address
1
0
00h
0
Don’t Care Block Address
0
0
00h
0
Don’t Care Block Address
X (1)
1
00h
Note: 1. A Locked Block can be protected ”DQ0 = 1” or unprotected ”DQ0 = 0”; see Block protection section.
Table 8. Read Protection Register and Protection Register Lock (RSIG Instruction)
Word
E
G
W
A0-A7
A8-A20
DQ0
DQ1
DQ2
Lock
VIL
V IL
VIH
80h
Don’t Care
0
OTP Prot.
data
Security
prot. data
00h
00h
Unique Id 0
VIL
V IL
VIH
81h
Don’t Care
ID data
ID data
ID data
ID data
ID data
Unique Id 1
VIL
V IL
VIH
82h
Don’t Care
ID data
ID data
ID data
ID data
ID data
Unique Id 2
VIL
V IL
VIH
83h
Don’t Care
ID data
ID data
ID data
ID data
ID data
Unique Id 3
VIL
V IL
VIH
84h
Don’t Care
ID data
ID data
ID data
ID data
ID data
OTP 0
VIL
V IL
VIH
85h
Don’t Care
OTP data
OTP data
OTP data
OTP data
OTP data
OTP 1
VIL
V IL
VIH
86h
Don’t Care
OTP data
OTP data
OTP data
OTP data
OTP data
OTP 2
VIL
V IL
VIH
87h
Don’t Care
OTP data
OTP data
OTP data
OTP data
OTP data
OTP 3
VIL
V IL
VIH
88h
Don’t Care
OTP data
OTP data
OTP data
OTP data
OTP data
8/42
DQ3-DQ7 DQ8-DQ15
M28W320CT, M28W320CB
INSTRUCTIONS AND COMMANDS
Sixteen instructions are available (see Tables 9
and 10) to perform Read Memory Array, Read Status Register, Read Electronic Signature, CFI Query, Erase, Program, Double Word Program, Clear
Status Register, Program/Erase Suspend, Program/Erase Resume, Block Protect, Block Unprotect, Block Lock and Protection Register Program.
Status Register output may be read at any time,
during programming or erase, to monitor the
progress of the operation.
An internal Command Interface (C.I.) decodes the
instructions while an internal Program/Erase Controller (P/E.C.) handles all timing and verifies the
correct execution of the Program and Erase instructions. P/E.C. provides a Status Register
whose bits indicate operation and exit status of the
internal algorithms.
The Command Interface is reset to Read Array
when power is first applied, when exiting from Reset or whenever VDD is lower than VLKO. Command sequence must be followed exactly. Any
invalid combination of commands will reset the device to Read Array.
Read (RD)
The Read instruction consists of one write cycle
(refer to Device Operations section) giving the
command FFh. Next read operations will read the
addressed location and output the data. When a
device reset occurs, the memory is in Read Array
as default.
Read Status Register (RSR)
The Status Register indicates when a program or
erase operation is complete and the success or
failure of operation itself. Issue a Read Status
Register Instruction (70h) to read the Status Register content. The Read Status Register instruction
may be issued at any time, also when a Program/
Erase operation is ongoing. The following Read
operations output the content of the Status Register. The Status Register is latched on the falling
edge of E or G signals, and can be read until E or
G returns to VIH. Either E or G must be toggled to
update the latched data. Additionally, any read attempt during program or erase operation will automatically output the content of the Status Register.
Read Electronic Signature (RSIG)
The Read Electronic Signature instruction consists of one write cycle (refer to Device Operations
section) giving the command 90h. A subsequent
read will output the Manufacturer Code, the Device Code, the Block protection Status, or the Protection Register. See Tables 6, 7 and 8 for the
valid address. The Electronic Signature can be
read from the memory allowing programming
equipment or applications to automatically match
their interface to the characteristics of
M28W320C.
CFI Query (RCFI)
The Common Flash Interface Query mode is entered by writing 98h. Next read operations will read
the CFI data. The CFI data structure contains also
a security area; in this section, a 64 bit unique security number is written, starting at this address
81h. This area can be accessed only in read mode
and there are no ways of changing the code after
it has been written by ST. Write a read instruction
to return to Read mode (refer to the Common
Flash Interface section).
Table 9. Commands
Hex Code
Command
00h
Invalid/Reserved
10h
Alternative Program Set-up
20h
Erase Set-up
30h
Double Word Program Set-up
40h
Program Set-up
50h
Clear Status Register
70h
Read Status Register
90h or 98h
Read Electronic Signature, or
CFI Query
B0h
Program/Erase Suspend
D0h
Program/Erase Resume, Erase
Confirm or Unprotect Confirm
FFh
Read Array
01h
Protect Confirm
2Fh
Lock Confirm
C0h
Protection Program
60h
Protection Set-up
9/42
M28W320CT, M28W320CB
Table 10. Instructions
Mnemonic
RD
RSR
Instruction
Read Memory
Array
Read Status
Register
Cycles
1st Cycle
Operat. Addr. (1)
2nd Cycle
Data
Addr.
Data
Data
Status
Register
1+
Write
X
FFh
Read (2)
Read
Address
1+
Write
X
70h
Read (2)
X
RSIG
Read
Electronic
Signature
1+
Write
X
RCFI
Read CFI
1+
Write
55h
EE
Erase
2
Write
X
20h
Write
PG
Program
2
Write
X
40h or
10h
Write
Address
3
Write
X
30h
Write
Address 1
1
Write
X
50h
1
Write
X
B0h
1
Write
X
D0h
Double Word
Program
Clear Status
CLRS (5) Register
Program/
PES
Erase
Suspend
Program/
PER
Erase
Resume
DPG (4)
3nd Cycle
Operat.
Signature
90h or
Read (2)
98h
Address (3)
98h or
Read (2)
90h
BP
Block Protect
2
Write
X
60h
Write
BU
Block
Unprotect
2
Write
X
60h
Write
BL
Block Lock
2
Write
X
60h
Write
PRP
Protection
Register
Program
2
Write
X
C0h
Write
CFI
Address
Block
Address
Operat.
Addr.
Data
Write
Address 2
Data
Input
Data
Query
D0h
Data
Input
Data
Input
Block
Address
Block
Address
Block
Address
D0h
Address
Data
Input
01h
2Fh
Note: 1. X = Don’t Care.
2. The first cycle of the RD, RSR, RSIG or RCFI instruction is followed by read operations in the memory array or special register. Any
number of read cycle can occur after one command cycle.
3. The signature address recognized are listed in the Tables 6, 7 and 8.
4. Address 1 and Address 2 must be consecutive address differing only for address bit A0.
5. A read cycle after a CLSR instruction will output the memory array.
Erase (EE)
Block erasure sets all the bits within the selected
block to ’1’. One block at a time can be erased. It
is not necessary to program the block with 00h as
the P/E.C. will do it automatically before erasing.
This instruction uses two write cycles. The first
command written is the Erase Set up command
20h. The second command is the Erase Confirm
command D0h. An address within the block to be
erased is given and latched into the memory during the input of the second command. If the second command given is not an erase confirm, the
status register bits b4 and b5 are set and the instruction aborts.
Read operations output the status register after
erasure has started.
10/42
Status Register bit b7 returns ’0’ while the erasure
is in progress and ’1’ when it has completed. After
completion the Status Register bit b5 returns ’1’ if
there has been an Erase Failure. Status register
bit b1 returns ’1’ if the user is attempting to program a protected block. Status Register bit b3 returns a ’1’ if VPP is below VPPLK.
Erase aborts if RP turns to VIL. As data integrity
cannot be guaranteed when the erase operation is
aborted, the erase must be repeated. A Clear Status Register instruction must be issued to reset b1,
b3, b4 and b5 of the Status Register. During the
execution of the erase by the P/E.C., the memory
accepts only the RSR (Read Status Register) and
PES (Program/Erase Suspend) instructions.
M28W320CT, M28W320CB
Table 11. Protection States (1)
Current State (2)
Next State After Event (3)
(WP, DQ1, DQ0)
Program/Erase
Allowed
Protect
Unprotect
Lock
WP transition
100
yes
101
100
111
000
101
no
101
100
111
001
110
yes
111
110
111
011
111
no
111
110
111
011
000
yes
001
000
011
100
001
no
001
000
011
101
011
no
011
011
011
111 or 110 (4)
Note: 1. All blocks are protected at power-up, so the default configuration is 001 or 101 according to WP status.
2. Current state and Next state gives the protection status of a block. The protection status is defined by the write protect pin and by
DQ1 (= 1 for a locked block) and DQ0 (= 1 for a protected block) as read in the Read Electronic Signature instruction with A1 = VIH
and A0 = VIL.
3. Next state is the protection status of a block after a Protect or Unprotect or Lock command has been issued or after WP has changed
its logic value.
4. A WP transition to VIH on a locked block will restore the previous DQ0 value, giving a 111 or 110.
Table 12. Status Register Bits
Mnemonic
P/ECS
ESS
ES
PS
VPPS
PSS
BPS
Bit
7
6
5
4
3
2
1
Name
Logic
Level
’1’
Ready
’0’
Busy
’1’
Suspended
’0’
In progress or
Completed
’1’
Erase Error
’0’
Erase Success
’1’
Program Error
’0’
Program Success
’1’
VPP Invalid, Abort
’0’
VPP OK
Program
Suspend
Status
’1’
Suspended
’0’
In Progress or
Completed
Block
Protection
Status
’1’
P/E.C. Status
Erase
Suspend
Status
Erase Status
Program
Status
V PP Status
’0’
0
Definition
Note
Indicates the P/E.C. status, check during
Program or Erase, and on completion before
checking bits b4 or b5 for Program or Erase
Success.
On an Erase Suspend instruction P/ECS and
ESS bits are set to ’1’. ESS bit remains ’1’ until an
Erase Resume instruction is given.
ES bit is set to ’1’ if P/E.C. has applied the
maximum number of erase pulses to the block
without achieving an erase verify.
PS bit set to ’1’ if the P/E.C. has failed to program
a word.
VPPS bit is set if the VPP voltage is below VPPLK
when a Program or Erase instruction is executed.
VPP is sampled only at the beginning of the
erase/program operation.
On a Program Suspend instruction P/ECS and
PSS bits are set to ’1’. PSS remains ’1’ until a
Program Resume Instruction is given.
Program/Erase on
protected Block,
BPS bit is set to ’1’ if a Program or Erase
Abort
operation has been attempted on a protected
block.
No operation to
protected blocks
Reserved
Note: Logic level ’1’ is High, ’0’ is Low.
11/42
M28W320CT, M28W320CB
Program (PG)
The memory array can be programmed word-byword. This instruction uses two write cycles. The
first command written is the Program Set-up command 40h (or 10h). A second write operation latches the Address and the Data to be written and
starts the P/E.C.
Read operations output the Status Register content after the programming has started. The Status
Register bit b7 returns ’0’ while the programming
is in progress and ’1’ when it has completed. After
completion the Status register bit b4 returns ’1’ if
there has been a Program Failure. Status register
bit b1 returns ’1’ if the user is attempting to program a protected block. Status Register bit b3 returns a ’1’ if VPP is below VPPLK. Programming
aborts if RP goes to V IL. As data integrity cannot
be guaranteed when the program operation is
aborted, the memory location must be erased and
reprogrammed. A Clear Status Register instruction must be issued to reset b4, b3 and b1 of the
Status Register.
During the execution of the program by the P/E.C.,
the memory accepts only the RSR (Read Status
Register) and PES (Program/Erase Suspend) instructions.
Double Word Program (DPG)
This feature is offered to improve the programming
throughput, writing a page of two adjacent words
in parallel.The two words must differ only for the
address A0. Programming should not be attempted when VPP is not at VPPH. The operation can
also be executed if V PP is below VPPH but result
could be uncertain. This instruction uses three
write cycles. The first command written is the Double Word Program Set-Up command 30h. A second write operation latches the Address and the
Data of the first word to be written, the third write
operation latches the Address and the Data of the
second word to be written and starts the P/E.C.
Read operations output the Status Register content after the programming has started. The Status
Register bit b7 returns ’0’ while the programming
is in progress and ’1’ when it has completed. After
completion the Status register bit b4 returns ’1’ if
there has been a Program Failure. Status register
bit b1 returns ’1’ if the user is attempting to program a protected block. Status Register bit b3 returns a ’1’ if VPP is below VPPLK. Programming
aborts if RP goes to V IL. As data integrity cannot
be guaranteed when the program operation is
aborted, the memory location must be erased and
reprogrammed. A Clear Status Register instruc-
12/42
tion must be issued to reset b4, b3 and b1 of the
Status Register.
During the execution of the program by the P/E.C.,
the memory accepts only the RSR (Read Status
Register) and PES (Program/Erase Suspend) instructions.
Clear Status Register (CLRS)
The Clear Status Register uses a single write operation which clears bits b1, b3, b4 and b5 to 0. Its
use is necessary before any new operation when
an error has been detected.
The Clear Status Register is executed writing the
command 50h.
Program/Erase Suspend (PES)
Program/Erase suspend is accepted only during
the Program Erase instruction execution. When a
Program/Erase Suspend command is written to
the C.I., the P/E.C. freezes the Program/Erase operation. Program/Erase Resume (PER) continues
the Program/Erase operation. Program/Erase
Suspend consists of writing the command B0h
without any specific address.
The Status Register bit b2 is set to ’1’ (within 5µs)
when the program has been suspended. b2 is set
to ’0’ in case the program is completed or in
progress. The Status Register bit b6 is set to ’1’
(within 30µs) when the erase has been suspended. b6 is set to ’0’ in case the erase is completed
or in progress. The valid commands while erase is
suspended are: Program/Erase Resume, Program, Read Array, Read Status Register, Read
Identifier, CFI Query, Block Protect, Block Unprotect, Block Lock and Protection Program. The user
can protect the Block being erased issuing the
Block Protect, Block Lock or Protection Program
commands. In this case the protection status bit
will change immediately, but when the erase is resumed, the operation will complete The valid commands while program is suspended are: Program/
Erase Resume, Read Array, Read Status Register, Read Identifier, CFI Query.
During program/erase suspend mode, the chip
can be placed in a pseudo-stand-by mode by taking E to VIH This reduces active current consumption. Program/Erase is aborted if RP turns to VIL.
Program/Erase Resume (PER)
If a Program/Erase Suspend instruction was previously executed, the program/erase operation may
be resumed by issuing the command D0h. The
status register bit b2/b6 is cleared when program/
erase resumes. Read operations output the status
register after the program/erase is resumed.
M28W320CT, M28W320CB
The suggested flow charts for programs that use
the programming, erasure and program/erase
suspend/resume features of the memories are
shown from Figures 11, 12, 13, 14 and 15.
Protection Register Program (PRP)
The Protection Register Program uses two write
cycles. The first command written is the protection
program command C0h. The second write operation latches the Address and the Data to be written
to the Protection Register (see Protection Register
and Security Block) and start the PE/C. Read operations output the Status Register content after
the programming has started. The 64 bits user
programmable Segment (85h to 88h) are programmed 16 bits at a time, it can be protected by
the user programming bit 1 of the Protection Lock
register. The bit 1 of the Protection Lock register
protect the bit 2 of the Protection Lock Register.
Writing the bit 2 of the Protection Lock Register will
result in a permanent protection of the Security
Block. Attempting to program a previously protected protection Register will result in a status register error (bit 1 and bit 4 of the status register will be
set to ’1’). The protection of the Protection Register
and/or the Security Block is not reversible.
The Protection Register Program cannot be suspended.
Block Protect (BP)
The BP instruction use two write cycles. The first
command written is the protection setup 60h. The
second command is block Protect command 01h.
The address within the block being protected must
be given in order to write the protection state. If the
second command is not recognized by the C.I the
bit 4 and bit 5 of the status register will be set to indicate a wrong sequence of commands. To read
the status register write the RSR command.
Block Unprotect (BU)
The instruction use two write cycles. The first command written is the protection setup 60h. The second command is block Unprotect command d0h.
The address within the block being unprotected
must be given in order to write the unprotection
state. If the second command is not recognized by
the C.I the bit 4 and bit 5 of the status register will
be set to indicate a wrong sequence of commands. To read the status register write the RSR
command.
Block Lock (BL)
The instruction use two write cycles. The first command written is the protection setup 60h. The second command is block Lock command 2Fh. The
address within the block being Locked must be
given in order to write the Locking state. If the second command is not recognized by the C.I the bit 4
and bit 5 of the status register will be set to indicate
a wrong sequence of commands. To read the status register write the RSR command.
Table 13. Program, Erase Times and Program/Erase Endurance Cycles
(TA = 0 to 70°C or –40 to 85°C; VDD = 2.7V to 3.6V)
M28W320C
Parameter
Test Condition s
Word Program
Double Word Program
Main Block Program
Unit
Typ (1)
Max
VPP = VDD
10
200
µs
VPP = 12V ±5%
10
200
µs
VPP = 12V ±5%
0.16
5
sec
VPP = VDD
0.32
5
sec
VPP = 12V ±5%
0.02
4
sec
VPP = VDD
0.04
4
sec
VPP = 12V ±5%
1
10
sec
VPP = VDD
1
10
sec
VPP = 12V ±5%
0.8
10
sec
VPP = VDD
0.8
10
sec
Min
Parameter Block Program
Main Block Erase
Parameter Block Erase
Program/Erase Cycles (per Block)
100,000
cycles
Note: TA = 25 °C.
13/42
M28W320CT, M28W320CB
BLOCK PROTECTION
The M28W320C provide a flexible protection of all
the memory providing the protection unprotection
and locking of any blocks. All blocks are protected
at power-up. Each block of the array has two levels of protection against program or erase operation. The first level is set by the Block Protect
instruction; a protected block cannot be programmed or erased until a Block Unprotect instruction is given for that block. A second level of
protection is set by the Block Lock instruction, and
requires the use of the WP pin, according to the
following scheme:
– when WP is at VIH, the Lock status is overridden
and all blocks can be protected or unprotected;
– when WP is at VIL, Lock status is enabled; the
locked blocks are protected, regardless of their
previous protect state, and protection status
cannot be changed. Blocks that are not locked
can still change their protection status;
– the lock status is cleared for all blocks at power
up.
The protection and lock status can be monitored
for each block using the Read Electronic Signature
(RSIG) instruction. Protected blocks will output a
’1’ on DQ0 and locked blocks will output a ’1’ in
DQ1.
PROTECTION REGISTER
and SECURITY BLOCK
The M28W320C features a 128-bit protection register and a security Block in order to increase the
protection of a system design. The Protection
Register is divided in two 64-bit segment. The first
segment (81h to 84h) is a unique device number,
while the second one (85h to 88h) can be programmed by the user. When shipped the user programmable segment is read at ’1’. It can be only
programmed at ’0’;
The user programmable segment can be protected writing the bit 1 of the Protection Lock register
(80h). The bit 1 protect also the bit 2 of the Protection Lock Register. The M28W320C feature a security Block. The security Block is located at
1FF000-1FFFFF (M28W320CT) or at 000000000FFF (M28W320CB) of the device. This block
can be permanently protected by the user programming the bit 2 of the Protection Lock Register.
The protection Register and the Protection Lock
Register can be read using the RSIG command. A
subsequent read in the address starting from 80h
to 88h, the user will retrieve respectively the Protection Lock register, the unique device number
segment and the OTP user programmable register
segment (see Table 8).
Figure 4. Security Block Memory Map
88h
User Programmable OTP
85h
84h
Parameter Block # 0
Unique device number
81h
80h
Protection Register Lock
2
1
0
AI03523
14/42
M28W320CT, M28W320CB
POWER CONSUMPTION
The M28W320C puts itself in one of four different
modes depending on the status of the control signals: Active Power, Automatic Stand-by, Stand-by
and Reset define decreasing levels of current consumption. These allow the memory power to be
minimised, in turn decreasing the overall system
power consumption. As different recovery time are
linked to the different modes, please refer to the
AC timing Table to design your system.
Active Power
When E is at VIL and RP is at VIH, the device is in
active mode. Refer to DC Characteristics to get
the values of the current supply consumption.
Automatic Stand-by
Automatic Stand-by provides a low power consumption state during read mode. Following a
read operation, after a delay close to the memory
access time, the device enters Automatic Standby: the Supply Current is reduced to ICC1 values.
The device keeps the last output data stable, till a
new location is accessed.
Stand-by or Reset
Refer to the Device Operations section.
Power Up
The Supply voltage VDD and the Program Supply
voltage VPP can be applied in any order. The
memory Command Interface is reset on power up
to Read Memory Array, but a negative transition of
Chip Enable E or a change of the addresses is required to ensure valid data outputs. Care must be
taken to avoid writes to the memory when VDD is
above VLKO. Writes can be inhibited by driving either E or W to VIH. The memory is disabled if RP
is at VIL.
Supply Rails
Normal precautions must be taken for supply voltage decoupling, each device in a system should
have the VDD and V PP rails decoupled with a
0.1µF capacitor close to the VDD and VPP pins.The
PCB trace widths should be sufficient to carry the
required V PP program and erase currents.
15/42
M28W320CT, M28W320CB
COMMON FLASH INTERFACE (CFI)
The Common Flash Interface (CFI) specification is
a JEDEC approved, standardised data structure
that can be read from the Flash memory device.
CFI allows a system software to query the flash
device to determine various electrical and timing
parameters, density information and functions
supported by the device. CFI allows the system to
easily interface to the Flash memory, to learn
about its features and parameters, enabling the
software to configure itself when necessary.
Tables 14, 15, 16, 17, 18 and 19 show the address
used to retrieve each data.
The CFI data structure gives information on the
device, such as the sectorization, the command
set and some electrical specifications. Tables 14,
15, 16 and 17 show the addresses used to retrieve
each data. The CFI data structure contains also a
security area; in this section, a 64 bit unique security number is written, starting at address 81h. This
area can be accessed only in read mode and there
are no ways of changing the code after it has been
written by ST. Write a read instruction to return to
Read mode. Refer to the CFI Query instruction to
understand how the M28W320C enters the CFI
Query mode.
Table 14. Query Structure Overview
Offset
Sub-section Name
Description
00h
Reserved
Reserved for algorithm-specific information
10h
CFI Query Identification String
Command set ID and algorithm data offset
1Bh
System Interface Information
Device timing & voltage information
27h
Device Geometry Definition
Flash device layout
P
Primary Algorithm-specific Extended Query table
Additional information specific to the Primary
Algorithm (optional)
A
Alternate Algorithm-specific Extended Query table
Additional information specific to the Alternate
Algorithm (optional)
Note: The Flash memory display the CFI data structure when CFI Query command is issued. In this table are listed the main sub-sections
detailed in Tables 15, 16, 17, 18 and 19. Query data are always presented on the lowest order data outputs.
Table 15. CFI Query Identification String
Offset
Data
Description
00h
0020h
01h
88BAh - top
88BBh - bottom
02h-0Fh
reserved
10h
0051h
Query Unique ASCII String ”QRY”
11h
0052h
Query Unique ASCII String ”QRY”
12h
0059h
Query Unique ASCII String ”QRY”
13h
0003h
14h
0000h
Primary Algorithm Command Set and Control Interface ID code 16 bit ID code
defining a specific algorithm
15h
offset = P = 0035h
16h
0000h
17h
0000h
18h
0000h
19h
value = A = 0000h
1Ah
0000h
Manufacturer Code
Device Code
Reserved
Address for Primary Algorithm extended Query table
Alternate Vendor Command Set and Control Interface ID Code second vendor
- specified algorithm supported (note: 0000h means none exists)
Address for Alternate Algorithm extended Query table
note: 0000h means none exists
Note: Query data are always presented on the lowest - order data outputs (DQ7-DQ0) only. DQ8-DQ15 are ‘0’.
16/42
M28W320CT, M28W320CB
Table 16. CFI Query System Interface Information
Offset
Data
1Bh
0027h
VDD Logic Supply Minimum Program/Erase or Write voltage
bit 7 to 4
BCD value in volts
bit 3 to 0
BCD value in 100 mV
1Ch
0036h
VDD Logic Supply Maximum Program/Erase or Write voltage
bit 7 to 4
BCD value in volts
bit 3 to 0
BCD value in 100 mV
00B4h
VPP [Programming] Supply Minimum Program/Erase voltage
bit 7 to 4
HEX value in volts
bit 3 to 0
BCD value in 100 mV
Note: This value must be 0000h if no VPP pin is present
1Eh
00C6h
VPP [Programming] Supply Maximum Program/Erase voltage
bit 7 to 4
HEX value in volts
bit 3 to 0
BCD value in 100 mV
Note: This value must be 0000h if no VPP pin is present
1Fh
0004h
Typical timeout per single byte/word program (multi-byte program count = 1), 2n µs
(if supported; 0000h = not supported)
20h
0000h
Typical timeout for maximum-size multi-byte program or page write, 2n µs
(if supported; 0000h = not supported)
21h
000Ah
Typical timeout per individual block erase, 2n ms
(if supported; 0000h = not supported)
22h
0000h
Typical timeout for full chip erase, 2n ms
(if supported; 0000h = not supported)
23h
0004h
Maximum timeout for byte/word program, 2n times typical (offset 1Fh)
(0000h = not supported)
24h
0000h
Maximum timeout for multi-byte program or page write, 2n times typical (offset 20h)
(0000h = not supported)
25h
0003h
Maximum timeout per individual block erase, 2n times typical (offset 21h)
(0000h = not supported)
26h
0000h
Maximum timeout for chip erase, 2n times typical (offset 22h)
(0000h = not supported)
1Dh
Description
17/42
M28W320CT, M28W320CB
Table 17. Device Geometry Definition
Offset Word
Mode
Data
27h
0016h
28h
0001h
29h
0000h
2Ah
0000h
2Bh
0000h
2Ch
0002h
Description
Device Size = 2n in number of bytes
Flash Device Interface Code description: Asynchronous x16
Maximum number of bytes in multi-byte program or page = 2n
Number of Erase Block Regions within device
bit 7 to 0 = x = number of Erase Block Regions
Note:1. x = 0 means no erase blocking, i.e. the device erases at once in ”bulk.”
2. x specifies the number of regions within the device containing one or more contiguous Erase Blocks of the same size. For example, a 128KB device (1Mb)
having blocking of 16KB, 8KB, four 2KB, two 16KB, and one 64KB is considered to have 5 Erase Block Regions. Even though two regions both contain
16KB blocks, the fact that they are not contiguous means they are separate
Erase Block Regions.
3. By definition, symmetrically block devices have only one blocking region.
M28W320CT
M28W320CT Erase Block Region Information
2Dh
001Eh
2Eh
0000h
2Fh
0000h
30h
0001h
31h
0007h
32h
0000h
33h
0020h
34h
0000h
M28W320CB
M28W320CB
2Dh
0007h
2Eh
0000h
2Fh
0020h
30h
0000h
31h
001Eh
32h
0000h
33h
0000h
34h
0001h
18/42
bit 31 to 16 = z, where the Erase Block(s) within this Region are (z) times 256 bytes in
size. The value z = 0 is used for 128 byte block size.
e.g. for 64KB block size, z = 0100h = 256 => 256 * 256 = 64K
bit 15 to 0 = y, where y+1 = Number of Erase Blocks of identical size within the Erase
Block Region:
e.g. y = D15-D0 = FFFFh => y+1 = 64K blocks [maximum number]
y = 0 means no blocking (# blocks = y+1 = ”1 block”)
Note: y = 0 value must be used with number of block regions of one as indicated
by (x) = 0
M28W320CT, M28W320CB
Table 18. Primary Algorithm-Specific Extended Query Table
Offset
Data
(P)h = 35h
0050h
0052h
Description
Primary Algorithm extended Query table unique ASCII string “PRI”
0049h
(P+3)h = 38h
0031h
Major version number, ASCII
(P+4)h = 39h
0030h
Minor version number, ASCII
(P+5)h = 3Ah
0006h
Extended Query table contents for Primary Algorithm
0000h
(P+7)h
0000h
(P+8)h
0000h
(P+9)h = 3Eh
0001h
bit 0
bit 1
bit 2
bit 3
bit 4
bit 31 to 5
Supported Functions after Suspend
Read Array, Read Status Register and CFI Query are always supported during Erase or
Program operation
bit 0
bit 7 to 1
(P+A)h = 3Fh
0000h
(P+B)h
0000h
Chip Erase supported
(1 = Yes, 0 = No)
Erase Suspend supported
(1 = Yes, 0 = No)
Program Suspend
(1 = Yes, 0 = No)
Lock/Unlock supported
(1 = Yes, 0 = No)
Quequed Erase supported
(1 = Yes, 0 = No)
Reserved; undefined bits are ‘0’
Program supported after Erase Suspend (1 = Yes, 0 = No)
Reserved; undefined bits are ‘0’
Block Lock Status
Defines which bits in the Block Status Register section of the Query are implemented.
bit 0
Block Lock Status Register Lock/Unlock bit active (1 = Yes, 0 = No)
bit 1
Block Lock Status Register Lock-Down bit active (1 = Yes, 0 = No)
bit 15 to 2 Reserved for future use; undefined bits are ‘0’
(P+C)h = 41h
0027h
VDD Logic Supply Optimum Program/Erase voltage (highest performance)
bit 7 to 4
bit 3 to 0
(P+D)h = 42h
00C0h
VPP Supply Optimum Program/Erase voltage
bit 7 to 4
bit 3 to 0
(P+E)h
0000h
HEX value in volts
BCD value in 100 mV
HEX value in volts
BCD value in 100 mV
Reserved
Table 19. Security Code Area
Offset
Data
80h
00XX
81h
XXXX
82h
XXXX
83h
XXXX
84h
XXXX
85h
XXXX
86h
XXXX
87h
XXXX
88h
XXXX
Description
Protection Register Lock
64 bits: unique device number
64 bits: User Programmable OTP
19/42
M28W320CT, M28W320CB
Table 20. DC Characteristics
(TA = 0 to 70°C or –40 to 85°C; VDD = VDDQ = 2.7V to 3.6V)
Symbol
Parameter
Typ
Max
Unit
±1
µA
Output Leakage Current
0V≤ VOUT ≤V DDQ
±10
µA
ICC
Supply Current (Read)
ICC1
Supply Current (Stand-by or
Automatic Stand-by)
ICC2
Supply Current
(Reset)
ICC4
Min
Input Leakage Current
ILO
ICC3
Test Conditio n
0V≤ V IN ≤ VDDQ
ILI
Supply Current (Program)
Supply Current (Erase)
E = VSS, G = VIH, f = 5MHz
10
20
mA
E = VDDQ ± 0.2V,
RP = VDDQ ± 0.2V
15
50
µA
RP = VSS ± 0.2V
15
50
µA
Program in progress
VPP = 12V ± 5%
10
20
mA
Program in progress
VPP = VDD
10
20
mA
Erase in progress
VPP = 12V ± 5%
5
20
mA
Erase in progress
VPP = VDD
5
20
mA
E = VDDQ ± 0.2V,
Erase suspended
50
µA
ICC5
Supply Current
(Program/Erase Suspend)
IPP
Program Current
(Read or Stand-by)
VPP > VDD
400
µA
IPP1
Program Current
(Read or Stand-by)
VPP ≤ VDD
5
µA
IPP2
Program Current (Reset)
RP = VSS ± 0.2V
5
µA
Program in progress
VPP = 12V ± 5%
10
mA
Program in progress
VPP = VDD
5
µA
Erase in progress
VPP = 12V ± 5%
10
mA
Erase in progress
VPP = VDD
5
µA
0.4
V
IPP3
IPP4
VIL
VIH
Program Current (Program)
Program Current (Erase)
Input Low Voltage
Input High Voltage
–0.5
V DDQ ≥ 2.7V
V DDQ ≥ 2.7V
–0.5
0.8
V
V DDQ –0.4
VDDQ +0.4
V
0.7 VDDQ
VDDQ +0.4
V
0.1
V
VOL
Output Low Voltage
IOL = 100µA, VDD = VDD min,
VDDQ = VDDQ min
VOH
Output High Voltage
IOH = –100µA, VDD = VDD min,
VDDQ = VDDQ min
V PP1
Program Voltage (Program or
Erase operations)
1.65
3.6
V
VPPH
Program Voltage
(Program or Erase
operations)
11.4
12.6
V
VPPLK
Program Voltage
(Program and Erase lock-out)
1
V
V LKO
VDD Supply Voltage (Program
and Erase lock-out)
2
V
20/42
VDDQ –0.1
V
M28W320CT, M28W320CB
Table 21. AC Measurement Conditions
Input Rise and Fall Times
Figure 6. AC Testing Load Circuit
≤ 10ns
VDDQ/2
0 to VDDQ
Input Pulse Voltages
Input and Output Timing Ref. Voltages
VDDQ/2
1N914
3.3kΩ
Figure 5. AC Testing Input Output Waveform
DEVICE
UNDER
TEST
VDDQ
OUT
CL = 50pF
VDDQ/2
0V
CL includes JIG capacitance
AI00610
AI00609B
Table 22. Capacitance (1) (TA = 25 °C, f = 1 MHz)
Symbol
CIN
COUT
Parameter
Input Capacitance
Output Capacitance
Test Condition
Min
Max
Unit
VIN = 0V
6
pF
VOUT = 0V
12
pF
Note: 1. Sampled only, not 100% tested.
21/42
M28W320CT, M28W320CB
Table 23. Read AC Characteristics (1)
(TA = 0 to 70°C or –40 to 85°C)
M28W320C
Symbol
Alt
Parameter
90
100
VDD = 2.7V to 3.6V
VDDQ = 2.7V min
V DD = 2.7V to 3.6V
VDDQ = 1.65V min
Min
Max
Min
Unit
Max
tAVAV
tRC
Address Valid to Next Address Valid
tAVQV
tACC
Address Valid to Output Valid
tAXQX (2)
tOH
Address Transition to Output Transition
0
0
ns
tEHQX (2)
tOH
Chip Enable High to Output Transition
0
0
ns
tEHQZ (2)
tHZ
Chip Enable High to Output Hi-Z
25
30
ns
tELQV (3)
tCE
Chip Enable Low to Output Valid
90
100
ns
tELQX (2)
tLZ
Chip Enable Low to Output Transition
0
0
ns
tGHQX (2)
tOH
Output Enable High to Output Transition
0
0
ns
tGHQZ (2)
tDF
Output Enable High to Output Hi-Z
25
30
ns
tGLQV (3)
tOE
Output Enable Low to Output Valid
30
35
ns
tGLQX (2)
tOLZ
Output Enable Low to Output Transition
tPHQV
tPWH
Reset High to Output Valid
tPLPH (2,4)
tRP
Note: 1.
2.
3.
4.
22/42
Reset Pulse Width
90
100
90
0
ns
100
0
150
100
See AC Testing Measurement conditions for timing measurements.
Sampled only, not 100% tested.
G may be delayed by up to tELQV - tGLQV after the falling edge of E without increasing tELQV.
The device Reset is possible but not guaranteed if tPLPH < 100ns.
ns
150
100
ns
ns
ns
POWER-UP
AND STANDBY
Note: Write Enable (W) = High.
RP
DQ0-DQ15
G
E
A0-A20
ADDRESS VALID
AND CHIP ENABLE
tPHQV
tGLQX
OUTPUTS
ENABLED
tGLQV
tELQV
tELQX
tAVQV
VALID
tAVAV
DATA VALID
VALID
STANDBY
tGHQZ
tGHQX
tEHQZ
tEHQX
AI02688
tAXQX
M28W320CT, M28W320CB
Figure 7. Read AC Waveforms
23/42
M28W320CT, M28W320CB
Table 24. Write AC Characteristics, Write Enable Controlled (1)
(TA = 0 to 70°C or –40 to 85°C)
M28W320C
Symbol
Alt
Parameter
90
100
VDD = 2.7V to 3.6V
VDDQ = 2.7V min
VDD = 2.7V to 3.6V
VDDQ = 1.65V min
Min
Max
Min
Unit
Max
tAVAV
tWC
Write Cycle Time
90
100
ns
tAVWH
tAS
Address Valid to Write Enable High
50
50
ns
tDVWH
tDS
Data Valid to Write Enable High
50
50
ns
tELWL
tCS
Chip Enable Low to Write Enable Low
0
0
ns
tPHWL
tPS
Reset High to Write Enable Low
90
100
ns
tPLPH (2, 3)
tRP
Reset Pulse Width
100
100
ns
µs
tPLRH (2, 4)
Reset Low to Program/Erase Abort
tQVVPL (2, 5)
Output Valid to VPP Low
0
0
ns
Data Valid to Write Protect Low
0
0
ns
200
200
ns
tQVWPL
30
30
t VPHWH (2)
tVPS
VPP High to Write Enable High
tWHAX
tAH
Write Enable High to Address Transition
0
0
ns
tWHDX
tDH
Write Enable High to Data Transition
0
0
ns
tWHEH
tCH
Write Enable High to Chip Enable High
0
0
ns
Write Enable High to Output Enable Low
30
30
ns
tWHGL
tWHWL
tWPH
Write Enable High to Write Enable Low
30
30
ns
tWLWH
tWP
Write Enable Low to Write Enable High
50
50
ns
Write Protect High to Write Enable High
50
50
ns
tWPHWH
tAVAV
tWC
Write Cycle Time
90
100
ns
tAVWH
tAS
Address Valid to Write Enable High
50
50
ns
Note: 1.
2.
3.
4.
5.
24/42
See AC Testing Measurement conditions for timing measurements.
Sampled only, not 100% tested.
The device Reset is possible but not guaranteed if tPLPH < 100ns.
The reset will complete within 100ns if RP is asserted while not in Program nor in Erase mode.
Applicable if VPP is seen as a logic input (VPP < 3.6V).
VPP
WP
RP
DQ0-DQ15
W
G
E
A0-A20
tPHWL
tWLWH
COMMAND
POWER-UP AND
SET-UP COMMAND
tDVWH
tELWL
tWHDX
tWHWL
tWHEH
CMD or DATA
CONFIRM COMMAND
OR DATA INPUT
tVPHWH
tWPHWH
tAVWH
VALID
tAVAV
tWHQV
tWHGL
tWHAX
PROGRAM OR ERASE
STATUS REGISTER
READ
1st POLLING
tQVVPL
AI03574
tQVWPL
STATUS REGISTER
M28W320CT, M28W320CB
Figure 8. Write AC Waveforms, W Controlled
25/42
M28W320CT, M28W320CB
Table 25. Write AC Characteristics, Chip Enable Controlled (1)
(TA = 0 to 70°C or –40 to 85°C)
M28W320C
90
Symbol
Alt
Parameter
100
V DD = 2.7V to 3.6V VDD = 2.7V to 3.6V
V DDQ = 2.7V min
VDDQ = 1.65V min
Min
Max
Min
Unit
Max
tAVAV
tWC
Write Cycle Time
90
100
ns
tAVEH
tAS
Address Valid to Chip Enable High
50
50
ns
tDVEH
tDS
Data Valid to Chip Enable High
50
50
ns
t EHAX
tAH
Chip Enable High to Address Transition
0
0
ns
tEHDX
tDH
Chip Enable High to Data Transition
0
0
ns
tEHEL
tCPH
Chip Enable High to Chip Enable Low
30
30
ns
Chip Enable High to Output Enable Low
30
30
ns
t EHGL
tEHWH
tWH
Chip Enable High to Write Enable High
0
0
ns
tELEH
tCP
Chip Enable Low to Chip Enable High
50
50
ns
tPHEL
tPS
Reset High to Chip Enable Low
90
100
ns
tPLPH (2, 3)
tRP
Reset Pulse Width
100
100
ns
tPLRH (2, 4)
Reset Low to Program/Erase Abort
t QVVPL (2, 5)
tQVWPL
30
30
µs
Output Valid to VPP Low
0
0
ns
Data Valid to Write Protect Low
0
0
ns
200
200
ns
tVPHEH (2)
tVPS
VPP High to Chip Enable High
t WLEL
tCS
Write Enable Low to Chip Enable Low
0
0
ns
Write Protect High to Chip Enable High
50
50
ns
tWPHEH
tAVAV
tWC
Write Cycle Time
90
100
ns
tAVEH
tAS
Address Valid to Chip Enable High
50
50
ns
Note: 1.
2.
3.
4.
5.
26/42
See AC Testing Measurement conditions for timing measurements.
Sampled only, not 100% tested.
The device Reset is possible but not guaranteed if tPLPH < 100ns.
The reset will complete within 100ns if RP is asserted while not in Program nor in Erase mode.
Applicable if VPP is seen as a logic input (VPP < 3.6V).
VPP
WP
RP
DQ0-DQ15
E
G
W
A0-A20
tPHEL
tELEH
COMMAND
POWER-UP AND
SET-UP COMMAND
tDVEH
tWLEL
tEHDX
tEHEL
tEHWH
CMD or DATA
CONFIRM COMMAND
OR DATA INPUT
tVPHEH
tWPHEH
tAVEH
VALID
tAVAV
tEHQV
tEHGL
tEHAX
PROGRAM OR ERASE
STATUS REGISTER
READ
1st POLLING
tQVVPL
AI03575
tQVWPL
STATUS REGISTER
M28W320CT, M28W320CB
Figure 9. Write AC Waveforms, E Controlled
27/42
M28W320CT, M28W320CB
Figure 10. Reset AC Waveform
Reset during Read Mode
tPLPH
RP
tPHQV
Reset during Program with tPLPH ≤ tPLRH
Abort
Complete
tPLRH
tPHWL
tPHEL
tPLPH
RP
Reset during Program/Erase with tPLPH > tPLRH
Abort
Complete Reset
tPLRH
tPHWL
tPHEL
tPLPH
RP
AI03537
28/42
M28W320CT, M28W320CB
Figure 11. Program Flowchart and Pseudo Code
Start
Write 40h or 10h
Command
Program instruction:
– write 40h or 10h command
– write Address & Data
(memory enters read status state after
the Program instruction)
Write Address
& Data
do:
– read status register (E or G must be
toggled) if PES instruction given execute
suspend program loop
NO
Read Status
Register
Suspend
b7 = 1
NO
YES
Suspend
Loop
while b7 = 1
YES
b3 = 0
NO
VPP Invalid
Error (1, 2)
If b3 = 1, VPP invalid error:
– error handler
NO
Program
Error (1, 2)
If b4 = 1, Program error:
– error handler
NO
Program to Protected
Block Error (1, 2)
YES
b4 = 0
YES
b1 = 0
If b1 = 1, Program to protected block error:
– error handler
YES
End
AI03538
Note: 1. Status check of b1 (Protected Block), b3 (VPP Invalid) and b4 (Program Error) can be made after each program operation or after
a sequence.
2. If an error is found, the Status Register must be cleared (CLRS instruction) before further P/E.C. operations.
29/42
M28W320CT, M28W320CB
Figure 12. Double Word Program Flowchart and Pseudo Code
Start
Write 30h
Command
DPG instruction:
– write 30h command
– write Address 1 & Data 1 (3)
– write Address 2 & Data 2 (3)
(memory enters read status state after
the Program instruction)
Write Address 1
& Data 1 (3)
Write Address 2
& Data 2 (3)
NO
Read Status
Register
Suspend
b7 = 1
NO
YES
Suspend
Loop
while b7 = 1
YES
b3 = 0
do:
– read status register (E or G must be
toggled) if PES instruction given execute
DPG suspend loop
NO
VPP Invalid
Error (1, 2)
If b3 = 1, VPP invalid error:
– error handler
NO
Program
Error (1, 2)
If b4 = 1, Program error:
– error handler
NO
Program to Protected
Block Error (1, 2)
YES
b4 = 0
YES
b1 = 0
If b1 = 1, Program to protected block error:
– error handler
YES
End
AI03539
Note: 1. Status check of b1 (Protected Block), b3 (VPP Invalid) and b4 (Program Error) can be made after each program operation or after
a sequence.
2. If an error is found, the Status Register must be cleared (CLRS instruction) before further P/E.C. operations.
3. Address 1 and Address 2 must be consecutive addresses differing only for address bit A0.
30/42
M28W320CT, M28W320CB
Figure 13. Program Suspend & Resume Flowchart and Pseudo Code
Start
Write B0h
Command
PES instruction:
– write B0h command
do:
– read status register
(E or G must be toggled)
Write 70h
Command
Read Status
Register
b7 = 1
NO
while b7 = 1
YES
b2 = 1
NO
Program Complete
If b2 = 0 Program completed
YES
Write a read
Command
Read data from
another address
Write D0h
Command
Write FFh
Command
Program Continues
Read Data
PER instruction:
– write D0h command to resume
the program
– if the program operation completed
then this is not necessary.
The device returns to Read Array as
normal (as if the Program/Erase
suspend was not issued).
AI03540
31/42
M28W320CT, M28W320CB
Figure 14. Erase Flowchart and Pseudo Code
Start
Write 20h
Command
EE instruction:
– write 20h command
– write Block Address (A12-A20) &
command D0h
(memory enters read status state after
the EE instruction)
Write Block Address
& D0h Command
Read Status
Register
Suspend
b7 = 1
do:
– read status register (E or G must be
toggled) if PES instruction given execute
suspend erase loop
NO
NO
YES
Suspend
Loop
while b7 = 1
YES
b3 = 0
NO
VPP Invalid
Error (1)
NO
Command
Sequence Error (1)
If b3 = 1, VPP invalid error:
– error handler
YES
b4, b5 = 0
If b4, b5 = 1, Command sequence error:
– error handler
YES
b5 = 0
NO
Erase Error (1)
If b5 = 1, Erase error:
– error handler
YES
b1 = 0
NO
Erase to Protected
Block Error (1)
If b1 = 1, Erase to protected block error:
– error handler
YES
End
AI03541
Note: 1. If an error is found, the Status Register must be cleared (CLRS instruction) before further P/E.C. operations.
32/42
M28W320CT, M28W320CB
Figure 15. Erase Suspend & Resume Flowchart and Pseudo Code
Start
Write B0h
Command
PES instruction:
– write B0h command
do:
– read status register
(E or G must be toggled)
Write 70h
Command
Read Status
Register
b7 = 1
NO
while b7 = 1
YES
b6 = 1
NO
Erase Complete
If b6 = 0, Erase completed
YES
Read data from
another block
or
Program/Protection Program
or
Block Protect/Unprotect/Lock
Write D0h
Command
Write FFh
Command
Erase Continues
Read Data
PER instruction:
– write D0h command to resume
erasure
– if the erase operation completed
then this is not necessary.
The device returns to Read Array as
normal (as if the Program/Erase
suspend was not issued).
AI03542
33/42
M28W320CT, M28W320CB
Figure 16. Command Interface and Program Erase Controller Flowchart (a)
WAIT FOR
COMMAND
WRITE (1)
NO
90h
YES
READ
SIGNATURE
NO
98h
YES
CFI
QUERY
NO
70h
YES
READ
STATUS
50h
NO
YES
CLEAR
STATUS
NO
60h
YES
BP/BU/BL
SET-UP
D
C0h
NO
YES
READ
STATUS
PRP
SET-UP
40h or
10h
READ
ARRAY
NO
YES
YES
READY
(2)
PROGRAM
SET-UP
PRP
30h
NO
YES
C
NO
B
DPG
SET-UP
YES
C
NO
D0h
NO
YES
2Fh
NO
BP/BU/BL
COMMAND
ERROR
ERASE
SET-UP
BLOCK
UNPROTECT
NO
FFh
YES
YES
D0h
BLOCK
PROTECT
NO
YES
B
01h
20h
BLOCK
LOCK
NO
YES
A
ERASE
COMMAND
ERROR
AI03543
Note: 1. If no command is written, the Command Interface remains in its previous valid state. Upon power-up, on exit from power-down or
if VDD falls below V LKO, the Command Interface defaults to Read Array mode.
2. P/E.C. status (Ready or Busy) is read on Status Register bit 7.
34/42
M28W320CT, M28W320CB
Figure 17. Command Interface and Program Erase Controller Flowchart (b)
A
B
ERASE
YES
(READ STATUS)
READY
(2)
NO
B0h
ERASE
NO
SUSPENDED
NO
YES
READ
STATUS
YES
ERASE
SUSPEND
READ
STATUS
YES
70h
YES
NO
READ
SIGNATURE
YES
NO
90h
NO
CFI
QUERY
YES
READY
(2)
READ
STATUS
98h
NO
PROGRAM
SET-UP
YES
c
40h or
10h
NO
DPG
SET-UP
YES
c
30h
NO
C0h
YES
PRP
SET-UP
NO
BP/BU/BL
SET-UP
YES
D
PRP
READY
(2)
NO
YES
B
60h
NO
READ
ARRAY
NO
D0h
YES
ERASE
RESUME
(READ STATUS)
AI03544
Note: 2. P/E. C. status (Ready or Busy) is read on Status Register bit 7.
35/42
M28W320CT, M28W320CB
Figure 18. Command Interface and Program Erase Controller Flowchart (c)
C
B
PROGRAM
YES
(READ STATUS)
READY
(2)
NO
B0h
NO
YES
READ
STATUS
PROGRAM
SUSPEND
NO
PROGRAM
SUSPENDED
YES
YES
READY
(2)
NO
READ
STATUS
YES
READ
STATUS
70h
NO
READ
SIGNATURE
YES
90h
NO
CFI
QUERY
YES
98h
NO
READ
ARRAY
NO
D0h
YES
PROGRAM
RESUME
(READ STATUS)
AI03545
Note: 2. P/E. C. status (Ready or Busy) is read on Status Register bit 7.
36/42
M28W320CT, M28W320CB
Table 26. Ordering Information Scheme
Example:
M28W320CT
90
N
6
T
Device Type
M28
Operating Voltage
W = VDD = 2.7V to 3.6V; V DDQ = 1.65V or 2.7V
Device Function
320C = 32 Mbit (2 Mb x16), Boot Block
Array Matrix
T = Top Boot
B = Bottom Boot
Random Speed
90 = 90 ns
100 = 100 ns
Package
N = TSOP48: 12 x 20 mm
GB = µBGA47: 0.75 mm pitch
Temperature Range
1 = 0 to 70 °C
6 = –40 to 85 °C
Optio n
T = Tape & Reel Packing
Devices are shipped from the factory with the memory content bits erased to ’1’.
Table 27. Daisy Chain Ordering Scheme
Example:
M28W320C
-GB T
Device Type
M28W320C
Daisy Chain
-GB = µBGA47: 0.75 mm pitch
Optio n
T = Tape & Reel Packing
For a list of available options (Speed, Package, etc...) or for further information on any aspect of this device, please contact the STMicroelectronics Sales Office nearest to you.
37/42
M28W320CT, M28W320CB
Table 28. Revision History
Date
Revision Details
February 2000
First Issue
04/19/00
Daisy Chain part numbering defined
µBGA Package Outline diagram change (Figure 20)
µBGA Chain diagrams, Package and PCB Connection re-designed (Figure 21, 22)
05/17/00
µBGA Package Outline diagram and Package Mechanical Data change (Figure 20, Table 30)
38/42
M28W320CT, M28W320CB
Table 29. TSOP48 - 48 lead Plastic Thin Small Outline, 12 x 20 mm, Package Mechanical Data
mm
inches
Symbol
Typ
Min
Max
A
Typ
Min
1.20
Max
0.0472
A1
0.05
0.15
0.0020
0.0059
A2
0.95
1.05
0.0374
0.0413
B
0.17
0.27
0.0067
0.0106
C
0.10
0.21
0.0039
0.0083
D
19.80
20.20
0.7795
0.7953
D1
18.30
18.50
0.7205
0.7283
E
11.90
12.10
0.4685
0.4764
–
–
–
–
L
0.50
0.70
0.0197
0.0276
α
0°
5°
0°
5°
N
48
e
0.50
0.0197
48
CP
0.10
0.0039
Figure 19. TSOP48 - 48 lead Plastic Thin Small Outline, 12 x 20 mm, Package Outline
A2
1
N
e
E
B
N/2
A
D1
CP
D
DIE
C
TSOP-a
A1
α
L
Drawing is not to scale.
39/42
M28W320CT, M28W320CB
Table 30. µBGA47 - 8 x 6 balls, 0.75 mm pitch, Package Mechanical Data
mm
inch
Symbol
Typ
Min
Max
A
Typ
Min
1.000
A1
0.0394
0.180
0.0071
A2
0.700
–
–
0.0276
–
–
b
0.350
0.300
0.400
0.0138
0.0118
0.0157
D
10.500
10.450
10.550
0.4134
0.4114
0.4154
D1
3.750
–
–
0.1476
–
–
ddd
0.080
0.0031
e
0.750
–
–
0.0295
–
–
E
6.390
6.340
6.440
0.2516
0.2496
0.2535
E1
5.250
–
–
0.2067
–
–
FD
3.375
–
–
0.1329
–
–
FE
0.570
–
–
0.0224
–
–
Figure 20. µBGA47 - 8 x 6 balls, 0.75 mm pitch, Bottom View Package Outline
E
E1
SE
FE
FD
SD
D
D1
e
BALL ”A1”
ddd
e
b
A2
A
A1
BGA-G06
Drawing is not to scale.
40/42
Max
M28W320CT, M28W320CB
Figure 21. µBGA47 Daisy Chain - Package Connections (Top view through package)
1
2
3
4
5
6
7
8
A
B
C
D
E
F
AI03295
Figure 22. µBGA47 Daisy Chain - PCB Connections (Top view through package)
1
2
3
4
5
6
7
8
START
POINT
A
B
C
D
E
END
POINT
F
AI3296
41/42
M28W320CT, M28W320CB
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in lif e support devices or systems without express written approval of STMicroelectronics.
The ST logo is registered trademark of STMicroelectronics
 2000 STMicroelectronics - All Rights Reserved
All other names are the property of their respective owners.
STMicroelectronics GROUP OF COMPANIES
Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia - Malta - Morocco Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A .
http://w ww.st.com
42/42
Similar pages