ONSEMI NUF6105FCT1G

NUF6105FC
6 Channel EMI Pi−Filter
Array with ESD Protection
This device is a 6 channel EMI filter array for data lines. Greater
than −35 dB attenuation is obtained at frequencies from 800 MHz to
2.2 GHz. It also offers ESD protection − clamping transients from
static discharges to protect delicate data line circuitry.
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CIRCUIT DESCRIPTION
Features
•
•
•
•
•
•
R1
EMI Filtering and ESD Protection for Data Lines
Integration of 30 Discretes Offers Cost and Space Savings
Exceeds IEC61000−4−2 (Level 4) Specifications
Low Profile Flip−Chip Packaging
MSL 1
Pb−Free Package is Available
A1
D1
C1
C2
D2
C4
D4
R2
A2
C2
D3
C3
B1
R3
A3
Typical Applications
•
•
•
•
•
C1
EMI Filtering and ESD Protection for Data Lines
Cell Phones
Handheld Portables
Notebook Computers
MP3 Players
C3
D5
C5
C6
D6
C8
D8
R4
A4
C4
D7
C7
B2
R5
A5
D9
MAXIMUM RATINGS (TA = 25°C)
Rating
C5
Symbol
Value
C9 C10
Unit
ESD Discharge IEC61000−4−2,
− Air Discharge
− Contact Discharge
Human Body Model
VPP
kV
DC Power per Resistor
PR
100
mW
DC Power per Package
PT
600
mW
Junction Temperature
TJ
150
°C
Operating Temperature Range
Top
−40 to +85
°C
Storage Temperature Range
Tstg
−55 to +150
°C
30
30
16
D10
R6
A6
C6
D11
C11 C12
D12
B3
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
FLIP−CHIP
CASE 499D
PLASTIC
A1
MARKING DIAGRAM
NUF6105AYWWG
G
A
= Assembly Location
Y
= Year
WW = Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping†
NUF6105FCT1
Flip−Chip
3000/Tape & Reel
NUF6105FCT1G
Flip−Chip
(Pb−Free)
3000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2005
August, 2005 − Rev. 3
1
Publication Order Number:
NUF6105FC/D
NUF6105FC
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic
Min
Typ
Max
Unit
−
−
5.0
V
6.0
7.0
8.0
V
VRWM = 3.3 V per line
−
−
0.1
mA
IR = 20 mA
80
100
120
W
VR = 2.5 V, f = 1 MHz (Note 1 and 2)
−
27
−
pF
Symbol
VRWM
VBR
IR
RI/O
Cd
Maximum Reverse Working Voltage
IZ = 10 mA
1. Measured at 25°C, VR = 2.5 V, f = 1.0 MHz.
2. Total line capacitance is 2 times the diode capacitance (Cd).
TYPICAL PERFORMANCE CURVES
(TA = 25°C unless otherwise specified)
0
0
−5
−10
−10
−20
−30
−20
−25
S41 (dB)
S21 (dB)
−15
Channel 1 or Channel 6
−30
−35
Channel 2 or Channel 5
Channel 3 to Channel 4
−40
Channel 1 to Channel 2
−50
−60
−40
−70
Channel 3
or Channel 4
−45
−50
10
100
1000
−80
10
10000
1000
10000
FREQUENCY (MHz)
Figure 1. Insertion Loss Curve
(S21 Measurement)
Figure 2. Analog Crosstalk Curve
(S41 Measurement)
2.0
105
104
103
1.5
RESISTANCE (W)
NORMALIZED CAPACITANCE
100
FREQUENCY (MHz)
1.0
0.5
102
101
100
99
98
97
96
0
0
1.0
2.0
3.0
4.0
95
5.0
−40
REVERSE VOLTAGE (V)
−15
10
35
60
TEMPERATURE (°C)
Figure 3. Typical Capacitance vs.
Reverse Biased Voltage
(Normalized Capacitance Cd at 2.5 V)
Figure 4. Resistance Over Temperature
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2
85
NUF6105FC
D: 6.92 V
@: 6.92 V
Figure 5. ESD Scope Trace Human Body Model (−8 kV)
D: 900 V
@: −900 V
Figure 6. ESD Scope Trace Human Body Model (+8 kV)
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3
NUF6105FC
Printed Circuit Board Recommendations
500 mm Pitch
300 mm Solder Ball
Parameter
250 mm +25
250 mm −0
PCB Pad Size
Pad Shape
Round
Pad Type
NSMD
350 mm ±25
Solder Mask Opening
125 mm
Solder Stencil Thickness
Stencil Aperture
250 x 250 mm sq.
Solder Flux Ratio
50/50
Solder Paste Type
No Clean Type 3 or Finer
Trace Finish
OSP Cu
Trace Width
150 mm Max
Copper
Solder Mask
NSMD
SMD
Figure 7. Solder Mask versus Non−Solder Mask Definition
Controlled Atmosphere
250
225°C Min
235°C Max
TEMPERATURE (°C)
200
183 °C
2 to 5 °C/s
150
140 to 160 °C
100
50
1 to 5 °C/s
0
0
1
2
3
4
1 to 2 min
30−100 sec
TIME (minutes)
Figure 8. Solder Reflow Profile
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4
5
NUF6105FC
PACKAGE DIMENSIONS
15 PIN FLIPCHIP CSP
CASE 499D−01
ISSUE O
4X
0.10 C
TERMINAL A1
LOCATOR
D
ÈÈ
ÈÈ
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETER.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
B
E
A1
0.10 C
A2
A
C
0.05 C
SEATING
PLANE
D1
e /2
e
C
15 X
b
0.05 C A B
0.03 C
E1
B
A
1
2
3
4
5
6
e1
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5
DIM
A
A1
A2
D
E
b
e
e1
D1
E1
MILLIMETERS
MIN
MAX
−−−
0.700
0.210
0.270
0.380
0.430
2.960 BSC
1.330 BSC
0.290
0.340
0.500 BSC
0.435 BSC
2.500 BSC
0.870 BSC
NUF6105FC
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
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6
For additional information, please contact your
local Sales Representative.
NUF6105FC/D