ONSEMI MC14040BD

MC14040B
12-Bit Binary Counter
The MC14040B 12–stage binary counter is constructed with MOS
P–channel and N–channel enhancement mode devices in a single
monolithic structure. This part is designed with an input wave shaping
circuit and 12 stages of ripple–carry binary counter. The device
advances the count on the negative–going edge of the clock pulse.
Applications include time delay circuits, counter controls, and
frequency–driving circuits.
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http://onsemi.com
MARKING
DIAGRAMS
Fully Static Operation
Diode Protection on All Inputs
Supply Voltage Range = 3.0 Vdc to 18 Vdc
Capable of Driving Two Low–power TTL Loads or One Low–power
Schottky TTL Load Over the Rated Temperature Range
Common Reset Line
Pin–for–Pin Replacement for CD4040B
16
PDIP–16
P SUFFIX
CASE 648
MC14040BCP
AWLYYWW
1
16
SOIC–16
D SUFFIX
CASE 751B
14040B
AWLYWW
1
MAXIMUM RATINGS (Voltages Referenced to VSS) (Note 2.)
Symbol
VDD
Vin, Vout
Parameter
DC Supply Voltage Range
Input or Output Voltage Range
(DC or Transient)
16
Value
Unit
– 0.5 to +18.0
V
– 0.5 to VDD + 0.5
V
± 10
PD
Power Dissipation,
per Package (Note 3.)
500
mW
TA
Ambient Temperature Range
– 55 to +125
°C
Tstg
Storage Temperature Range
– 65 to +150
°C
TL
Lead Temperature
(8–Second Soldering)
260
°C
16
mA
2. Maximum Ratings are those values beyond which damage to the device
may occur.
3. Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C
This device contains protection circuitry to guard against damage due to high
static voltages or electric fields. However, precautions must be taken to avoid
applications of any voltage higher than maximum rated voltages to this
high–impedance circuit. For proper operation, Vin and Vout should be constrained
to the range VSS
(Vin or Vout)
VDD.
Unused inputs must always be tied to an appropriate logic voltage level (e.g.,
either VSS or VDD). Unused outputs must be left open.
v
14
040B
ALYW
1
Input or Output Current
(DC or Transient) per Pin
Iin, Iout
TSSOP–16
DT SUFFIX
CASE 948F
v
SOEIAJ–16
F SUFFIX
CASE 966
MC14040B
AWLYWW
1
A
= Assembly Location
WL or L = Wafer Lot
YY or Y = Year
WW or W = Work Week
ORDERING INFORMATION
Device
Package
Shipping
MC14040BCP
PDIP–16
2000/Box
MC14040BD
SOIC–16
2400/Box
MC14040BDR2
SOIC–16
2500/Tape & Reel
MC14040BDT
TSSOP–16
96/Rail
MC14040BF
SOEIAJ–16
See Note 1.
MC14040BFEL
SOEIAJ–16
See Note 1.
1. For ordering information on the EIAJ version of
the SOIC packages, please contact your local
ON Semiconductor representative.
 Semiconductor Components Industries, LLC, 2000
March, 2000 – Rev. 3
1
Publication Order Number:
MC14040B/D
MC14040B
PIN ASSIGNMENT
Q12
1
16
VDD
Q6
2
15
Q11
Q5
3
14
Q10
Q7
4
13
Q8
Q4
5
12
Q9
Q3
6
11
R
Q2
7
10
C
VSS
8
9
Q1
TRUTH TABLE
Clock
Reset
Output State
X
0
0
1
No Change
Advance to next state
All Outputs are low
X = Don’t Care
LOGIC DIAGRAM
Q1
Q2
9
CLOCK
10
C
C
R
Q3
6
7
Q
C
Q
C
R
Q
C
Q
C
R
Q
C
Q
C
RESET
11
Q4 = PIN 5
Q5 = PIN 3
Q6 = PIN 2
Q7 = PIN 4
Q8 = PIN 13
Q9 = PIN 12
http://onsemi.com
2
Q10
14
VDD = PIN 16
VSS = PIN 8
R
Q11
15
Q
C
Q
C
R
Q12
1
Q
C
Q
C
Q
R
MC14040B
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ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
Characteristic
Output Voltage
Vin = VDD or 0
Symbol
– 55_C
25_C
125_C
VDD
Vdc
Min
Max
Min
Typ (4.)
Max
Min
Max
Unit
“0” Level
VOL
5.0
10
15
—
—
—
0.05
0.05
0.05
—
—
—
0
0
0
0.05
0.05
0.05
—
—
—
0.05
0.05
0.05
Vdc
“1” Level
VOH
5.0
10
15
4.95
9.95
14.95
—
—
—
4.95
9.95
14.95
5.0
10
15
—
—
—
4.95
9.95
14.95
—
—
—
Vdc
Input Voltage
“0” Level
(VO = 4.5 or 0.5 Vdc)
(VO = 9.0 or 1.0 Vdc)
(VO = 13.5 or 1.5 Vdc)
VIL
5.0
10
15
—
—
—
1.5
3.0
4.0
—
—
—
2.25
4.50
6.75
1.5
3.0
4.0
—
—
—
1.5
3.0
4.0
“1” Level
VIH
5.0
10
15
3.5
7.0
11
—
—
—
3.5
7.0
11
2.75
5.50
8.25
—
—
—
3.5
7.0
11
—
—
—
5.0
5.0
10
15
– 3.0
– 0.64
– 1.6
– 4.2
—
—
—
—
– 2.4
– 0.51
– 1.3
– 3.4
– 4.2
– 0.88
– 2.25
– 8.8
—
—
—
—
– 1.7
– 0.36
– 0.9
– 2.4
—
—
—
—
IOL
5.0
10
15
0.64
1.6
4.2
—
—
—
0.51
1.3
3.4
0.88
2.25
8.8
—
—
—
0.36
0.9
2.4
—
—
—
mAdc
Input Current
Iin
15
—
± 0.1
—
± 0.00001
± 0.1
—
± 1.0
µAdc
Input Capacitance
(Vin = 0)
Cin
—
—
—
—
5.0
7.5
—
—
pF
Quiescent Current
(Per Package)
IDD
5.0
10
15
—
—
—
5.0
10
20
—
—
—
0.005
0.010
0.015
5.0
10
20
—
—
—
150
300
600
µAdc
IT
5.0
10
15
Vin = 0 or VDD
(VO = 0.5 or 4.5 Vdc)
(VO = 1.0 or 9.0 Vdc)
(VO = 1.5 or 13.5 Vdc)
Output Drive Current
(VOH = 2.5 Vdc)
(VOH = 4.6 Vdc)
(VOH = 9.5 Vdc)
(VOH = 13.5 Vdc)
(VOL = 0.4 Vdc)
(VOL = 0.5 Vdc)
(VOL = 1.5 Vdc)
Vdc
Vdc
IOH
Source
Sink
Total Supply Current (5.) (6.)
(Dynamic plus Quiescent,
Per Package)
(CL = 50 pF on all outputs, all
buffers switching)
mAdc
IT = (0.42 µA/kHz) f + IDD
IT = (0.85 µA/kHz) f + IDD
IT = (1.43 µA/kHz) f + IDD
4. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
5. The formulas given are for the typical characteristics only at 25_C.
6. To calculate total supply current at loads other than 50 pF:
IT(CL) = IT(50 pF) + (CL – 50) Vfk
where: IT is in µA (per package), CL in pF, V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.001.
http://onsemi.com
3
µAdc
MC14040B
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SWITCHING CHARACTERISTICS (7.) (CL = 50 pF, TA = 25_C)
VDD
Characteristic
Symbol
Output Rise and Fall Time
TTLH, TTHL = (1.5 ns/pF) CL + 25 ns
TTLH, TTHL = (0.75 ns/pF) CL + 12.5 ns
TTLH, TTHL = (0.55 ns/pF) CL + 9.5 ns
tTLH,
tTHL
Propagation Delay Time
Clock to Q1
tPHL, tPLH = (1.7 ns/pF) CL + 315 ns
tPHL, tPLH = (0.66 ns/pF) CL + 137 ns
tPHL, tPLH = (0.5 ns/pF) CL + 95 ns
tPLH,
tPHL
Vdc
Min
Typ (8.)
Max
5.0
10
15
—
—
—
100
50
40
200
100
80
5.0
10
15
—
—
—
260
115
80
520
230
160
5.0
10
15
—
—
—
1625
720
500
3250
1440
1000
Unit
ns
ns
Clock to Q12
tPHL, tPLH = (1.7 ns/pF) CL + 2415 ns
tPHL, tPLH = (0.66 ns/pF) CL + 867 ns
tPHL, tPLH = (0.5 ns/pF) CL + 475 ns
ns
Propagation Delay Time
Reset to Qn
tPHL = (1.7 ns/pF) CL + 485 ns
tPHL = (0.86 ns/pF) CL + 182 ns
tPHL = (0.5 ns/pF) CL + 145 ns
tPHL
Clock Pulse Width
Clock Pulse Frequency
Clock Rise and Fall Time
ns
5.0
10
15
—
—
—
370
155
115
740
310
230
tWH
5.0
10
15
385
150
115
140
55
38
—
—
—
ns
fcl
5.0
10
15
—
—
—
2.1
7.0
10.0
1.5
3.5
4.5
MHz
tTLH, tTHL
5.0
10
15
ns
No Limit
Reset Pulse Width
tWH
5.0
10
15
960
360
270
320
120
80
—
—
—
ns
Reset Removal Time
trem
5.0
10
15
130
50
30
65
25
15
—
—
—
ns
7. The formulas given are for the typical characteristics only at 25_C.
8. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
VDD
VDD
500 µF
0.01 µF
CERAMIC
ID
PULSE
GENERATOR
C Q1
Q2
Q
R n
C Q1
Q2
Q
R n
CL
CL
VSS
CL
CL
CL
VSS
20 ns
CLOCK
PULSE
GENERATOR
90%
50%
10%
CL
CLOCK
20 ns
20 ns
20 ns
tPLH
VDD
90%
50%
10%
tWH
tPHL
50% DUTY CYCLE
90%
50%
10%
tTLH
Figure 1. Power Dissipation Test Circuit
and Waveform
Figure 2. Switching Time Test Circuit
and Waveforms
Q
VSS
http://onsemi.com
4
tTHL
MC14040B
1
2
4
8
16
32
64
128
256
512
1024
2048
4096
CLOCK
RESET
Q1
Q2
Q3
Q4
Q5
Q6
Q7
Q8
Q9
Q10
Q11
Q12
Figure 3. Timing Diagram
APPLICATIONS INFORMATION
TIME–BASE GENERATOR
outputs Q5, Q10, Q11, and Q12 division by 3600 is
accomplished. The MC14012B decodes the counter
outputs, produces a single output pulse, and resets the binary
counter. The resulting output frequency is 1.0 pulse/minute.
A 60 Hz sinewave obtained through a 1.0 Megohm
resistor connected directly to a standard 120 Vac power line
is applied to the clock input of the MC14040B. By selecting
VDD
1.0 M
MC14040B
Q5
C
≥ 20 pF
Q10
120 Vac
60 Hz
1/2
MC14012B
Q11
R
Q12
VSS
http://onsemi.com
5
1/2
MC14012B
1.0 PULSE/MINUTE
OUTPUT
MC14040B
PACKAGE DIMENSIONS
PDIP–16
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
–A–
16
9
1
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
B
F
C
DIM
A
B
C
D
F
G
H
J
K
L
M
S
L
S
–T–
SEATING
PLANE
K
H
G
D
M
J
16 PL
0.25 (0.010)
M
T A
M
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
9
–B–
1
P
8 PL
0.25 (0.010)
8
M
B
S
G
R
K
F
X 45 _
C
SEATING
PLANE
J
M
D
16 PL
0.25 (0.010)
MILLIMETERS
MIN
MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
SOIC–16
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B–05
ISSUE J
–A–
–T–
INCHES
MIN
MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0.305
0_
10 _
0.020
0.040
M
T B
S
A
S
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6
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.229
0.244
0.010
0.019
MC14040B
PACKAGE DIMENSIONS
SOEIAJ–16
F SUFFIX
PLASTIC EIAJ SOIC PACKAGE
CASE 966–01
ISSUE O
16
LE
9
Q1
M_
E HE
1
L
8
DETAIL P
Z
D
e
VIEW P
A
A1
b
0.13 (0.005)
c
M
0.10 (0.004)
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7
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
DIM
A
A1
b
c
D
E
e
HE
L
LE
M
Q1
Z
MILLIMETERS
MIN
MAX
–––
2.05
0.05
0.20
0.35
0.50
0.18
0.27
9.90
10.50
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10 _
0_
0.70
0.90
–––
0.78
INCHES
MIN
MAX
–––
0.081
0.002
0.008
0.014
0.020
0.007
0.011
0.390
0.413
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10 _
0_
0.028
0.035
–––
0.031
MC14040B
PACKAGE DIMENSIONS
TSSOP–16
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948F–01
ISSUE O
16X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
V
S
S
S
ÇÇÇ
ÉÉÉ
ÇÇÇ
ÉÉÉ
ÇÇÇ
K
K1
2X
L/2
16
9
J1
B
–U–
L
SECTION N–N
J
PIN 1
IDENT.
8
1
N
0.25 (0.010)
0.15 (0.006) T U
S
A
–V–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH. PROTRUSIONS OR GATE BURRS. MOLD
FLASH OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
M
N
F
DETAIL E
–W–
C
0.10 (0.004)
–T– SEATING
PLANE
DETAIL E
H
D
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
MIN
MAX
4.90
5.10
4.30
4.50
–––
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.18
0.28
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
INCHES
MIN
MAX
0.193
0.200
0.169
0.177
–––
0.047
0.002
0.006
0.020
0.030
0.026 BSC
0.007
0.011
0.004
0.008
0.004
0.006
0.007
0.012
0.007
0.010
0.252 BSC
0_
8_
G
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MC14040B/D