ONSEMI BUV20

ON Semiconductor
BUV20
BUV60
SWITCHMODE Series
NPN Silicon Power Transistor
. . . designed for high speed, high current, high power applications.
50 AMPERES
NPN SILICON
POWER
METAL TRANSISTOR
125 VOLTS
250 WATTS
• High DC current gain:
•
•
hFE min = 20 at IC = 25 A
= 10 at IC = 50 A
Low VCE(sat):
VCE(sat) max. = 0.6 V at IC = 25 A
= 0.9 V at IC = 50 A
Very fast switching times:
TF = 0.25 µs at IC = 50 A
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MAXIMUM RATINGS
Rating
Symbol
Collector–Emititer Voltage
BUV20
VCEO(sus)
BUV60
125
Unit
Vdc
Collector–Base Voltage
VCBO
Emitter–Base Voltage
VEBO
Collector–Emitter Voltage (VBE =
–1.5 V)
VCEX
160
260
Vdc
Collector–Emitter voltage (RBE =
100 Ω)
VCER
150
260
Vdc
Collector–Current — Continuous
— Peak (PW 10 ms)
160
260
7
IC
ICM
CASE 197A–05
TO–204AE
(TO–3)
Vdc
Vdc
50
60
Adc
Apk
Base–Current continuous
IB
10
Adc
Total Power Dissipation @ TC =
25C
PD
250
Watts
Operating and Storage Junction
Temperature Range
TJ, Tstg
–65 to 200
C
THERMAL CHARACTERISTICS
Characteristic
Symbol
BUV20
θJC
Thermal Resistance, Junction to
Case
BUV60
0.7
Unit
C/W
1.0
DERATING FACTOR
0.8
0.6
0.4
0.2
0
40
80
120
TC, TEMPERATURE (°C)
160
200
Figure 1. Power Derating
 Semiconductor Components Industries, LLC, 2001
May, 2001 – Rev. 10
1
Publication Order Number:
BUV20/D
BUV20 BUV60
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ELECTRICAL CHARACTERISTICS (TC = 25C unless otherwise noted)
Characteristic
Symbol
Min
VCEO(sus)
125
Max
Unit
OFF CHARACTERISTICS1
Collector–Emitter Sustaining Voltage
(IC = 200 mA, IB = 0, L = 25 mH)
Vdc
BUV20, BUV60
Collector Cutoff Current at Reverse Bias
(VCE = 140 V, VBE = – 1.5 V)
(VCE = 140 V, VBE = – 1.5 V, TC = 125C)
(VCE = 260 V, VBE = – 1.5 V)
BUV20
BUV20
BUV60
ICEX
Collector–Emitter Cutoff Current
(VCE = 100 V)
BUV20
mAdc
3.0
12
ICEO
Emitter–Base Reverse Voltage
(IE = 50 mA)
BUV20, BUV60
VEBO
Emitter–Cutoff Current
(VEB = 5 V)
BUV20, BUV60
3.0
7
IEBO
mAdc
V
1.0
mAdc
SECOND BREAKDOWN
Second Breakdown Collector Current with base forward biased
(VCE = 20 V, t = 1 s)
(VCE = 40 V, t = 1 s)
IS/b
Adc
12
1.5
ON CHARACTERISTICS1
DC Current Gain
(IC = 25 A, VCE = 2 V)
(IC = 50 A, VCE = 4 V)
BUV20
BUV20
hFE
Collector–Emitter Saturation Voltage
(IC = 25 A, IB = 2.5 A)
(IC = 50 A, IB = 5 A)
BUV20
BUV20
Base–Emitter Saturation Voltage
(IC = 50 A, IB = 5 A)0
BUV20
Collector–Emitter Saturation Voltage
(IC = 25 A, IB = 1.25 A)
(IC = 50 A, IB = 5 A)
(IC = 60 A, IB = 7.5 A)
BUV60
BUV60
BUV60
Base–Emitter Saturation Voltage
(IC = 50 A, IB = 5 A)
(IC = 60 A, IB = 7.5 A)
BUV60
BUV60
20
10
60
–
VCE(sat)
Vdc
0.6
1.2
VBE(sat)
Vdc
2.0
VCE(sat)
Vdc
0.9
0.9
1.2
VBE(sat)
Vdc
1.6
1.8
DYNAMIC CHARACTERISTICS
Current Gain — Bandwidth Product
(VCE = 15 V, IC = 2 A, f = 4 MHz)
fT
8.0
MHz
SWITCHING CHARACTERISTICS (Resistive Load)
Turn–on Time
Storage Time
(IC = 50 A
A, IB1 = IB2 = 5 A,
A
VCC = 30 V, RC = 0.6 Ω)
Fall Time
1
Pulse Test: Pulse Width 300 µs, Duty Cycle 2%.
http://onsemi.com
2
ton
1.5
ts
1.2
tf
0.25
µs
BUV20 BUV60
100
There are two limitations on the power handling ability of
a transistor: average junction temperature and second
breakdown. Safe operating area curves indicate IC – VCE
limits of the transistor that must be observed for reliable
operation i.e., the transistor must not be subjected to greater
dissipation than the curves indicate.
The data of Figure 2 is based on TC = 25C. TJ(pk) is
variable depending on power level. Second breakdown
limitations do not derate the same as thermal limitations.
At high case temperatures, thermal limitations will reduce
the power that can be handled to values less than the
limitations imposed by second breakdown.
IC, COLLECTOR CURRENT (A)
50
10
1
10
100 125
VCE, COLLECTOR-EMITTER VOLTAGE (V)
1
Figure 2. Active Region Safe Operating Area
2.0
100
VCE = 4 V
IC/IB = 10
80
V, VOLTAGE (V)
1.6
VBE(sat)
1.2
40
0.8
VCE(sat)
0.4
0
t, TIME (s)
µ
60
1
20
0
100
10
1
10
IC, COLLECTOR CURRENT (A)
IC, COLLECTOR CURRENT (A)
Figure 3. “On” Voltages
Figure 4. DC Current Gain
VCC = 30 V
IC/IB1 = 10
IB1 = IB2
3.0
2.0
VCC
RC
1.0
tS
0.4
0.3
0.2
ton
104 µF
IB2
IB1
VCC = 30 V
RC = 0.6 Ω
tF
RC — Non inductive resistance
0
10
20
30
40
50
IC, COLLECTOR CURRENT (A)
Figure 6. Switching Times Test Circuit
Figure 5. Resistive Switching Performance
http://onsemi.com
3
BUV20 BUV60
PACKAGE DIMENSIONS
TO–204AE (TO–3)
CASE 197A–05
ISSUE J
A
N
C
–T–
E
D
U
SEATING
PLANE
K
2 PL
0.30 (0.012)
V
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
T Q
M
M
Y
DIM
A
B
C
D
E
G
H
K
L
N
Q
U
V
M
–Y–
L
2
H
G
B
M
T Y
1
INCHES
MIN
MAX
1.530 REF
0.990
1.050
0.250
0.335
0.057
0.063
0.060
0.070
0.430 BSC
0.215 BSC
0.440
0.480
0.665 BSC
0.760
0.830
0.151
0.165
1.187 BSC
0.131
0.188
MILLIMETERS
MIN
MAX
38.86 REF
25.15
26.67
6.35
8.51
1.45
1.60
1.53
1.77
10.92 BSC
5.46 BSC
11.18
12.19
16.89 BSC
19.31
21.08
3.84
4.19
30.15 BSC
3.33
4.77
–Q–
0.25 (0.010)
M
SWITCHMODE is a trademark of Semiconductor Components Industries, LLC (SCILLC)
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes
without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular
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including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be
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4
BUV20/D