PHILIPS BCM857BS Pnp matched double transistor Datasheet

BCM857BS
PNP matched double transistor; ∆hFE = 10 %
Rev. 02 — 11 April 2005
Product data sheet
1. Product profile
1.1 General description
PNP matched double transistor in a SOT363 (SC-88) SMD plastic package. Matched
version of BC857BS. The transistors are fully isolated internally.
NPN equivalent: BCM847BS.
1.2 Features
■ Current gain matching
■ Base-emitter voltage matching
1.3 Applications
■ Current mirror
■ Differential amplifier
1.4 Quick reference data
Table 1:
Quick reference data
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VCEO
collector-emitter voltage
open base
-
-
−45
V
IC
collector current
-
-
−100
mA
hFE
DC current gain
VCE = −5 V;
IC = −2 mA
200
290
450
∆hFE
hFE matching
VCE = −5 V;
IC = −2 mA
-
-
10
%
∆VBE
VBE matching
VCE = −5 V;
IC = −2 mA
-
-
2
mV
BCM857BS
Philips Semiconductors
PNP matched double transistor; ∆hFE = 10 %
2. Pinning information
Table 2:
Pinning
Pin
Description
Simplified outline
1
emitter TR1
2
base TR1
3
collector TR2
4
emitter TR2
5
base TR2
6
collector TR1
6
5
4
Symbol
6
5
4
TR2
TR1
1
2
3
1
2
3
sym018
3. Ordering information
Table 3:
Ordering information
Type number
BCM857BS
Package
Name
Description
Version
SC-88
plastic surface mounted package; 6 leads
SOT363
4. Marking
Table 4:
Marking codes
Type number
Marking code [1]
BCM857BS
A9*
[1]
* = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
9397 750 14723
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 02 — 11 April 2005
2 of 8
BCM857BS
Philips Semiconductors
PNP matched double transistor; ∆hFE = 10 %
5. Limiting values
Table 5:
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
Per transistor
VCBO
collector-base voltage
open emitter
-
−50
V
VCEO
collector-emitter voltage
open base
-
−45
V
VEBO
emitter-base voltage
open collector
-
−5
V
IC
collector current (DC)
-
−100
mA
ICM
peak collector current
single pulse;
tp ≤ 1 ms
-
−200
mA
Ptot
total power dissipation
Tamb ≤ 25 °C
-
200
mW
Tstg
storage temperature
−65
+150
°C
Tj
junction temperature
-
150
°C
Tamb
ambient temperature
−65
+150
°C
-
300
mW
Per device
total power dissipation
Ptot
[1]
Tamb ≤ 25 °C
[1]
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
6. Thermal characteristics
Table 6:
Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
-
-
416
K/W
Per device
Rth(j-a)
[1]
thermal resistance from
junction to ambient
in free air
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
9397 750 14723
Product data sheet
[1]
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 02 — 11 April 2005
3 of 8
BCM857BS
Philips Semiconductors
PNP matched double transistor; ∆hFE = 10 %
7. Characteristics
Table 7:
Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ
Max
Unit
Per transistor
ICBO
collector-base cut-off VCB = −30 V; IE = 0 A
current
VCB = −30 V; IE = 0 A;
Tj = 150 °C
-
-
−15
nA
-
-
−5
µA
nA
IEBO
emitter-base cut-off
current
VEB = −5 V; IC = 0 A
-
-
−100
hFE
DC current gain
VCE = −5 V; IC = −10 µA
-
250
-
VCE = −5 V; IC = −2 mA
200
290
450
−200
VCEsat
collector-emitter
saturation voltage
IC = −10 mA; IB = −0.5 mA
-
−50
IC = −100 mA; IB = −5 mA
-
−200
−400
mV
VBEsat
base-emitter
saturation voltage
IC = −10 mA; IB = −0.5 mA
-
−760
-
mV
-
−920
-
mV
VBE
base-emitter voltage
VCE = −5 V; IC = −2 mA
-600
−650
−700
mV
VCE = −5 V; IC = −10 mA
-
-
−760
mV
Cc
collector capacitance VCB = −10 V; IE = ie = 0 A;
f = 1 MHz
-
-
2.2
pF
Ce
emitter capacitance
VEB = −0.5 V; IC = ic = 0 A;
f = 1 MHz
-
10
-
pF
fT
transition frequency
VCE = −5 V; IC = −10 mA;
f = 100 MHz
100
250
-
MHz
IC = −100 mA; IB = −5 mA
[1]
mV
Per device
∆hFE
DC current gain
matching
VCE = −5 V; IC = −2 mA
-
-
10
%
∆VBE
base-emitter voltage
matching
VCE = −5 V; IC = −2 mA
-
-
2
mV
[1]
Pulse test: tp ≤ 300 µs; δ ≤ 0.02.
9397 750 14723
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 02 — 11 April 2005
4 of 8
BCM857BS
Philips Semiconductors
PNP matched double transistor; ∆hFE = 10 %
8. Package outline
2.2
1.8
6
2.2 1.35
2.0 1.15
1.1
0.8
5
4
2
3
0.45
0.15
pin 1
index
1
0.25
0.10
0.3
0.2
0.65
1.3
Dimensions in mm
04-11-08
Fig 1. Package outline SOT363 (SC-88)
9. Packing information
Table 8:
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code. [1]
Type number
BCM857BS
Package
SOT363
Description
3000
10000
4 mm pitch, 8 mm tape and reel; T1
[2]
-115
-135
4 mm pitch, 8 mm tape and reel; T2
[3]
-125
-165
[1]
For further information and the availability of packing methods, see Section 14.
[2]
T1: normal taping
[3]
T2: reverse taping
9397 750 14723
Product data sheet
Packing quantity
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 02 — 11 April 2005
5 of 8
BCM857BS
Philips Semiconductors
PNP matched double transistor; ∆hFE = 10 %
10. Revision history
Table 9:
Revision history
Document ID
Release date
Data sheet status
Change notice
Doc. number
Supersedes
BCM857BS_2
20050411
Product data sheet
-
9397 750 14723
BCM857BS_1
Modifications:
BCM857BS_1
•
•
Table 7 Revaluation of data according to the latest control samples
Table 7 ICBO unit for conditions VCB = 30 V; IE = 0 A; Tj = 150 °C amended to µA
20040914
Product data sheet
-
9397 750 14723
Product data sheet
9397 750 13712
-
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 02 — 11 April 2005
6 of 8
BCM857BS
Philips Semiconductors
PNP matched double transistor; ∆hFE = 10 %
11. Data sheet status
Level
Data sheet status [1]
Product status [2] [3]
Definition
I
Objective data
Development
This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II
Preliminary data
Qualification
This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III
Product data
Production
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
[1]
Please consult the most recently issued data sheet before initiating or completing a design.
[2]
The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3]
For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
12. Definitions
13. Disclaimers
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
Right to make changes — Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status ‘Production’),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
14. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: [email protected]
9397 750 14723
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 02 — 11 April 2005
7 of 8
BCM857BS
Philips Semiconductors
PNP matched double transistor; ∆hFE = 10 %
15. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
9
10
11
12
13
14
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . .
General description. . . . . . . . . . . . . . . . . . . . . .
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . .
Quick reference data. . . . . . . . . . . . . . . . . . . . .
Pinning information . . . . . . . . . . . . . . . . . . . . . .
Ordering information . . . . . . . . . . . . . . . . . . . . .
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . .
Thermal characteristics. . . . . . . . . . . . . . . . . . .
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . .
Package outline . . . . . . . . . . . . . . . . . . . . . . . . .
Packing information. . . . . . . . . . . . . . . . . . . . . .
Revision history . . . . . . . . . . . . . . . . . . . . . . . . .
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information . . . . . . . . . . . . . . . . . . . . .
1
1
1
1
1
2
2
2
3
3
4
5
5
6
7
7
7
7
© Koninklijke Philips Electronics N.V. 2005
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Date of release: 11 April 2005
Document number: 9397 750 14723
Published in The Netherlands
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