NL27WZ16 Dual Buffer The NL27WZ16 is a high performance dual buffer operating from a 1.65 to 5.5 V supply. At VCC = 3 V, high impedance TTL compatible inputs significantly reduce current loading to input drivers while TTL compatible outputs offer improved switching noise performance. • • • • • • • • Extremely High Speed: tPD 2.0 ns (typical) at VCC = 5.0 V Designed for 1.65 V to 5.5 V VCC Operation Over Voltage Tolerant Inputs LVTTL Compatible − Interface Capability With 5.0 V TTL Logic with VCC = 3.0 V LVCMOS Compatible 24 mA Balanced Output Sink and Source Capability Near Zero Static Supply Current Substantially Reduces System Power Requirements Chip Complexity: FET = 72; Equivalent Gate = 18 6 1 IN A1 2 GND 5 OUT Y1 http://onsemi.com MARKING DIAGRAMS SC−88 / SOT−363/SC−70 DF SUFFIX CASE 419B MRd 1 d = Date Code TSOP−6/SOT−23/SC−59 DT SUFFIX CASE 318G MRd VCC 1 d = Date Code 3 IN A2 4 OUT Y2 Figure 1. Pinout (Top View) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. IN A1 1 OUT Y1 IN A2 1 OUT Y2 Figure 2. Logic Symbol PIN ASSIGNMENT 1 IN A1 2 GND 3 IN A2 4 OUT Y2 5 VCC 6 OUT Y1 Semiconductor Components Industries, LLC, 2004 March, 2004 − Rev. 2 FUNCTION TABLE A Input L H Y Output L H 1 Publication Order Number: NL27WZ16/D NL27WZ16 MAXIMUM RATINGS (Note 1) Symbol Characteristics Value Unit 0.5 to 7.0 V 0.5 ≤ VI ≤ 7.0 V 0.5 ≤ VO ≤ 7.0 V VI < GND 50 mA VO < GND 50 mA DC Output Sink Current 50 mA DC Supply Current per Supply Pin 100 mA IGND DC Ground Current per Ground Pin 100 mA TSTG Storage Temperature Range 65 to 150 °C PD Power Dissipation in Still Air SC−88, TSOP−6 200 mW JA Thermal Resistance SC−88, TSOP−6 333 °C/W TL Lead Temperature, 1 mm from case for 10 s TJ Junction Temperature under Bias VESD ESD Withstand Voltage ILatch−Up Latch−Up Performance VCC DC Supply Voltage VI DC Input Voltage VO DC Output Voltage IIK DC Input Diode Current IOK DC Output Diode Current IO ICC Output in Z or LOW State (Note 2) 260 °C 150 °C Human Body Model (Note 3) Machine Model (Note 4) Charged Device Model (Note 5) > 2000 > 200 N/A V Above VCC and Below GND at 85°C (Note 6) 500 mA 1. Absolute maximum continuous ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute−maximum−rated conditions is not implied. 2. IO absolute maximum rating must be observed. 3. Tested to EIA/JESD22−A114−A 4. Tested to EIA/JESD22−A115−A 5. Tested to JESD22−C101−A 6. Tested to EIA/JESD78 RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC Supply Voltage VI Input Voltage VO Output Voltage TA Operating Free−Air Temperature ∆t/∆V Input Transition Rise or Fall Rate Operating Data Retention Only (High or LOW State) VCC = 1.8 V 0.15 V VCC = 2.5 V 0.2 V VCC =3.0 V 0.3 V VCC =5.0 V 0.5 V http://onsemi.com 2 Min Max Unit 1.65 1.5 5.5 5.5 V 0 5.5 V 0 5.5 V 40 85 °C 0 0 0 0 20 20 10 5 ns/V NL27WZ16 DC ELECTRICAL CHARACTERISTICS Symbol Parameter Min 0.75 VCC 0.7 VCC VIH High−Level Input Voltage 1.65 to 1.95 2.3 to 5.5 VIL Low−Level Input Voltage 1.65 to 1.95 2.3 to 5.5 VOH High−Level Output Voltage VIN = VIH VOL Input Leakage Current IOFF Power Off Leakage Current ICC Quiescent Supply Current Typ Max Min Max 0.75 VCC 0.7 VCC 0.25 VCC 0.3 VCC Unit Condition V 0.25 VCC 0.3 VCC V 1.65 1.8 2.3 3.0 4.5 1.55 1.7 2.2 2.9 4.4 1.65 1.8 2.3 3.0 4.5 1.55 1.7 2.2 2.9 4.4 V IOH = −100 A 1.65 2.3 3.0 3.0 4.5 1.29 1.9 2.4 2.3 3.8 1.52 2.15 2.80 2.68 4.20 1.29 1.9 2.4 2.3 3.8 V IOH = −4 mA IOH = −8 mA IOH = −16 mA IOH = −24 mA IOH = −32 mA 1.65 1.8 2.3 3.0 4.5 0.0 0.0 0.0 0.0 0.0 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 V IOL = 100 A 1.65 2.3 3.0 3.0 4.5 0.08 0.10 0.15 0.22 0.22 0.24 0.30 0.40 0.55 0.55 0.24 0.30 0.40 0.55 0.55 V IOL = 4 mA IOL = 8 mA IOL = 16 mA IOL = 24 mA IOL = 32 mA 0 to 5.5 1.0 1.0 A 0 V VIN 5.5 V 0.0 1.0 10 A VIN or VOUT = 5.5 V 1.65 to 5.5 1.0 10 A VIN = 5.5 V, GND Low−Level Output Voltage VIN = VIL IIN 40C TA 85C TA = 25C VCC (V) ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ Î ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ Î ÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎ AC ELECTRICAL CHARACTERISTICS tR = tF = 2.5 ns; CL = 50 pF; RL = 500 Ω 40°C ≤ TA ≤ 85°C TA = 25°C Symbol tPLH tPHL Parameter Propagation g Delay y (Fi (Figure 3 and d 4) Condition VCC (V) Min Typ Max Min Max Unit RL = 1 M CL = 15 pF 1.8 0.15 1.8 8.0 9.6 1.8 10.2 ns RL = 1 M CL = 15 pF 2.5 0.2 1.0 3.0 5.2 1.0 5.8 RL = 1 M CL = 15 pF 3.3 0.3 0.8 2.3 3.6 0.8 4.0 1.2 3.0 4.6 1.2 5.1 0.5 1..8 2.9 0.5 3.2 0.8 2.4 3.8 0.8 4.2 RL = 500 CL = 50 pF 5.0 0.5 RL = 1 M CL = 15 pF RL = 500 CL = 50 pF CAPACITIVE CHARACTERISTICS Symbol Parameter CIN Input Capacitance CPD Power Dissipation Capacitance (Note 7) Condition Typical Unit VCC = 5.5 V, VI = 0 V or VCC 7.0 pF 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 10 MHz, VCC = 5.5 V, VI = 0 V or VCC 9 11 pF 7. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD VCC2 fin ICC VCC. http://onsemi.com 3 NL27WZ16 VCC VCC A 50% GND tPLH Y PULSE GENERATOR tPHL DUT RT 50% VCC PROPAGATION DELAYS tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns CL RL RT = ZOUT of pulse generator (typically 50 Ω) Figure 3. Switching Waveforms Figure 4. Test Circuit DEVICE ORDERING INFORMATION Device Nomenclature Logic Circuit Indicator No. of Gates per Package Temp Range Identifier NL27WZ16DFT2 NL 2 NL27WZ16DTT1 NL 2 Device Order Number Technology Device Function Package Suffix Tape & Reel Suffix Package Type (Name/SOT#/ Common Name) Tape and Reel Size 7 WZ 16 DF T2 SC−88 / SOT−363 / SC−70 178 mm (7”) 3000 Unit 7 WZ 16 DT T1 TSOP−6 / SOT−23 / SC−59 178 mm (7”) 3000 Unit http://onsemi.com 4 NL27WZ16 PACKAGE DIMENSIONS SC70−6/SC−88/SOT−363 DF SUFFIX CASE 419B−02 ISSUE U A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419B−01 OBSOLETE, NEW STANDARD 419B−02. G 6 5 4 1 2 3 DIM A B C D G H J K N S −B− S D 6 PL 0.2 (0.008) M B M INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC −−− 0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 N J C H K SOLDERING FOOTPRINT* 0.50 0.0197 0.65 0.025 0.65 0.025 0.40 0.0157 1.9 0.0748 SCALE 20:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 5 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC −−− 0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 NL27WZ16 PACKAGE DIMENSIONS SOT23−6/TSOP−6/SC59−6 DT SUFFIX CASE 318G−02 ISSUE L NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. A L 6 S 1 5 4 2 3 B MILLIMETERS DIM MIN MAX A 2.90 3.10 B 1.30 1.70 C 0.90 1.10 D 0.25 0.50 G 0.85 1.05 H 0.013 0.100 J 0.10 0.26 K 0.20 0.60 L 1.25 1.55 M 0 10 S 2.50 3.00 D G M J C 0.05 (0.002) K H INCHES MIN MAX 0.1142 0.1220 0.0512 0.0669 0.0354 0.0433 0.0098 0.0197 0.0335 0.0413 0.0005 0.0040 0.0040 0.0102 0.0079 0.0236 0.0493 0.0610 0 10 0.0985 0.1181 SOLDERING FOOTPRINT* 2.4 0.094 1.9 0.075 0.95 0.037 0.95 0.037 0.7 0.028 1.0 0.039 SCALE 10:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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