Rohm BD63821EFV Silicon monolithic integrated circuit Datasheet

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STRUCTURE
Silicon monolithic integrated circuits
PRODUCT SERIES
2ch DC brush motor driver
TYPE
BD63821EFV
FUNCTION
・PWM constant current controllable two H bridge driver
・Forward, reverse, brake and stop function
・Direct PWM control
○Absolute maximum ratings(Ta=25°C)
Item
Supply voltage
Symbol
VCC1,2
Ratings
Unit
-0.3~+36.0
V
1.45※1
W
Power dissipation
Pd
4.70※2
W
Input voltage for control pin
VIN
-0.3~+7.0
V
RNF voltage
VRNF
0.7
V
※3
Output current
IOUT
1.0
A/ch
Output current(peak)※4
IOUTPEAK
1.5※3
A/ch
FAULT, LOCK voltage
VFAULT
-0.3~+7.0
V
FAULT, LOCK current
IFAULT
5
mA
Operating temperature range
Topr
-25~+85
°C
Storage temperature range
Tstg
-55~+150
°C
Junction temperature
Tjmax
+150
°C
※1
70mm×70mm×1.6mm glass epoxy board. Derating in done at 11.6mW/°C for operating above Ta=25°C.
※2
4-layer recommended board. Derating in done at 37.6mW/°C for operating above Ta=25°C.
※3
Do not, however exceed Pd, ASO and Tjmax=150°C.
※4
Pulse width tw≦20ms.
○Operating conditions (Ta=-25~+85°C)
Item
Symbol
Supply voltage
VCC1,2
Input voltage for control pin
VIN
PWM input frequency
FIN
Min.
19
0
-
Typ.
24
-
This product isn’t designed for protection against radioactive rays.
REV. B
Max.
28
5.5
100
Unit
V
V
kHz
2/4
○Electrical characteristics (Unless otherwise specified Ta=25°C, VCC1,2=24V)
Item
Min.
Limit
Typ.
Max.
-
1.0
2.5
2.5
5.0
mA
mA
PS=0V
PS=IN1A=IN2A=5V
2.0
35
-10
50
0
0.8
100
-
V
V
µA
µA
VIN=5V
VIN=0V
-
50
-
100
10
mV
µA
IFAULT=1mA
VFAULT=5V
RON
-
1.90
2.50
Ω
ILEAK
-
-
10
µA
IRNFS
IRNF
IVREF
VREF
tONMIN
-2.0
-40
-2.0
0
0.7
-0.1
-20
-0.1
1.5
3.0
3.0
µA
µA
µA
V
µs
RNFXS=0V
RNFX=0V
VREFX=0V
VCTH
0.57
0.60
0.63
V
VREFX=3V
Symbol
Whole
Circuit current at standby
ICCST
Circuit current
ICC
Control input (IN1A, IN1B, IN2A, IN2B, PS)
H level input voltage
VINH
L level input voltage
VINL
H level input current
IINH
L level input current
IINL
FAULT LOCK output (FAULT, LOCK)
Output low voltage
VFAULT
Output leak current
IFAULT_LEAK
Output (OUT1A, OUT1B, OUT2A, OUT2B)
Output on resistance
Output leak current
Current control
RNFXS input current
RNFX input current
VREFX input current
VREFX input voltage range
Minimum on time (Blank time)
Current limit
Comparator threshold
REV. B
Unit
Conditions
IOUT=0.5A,
Sum of upper and lower
3/4
○Package outline
Product No.
BD63821EFV
Lot No.
HTSSOP-B28 (Unit:mm)
○Block diagram
○Pin No. / Pin name
VREF1 11
+
-
+
1/5
-
RNF1S
VREF2 12
+
-
1/5
14 FAULT
Regulator
+
-
RNF2S
Blank time
PWM control
CR 10
TSD
OCP
UVLO
OVLO
15 LOCK
OSC
7 VCC1
5 OUT1A
IN2A 19
IN2B 20
PS 13
GND 9
TEST 18
Forward
Reverse
BRAKE
Open
2 OUT1B
3 RNF1
Predriver
IN1B 17
Forward
Reverse
BRAKE
Open
Control logic
IN1A 16
4 RNF1S
Pin No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
Pin name
GND
OUT1B
RNF1
RNF1S
OUT1A
NC
VCC1
NC
GND
CR
VREF1
VREF2
PS
FAULT
22 VCC2
24 OUT2A
NC : Non Connection
27 OUT2B
26 RNF2
25 RNF2S
1 GND
REV. B
Pin No.
15
16
17
18
19
20
21
22
23
24
25
26
27
28
Pin name
LOCK
IN1A
IN1B
TEST
IN2A
IN2B
NC
VCC2
NC
OUT2A
RNF2S
RNF2
OUT2B
NC
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○Operation Notes
(1) Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating
conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a
short circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings,
consider adding circuit protection devices, such as fuses.
(2) Power supply lines
As return of current regenerated by back EMF of motor happens, take steps such as putting capacitor
between power supply and GND as an electric pathway for the regenerated current. Be sure that there is no
problem with each property such as emptied capacity at lower temperature regarding electrolytic capacitor
to decide capacity value. If the connected power supply does not have sufficient current absorption capacity,
regenerative current will cause the voltage on the power supply line to rise, which combined with the
product and its peripheral circuitry may exceed the absolute maximum ratings. It is recommended to
implement a physical safety measure such as the insertion of a voltage clamp diode between the power
supply and GND pins.
(3) GND potential
The potential of GND pin must be minimum potential in all operating conditions.
(4) Metal on the backside (Define the side where product markings are printed as front)
The metal on the backside is shorted with the backside of IC chip therefore it should be connected to GND.
Be aware that there is a possibility of malfunction or destruction if it is shorted with any potential other than
GND.
(5) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual
operating conditions. This IC exposes the metal on the backside of package. Note that this part is assumed
to use after providing heat dissipation treatment to improve heat dissipation efficiency. Try to occupy as
wide as possible with heat dissipation pattern not only on the board surface but also the backside.
(6) Operation in strong electromagnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the
IC to malfunction.
(7) ASO
When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.
(8) Thermal shutdown circuit
The IC has a built-in thermal shutdown circuit (TSD circuit). If the chip temperature becomes Tjmax=150°C,
and higher, coil output to the motor will be open. The TSD circuit is designed only to shut the IC off to
prevent runaway thermal operation. It is not designed to protect or indemnify peripheral equipment. Do not
use the TSD function to protect peripheral equipment.
(9) Over current protection circuit
The IC has a built-in over current protection circuit (OCP circuit). The OCP circuit is designed only to shut
the IC off to prevent abnormal situations, when absolute maximum output current is exceeded. It is not
designed to protect or indemnify peripheral equipment. Do not use the OCP function to protect peripheral
equipment.
(10) Ground Wiring Pattern
When using both large current and small signal GND patterns, it is recommended to isolate the two ground
patterns, placing a single ground point at the ground potential of application so that the pattern wiring
resistance and voltage variations caused by large currents do not cause variations in the small signal
ground voltage. Be careful not to change the GND wiring pattern of any external components, either.
(11) TEST pin
Be sure to connect TEST pin to GND.
REV. B
Notice
Notes
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Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
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R1120A
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