UMS CHR3693-QDG 21-26.5ghz integrated down converter Datasheet

CHR3693-QDG
RoHS COMPLIANT
21-26.5GHz Integrated Down converter
GaAs Monolithic Microwave IC in SMD package
Description
The CHR3693-QDG is a multifunction chip,
which integrates a balanced cold FET mixer,
a time two multiplier, and a RF self biased
LNA.
It is designed for a wide range of
applications,
typically
commercial
communication systems.
The circuit is manufactured with a pHEMT
process, 0.25µm gate length, via holes
through the substrate and air bridges.
It is supplied in lead-free SMD package.
UMS
UMS
R3693
A3667A
A3688A
YYWW
YYWWG
Main Features
Conversion gain (Inf. & Sup. Mode)
■ Broadband performance 21-26.5GHz
■ 14dB gain
■ -5dBm input IP3
■ 18dBc image rejection
■ DC bias: Vd=4.0Volt@Id=160mA
■ 24LQFN4x4
■ MSL Level: 1
F_FI=2GH
F_FI=3GH
Q (suprad
I (infradyn
Main Electrical Characteristics
Tamb.= +25°C, Vdx=Vdl=4.0V, Vgx=-0.9V, Vgm=-0.7V
Symbol
Parameter
Min
Typ
Max
Unit
F_RF
RF frequency range
21
26.5
GHz
F_LO
LO frequency range
9
14
GHz
F_IF
IF frequency range
DC
3.5
GHz
Gc
Conversion gain
12
14
dB
ESD Protection: Electrostatic discharge sensitive device. Observe handling precautions!
Ref. : DSCHR3693QDG2181 - 29 Jun 12
1/14
Specifications subject to change without notice
United Monolithic Semiconductors S.A.S.
Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France
Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34
CHR3693-QDG
21-26.5GHz Integrated Down converter
Electrical Characteristics
Tamb.= +25°C, Vdx=Vdl = +4.0V, Vgx=-0.9V, Vgm=-0.7V
Symbol
Parameter
Min
Typ
Max
Unit
F_RF
RF frequency range
21
26.5
GHz
F_LO
LO frequency range
9
14
GHz
F_IF
IF frequency range
DC
3.5
GHz
Gc
Conversion gain
12
14
dB
NF
Noise Figure for IF>0.1GHz
2
2.5
dB
P_LO
LO Input power
2
5
dBm
(1)
Img Sup Image Suppression
15
18
dBc
IIP3
Input IP3
-2
dBm
LO_RL
LO return loss
-9
-7
dB
RF return loss (21 to 24GHz)
-12
-7
dB
RF_RL
RF return loss (24 to 26.5GHz)
-8
-6
dB
LO/RF
Isolation LO  RF
45
dBc
2LO/RF Isolation 2LO  RF
35
dBc
(2)
Id
Bias current (Idl + Idx)
120
160
200
mA
(1)
With external I/Q 90° hybrid coupler
(2)
Typically, Idl= 90mA, Idx=70mA
These values are representative of onboard measurements as defined on the drawing at
paragraph “Evaluation mother board”.
Absolute Maximum Ratings (1)
Tamb.= +25°C
Symbol
Parameter
Values
Unit
Vd
Maximum drain bias voltage
4.5
V
Id
Maximum drain bias current
230
mA
Vg
Gate bias voltage
-2.0 to +0.4
V
(2)
P_RF
Maximum RF input power
10
dBm
(2)
P_LO
Maximum LO input power
10
dBm
Tch
Maximum channel temperature
175
°C
Ta
Operating temperature range
-40 to +85
°C
Tstg
Storage temperature range
-55 to +150
°C
(1)
Operation of this device above anyone of these parameters may cause permanent
damage.
(2)
Duration < 1s.
Ref. : DSCHR3693QDG2181 - 29 Jun 12
2/14
Specifications subject to change without notice
Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France
Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34
CHR3693-QDG
21-26.5GHz Integrated Down converter
Device thermal performances
All the figures given in this section are obtained assuming that the QFN device is cooled
down only by conduction through the package thermal pad (no convection mode considered).
The temperature is monitored at the package back-side interface (Tcase) as shown below.
The system maximum temperature must be adjusted in order to guarantee that Tcase
remains below than the maximum value specified in the next table. So, the system PCB must
be designed to comply with this requirement.
A derating must be applied on the dissipated power if the Tcase temperature can not be
maintained below than the maximum temperature specified (see the curve Pdiss. Max) in
order to guarantee the nominal device life time (MTTF).
DEVICE THERMAL SPECIFICATION : Product name
Recommended max. junction temperature (Tj max)
:
124
Junction temperature absolute maximum rating
:
175
Max. continuous dissipated power (Pdiss. Max.)
:
0.64
=> Pdiss. Max. derating above Tcase(1)= 85
°C :
16
Junction-Case thermal resistance (Rth J-C)(2)
:
<60
Minimum Tcase operating temperature(3)
:
-40
Maximum Tcase operating temperature(3)
:
85
Minimum storage temperature
:
-55
Maximum storage temperature
:
150
°C
°C
W
mW/°C
°C/W
°C
°C
°C
°C
(1) Derating at junctio n temperature co nstant = Tj max.
(2) Rth J-C is calculated fo r a wo rst case co nsidering the ho t t e s t junc t io n o f the M M IC and all the devices biased.
(3) Tcase=P ackage back side temperature measured under the die-attach-pad (see the drawing belo w).
0.7
0.5
0.4
0.3
0.2
0.1
Pdiss. Max. @Tj <Tj max (W)
0
-50
-25
0
25
50
75
100
125
150
Pdiss. Max. @Tj <Tj max (W)
0.6
Tcase
Example:
QFN16L
16L3x3
3x3
Example
: QFN
Location
temeprature
Location
of of
temperature
reference
point
(Tcase)
reference
point
(Tcase)
package's
bottom
side
on on
package’s
bottom
side
Tcase (°C)
6.4
Ref. : DSCHR3693QDG2181 - 29 Jun 12
3/14
Specifications subject to change without notice
Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France
Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34
CHR3693-QDG
21-26.5GHz Integrated Down converter
Typical Board Measurements
Tamb=25°C, Vdx=Vdl=4V, Typical Vgx=-0.9V & Vgm=-0.7V
P_LO=2dBm, F_IF=2GHz
These values are representative of onboard measurements as defined on the drawing at
page 12 (paragraph “Evaluation mother board”) (in connector access planes).
Conversion Gain in infradyne mode versus frequency
F_RF = 2xF_LO-F_IF
-40°C
+25°C
+80°C
Conversion Gain in supradyne mode versus frequency
F_RF = 2xF_LO+F_IF
-40°C
Ref. : DSCHR3693QDG2181 - 29 Jun 12
+25°C
4/14
+80°C
Specifications subject to change without notice
Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France
Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34
CHR3693-QDG
21-26.5GHz Integrated Down converter
Typical Board Measurements
Tamb=25°C, Vdx=Vdl=4V, Typical Vgx=-0.9V & Vgm=-0.7V
P_LO=2dBm, F_IF=2GHz
Image Frequency rejection (inf. & sup. Mode) @ -40, +25, +80°C
-40°C
Q (supradyne)
+25°C
I (infradyne)
+80°C
Ref. : DSCHR3693QDG2181 - 29 Jun 12
5/14
Specifications subject to change without notice
Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France
Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34
CHR3693-QDG
21-26.5GHz Integrated Down converter
Typical Board Measurements
Tamb=25°C, Vdx=Vdl=4V, Typical Vgx=-0.9V & Vgm=-0.7V
P_LO=2dBm, F_IF=2GHz
Board losses have been de-embedded (results in package access planes)
Noise Figure in infradyne mode versus frequency
F_RF = 2xF_LO-F_IF
5
NF LSB @+85°C
NF LSB @+25°C
NF LSB @-40°C
Noise Figure (dB)
4
3
2
1
0
20
21
22
23
24
25
26
Frequency (GHz)
Noise Figure in supradyne mode versus frequency
F_RF = 2xF_LO+F_IF
5
NF USB @+85°C
NF USB @+25°C
NF USB @-40°C
Noise Figure (dB)
4
3
2
1
0
20
21
22
23
24
25
26
Frequency (GHz)
Ref. : DSCHR3693QDG2181 - 29 Jun 12
6/14
Specifications subject to change without notice
Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France
Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34
CHR3693-QDG
21-26.5GHz Integrated Down converter
Typical Board Measurements
Tamb=25°C, Vdx=Vdl=4V, Typical Vgx=-0.9V & Vgm=-0.7V
P_LO=2dBm
Compression versus PRF (infradyne and supradyne modes)
F_RF=21GHz & F_IF=3GHz
-40°C
+25°C
+80°C
Q (supradyne)
I (infradyne)
Compression versus PRF (infradyne and supradyne modes)
F_RF=26GHz & F_IF=2GHz
-40°C
+25°C
+80°C
Q (supradyne)
I (infradyne)
Ref. : DSCHR3693QDG2181 - 29 Jun 12
7/14
Specifications subject to change without notice
Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France
Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34
CHR3693-QDG
21-26.5GHz Integrated Down converter
Typical Board Measurements
Tamb=25°C, Vdx=Vdl=4V, Typical Vgx=-0.9V & Vgm=-0.7V
Input IP3 versus RF power
P_LO=2dBm, F_FI=2GHz
1
0
IIP3 (dBm)
-1
-2
-3
-4
-5
21GHz @ -40°C
23.6GHz @ -40°C
26.5GHz @ -40°C
21GHz @ 25°C
23.6GHz @ 25°C
26.5GHz @ 25°C
21GHz @ 80°C
23.6GHz @ 80°C
26.5GHz @ 80°C
-6
-25
-24
-23
-22
-21
-20
-19
-18
P_RF 2tones (dBm)
-17
-16
-15
Isolations LO/RF & 2LO/RF
P_LO=2, 4 & 6dBm
Isolation LO-RF
Isolation 2LO-RF
PLO=2dBm
PLO=4dBm
PLO=6dBm
Ref. : DSCHR3693QDG2181 - 29 Jun 12
8/14
Specifications subject to change without notice
Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France
Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34
CHR3693-QDG
21-26.5GHz Integrated Down converter
Typical Board Measurements
Tamb=25°C, Vdx=Vdl=4V, Typical Vgx=-0.9V & Vgm=-0.7V
LO Return Loss @ P_LO=0dBm
LO Freq (GHz)
RF Return Loss @ P_RF=-30dBm
RF Freq (GHz)
Ref. : DSCHR3693QDG2181 - 29 Jun 12
9/14
Specifications subject to change without notice
Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France
Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34
CHR3693-QDG
21-26.5GHz Integrated Down converter
Package outline (1)
Matt tin, Lead Free
Units :
From the standard :
(Green)
mm
JEDEC MO-220
(VGGD)
25- GND
12345678-
NC
Gnd(2)
Gnd(2)
RF in
Gnd(2)
Gnd(2)
Vdl
Vgm
910111213141516-
Vdx
NC
NC
Vgx
Gnd(2)
Gnd(2)
LO IN
Gnd(2)
1718192021222324-
Gnd(2)
NC
I-IF out
Gnd(2)
Gnd(2)
Q-IF out
NC
NC
(1)
The package outline drawing included to this data-sheet is given for indication. Refer to the
application note AN0017 (http://www.ums-gaas.com) for exact package dimensions.
(2)
It is strongly recommended to ground all pins marked “Gnd” through the PCB board.
Ensure that the PCB board is designed to provide the best possible ground to the package.
Ref. : DSCHR3693QDG2181 - 29 Jun 12
10/14
Specifications subject to change without notice
Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France
Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34
CHR3693-QDG
21-26.5GHz Integrated Down converter
Definition of the Sij reference planes
The reference planes used for Sij
measurements given above are symmetrical
from the symmetrical axis of the package
(see drawing beside). The input and output
reference planes are located at 3.18mm
offset (input wise and output wise
respectively) from this axis. Then, the given
Sij parameters incorporate the land pattern of
the evaluation motherboard recommended in
paragraph "Evaluation mother board".
3.18
Ref. : DSCHR3693QDG2181 - 29 Jun 12
11/14
3.18
Specifications subject to change without notice
Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France
Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34
CHR3693-QDG
21-26.5GHz Integrated Down converter
Evaluation mother board
■ Compatible with the proposed footprint.
■ Based on typically Ro4003 / 8mils or equivalent.
■ Using a micro-strip to coplanar transition to access the package.
■ Recommended for the implementation of this product on a module board.
■ Decoupling capacitors of 10nF ±10% are recommended for all DC accesses.
■ See application note AN0017 for details.
10nF capacitor 0603
Hybrid coupler 90° (ex. Anaren 11306-3)
Ref. : DSCHR3693QDG2181 - 29 Jun 12
12/14
Specifications subject to change without notice
Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France
Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34
CHR3693-QDG
21-26.5GHz Integrated Down converter
Note
Ref. : DSCHR3693QDG2181 - 29 Jun 12
13/14
Specifications subject to change without notice
Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France
Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34
CHR3693-QDG
21-26.5GHz Integrated Down converter
Recommended package footprint
Refer to the application note AN0017 available at http://www.ums-gaas.com for package foot
print recommendations.
SMD mounting procedure
For the mounting process standard techniques involving solder paste and a suitable reflow
process can be used. For further details, see application note AN0017.
Recommended environmental management
UMS products are compliant with the regulation in particular with the directives RoHS
N°2011/65 and REACh N°1907/2006. More environmental data are available in the
application note AN0019 also available at http://www.ums-gaas.com.
Recommended ESD management
Refer to the application note AN0020 available at http://www.ums-gaas.com for ESD
sensitivity and handling recommendations for the UMS package products.
Ordering Information
QFN 4x4 RoHS compliant package:
CHR3693-QDG/XY
Stick: XY = 20
Tape & reel: XY = 21
Information furnished is believed to be accurate and reliable. However United Monolithic Semiconductors
S.A.S. assumes no responsibility for the consequences of use of such information nor for any infringement of
patents or other rights of third parties which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of United Monolithic Semiconductors S.A.S.. Specifications
mentioned in this publication are subject to change without notice. This publication supersedes and replaces all
information previously supplied. United Monolithic Semiconductors S.A.S. products are not authorised for use
as critical components in life support devices or systems without express written approval from United
Monolithic Semiconductors S.A.S.
Ref. : DSCHR3693QDG2181 - 29 Jun 12
14/14
Specifications subject to change without notice
Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France
Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34
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