TI CD74ACT273PW Octal d flip-flop with reset Datasheet

Data sheet acquired from Harris Semiconductor
SCHS249B
CD54AC273, CD74AC273
CD54ACT273, CD74ACT273
Octal D Flip-Flop with Reset
August 1998 - Revised July 2002
Features
Description
• Buffered Inputs
The ’AC273 and ’ACT273 devices are octal D-type flip-flops
with reset that utilize advanced CMOS logic technology.
Information at the D input is transferred to the Q output on
the positive-going edge of the clock pulse. All eight flip-flops
are controlled by a common clock (CP) and a common reset
(MR). Resetting is accomplished by a low voltage level
independent of the clock.
• Typical Propagation Delay
- 6.5ns at VCC = 5V, TA = 25oC, CL = 50pF
• Exceeds 2kV ESD Protection MIL-STD-883, Method
3015
• SCR-Latchup-Resistant CMOS Process and Circuit
Design
Ordering Information
• Speed of Bipolar FAST™/AS/S with Significantly
Reduced Power Consumption
PART
NUMBER
• Balanced Propagation Delays
• AC Types Feature 1.5V to 5.5V Operation and
Balanced Noise Immunity at 30% of the Supply
• ±24mA Output Drive Current
- Fanout to 15 FAST™ ICs
- Drives 50Ω Transmission Lines
Pinout
CD54AC273, CD54ACT273
(CDIP)
CD74AC273, CD74ACT273
(PDIP, SOIC)
TOP VIEW
TEMPERATURE
RANGE
PACKAGE
CD74AC273E
0oC to 70oC
-40oC to 85oC
-55oC to 125oC
20 Ld PDIP
CD54AC273F3A
-55oC to 125oC
20 Ld CDIP
CD74ACT273E
0oC to 70oC
-40oC to 85oC
-55oC to 125oC
20 Ld PDIP
CD54ACT273F3A
-55oC to 125oC
20 Ld CDIP
CD74AC273M
0oC to 70oC
-40oC to 85oC
-55oC to 125oC
20 Ld SOIC
CD74ACT273M
0oC to 70oC
-40oC to 85oC
-55oC to 125oC
20 Ld SOIC
NOTES:
MR
1
20 VCC
Q0
2
19 Q7
D0
3
18 D7
D1
4
17 D6
Q1
5
16 Q6
Q2
6
15 Q5
D2
7
14 D5
D3
8
13 D4
Q3
9
12 Q4
GND 10
11 CP
1. When ordering, use the entire part number. Add the suffix 96 to
obtain the variant in the tape and reel.
2. Wafer and die for this part number is available which meets all
electrical specifications. Please contact your local sales office for
ordering information.
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
FAST™ is a Trademark of Fairchild Semiconductor.
Copyright © 2002, Texas Instruments Incorporated
1
CD54AC273, CD74AC273, CD54ACT273, CD74ACT273
Functional Diagram
CLOCK
CP
DATA
INPUTS
D0
Q0
D1
Q1
D2
Q2
D3
Q3
D4
Q4
D5
Q5
D6
Q6
D7
Q7
DATA
OUTPUTS
RESET MR
TRUTH TABLE
INPUTS
OUTPUTS
RESET
(MR)
CLOCK
CP
DATA
Dn
Qn
L
X
X
L
H
↑
H
H
H
↑
L
L
H
L
X
Q0
H = High level (steady state), L = Low level (steady state), X = Irrelevant, ↑ = Transition from Low to High level, Q0 = The level of Q
before the indicated steady-state input conditions were established.
2
CD54AC273, CD74AC273, CD54ACT273, CD74ACT273
Absolute Maximum Ratings
Thermal Information
DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 6V
DC Input Diode Current, IIK
For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Diode Current, IOK
For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±50mA
DC Output Source or Sink Current per Output Pin, IO
For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±50mA
DC VCC or Ground Current, ICC or IGND (Note 3) . . . . . . . . .±100mA
Thermal Resistance, θJA (Typical, Note 5)
E Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69oC/W
M Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58oC/W
Maximum Junction Temperature (Plastic Package) . . . . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC
Operating Conditions
Temperature Range, TA . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
Supply Voltage Range, VCC (Note 4)
AC Types. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.5V to 5.5V
ACT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC
Input Rise and Fall Slew Rate, dt/dv
AC Types, 1.5V to 3V . . . . . . . . . . . . . . . . . . . . . . . . . 50ns (Max)
AC Types, 3.6V to 5.5V . . . . . . . . . . . . . . . . . . . . . . . . 20ns (Max)
ACT Types, 4.5V to 5.5V. . . . . . . . . . . . . . . . . . . . . . . 10ns (Max)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
3. For up to 4 outputs per device, add ±25mA for each additional output.
4. Unless otherwise specified, all voltages are referenced to ground.
5. The package thermal impedance is calculated in accordance with JESD 51.
DC Electrical Specifications
TEST
CONDITIONS
PARAMETER
-40oC TO
85oC
25oC
-55oC TO
125oC
SYMBOL
VI (V)
IO (mA)
VCC
(V)
MIN
MAX
MIN
MAX
MIN
MAX
UNITS
VIH
-
-
1.5
1.2
-
1.2
-
1.2
-
V
AC TYPES
High Level Input Voltage
Low Level Input Voltage
High Level Output Voltage
VIL
VOH
-
VIH or VIL
3
2.1
-
2.1
-
2.1
-
V
5.5
3.85
-
3.85
-
3.85
-
V
1.5
-
0.3
-
0.3
-
0.3
V
3
-
0.9
-
0.9
-
0.9
V
5.5
-
1.65
-
1.65
-
1.65
V
-0.05
1.5
1.4
-
1.4
-
1.4
-
V
-0.05
3
2.9
-
2.9
-
2.9
-
V
-0.05
4.5
4.4
-
4.4
-
4.4
-
V
-4
3
2.58
-
2.48
-
2.4
-
V
-24
4.5
3.94
-
3.8
-
3.7
-
V
-75
(Note 6, 7)
5.5
-
-
3.85
-
-
-
V
-50
(Note 6, 7)
5.5
-
-
-
-
3.85
-
V
-
3
CD54AC273, CD74AC273, CD54ACT273, CD74ACT273
DC Electrical Specifications
(Continued)
TEST
CONDITIONS
PARAMETER
Low Level Output Voltage
-40oC TO
85oC
25oC
-55oC TO
125oC
SYMBOL
VI (V)
IO (mA)
VCC
(V)
MIN
MAX
MIN
MAX
MIN
MAX
UNITS
VOL
VIH or VIL
0.05
1.5
-
0.1
-
0.1
-
0.1
V
0.05
3
-
0.1
-
0.1
-
0.1
V
0.05
4.5
-
0.1
-
0.1
-
0.1
V
12
3
-
0.36
-
0.44
-
0.5
V
24
4.5
-
0.36
-
0.44
-
0.5
V
75
(Note 6, 7)
5.5
-
-
-
1.65
-
-
V
50
(Note 6, 7)
5.5
-
-
-
-
-
1.65
V
II
VCC or
GND
-
5.5
-
±0.1
-
±1
-
±1
µA
ICC
VCC or
GND
0
5.5
-
8
-
80
-
160
µA
High Level Input Voltage
VIH
-
-
4.5 to
5.5
2
-
2
-
2
-
V
Low Level Input Voltage
VIL
-
-
4.5 to
5.5
-
0.8
-
0.8
-
0.8
V
High Level Output Voltage
VOH
VIH or VIL
-0.05
4.5
4.4
-
4.4
-
4.4
-
V
-24
4.5
3.94
-
3.8
-
3.7
-
V
-75
(Note 6, 7)
5.5
-
-
3.85
-
-
-
V
-50
(Note 6, 7)
5.5
-
-
-
-
3.85
-
V
0.05
4.5
-
0.1
-
0.1
-
0.1
V
24
4.5
-
0.36
-
0.44
-
0.5
V
75
(Note 6, 7)
5.5
-
-
-
1.65
-
-
V
50
(Note 6, 7)
5.5
-
-
-
-
-
1.65
V
Input Leakage Current
Quiescent Supply Current
MSI
ACT TYPES
Low Level Output Voltage
Input Leakage Current
Quiescent Supply Current
MSI
Additional Supply Current per
Input Pin TTL Inputs High
1 Unit Load
VOL
VIH or VIL
II
VCC or
GND
-
5.5
-
±0.1
-
±1
-
±1
µA
ICC
VCC or
GND
0
5.5
-
8
-
80
-
160
µA
∆ICC
VCC
-2.1
-
4.5 to
5.5
-
2.4
-
2.8
-
3
mA
NOTES:
6. Test one output at a time for a 1-second maximum duration. Measurement is made by forcing current and measuring voltage to minimize
power dissipation.
7. Test verifies a minimum 50Ω transmission-line-drive capability at 85oC, 75Ω at 125oC.
ACT Input Load Table
INPUT
UNIT LOAD
Dn
0.5
MR
0.57
CP
1
NOTE: Unit load is ∆ICC limit specified in DC Electrical Specifications
Table, e.g., 2.4mA max at 25oC.
4
CD54AC273, CD74AC273, CD54ACT273, CD74ACT273
Prerequisite For Switching Function
PARAMETER
-40oC TO 85oC
-55oC TO 125oC
SYMBOL
VCC (V)
MIN
MAX
MIN
MAX
UNITS
tSU
1.5
2
-
2
-
ns
3.3
(Note 9)
2
-
2
-
ns
5
(Note 10)
2
-
2
-
ns
1.5
2
-
2
-
ns
3.3
2
-
2
-
ns
5
2
-
2
-
ns
1.5
2
-
2
-
ns
3.3
2
-
2
-
ns
5
2
-
2
-
ns
1.5
55
-
63
-
ns
3.3
6.1
-
7
-
ns
5
4.4
-
5
-
ns
1.5
55
-
63
-
ns
3.3
6.1
-
7
-
ns
5
4.4
-
5
-
ns
1.5
9
-
8
-
MHz
3.3
81
-
71
-
MHz
5
114
-
100
-
MHz
AC TYPES
Data to CP Set-Up Time
Hold Time
tH
Removal Time, MR to CP
tREM
MR Pulse Width
tW
CP Pulse Width
tW
CP Frequency
fMAX
ACT TYPES
Data to CP Set-Up Time
tSU
5
(Note 10)
2
-
2
-
ns
Hold Time
tH
5
2
-
2
-
ns
tREM
5
2
-
2
-
ns
MR Pulse Width
tW
5
4.4
-
5
-
ns
CP Pulse Width
tW
5
5.3
-
6
-
ns
fMAX
5
97
-
85
-
MHz
Removal Time MR to CP
CP Frequency
Switching Specifications Input tr, tf = 3ns, CL = 50pF (Worst Case)
-40oC TO 85oC
PARAMETER
-55oC TO 125oC
SYMBOL
VCC (V)
MIN
TYP
MAX
MIN
TYP
MAX
UNITS
tPLH, tPHL
1.5
-
-
154
-
-
169
ns
3.3
(Note 9)
4.9
-
17.2
4.7
-
18.9
ns
5
(Note 10)
3.5
-
12.3
3.4
-
13.5
ns
AC TYPES
Propagation Delay,
CP to Qn
5
CD54AC273, CD74AC273, CD54ACT273, CD74ACT273
Switching Specifications Input tr, tf = 3ns, CL = 50pF (Worst Case)
(Continued)
-40oC TO 85oC
-55oC TO 125oC
SYMBOL
VCC (V)
MIN
TYP
MAX
MIN
TYP
MAX
UNITS
tPLH, tPHL
1.5
-
-
154
-
-
169
ns
3.3
4.9
-
17.2
4.7
-
18.9
ns
5
3.5
-
12.3
3.4
-
13.5
ns
CI
-
-
-
10
-
-
10
pF
CPD
(Note 11)
-
-
45
-
-
45
-
pF
Propagation Delay,
CP to Qn
tPLH, tPHL
5
(Note 10)
3.5
-
12.3
3.4
-
13.5
ns
Propagation Delay,
MR to Qn
tPLH, tPHL
5
3.5
-
12.3
3.4
-
13.5
ns
Input Capacitance
CI
-
-
-
10
-
-
10
pF
CPD
(Note 11)
-
-
45
-
-
45
-
pF
PARAMETER
Propagation Delay,
MR to Qn
Input Capacitance
Power Dissipation Capacitance
ACT TYPES
Power Dissipation Capacitance
NOTES:
8. Limits tested 100%.
9. 3.3V Min is at 3.6V, Max is at 3V.
10. 5V Min is at 5.5V, Max is at 4.5V.
11. CPD is used to determine the dynamic power consumption per flip-flop.
AC: PD = CPD VCC2 fi = ∑ (CL VCC2 fo)
ACT: PD = CPD VCC2 fi + ∑ (CL VCC2 fo) + VCC ∆ICC where fi = input frequency, fo = output frequency, CL = output load capacitance,
VCC = supply voltage.
INPUT
LEVEL
INPUT
LEVEL
CP
10%
tr
tf
90%
VS
VS
10%
MR
VS
INPUT
tW
tPLH
tPHL
Q
VS
VS
Q
FIGURE 1. PROPAGATION DELAY TIMES AND CLOCK
PULSE WIDTH
tREM
tW
CP
(Q)
VS
VS
GND
VS
tPLH
VS
FIGURE 2. PREREQUISITE AND PROPAGATION DELAY
TIMES FOR MASTER RESET
6
CD54AC273, CD74AC273, CD54ACT273, CD74ACT273
OUTPUT
LEVEL
D
VS
VS
VS
VS
tH (L)
tH (H)
tSU (L)
CP
tSU (H)
VS
VS
FIGURE 3. PREREQUISITE FOR CLOCK
OUTPUT
RL (NOTE)
500Ω
DUT
OUTPUT
LOAD
CL
50pF
NOTE: For AC Series Only: When VCC = 1.5V, RL = 1kΩ.
AC
ACT
VCC
3V
Input Switching Voltage, VS
0.5 VCC
1.5V
Output Switching Voltage, VS
0.5 VCC
0.5 VCC
Input Level
FIGURE 4. PROPAGATION DELAY TIMES
7
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
CD54AC273F3A
ACTIVE
CDIP
J
20
1
TBD
A42 SNPB
N / A for Pkg Type
CD54ACT273F3A
ACTIVE
CDIP
J
20
1
TBD
A42 SNPB
N / A for Pkg Type
CD74AC273E
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74AC273EE4
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74AC273M
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74AC273M96
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74AC273M96E4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74AC273ME4
ACTIVE
SOIC
DW
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74AC273SM
OBSOLETE
SSOP
DB
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74ACT273E
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74ACT273EE4
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD74ACT273M
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74ACT273M96
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74ACT273M96E4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74ACT273ME4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74ACT273PW
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74ACT273PWE4
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74ACT273PWR
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74ACT273PWRE4
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74ACT273SM
OBSOLETE
SSOP
DB
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74ACT273SM96
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74ACT273SM96E4
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
25
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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